US20140182820A1 - Vapor chamber structure - Google Patents

Vapor chamber structure Download PDF

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Publication number
US20140182820A1
US20140182820A1 US13/732,417 US201313732417A US2014182820A1 US 20140182820 A1 US20140182820 A1 US 20140182820A1 US 201313732417 A US201313732417 A US 201313732417A US 2014182820 A1 US2014182820 A1 US 2014182820A1
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US
United States
Prior art keywords
vapor chamber
chamber
radiating fins
main body
chamber structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/732,417
Inventor
Chih-peng Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US13/732,417 priority Critical patent/US20140182820A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIH-PENG
Publication of US20140182820A1 publication Critical patent/US20140182820A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices

Definitions

  • the present invention relates to a vapor chamber structure, and more particularly to a vapor chamber structure that is integrally formed by way of extrusion to have a sealed chamber and a plurality of outward extended radiating fins.
  • the heat dissipation devices generally adopted by the electronic industry for removing heat from the electronic elements include fans, heat sinks and heat pipes.
  • the heat sink is provided to contact with a heat source for absorbing heat, and the absorbed heat is then transferred to a remote location by a heat pipe for dissipating into ambient air.
  • the fan is used to force air flow through the heat sink to carry the absorbed heat away from the heat sink.
  • a vapor chamber is usually selected as the heat dissipation element for heat transfer and heat dissipation.
  • a conventional vapor chamber is formed by closing two mating plates to each other, so as to define a sealed chamber between the two closed plates.
  • the sealed chamber is in a vacuum state and has a supporting structure and a wick structure provided therein.
  • the wick structure for the conventional vapor chamber can be a mesh structure, a sintered-powder structure or a plurality of grooves, and is formed, in a secondary processing, on one side of the plate that is to be closed by the other plate.
  • the prior art vapor chamber has the following disadvantages: (1) requiring higher manufacturing cost; and (2) requiring longer manufacturing time.
  • a primary object of the present invention is to provide a vapor chamber structure that is manufactured with reduced labor cost and shortened manufacturing time.
  • the vapor chamber structure includes a main body internally defining a sealed chamber and having a plurality of radiating fins externally provided thereon.
  • the radiating fins are integrally formed on and outward extended from one side of the main body in a direction opposite to the chamber; and the chamber is internally provided with a wick structure and filled with a working fluid.
  • the vapor chamber structure according to the present invention can be integrally formed by way of extrusion to have the sealed chamber and the plurality of outward extended radiating fins. In this way, the vapor chamber structure can be manufactured with reduced material and labor as well as shortened manufacturing time to largely lower the overall manufacturing cost thereof.
  • FIG. 1A is a perspective sectional view of a vapor chamber structure according to a first embodiment of the present invention
  • FIG. 1B is a cross sectional view of the vapor chamber structure of FIG. 1A ;
  • FIG. 2 is a cross sectional view of a vapor chamber structure according to a second embodiment of the present invention.
  • FIG. 3 is a cross sectional view of a vapor chamber structure according to a third embodiment of the present invention.
  • FIG. 4A is a perspective sectional view of a vapor chamber structure according to a fourth embodiment of the present invention.
  • FIG. 4B is a cross sectional view of the vapor chamber structure of FIG. 4A .
  • FIGS. 1A and 1B are perspective sectional and cross sectional views, respectively, of a vapor chamber structure 1 according to a first embodiment of the present invention.
  • the vapor chamber structure 1 in the first embodiment includes a main body 10 , which defines a sealed chamber 102 and has a plurality of radiating fins 101 provided thereon.
  • the radiating fins 101 are outward extended from one side of the main body 10 in a direction opposite to the chamber 102 .
  • the chamber 102 is internally provided with a wick structure 1021 and filled with a working fluid 1022 .
  • the wick structure 1021 can be formed of a plurality of grooves, a sintered powder structure, or a mesh structure. In the first embodiment, the wick structure 1021 is illustrated as a plurality of grooves without limiting the present invention thereto.
  • the radiating fins 101 and the chamber 102 are integrally formed with one another.
  • FIG. 2 is a cross sectional view of a vapor chamber structure 1 according to a second embodiment of the present invention.
  • the vapor chamber structure 1 in the second embodiment is generally structurally similar to that in the first embodiment, except that the wick structure 1021 in the second embodiment is illustrated as a sintered-powder structure without limiting the present invention thereto.
  • FIG. 3 is a cross sectional view of a vapor chamber structure 1 according to a third embodiment of the present invention.
  • the vapor chamber structure 1 in the third embodiment is generally structurally similar to that in the first embodiment, except that the wick structure 1021 in the third embodiment is illustrated as a mesh structure without limiting the present invention thereto.
  • FIGS. 4A and 4B are perspective sectional and cross sectional views, respectively, of a vapor chamber structure 1 according to a fourth embodiment of the present invention.
  • the vapor chamber structure 1 in the fourth embodiment is generally structurally similar to that in the first embodiment, except that the main body 10 in the fourth embodiment includes a first side 11 and an opposite second side 12 .
  • the radiating fins 101 can be selectively formed on the first side 11 or the second side 12 to outward extend therefrom, while the other side of the main body 10 without the radiating fins 101 is for contacting with a heat source 2 .
  • the manufacturing process of the vapor chamber structure 1 is effectively simplified to reduce the labor cost and the manufacturing time thereof.
  • the vapor chamber structure according to the present invention has the following advantages: (1) reduced manufacturing cost; and (2) reduced labor cost and shortened manufacturing time.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A vapor chamber structure includes a main body internally defining a sealed chamber and having a plurality of radiating fins externally provided thereon. The radiating fins are integrally formed on and outward extended from one side of the main body in a direction opposite to the chamber; and the chamber is internally provided with a wick structure and filled with a working fluid. By integrally forming the radiating fins and the chamber with one another, the vapor chamber structure can be manufactured with reduced labor cost and shortened manufacturing time.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a vapor chamber structure, and more particularly to a vapor chamber structure that is integrally formed by way of extrusion to have a sealed chamber and a plurality of outward extended radiating fins.
    • BACKGROUND OF THE INVENTION
  • Due to the rapid progress in different technological fields, most of the currently available electronic products have largely enhanced functions, and many internal electronic elements of these functionally enhanced electronic products, such as the central processing unit (CPU), the chipset, or the display unit thereof, also have constantly increased operating speed. The electronic elements operating at high speed would produce more heat in one unit time. The produced heat must be timely removed with proper means, so as to avoid lowered stability and performance of the electronic products or even burnout of the electronic elements.
  • The heat dissipation devices generally adopted by the electronic industry for removing heat from the electronic elements include fans, heat sinks and heat pipes. The heat sink is provided to contact with a heat source for absorbing heat, and the absorbed heat is then transferred to a remote location by a heat pipe for dissipating into ambient air. The fan is used to force air flow through the heat sink to carry the absorbed heat away from the heat sink. For a heat source that is located in a considerably narrow space or has a considerably large area, a vapor chamber is usually selected as the heat dissipation element for heat transfer and heat dissipation.
  • A conventional vapor chamber is formed by closing two mating plates to each other, so as to define a sealed chamber between the two closed plates. The sealed chamber is in a vacuum state and has a supporting structure and a wick structure provided therein. The wick structure for the conventional vapor chamber can be a mesh structure, a sintered-powder structure or a plurality of grooves, and is formed, in a secondary processing, on one side of the plate that is to be closed by the other plate. After the two plates are closed together, air enclosed in the sealed chamber is evacuated to produce a vacuum state in the chamber, and then the chamber is filled with a working fluid. When forming the conventional vapor chamber through the above procedures, a lot of labor, time and material are required.
  • In conclusion, the prior art vapor chamber has the following disadvantages: (1) requiring higher manufacturing cost; and (2) requiring longer manufacturing time.
  • It is therefore tried by the inventor to develop an improved vapor chamber structure to eliminate the disadvantages in the prior art vapor chamber.
    • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a vapor chamber structure that is manufactured with reduced labor cost and shortened manufacturing time.
  • To achieve the above and other objects, the vapor chamber structure according to the present invention includes a main body internally defining a sealed chamber and having a plurality of radiating fins externally provided thereon. The radiating fins are integrally formed on and outward extended from one side of the main body in a direction opposite to the chamber; and the chamber is internally provided with a wick structure and filled with a working fluid.
  • The vapor chamber structure according to the present invention can be integrally formed by way of extrusion to have the sealed chamber and the plurality of outward extended radiating fins. In this way, the vapor chamber structure can be manufactured with reduced material and labor as well as shortened manufacturing time to largely lower the overall manufacturing cost thereof.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
  • FIG. 1A is a perspective sectional view of a vapor chamber structure according to a first embodiment of the present invention;
  • FIG. 1B is a cross sectional view of the vapor chamber structure of FIG. 1A;
  • FIG. 2 is a cross sectional view of a vapor chamber structure according to a second embodiment of the present invention;
  • FIG. 3 is a cross sectional view of a vapor chamber structure according to a third embodiment of the present invention;
  • FIG. 4A is a perspective sectional view of a vapor chamber structure according to a fourth embodiment of the present invention; and FIG. 4B is a cross sectional view of the vapor chamber structure of FIG. 4A.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
  • Please refer to FIGS. 1A and 1B that are perspective sectional and cross sectional views, respectively, of a vapor chamber structure 1 according to a first embodiment of the present invention. As shown, the vapor chamber structure 1 in the first embodiment includes a main body 10, which defines a sealed chamber 102 and has a plurality of radiating fins 101 provided thereon. The radiating fins 101 are outward extended from one side of the main body 10 in a direction opposite to the chamber 102. The chamber 102 is internally provided with a wick structure 1021 and filled with a working fluid 1022.
  • The wick structure 1021 can be formed of a plurality of grooves, a sintered powder structure, or a mesh structure. In the first embodiment, the wick structure 1021 is illustrated as a plurality of grooves without limiting the present invention thereto.
  • In the present invention, the radiating fins 101 and the chamber 102 are integrally formed with one another.
  • Please refer to FIG. 2 that is a cross sectional view of a vapor chamber structure 1 according to a second embodiment of the present invention. As shown, the vapor chamber structure 1 in the second embodiment is generally structurally similar to that in the first embodiment, except that the wick structure 1021 in the second embodiment is illustrated as a sintered-powder structure without limiting the present invention thereto.
  • FIG. 3 is a cross sectional view of a vapor chamber structure 1 according to a third embodiment of the present invention. As shown, the vapor chamber structure 1 in the third embodiment is generally structurally similar to that in the first embodiment, except that the wick structure 1021 in the third embodiment is illustrated as a mesh structure without limiting the present invention thereto.
  • FIGS. 4A and 4B are perspective sectional and cross sectional views, respectively, of a vapor chamber structure 1 according to a fourth embodiment of the present invention.
  • As shown, the vapor chamber structure 1 in the fourth embodiment is generally structurally similar to that in the first embodiment, except that the main body 10 in the fourth embodiment includes a first side 11 and an opposite second side 12. The radiating fins 101 can be selectively formed on the first side 11 or the second side 12 to outward extend therefrom, while the other side of the main body 10 without the radiating fins 101 is for contacting with a heat source 2.
  • By integrally forming the radiating fins 101 and the chamber 102 with one another in manufacturing the vapor chamber structure 1, it is not necessary to assemble the radiating fins to the vapor chamber by welding or other additional mechanical processing. Therefore, the manufacturing process of the vapor chamber structure 1 is effectively simplified to reduce the labor cost and the manufacturing time thereof.
  • In summary, compared to the prior art, the vapor chamber structure according to the present invention has the following advantages: (1) reduced manufacturing cost; and (2) reduced labor cost and shortened manufacturing time.
  • The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (4)

What is claimed is:
1. A vapor chamber structure, comprising a main body internally defining a sealed chamber and having a plurality of radiating fins provided thereon; the radiating fins being outward extended from one side of the main body in a direction opposite to the chamber; and the chamber being internally provided with a wick structure and filled with a working fluid.
2. The vapor chamber structure as claimed in claim 1, wherein the main body has a first side and an opposite second side; the radiating fins being outward extended from one of the first and the second side, and the other side of the main body without the radiating fins being used to contact with a heat source.
3. The vapor chamber structure as claimed in claim 1, wherein the wick structure is selected from the group consisting of a plurality of grooves, a sintered-powder structure, and a mesh structure.
4. The vapor chamber structure as claimed in claim 1, wherein the radiating fins and the chamber are integrally formed with one another.
US13/732,417 2013-01-01 2013-01-01 Vapor chamber structure Abandoned US20140182820A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/732,417 US20140182820A1 (en) 2013-01-01 2013-01-01 Vapor chamber structure

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3121546A1 (en) 2015-07-21 2017-01-25 Ernst Gruber Heat distributor element
WO2017030706A3 (en) * 2015-08-14 2017-04-20 Microsoft Technology Licensing, Llc Heat dissipation in electronics
JP2023009837A (en) * 2021-07-08 2023-01-20 明正 陳 Heat radiation net and vapor chamber with the heat radiation net installed

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US20020144804A1 (en) * 2001-01-19 2002-10-10 Yue Liang Thermal transfer device and working fluid therefor including a kinetic ice inhibitor
US6749013B2 (en) * 1997-12-25 2004-06-15 The Furukawa Electric Co., Ltd. Heat sink
US7011146B2 (en) * 2003-02-27 2006-03-14 Nationaltsing Hua University Microchannel heat pipe with parallel grooves for recycling coolant
US20080068802A1 (en) * 2006-09-19 2008-03-20 Inventec Corporation Heatsink device with vapor chamber
US20080110594A1 (en) * 2006-11-10 2008-05-15 Martin Yves C Air/fluid cooling system
US20090151905A1 (en) * 2007-12-14 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber
US7599185B2 (en) * 2008-02-04 2009-10-06 Celsia Technologies Taiwan, Inc. Cooling device
US7621316B2 (en) * 2003-09-12 2009-11-24 The Furukawa Electric Co., Ltd. Heat sink with heat pipes and method for manufacturing the same
US20100326630A1 (en) * 2009-06-24 2010-12-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber and method for manufacturing the same
US20100326644A1 (en) * 2009-06-30 2010-12-30 Shui-Hsu Hung Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6749013B2 (en) * 1997-12-25 2004-06-15 The Furukawa Electric Co., Ltd. Heat sink
US20020144804A1 (en) * 2001-01-19 2002-10-10 Yue Liang Thermal transfer device and working fluid therefor including a kinetic ice inhibitor
US7011146B2 (en) * 2003-02-27 2006-03-14 Nationaltsing Hua University Microchannel heat pipe with parallel grooves for recycling coolant
US7621316B2 (en) * 2003-09-12 2009-11-24 The Furukawa Electric Co., Ltd. Heat sink with heat pipes and method for manufacturing the same
US20110030924A1 (en) * 2003-09-12 2011-02-10 The Furukawa Electric Co., Ltd. Heat sink with heat pipes and method for manufacturing the same
US20080068802A1 (en) * 2006-09-19 2008-03-20 Inventec Corporation Heatsink device with vapor chamber
US20080110594A1 (en) * 2006-11-10 2008-05-15 Martin Yves C Air/fluid cooling system
US20090151905A1 (en) * 2007-12-14 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber
US7599185B2 (en) * 2008-02-04 2009-10-06 Celsia Technologies Taiwan, Inc. Cooling device
US20100326630A1 (en) * 2009-06-24 2010-12-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber and method for manufacturing the same
US20100326644A1 (en) * 2009-06-30 2010-12-30 Shui-Hsu Hung Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3121546A1 (en) 2015-07-21 2017-01-25 Ernst Gruber Heat distributor element
WO2017030706A3 (en) * 2015-08-14 2017-04-20 Microsoft Technology Licensing, Llc Heat dissipation in electronics
US10098259B2 (en) 2015-08-14 2018-10-09 Microsoft Technology Licensing, Llc Heat dissipation in electronics
JP2023009837A (en) * 2021-07-08 2023-01-20 明正 陳 Heat radiation net and vapor chamber with the heat radiation net installed

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Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, CHIH-PENG;REEL/FRAME:029551/0427

Effective date: 20130101

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION