CN207752431U - A kind of liquid cooling system - Google Patents

A kind of liquid cooling system Download PDF

Info

Publication number
CN207752431U
CN207752431U CN201721864048.2U CN201721864048U CN207752431U CN 207752431 U CN207752431 U CN 207752431U CN 201721864048 U CN201721864048 U CN 201721864048U CN 207752431 U CN207752431 U CN 207752431U
Authority
CN
China
Prior art keywords
cooling
heating
liquid
liquid level
cooling fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721864048.2U
Other languages
Chinese (zh)
Inventor
沈卫东
吴宏杰
王晨
张鹏
彭晶楠
李星
李洪民
孙振
陈进
范娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dawning data infrastructure innovation technology (Beijing) Co.,Ltd.
Original Assignee
Shuguang Energy Saving Technology (beijing) Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shuguang Energy Saving Technology (beijing) Ltd By Share Ltd filed Critical Shuguang Energy Saving Technology (beijing) Ltd By Share Ltd
Priority to CN201721864048.2U priority Critical patent/CN207752431U/en
Application granted granted Critical
Publication of CN207752431U publication Critical patent/CN207752431U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The utility model discloses a kind of liquid cooling systems, including:Refrigerant and the cooling fin for being connected to heating device surface;Wherein, cooling fin is vertical with the liquid level of refrigerant, and a part for cooling fin is located at the top of liquid level, and another part is located at the lower section of liquid level.By installing cooling fin on heating element, cooling fin extends into liquid level hereinafter, taking away heat in a manner of phase transformation.The radiating, is energy saving of immersion liquid cooling system, high efficiency and heat radiation can be realized, more particularly to realize the radiating of immersion liquid cooling middle low power component, energy saving, high efficiency and heat radiation.

Description

A kind of liquid cooling system
Technical field
The utility model is related to cooling system technical fields, it particularly relates to a kind of liquid cooling system.
Background technology
Common computer depends on greatly cold air and cools down to machine, and water cooling or liquid cooling have two big benefits:First, its handle Coolant is directly directed to heat source, rather than the indirect refrigeration as air-cooled;Second is that compared with air-cooled, what per unit volume was transmitted Heat, that is, radiating efficiency is up to 3500 times.Water-filled radiator appeared in market, the servers such as Hewlett-Packard, IBM at 2008 or so The company of giant and some other absorbed data center's technology all successively released water-cooling product.
Latent heat of vaporization when evaporation cooling is using fluid boiling from calorifics principle takes away heat.It is this to be boiled using fluid The type of cooling of latent heat of vaporization when rising just is called " evaporation cooling ".Due to fluid the latent heat of vaporization than fluid specific heat greatly very It is more, so transpiration-cooled cooling effect is more notable.
In direct-type liquid cooling system, that is, when using refrigerant to carry out immersion type cooling, fin and fan are eliminated, only with system The phase transformation of cryogen is exchanged heat to cool down heating element.
In immersion liquid cooling system, certain heating elements above mainboard for some reason, such as boil Liquid level big ups and downs when generation, to be in gas-liquid mixed area or gas phase zone so that it leaves refrigerant, to fill Dispersion heat.
Utility model content
For problem present in the relevant technologies, the utility model proposes a kind of liquid cooling systems, can improve above mainboard Heating device heat dissipation effect.
What the technical solution of the utility model was realized in:
One side according to the present utility model provides a kind of liquid cooling system, including:Refrigerant and it is connected to fever The cooling fin of device surface;Wherein, cooling fin is vertical with the liquid level of refrigerant, and a part for cooling fin is located at the upper of liquid level Side, another part are located at the lower section of liquid level.
Another part of embodiment according to the present utility model, the cooling fin below liquid level is by strengthening at boiling The surface of reason.
The material of embodiment according to the present utility model, cooling fin is metal.
Embodiment according to the present utility model, heating device have the liquid level vertical surface with refrigerant, cooling fin covering On the surface.
Embodiment according to the present utility model, the quantity of heating device be it is multiple, cooling fin simultaneously with multiple heating devices Connection.
Embodiment according to the present utility model, multiple heating devices are arranged successively on the direction for the liquid level for being parallel to refrigerant Row, cooling fin are upwardly extended in the side for the liquid level for being parallel to refrigerant.
Embodiment according to the present utility model is additionally provided with the second heating device below the liquid level of refrigerant.
Embodiment according to the present utility model, the second heating device are located at the underface of heating device.
The utility model extends into liquid level hereinafter, with phase transformation by installing cooling fin, cooling fin on heating element Mode takes away heat.The radiating, is energy saving of immersion liquid cooling system, high efficiency and heat radiation can be realized, more particularly to realize immersion liquid The radiating, is energy saving of cold middle low power component, high efficiency and heat radiation.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this A little attached drawings obtain other attached drawings.
Fig. 1 a are the schematic side views according to the liquid cooling system of the utility model embodiment;
Fig. 1 b are the schematic elevation views according to the liquid cooling system of the utility model embodiment;
Fig. 2 is the schematic diagram for strengthening boiling processing surface.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, the every other embodiment that those of ordinary skill in the art are obtained all belongs to In the range of the utility model protection.
In conjunction with shown in Fig. 1 a and Fig. 1 b, include according to the liquid cooling system of the utility model embodiment:Refrigerant and connection Cooling fin 10 in 20 surface of heating device;Wherein, cooling fin 10 is vertical with the liquid level 15 of refrigerant, and the one of cooling fin 10 Part is located at the top of liquid level 15, and another part 12 is located at the lower section of liquid level 15.Wherein, heating device 20 is to be located at server master Heating device on plate 30.
In immersion liquid cooling system, for some reason, such as boiling when liquid level big ups and downs, can make certain hairs Hot component is exposed to except refrigerant, is in gas-liquid mixed area or even gas phase zone.In order to solve this part heating element Heat dissipation problem, especially low power heating device, may be used scheme as above.One gold of crimping fastening on heating element The cooling fin 10 of category, the cooling fin 10 have the part 12 for stretching into 15 lower section of refrigerant liquid level.
The above-mentioned technical proposal of the utility model, by installing cooling fin 10 on heating element, cooling fin 10 extends Into liquid level 15 hereinafter, taking away heat in a manner of phase transformation.It can realize the radiating, is energy saving of immersion liquid cooling system, high efficiency and heat radiation, More particularly to realize the radiating of immersion liquid cooling middle low power component, energy saving, high efficiency and heat radiation.
Wherein, the material of cooling fin 10 is metal.
Preferably, another part 12 positioned at the cooling fin 10 of 15 lower section of liquid level is the surface by strengthening boiling processing. In actual use, the heat of lower-powered heating element is by 10 heat conduction of metal fin, and cooling fin 10 then stretches into In refrigerant, it is immersed in 15 part 12 below of refrigerant liquid level and carries out strengthening boiling processing, increase the vaporization nucleus of metal surface The heart takes away heat by the phase transformation of refrigerant.So as to enable the heating element for being located at 15 top of liquid level to be radiated, It will not overtemperature.Fig. 2 illustratively shows the schematic diagram for strengthening boiling processing surface.
As illustrated in figs. 1A and ib, there is heating device 20 the liquid level vertical surface with refrigerant, cooling fin 10 to be covered in On the surface of heating device 20.
In one embodiment, the quantity of heating device 20 can be it is multiple, and cooling fin 10 simultaneously with multiple fevers Device 20 connects.In the present embodiment, multiple heating devices 20 are arranged in order on the direction for the liquid level 15 for being parallel to refrigerant, Cooling fin 10 is upwardly extended in the side for the liquid level 15 for being parallel to refrigerant.
In one embodiment, the second heating device 40 is additionally provided with below the liquid level of refrigerant 15.Wherein, the second hair Thermal device 40 is located at the underface of heating device 20.Second heating device 40 can be the heating device of such as CPU.In this implementation Example in, for some reason, for example, boiling when liquid level big ups and downs, can make certain lower-powered hairs right over CPU Hot component is exposed to except refrigerant, is in gas-liquid mixed area or even gas phase zone.In order to solve this part heating element Heat dissipation problem, one metal fin 10 of crimping fastening on row's heating element arranged side by side, the length of the cooling fin 10 are super Go out heating element size, lower part is stretched under refrigerant liquid level 15.
In conclusion the utility model on the small-power heating element positioned at ullage by installing heat dissipation metal Piece, cooling fin lower part carries out strengthening boiling processing, and stretches into liquid level hereinafter, taking away heat in a manner of phase transformation.It can realize submergence The radiating, is energy saving of formula liquid cooling middle low power component, high efficiency and heat radiation.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model Protection domain within.

Claims (8)

1. a kind of liquid cooling system, which is characterized in that including:Refrigerant and the cooling fin for being connected to heating device surface;
Wherein, the cooling fin is vertical with the liquid level of the refrigerant, and a part for the cooling fin is located at the liquid level Top, another part is located at the lower section of the liquid level.
2. liquid cooling system according to claim 1, which is characterized in that be located at the institute of the cooling fin below the liquid level It is the surface by strengthening boiling processing to state another part.
3. liquid cooling system according to claim 1, which is characterized in that the material of the cooling fin is metal.
4. liquid cooling system according to claim 1, which is characterized in that the heating device has the liquid with the refrigerant Face vertical surface, the cooling fin covering is on said surface.
5. liquid cooling system according to claim 1, which is characterized in that the quantity of the heating device be it is multiple, it is described dissipate Backing is connect with multiple heating devices simultaneously.
6. liquid cooling system according to claim 5, which is characterized in that the multiple heating device is being parallel to the refrigeration It is arranged in order on the direction of the liquid level of agent, the cooling fin is upwardly extended in the side for the liquid level for being parallel to the refrigerant.
7. liquid cooling system according to claim 1, which is characterized in that be additionally provided with below the liquid level of the refrigerant Two heating devices.
8. liquid cooling system according to claim 7, which is characterized in that second heating device is located at the heating device Underface.
CN201721864048.2U 2017-12-27 2017-12-27 A kind of liquid cooling system Active CN207752431U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721864048.2U CN207752431U (en) 2017-12-27 2017-12-27 A kind of liquid cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721864048.2U CN207752431U (en) 2017-12-27 2017-12-27 A kind of liquid cooling system

Publications (1)

Publication Number Publication Date
CN207752431U true CN207752431U (en) 2018-08-21

Family

ID=63150660

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721864048.2U Active CN207752431U (en) 2017-12-27 2017-12-27 A kind of liquid cooling system

Country Status (1)

Country Link
CN (1) CN207752431U (en)

Similar Documents

Publication Publication Date Title
CN104519722B (en) Control device of liquid cooling and the server with the device
CN205793895U (en) Radiating subassembly
CN108153401A (en) A kind of computer server radiator
CN207488929U (en) A kind of contact cold energy radiator
CN106383562A (en) Chilling plate water-cooling radiating device
CN201251749Y (en) Novel refrigerating and heat-dissipating device of CPU semiconductor
TWM426065U (en) Heat sink module with loop-type vapor chamber
CN207752431U (en) A kind of liquid cooling system
CN208370095U (en) Cabinet-type cooling system
CN207610584U (en) A kind of microchannel heat sink
CN108489303A (en) A kind of heat sink arrangement with thermal insulation layer
CN108196650A (en) Supercomputer cooling heat radiator based on liquid metal
CN205665634U (en) Liquid cooling's rack -mounted server
CN206788697U (en) A kind of high-efficient heat-dissipating computer motherboard
CN104317374A (en) Radiating device and method
CN201212970Y (en) Water cooling and heat radiating system for personal high performance computer
CN109814689A (en) Liquid cooled server
CN206341248U (en) A kind of cooling system
CN109271007A (en) A kind of high-availability computer CPU radiator
CN205450900U (en) Overall arrangement of water -cooling all -in -one inner structure
CN207909067U (en) A kind of computer server radiator
CN109068539A (en) A kind of segmented air duct partition apparatus
CN204272578U (en) A kind of novel immersion heat abstractor
CN106993393A (en) A kind of heat dissipation equipment and terminal
CN107943256A (en) A kind of radiator

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 100193 building 36, Zhongguancun Software Park, 8 North East West Road, Haidian District, Beijing.

Patentee after: Dawning data infrastructure innovation technology (Beijing) Co.,Ltd.

Address before: 100193 room 528, 5th floor, building 36, courtyard 8, Dongbeiwang Road, Haidian District, Beijing

Patentee before: SUGON ENERGY-SAVING TECHNOLOGY (BEIJING) Co.,Ltd.