CN103874387A - Uniform temperature plate structure and manufacturing method thereof - Google Patents
Uniform temperature plate structure and manufacturing method thereof Download PDFInfo
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- CN103874387A CN103874387A CN201210525921.0A CN201210525921A CN103874387A CN 103874387 A CN103874387 A CN 103874387A CN 201210525921 A CN201210525921 A CN 201210525921A CN 103874387 A CN103874387 A CN 103874387A
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- equalizing plate
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Abstract
A uniform temperature plate structure comprises a body which is provided with a plurality of radiating fins and a cavity. The radiating fins are arranged on one side of the body and extend towards the opposite side of the body. The cavity is disposed in the body. A capillary structure and a working fluid are arranged in the cavity. The radiating fins and the body are integrally formed. By adopting the uniform temperature plate structure and the manufacturing method thereof, the production cost can be reduced, and even work hours can be decreased.
Description
Technical field
The invention relates to a kind of equalizing plate structure and manufacture method thereof, espespecially a kind of equalizing plate structure and manufacture method thereof by extruding processing one-body molded one with multiple radiating fins and a chamber.
Background technology
Along with scientific and technological industry is progressive fast, the function of electronic installation is also more and more powerful, for example device (Central Processing Unit in centre, CPU), the electronic component arithmetic speed of wafer set or display unit is also along with growth, causes the heat that the electronic component unit interval produces relatively to improve; Therefore, if the heat that electronic component gives out cannot dispel the heat in time, will affect the running of electronic installation entirety, or cause the damage of electronic component.
The heat radiator of electronic element major part that general industry adopts is by dispelling the heat as heat dissipation elements such as fan, radiator or heat pipes, and by radiator contact thermal source, by heat pipe, heat is preached to far-end and dispelled the heat again, or by fan mandatory guidance air-flow to this radiator forced heat radiation, thermal source narrower for space or that area is larger is selected the use as conduction heat sources using temperature-uniforming plate as heat conducting element.
Traditional temperature-uniforming plate is by covering made with two sheet material correspondences, described sheet material correspondence covers and forms an airtight chamber, this airtight chamber is vacuum state, and there is supporting construction and capillary structure, the capillary structure of tradition temperature-uniforming plate is that grid body and agglomerated powder opisthosoma and groove are wherein arbitrary, take shape in by the mode of secondary operations the side that aforementioned plate body is wanted to cover, cover again and vacuumize steps such as inserting working fluid thereafter, quite expend man-hour and material.
Therefore known technology has following shortcoming:
1. production cost is higher;
2. man-hour is longer.
Because, how to solve above-mentioned public problem and disappearance, the inventor who is this case desires most ardently to the relevant manufacturer that is engaged in the industry the direction place that research improves.
Summary of the invention
For this reason, for effectively solving the above problems, main purpose of the present invention is to provide one to reduce production costs, and reaches the equalizing plate structure of reducing work hours.
Secondary objective of the present invention is to provide one to reduce production costs, and reaches the manufacture method of the equalizing plate structure of reducing work hours.
In order to achieve the above object, the invention provides a kind of equalizing plate structure Bao Kuo ︰ mono-body, this body has multiple radiating fins and a chamber, described radiating fin is located at aforementioned body one side, and form to a side extension institute of contrary aforementioned body, this chamber is located in aforementioned body, has a capillary structure and a working fluid in this chamber; Described radiating fin and this chamber and this body are formed in one.
In order to achieve the above object, the invention provides a kind of manufacture method of equalizing plate structure, Bao draws together Xia row Bu Zhou ︰
Make a body with multiple radiating fins and a chamber with the processing mode extruding;
By the closed at both ends of this body and vacuumize and insert working fluid.
The present invention, by extruding the one-body molded temperature-uniforming plate with radiating fin and chamber of processing, not only can save material cost, more can effectively reduce work hours, and then reach significantly and reduce production costs.
Brief description of the drawings
Figure 1A is the schematic perspective view of the first embodiment of equalizing plate structure of the present invention;
Figure 1B is the cutaway view of the first embodiment of equalizing plate structure of the present invention;
Fig. 2 is the cutaway view of the second embodiment of equalizing plate structure of the present invention;
Fig. 3 is the cutaway view of the 3rd embodiment of equalizing plate structure of the present invention;
Fig. 4 A is the schematic perspective view of the 4th embodiment of equalizing plate structure of the present invention;
Fig. 4 B is the profile of the 4th embodiment of equalizing plate structure of the present invention;
Fig. 5 is the manufacture method first embodiment flow chart of steps of equalizing plate structure of the present invention;
Fig. 6 is the manufacture method second embodiment flow chart of steps of equalizing plate structure of the present invention;
Fig. 7 is manufacture method the 3rd embodiment flow chart of steps of equalizing plate structure of the present invention.
Main element symbol description
Equalizing plate structure 1
The first side 11
The second side 12
Radiating fin 101
Working fluid 1022
Pyrotoxin 2
Embodiment
Characteristic in above-mentioned purpose of the present invention and structure thereof and function, will be explained according to appended graphic preferred embodiment.
Referring to Figure 1A, Figure 1B, is schematic perspective view and the cutaway view of equalizing plate structure the first embodiment of the present invention, as shown in the figure, and described equalizing plate structure 1, Bao Kuo ︰ mono-body 10;
This body 10 has multiple radiating fins 101 and a chamber 102, the side extension institute that described radiating fin 101 is located at the contrary aforementioned body 10 of aforementioned body 10 1 side direction forms, this chamber 102 is located in aforementioned body 10, has a capillary structure 1021 and a working fluid 1022 in this chamber 102.
Aforementioned capillary structure 1021 is that multiple grooves and agglomerated powder opisthosoma and grid body are wherein arbitrary, and the present embodiment is using multiple grooves as explanation but do not regard it as and be limited.
Described radiating fin 101 is formed in one with chamber 102.
Refer to Fig. 2, for the cutaway view of equalizing plate structure the second embodiment of the present invention, as shown in the figure, the present embodiment is identical with structure and the connection relationship of aforementioned the first embodiment part, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together for described capillary structure 1021 is for agglomerated powder opisthosoma is as explanation, but do not regard it as and be limited.
Refer to Fig. 3, for the cutaway view of equalizing plate structure of the present invention the 3rd embodiment, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure and connection relationship, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together for described capillary structure 1021 is using grid body as illustrating but not regarding it as and be limited.
Refer to Fig. 4 A, Fig. 4 B, for schematic perspective view and the profile of equalizing plate structure of the present invention the 4th embodiment, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure and connection relationship, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together for, described body 10 also has one first side 11 and one second side 12, described radiating fin 101 is selected in this first side 11 and wherein any side extension institute configuration of the second side 12, and opposite side contacts with a pyrotoxin 2 relatively.
Referring to Fig. 5, and consult in the lump Figure 1B and show, is the flow chart of steps of manufacture method first embodiment of equalizing plate structure of the present invention, as shown in the figure, the manufacture method of equalizing plate structure of the present invention, Bao draws together Xia row Bu Zhou ︰
S1 ︰ makes a body with multiple radiating fins and a chamber with the processing mode extruding;
There is the body 10 of multiple radiating fins 101 and a chamber 102 with the processing mode one-body molded extruding.
S2 ︰ is by the closed at both ends of this body and vacuumize and insert working fluid.
By the closed at both ends of described body 10 and vacuumize and insert working fluid 1022.
Refer to Fig. 6 and consult in the lump Figure 1B and show, for the flow chart of steps of manufacture method second embodiment of equalizing plate structure of the present invention, the present embodiment is identical with aforementioned the first embodiment part steps flow process, therefore will repeat no more at this, only not existing together of the present embodiment and aforementioned the first embodiment forms at least one capillary structure 1021 in the inwall of this chamber 102 for described step S1 ︰ makes one with the processing mode extruding after having body 10 these steps of multiple radiating fins 101 and a chamber 102 simultaneously.
Described step S1 ︰ makes a body with multiple radiating fins and a chamber with the processing mode extruding, and forms at least one capillary structure in the inwall of this chamber simultaneously.
There is the body 10 of multiple radiating fins 101 and a chamber 102 with the processing mode one-body molded extruding, and form at least one capillary structure 1021 in these chamber 102 inwalls simultaneously; Wherein, described capillary structure 1021 can be multiple grooves.
Refer to Fig. 7 and consult in the lump Figure 1B and show, for the flow chart of steps of manufacture method the 3rd embodiment of equalizing plate structure of the present invention, the present embodiment is identical with aforementioned the first embodiment part steps flow process, therefore will repeat no more at this, only not existing together of the present embodiment and aforementioned the first embodiment has and more comprises a step S3 ︰ after body 10 these steps of multiple radiating fins 101 and a chamber 102 and form at least one capillary structure 1021 in the inwall of this chamber 102 for described step S1 ︰ makes one with the processing mode extruding.
Described step S3 ︰ forms at least one capillary structure in the inwall of this chamber.
Form at least one capillary structure 1021 in described chamber 102 inwalls, this capillary structure 1021 can be agglomerated powder opisthosoma and grid body is wherein arbitrary.
One-body molded with chamber 102 by aforesaid radiating fin 101, do not need to relend by welding manner or increase extra machining (as welding) by radiating fin and temperature-uniforming plate combination, so not only can effectively reduce procedure for processing, and then reach and reduce work hours and reduce production costs.
The above, the present invention has following advantages compared to known technology:
1. reduce production costs;
2. reduce work hours.
Below the present invention is described in detail, only the above, be only a preferred embodiment of the present invention, when not limiting scope of the invention process.All equalization variation and modifications etc. of doing according to the present patent application scope, all should still belong to patent covering scope of the present invention.
Claims (10)
1. an equalizing plate structure, is characterized in that, bag is drawn together ︰
One body, has multiple radiating fins and a chamber, and the side extension institute that described radiating fin is located at the contrary aforementioned body of aforementioned body one side direction forms, and this chamber is located in aforementioned body, has a capillary structure and a working fluid in this chamber.
2. equalizing plate structure as claimed in claim 1, is characterized in that, described body also has one first side and one second side, and described radiating fin is selected by wherein arbitrary extension institute configuration of this first side and the second side, and another side contacts with a pyrotoxin relatively.
3. equalizing plate structure as claimed in claim 1, is characterized in that, described capillary structure is that multiple grooves and agglomerated powder opisthosoma and grid body are wherein arbitrary.
4. equalizing plate structure as claimed in claim 1, is characterized in that, described radiating fin and this chamber are formed in one.
5. a manufacture method for equalizing plate structure, is characterized in that, comprises lower row and walks rapid ︰
Make a body with multiple radiating fins and a chamber with the processing mode extruding;
By the closed at both ends of this body and vacuumize and insert working fluid.
6. the manufacture method of equalizing plate structure as claimed in claim 5, it is characterized in that, describedly make one with the processing mode extruding and have and more comprise a step after this step of body of multiple radiating fins and a chamber and form at least one capillary structure in the inwall of this chamber.
7. the manufacture method of equalizing plate structure as claimed in claim 5, is characterized in that, described radiating fin and this chamber are formed in one.
8. the manufacture method of equalizing plate structure as claimed in claim 5, is characterized in that, describedly makes this step of body with multiple radiating fins and a chamber with the processing mode extruding and forms at least one capillary structure in the inwall of this chamber simultaneously.
9. the manufacture method of equalizing plate structure as claimed in claim 8, is characterized in that, described capillary structure is multiple grooves.
10. the manufacture method of equalizing plate structure as claimed in claim 8, is characterized in that, described capillary structure is that agglomerated powder opisthosoma and grid body are wherein arbitrary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210525921.0A CN103874387A (en) | 2012-12-07 | 2012-12-07 | Uniform temperature plate structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210525921.0A CN103874387A (en) | 2012-12-07 | 2012-12-07 | Uniform temperature plate structure and manufacturing method thereof |
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| CN103874387A true CN103874387A (en) | 2014-06-18 |
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| CN201210525921.0A Pending CN103874387A (en) | 2012-12-07 | 2012-12-07 | Uniform temperature plate structure and manufacturing method thereof |
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| CN (1) | CN103874387A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106090647A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | Has the radiator of concealed temperature-uniforming plate |
| CN106090646A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | A kind of radiator having concealed temperature-uniforming plate |
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN109906025A (en) * | 2019-04-24 | 2019-06-18 | 常州恒创热管理有限公司 | A kind of U-shaped temperature-uniforming plate and radiator |
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| US20090151905A1 (en) * | 2007-12-14 | 2009-06-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with vapor chamber |
| CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Uniform-temperature panel and manufacturing method thereof |
| US20100326644A1 (en) * | 2009-06-30 | 2010-12-30 | Shui-Hsu Hung | Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same |
| CN202931737U (en) * | 2012-12-07 | 2013-05-08 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
-
2012
- 2012-12-07 CN CN201210525921.0A patent/CN103874387A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090151905A1 (en) * | 2007-12-14 | 2009-06-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with vapor chamber |
| CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Uniform-temperature panel and manufacturing method thereof |
| US20100326644A1 (en) * | 2009-06-30 | 2010-12-30 | Shui-Hsu Hung | Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same |
| CN202931737U (en) * | 2012-12-07 | 2013-05-08 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546116A (en) * | 2015-09-23 | 2017-03-29 | 迈萪科技股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN106090647A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | Has the radiator of concealed temperature-uniforming plate |
| CN106090646A (en) * | 2016-07-29 | 2016-11-09 | 苏州聚力电机有限公司 | A kind of radiator having concealed temperature-uniforming plate |
| CN109906025A (en) * | 2019-04-24 | 2019-06-18 | 常州恒创热管理有限公司 | A kind of U-shaped temperature-uniforming plate and radiator |
| CN109906025B (en) * | 2019-04-24 | 2024-02-20 | 常州恒创热管理有限公司 | U-shaped temperature equalization plate and radiator |
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Application publication date: 20140618 |
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