CN109906025B - U-shaped temperature equalization plate and radiator - Google Patents
U-shaped temperature equalization plate and radiator Download PDFInfo
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- CN109906025B CN109906025B CN201910333089.6A CN201910333089A CN109906025B CN 109906025 B CN109906025 B CN 109906025B CN 201910333089 A CN201910333089 A CN 201910333089A CN 109906025 B CN109906025 B CN 109906025B
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- 239000007788 liquid Substances 0.000 claims description 40
- 230000007704 transition Effects 0.000 claims 3
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 238000001704 evaporation Methods 0.000 description 13
- 230000008020 evaporation Effects 0.000 description 13
- 239000012071 phase Substances 0.000 description 9
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000007791 liquid phase Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention relates to the technical field of heat dissipation, in particular to a U-shaped temperature equalizing plate and a radiator. The U-shaped temperature equalizing plate comprises a first temperature equalizing plate, a second temperature equalizing plate and a connecting plate for connecting the first temperature equalizing plate and the second temperature equalizing plate, wherein a first cavity is arranged in the first temperature equalizing plate, and a second cavity is arranged in the second temperature equalizing plate. Compared with the traditional structure, the U-shaped temperature equalizing plate provided by the invention has the advantages that the first temperature equalizing plate and the second temperature equalizing plate are connected through the connecting plate, so that the contact area of the U-shaped temperature equalizing plate and a heat source can be increased, and the heat dissipation efficiency of the U-shaped temperature equalizing plate is improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a U-shaped temperature equalizing plate and a radiator.
Background
With the rapid development of miniaturization, integration and high efficiency of power electronic equipment and devices, the performance and heat dissipation capacity of the devices are continuously increased, and a series of problems such as uneven heat flux density distribution, extremely large local heat flux density, heat accumulation in local areas, overhigh local temperature and the like are accompanied, and the problems present new challenges for the thermal design of the power electronic equipment, so that a thermal management system is required to meet the requirements of high performance, high compactness, high reliability and high flexibility.
The flat heat pipe has strong phase change heat transfer capability, has been applied to replace the traditional pure metal radiator fin, can reduce heat source and air thermal resistance to the maximum extent, and effectively strengthens the convection heat exchange and heat radiation of the radiator surface. However, the application of the flat heat pipe is limited to the mode of directly installing the flat heat pipe on the base of the radiator at present, and although a cavity capable of containing the phase change working medium exists in the flat heat pipe, the contact area between the flat heat pipe and the base is smaller, so that the overall radiating effect is reduced to a certain extent.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the U-shaped temperature equalizing plate and the radiator with higher heat dissipation efficiency are provided.
The technical scheme adopted for solving the technical problems is as follows:
the utility model provides a U-shaped samming board, the samming board of U-shaped includes first samming board and second samming board and connects first samming board with the connecting plate of second samming board, be equipped with first cavity in the first samming board, be equipped with the second cavity in the second samming board.
Further, at least one connecting channel is arranged in the connecting plate, and the first cavity and the second cavity are mutually communicated through the connecting channel.
Further, the width of the connecting channel is 3-10 mm.
Further, the height of the connecting channel is 1.5-3 mm.
Further, the connection channel is disposed near one end of the connection board in the length direction.
Further, the first cavity, the second cavity and the connecting channel are filled with phase-change working media, when the U-shaped temperature equalizing plate is placed at an included angle of more than 0 degrees and less than or equal to 90 degrees with the horizontal plane along the length direction of the connecting plate, and the connecting channel is positioned at the lower end of the connecting plate, the liquid level of the phase-change working media in the first cavity or the second cavity is higher than the connecting channel.
Further, the first temperature equalizing plate and the second temperature equalizing plate are parallel to each other and perpendicular to the connecting plate.
The radiator comprises a base and the U-shaped temperature equalizing plate, wherein an assembly groove matched with a connecting plate of the U-shaped temperature equalizing plate is formed in the base.
Further, when the radiator is used, the connecting channel is positioned at the lower end of the connecting plate in the vertical direction, and the connecting channel is immersed below the liquid level of the phase-change working medium.
Further, a plurality of convex columns are arranged in the assembly groove, and through holes or grooves matched with the convex columns are formed in positions, corresponding to the convex columns, on the connecting plate of the U-shaped temperature equalization plate.
Further, the position of the assembly groove corresponding to the connecting channel is deepened and widened to form an avoidance groove.
Compared with the traditional structure, the U-shaped temperature equalizing plate provided by the invention has the advantages that the first temperature equalizing plate and the second temperature equalizing plate are connected through the connecting plate, so that the contact area of the U-shaped temperature equalizing plate and the heat dissipation source can be increased, and the heat dissipation efficiency is improved.
Furthermore, the U-shaped temperature equalizing plate provided by the invention has the advantages that the first cavity in the first temperature equalizing plate and the second cavity in the second temperature equalizing plate are communicated through the connecting channel on the connecting plate, and the closed cavity is formed in the U-shaped temperature equalizing plate, and because the closed cavity is an integral communicating channel, the phase change working medium does not need to be respectively filled into the first cavity and the second cavity, only one-time filling is needed, the filling efficiency is improved, and the filling cost is saved.
According to the radiator disclosed by the invention, the base and the U-shaped temperature-equalizing plate can be connected with the connecting plate in a matching way through the assembly groove, and the convex column on the base can be connected with the through hole or the groove on the connecting plate in a matching way, so that the contact area between the base and the U-shaped temperature-equalizing plate is further increased, and the radiating efficiency is improved.
Drawings
The invention is further described below with reference to the drawings and examples.
FIG. 1 is a schematic perspective view of a U-shaped temperature equalization plate according to a first embodiment;
FIG. 2 is a schematic view of a base in the first embodiment;
FIG. 3 is a front view of a U-shaped temperature uniformity plate according to a first embodiment;
FIG. 4 is a cross-sectional view taken along line D-D of FIG. 3;
fig. 5 is a schematic perspective view of a radiator in a second embodiment;
FIG. 6 is a schematic diagram showing an expanded structure of a U-shaped temperature equalization plate in the second embodiment;
fig. 7 is a schematic perspective view of a U-shaped temperature equalization plate in the second embodiment when the U-shaped temperature equalization plate is vertically placed;
fig. 8 is a schematic perspective view of a base in the second embodiment;
fig. 9 is a front view of a radiator in the second embodiment;
FIG. 10 is a cross-sectional view taken along line C-C of FIG. 9;
FIG. 11 is an enlarged schematic view at B in FIG. 10;
fig. 12 is a schematic diagram showing an expanded structure of a U-shaped temperature equalization plate in the third embodiment.
In the figure: in the figure, the names and numbers of the parts are respectively as follows:
base 1 assembly groove 11 convex column 12
Dodge groove 13U shape samming board 2 first samming board 21
The second temperature equalizing plate 22 is connected with the first cavity 211 of the plate 23
The second cavity 221 connects with the channel 231
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. The figure is a simplified schematic diagram illustrating the basic structure of the invention only by way of illustration, and therefore it shows only the constitution related to the invention.
Example 1
Referring to fig. 1-4, the heat sink includes a base 1 and a U-shaped temperature-equalizing plate 2 disposed on the base 1, wherein the U-shaped temperature-equalizing plate 2 includes a first temperature-equalizing plate 21, a second temperature-equalizing plate 22, and a connecting plate 23 connecting the first temperature-equalizing plate 21 and the second temperature-equalizing plate 22, and the first temperature-equalizing plate 21 and the second temperature-equalizing plate 22 are parallel to each other and perpendicular to the connecting plate 23. The first temperature equalizing plate 21 is provided with a first cavity 211, and the second temperature equalizing plate 22 is provided with a second cavity 221. The first cavity 211 and the second cavity 221 are filled with liquid phase-change working media, when the liquid phase-change working media in the first cavity 211 and the second cavity 221 absorb heat of a heat source and then vaporize, the gaseous phase-change working media rapidly expand and then fill the whole cavity, when the gaseous phase-change working media move to a condensation section and then cool and liquefy, and then the liquid phase-change working media are guided to flow back to an evaporation section of the cavity again.
In this embodiment, the base 1 and the U-shaped temperature equalizing plate 2 are assembled by press-fitting. The base 1 is provided with an assembly groove 11 matched with a connecting plate 23 of the U-shaped temperature equalizing plate 2, the U-shaped temperature equalizing plate 2 is assembled, a plurality of convex columns 12 are arranged in the assembly groove 11, a plurality of through holes 232 matched with the convex columns 12 are formed in corresponding positions of the connecting plate 23, and the through holes 232 are in interference fit with the convex columns 12.
When the heat source heat dissipation device is used, a heat source needing to dissipate heat is attached to the inner side of the base 1 (namely, the side far away from the U-shaped temperature-equalizing plate 2) or is close to the inner side of the base 1, heat of the heat source is transferred to the outer side of the base 1 (namely, the side close to the U-shaped temperature-equalizing plate 2) from the inner side of the base 1, the liquid phase-change working medium absorbs heat and then is vaporized, the liquid phase-change working medium is condensed into the liquid phase-change working medium after being released heat in a condensation section flowing to the U-shaped temperature-equalizing plate 2, and the liquid phase-change working medium flows back to an evaporation section of the U-shaped temperature-equalizing plate 2.
In this embodiment, the first temperature-equalizing plate 21 and the second temperature-equalizing plate 22 are connected by the connecting plate 23, and the contact area between the U-shaped temperature-equalizing plate 2 and the heat source can be increased by the connecting plate 23, thereby improving the heat dissipation efficiency.
Example two
Referring to fig. 5-11, a second embodiment of the present invention provides a heat sink, which includes a base 1 and a U-shaped temperature-equalizing plate 2 disposed on the base 1, wherein the U-shaped temperature-equalizing plate 2 includes a first temperature-equalizing plate 21, a second temperature-equalizing plate 22, and a connecting plate 23 connecting the first temperature-equalizing plate 21 and the second temperature-equalizing plate 22, and the first temperature-equalizing plate 21 and the second temperature-equalizing plate 22 are parallel to each other and perpendicular to the connecting plate 23. The first temperature equalizing plate 21 is internally provided with a first cavity 211, the second temperature equalizing plate 22 is internally provided with a second cavity 221, the connecting plate 23 is internally provided with a connecting channel 231, and the first cavity 211 and the second cavity 221 are mutually communicated through the connecting channel 231. The first cavity 211, the second cavity 221 and the connection channel 231 form a closed cavity. The liquid phase-change working medium is filled in the closed cavity, the liquid phase-change working medium in the closed cavity is vaporized after absorbing heat of a heat source during working, the gaseous phase-change working medium rapidly expands to fill the whole closed cavity, the gaseous phase-change working medium is cooled and liquefied after moving to the condensation section, and then the liquid phase-change working medium is guided to flow back to the evaporation section of the closed cavity again. The width a of the connection channel 231 is 3-10 mm, and the height h of the connection channel 231 is 1.5-3 mm to ensure that the liquid phase change working medium and the gas phase change working medium can flow rapidly along the connection channel 231. In this embodiment, the connection channel 231 is provided, and the first cavity 211 and the second cavity 221 can be filled with the phase-change working medium by one-time vacuumizing, one-time filling and sealing by welding, so that the process is simpler.
The connection passage 231 is near one end of the connection plate 23 in the longitudinal direction in this embodiment. When the radiator in this embodiment is in use, the U-shaped temperature equalizing plate 2 is vertically disposed along the length direction of the connecting plate 23 (i.e. the connecting plate 23 is perpendicular to the horizontal plane), at this time, the connecting channel 231 is located at the lower end of the vertical direction of the connecting plate 23, the liquid level of the liquid working medium is higher than the top of the connecting channel 231, i.e. the connecting channel 231 is immersed below the liquid level to play a role of a communicating vessel, so as to ensure that the liquid working mediums in the first cavity 211 and the second cavity 221 can circulate through the connecting channel 231, so that the liquid levels in the first cavity 211 and the second cavity 221 are leveled, and the U-shaped temperature equalizing plate 2 is ensured to have a uniform heat dissipation effect. In other embodiments, when the radiator is in use, the included angle between the length direction of the connection plate 23 and the horizontal plane of the U-shaped temperature equalizing plate 2 may be an acute angle (greater than 0 degrees and less than 90 degrees), at this time, as long as the connection channel 231 is guaranteed to be located at one end of the connection plate 23 near the horizontal plane, and the liquid level of the liquid working medium is higher than the top of the connection channel 231, that is, the connection channel 231 is immersed below the liquid level to play a role of a communicating vessel, so that the liquid working medium in the first cavity 211 and the second cavity 221 can circulate through the connection channel 231, and the U-shaped temperature equalizing plate 2 can be guaranteed to have a better heat dissipation effect.
When the U-shaped temperature equalization plate 2 according to the embodiment of the present invention is used, the U-shaped temperature equalization plate 2 is vertically placed or is disposed at a certain angle with respect to the horizontal plane, if the connection channel 231 is located at one end of the connection plate 23 far away from the horizontal plane, the connection channel 231 is located above the liquid level of the liquid working medium in the first cavity 211 and the second cavity 221, and when the U-shaped temperature equalization plate 2 works, the connection channel 231 cannot well communicate the liquid working medium in the first cavity 211 and the second cavity 221, so that the heat dissipation effect of the U-shaped temperature equalization plate 2 is poor. Further, at this time, if the heat source powers of the first temperature equalizing plate 21 and the second temperature equalizing plate 22 are different, and if the heat source power of the evaporation section of the first temperature equalizing plate 21 is greater than the heat source power of the evaporation section of the second temperature equalizing plate 22, the flow rate of the phase change evaporation of the liquid phase working medium in the first temperature equalizing plate 21 is greater, and if the first cavity 211 and the second cavity 221 are not communicated with each other, the liquid phase working medium in the first cavity 211 is evaporated at a higher flow rate and faster evaporation, the liquid level of the working medium in the first cavity 211 is lower than the liquid level of the second cavity 221, and in severe cases, the liquid phase working medium in the first cavity 211 is completely evaporated and cannot work normally.
In this embodiment, the two cavities of the U-shaped temperature-equalizing plate 2 are communicated, and the liquid levels in the first cavity 211 and the second cavity 221 are automatically balanced, so that the U-shaped temperature-equalizing plate 2 of this embodiment has the function of automatically adjusting the working medium balance liquid level and flow of the temperature-equalizing plate for unbalanced heat sources, and thus has better heat dissipation performance.
In this embodiment, the connection channel 231 is immersed below the liquid level of the liquid working medium, the lower ends of the first cavity 211 and the second cavity 221 are in a liquid phase which is mutually communicated, and the upper part is in a gas phase which is not mutually communicated, so that the liquid working medium at the lower end (evaporation section) of the first cavity 211 and the lower end (evaporation section) of the second cavity 221 absorbs heat and evaporates, flows to the upper condensation sections of the first cavity 211 and the second cavity 221 respectively, flows back to the evaporation section below the cavities after being cooled, and circulates to absorb heat and evaporate to further play a role of heat dissipation.
In this embodiment, the base 1 and the U-shaped temperature equalizing plate 2 are assembled by press-fitting. In this embodiment, an assembly groove 11 matched with a connecting plate 23 of a U-shaped temperature equalizing plate 2 is formed in a base 1, a plurality of convex columns 12 are arranged in the assembly groove 11, a plurality of through holes 232 matched with the convex columns 12 are formed in corresponding positions of the connecting plate 23, the through holes 232 are in interference fit with the convex columns 12, and a connecting channel 231 on the connecting plate 23 avoids the positions of the through holes 232. In this embodiment, the width of the position of the assembly groove 11 corresponding to the connection channel 231 is widened and the depth is deepened to form the avoidance groove 13, so that the position corresponding to the connection channel 231 is not stressed or is stressed less in the press-fitting process, and the connection channel 231 is prevented from being shrunken due to extrusion.
When the flat plate is bent by using the bending die in the processing process, the U-shaped temperature equalizing plate 2 of this embodiment is also provided with a groove for avoiding the widening of the width and the deepening of the depth at the position corresponding to the connection channel 231, so as to avoid the collapse of the connection channel.
It will be appreciated that in other embodiments not shown, the base 1 may be provided with only the fitting groove 11 matching with the connecting plate 23, and the base 1 and the U-shaped temperature equalizing plate 2 are press-fitted with each other through the connecting plate 23 and the fitting groove 11.
It will be appreciated that in other embodiments, not shown, a plurality of protruding columns are disposed in the assembly groove 11, a groove matched with the protruding column 12 is disposed on the connecting plate 23 of the U-shaped temperature equalization plate 2 at a position away from the first temperature equalization plate 21 and the second temperature equalization plate 22 corresponding to the protruding column 12, and the groove avoids the position of the connecting channel 231, that is, in other embodiments, the groove may be used instead of the through hole 232 in the second embodiment.
It will be appreciated that in other embodiments not shown, a recess may be provided in the mounting groove 11 and a post provided in the web 23 at a location corresponding to the recess.
It will be appreciated that in other embodiments not shown, the U-shaped temperature equalizing plate 2 may be more than two.
In this embodiment, the closed cavity is set to a negative pressure state, so that the boiling point of the liquid phase change working medium in the negative pressure state is reduced, thereby facilitating rapid evaporation of the phase change working medium after being heated and timely radiating. It is understood that the phase change working fluid includes, but is not limited to, water, alcohol, and propanol. In addition, because the closed cavity is an integral communication channel, the phase change working medium does not need to be respectively filled into the first cavity 211 and the second cavity 221, and only one-time filling is needed, so that the filling efficiency is improved, and the filling cost is saved.
When the heat source heat dissipation device is used, a heat source needing to dissipate heat is attached to the inner side of the base 1 (namely, the side far away from the U-shaped temperature-equalizing plate 2) or is close to the inner side of the base 1, heat of the heat source is transferred to the outer side of the base 1 (namely, the side close to the U-shaped temperature-equalizing plate 2) from the inner side of the base 1, the liquid phase-change working medium absorbs heat and then is vaporized, the liquid phase-change working medium is condensed into the liquid phase-change working medium after being released heat in a condensation section flowing to the U-shaped temperature-equalizing plate 2, and the liquid phase-change working medium flows back to an evaporation section of the U-shaped temperature-equalizing plate 2.
Example III
Referring to fig. 12, the U-shaped temperature equalizing plate of the present embodiment includes a first temperature equalizing plate 21, a second temperature equalizing plate 22, and a connecting plate 23 connecting the first temperature equalizing plate 21 and the second temperature equalizing plate 22, where the first temperature equalizing plate 21 and the second temperature equalizing plate 22 are parallel to each other and perpendicular to the connecting plate 23. The first temperature equalizing plate 21 is provided with a first cavity (not shown), the second temperature equalizing plate 22 is provided with a second cavity (not shown), the connecting plate 23 is provided with a plurality of connecting channels 231, and the first cavity and the second cavity are mutually communicated through the connecting channels 231. The first cavity, the second cavity and the connection channel 231 form a closed cavity. The liquid phase-change working medium is filled in the closed cavity, the liquid phase-change working medium in the closed cavity is vaporized after absorbing heat of a heat source during working, the gaseous phase-change working medium rapidly expands to fill the whole closed cavity, the gaseous phase-change working medium is cooled and liquefied after moving to the condensation section, and then the liquid phase-change working medium is guided to flow back to the evaporation section of the closed cavity again.
The radiator of this embodiment includes base and above-mentioned U-shaped samming board, and base and the equal Wen Bantong pressure equipment mode of U-shaped are assembled. In this embodiment, an assembly groove matched with the connecting plate 23 of the U-shaped temperature equalizing plate is formed in the base, a plurality of convex columns are formed in the assembly groove, a plurality of through holes matched with the convex columns are formed in corresponding positions of the connecting plate 23, the through holes are in interference fit with the convex columns, and the connecting channels 231 on the connecting plate 23 avoid the positions of the through holes. In this embodiment, the width of the assembly groove corresponding to the position of the connection channel 231 is widened and the depth is deepened to form an avoidance groove, so that the position corresponding to the connection channel 231 is not stressed or stressed less in the press-fitting process, and the connection channel 231 is prevented from being shrunken due to extrusion.
The setting of a plurality of connecting channel 231 in this embodiment can realize the quick intercommunication of first cavity and second cavity, improves the radiating effect, can satisfy the heat dissipation needs on high-power equipment surface.
While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (6)
1. The U-shaped temperature-equalizing plate is characterized by comprising a first temperature-equalizing plate, a second temperature-equalizing plate and a connecting plate for connecting the first temperature-equalizing plate and the second temperature-equalizing plate, wherein a first cavity is arranged in the first temperature-equalizing plate, and a second cavity is arranged in the second temperature-equalizing plate; be equipped with a plurality of connecting channels in the connecting plate, first cavity the second cavity passes through connecting channel intercommunication each other, first cavity the second cavity reaches connecting channel intussuseption is filled with the phase transition working medium, works as the U-shaped samming board is followed the contained angle of length direction and the horizontal plane of connecting plate is greater than 0 degree and is less than or equal to 90 degrees and places, just connecting channel is located when connecting plate length direction's lower extreme, first cavity or the liquid level of the phase transition working medium in the second cavity is higher than connecting channel, so that connecting channel submergence is in the liquid level below of phase transition working medium.
2. The U-shaped temperature equalization plate according to claim 1, wherein the width of the connecting channel is 3-10 mm.
3. The U-shaped temperature equalization plate of claim 1, wherein said first temperature equalization plate and said second temperature equalization plate are parallel to each other and perpendicular to said connection plate.
4. A radiator characterized by comprising a base and the U-shaped temperature equalizing plate according to any one of claims 1-3, wherein the base is provided with an assembly groove matched with a connecting plate of the U-shaped temperature equalizing plate.
5. The heat radiator as claimed in claim 4, wherein a plurality of protruding columns are provided in the assembly groove, and through holes or grooves matched with the protruding columns are provided on the connection plate of the U-shaped temperature equalization plate at positions corresponding to the protruding columns.
6. The heat sink of claim 4, wherein the fitting groove is deepened and widened to form a relief groove at a position corresponding to the connection passage.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910333089.6A CN109906025B (en) | 2019-04-24 | 2019-04-24 | U-shaped temperature equalization plate and radiator |
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| CN201910333089.6A CN109906025B (en) | 2019-04-24 | 2019-04-24 | U-shaped temperature equalization plate and radiator |
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| CN109906025A CN109906025A (en) | 2019-06-18 |
| CN109906025B true CN109906025B (en) | 2024-02-20 |
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| WO2021054755A1 (en) * | 2019-09-19 | 2021-03-25 | 주식회사 케이엠더블유 | Antenna device |
| CN112087925B (en) * | 2020-09-07 | 2023-03-03 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Underwater equipment heat radiation structure based on three-dimensional temperature-uniforming plate and underwater equipment |
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Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd. Country or region after: China Address before: 213000 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd. Country or region before: China |