M267517 四、創作說明（1) 【新型所屬之技術領域】 本創作是有關於一種均溫板散熱器（四）， T電腦之發熱元件上，可將發熱元件所產生之K 出，而增加散熱器之熱傳效果及散熱效率。’、、、里、W 【先前技術】 目前業界在電子元件之散熱方面， 組織等導熱結棬w s女上i j用熱管、毛細 率、重量輕、2ΐ!;,傳能力，快速傳熱、高熱傳導 結構間早及多用途等特性，可以难说 熱且不消耗電力’因此非常適合電子產品的散：=量的 將熱管結合鰭片所组成之赦 放熱而求，故 重要課題。斤、'且成之熱g放熱益’已成為解決散熱之 一般習知之熱管散熱器，如第一圖所示，放 有-底座l〇a、複數熱管2〇a及多數鰭片，，发、要：括 座1〇“系呈-板片狀，該底座l〇a之頂面係與各；中二底 之一端貼附接觸，而各兮埶总 口亥熱吕20a 各嗲鍵片30a卜 各亥熱e 2〇a之另一端則係串接連結 各該…曰片30a上，使用時係將該底 4〇a上’當該發熱元件40a運作產生熱量時置：敎m 底座―後’ *傳導至各該熱管2Ga及，鰭片3〇Γ上、、，里而達&成 熱量之散逸。 上，而達成 果.ΐΠί熱管散熱器，雖具有達成熱量散逸之效 LS，=該熱管，與底座…及各該籍片_之 地緩慢且費時，；、生a斗w & 日门〇 u a上’相田 而仏成該政熱器之熱傳效果及散熱效率不 1^· 第5頁 M267517M267517 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a temperature-equalizing plate radiator (4). On the heating element of a T computer, the K generated by the heating element can be output to increase heat dissipation. Device's heat transfer effect and heat dissipation efficiency. '、,, 里, W [Previous technology] At present, in the field of heat dissipation of electronic components, the industry and other thermal conduction structures, such as heat pipes, capillaries, light weight, 2ΐ!;, Heat transfer capacity, fast heat transfer, high The characteristics of early and multi-purpose heat transfer structures are difficult to say that heat does not consume electricity. Therefore, it is very suitable for the dissipation of electronic products: the amount of heat is required to combine heat pipes with fins, so it is an important issue. The weight of the heat produced by the heat generation has become a common heat pipe radiator for solving heat dissipation. As shown in the first figure, a base 10a, a plurality of heat pipes 20a, and most fins are placed. Important: The bracket 10 is in the form of a plate, and the top surface of the base 10a is in contact with each; one end of the middle two bottom is in contact with each other, and each of the main mouths is 20A and each keypad 30a The other end of the bogehaier e 2〇a is connected in series to each of the ... The film 30a, when used, is placed on the bottom 4a 'when the heating element 40a operates to generate heat: 敎 m base ― 后 '* Conducted to each of the heat pipes 2Ga and the fins 3〇Γ, ,,, and the heat dissipation of the heat. The heat pipe heat sink has the effect of achieving heat dissipation LS , = The heat pipe, the base, and the place where the film is _ are slow and time-consuming ;, the heat transfer effect and heat dissipation efficiency of the heat exchanger and the heat dissipation effect of the heat exchanger are not matched 1 ^ · Page 5 M267517
四、創作說明（2) 佳。 點及從事該行業多年 ’乃潛心研究並配合 終於提出一種設計合 種均溫板散熱器 有大面積的接觸及高 里迅速導出’而增加 於是’本創作人有感於上述問題 之經驗’並針對可進行改善之問題點 貫際之運用，本著精益求精之精神， 理且有效改善上述問題點之本創作。 【新型内容】 本創作之主要目的，在於提供一 (四）’其係使均溫板本體與鰭片組具 熱傳速度，以將發熱元件所產生之熱 散熱為之熱傳效果及散熱效率。 為達上述之目的，本創作 設於電腦之發熱元件上，包括 片組’其中該均溫板本體係呈 一上板體及一下板體，於該上 空容腔，於該中空容腔内設置 至少一端係連接於均溫板本體 【實施方式】 係種均溫板散熱器（四）， 有一均溫板本體及至少一餘 一「U」字型，且其係包含 板體與下板體間形成有一中 有導熱結構；而該鰭片組之 上。 一余^參閱『第二、三及四圖』所示，係分別為本創作第 貝施例之立體分解圖、組合示意圖及使用狀態剖視圖， 本創作係一種均溫板散熱器（四），設置於電腦之發熱元件 上，包括有一均溫板本體10及至少一鰭片組20，其中： 該均溫板本體1 0係包含一上板體11及一下板體1 2，該 下板體1 2係由一矩形底板及從底板四周向上延伸之側板所 構成，當該上板體n蓋合連接於下板體12時，於上板體n4. Creative Instructions (2) Point and has been engaged in the industry for many years, 'is the research and cooperation and finally came up with a design of a kind of isothermal plate radiator with a large area of contact and high-speed rapid export' and increased the 'this creator's experience of the above problems' and Aiming at the application of the problem points that can be improved, in the spirit of excellence, rationally and effectively improve the original creation of the above problem points. [New content] The main purpose of this creation is to provide one (four) 'which is to make the body of the temperature equalizing plate and the fins have a heat transfer speed, and the heat transfer effect and heat dissipation efficiency of the heat generated by the heating element . In order to achieve the above purpose, the creation is set on the heating element of the computer, including the film group, in which the temperature equalizing plate presents an upper plate body and a lower plate body, which are arranged in the upper cavity and in the hollow cavity. At least one end is connected to the temperature-equalizing plate body [Embodiment] It is a type of temperature-equalizing plate radiator (four), which has a temperature-equalizing plate body and at least one more "U" shape, and it includes a plate body and a lower plate body A thermally conductive structure is formed between the fins. More than one ^ Refer to the "second, third, and fourth pictures", which are respectively a three-dimensional exploded view, a combined schematic diagram, and a cross-sectional view of the use state of this creative example. This creation is a type of temperature plate radiator (four), The heating element disposed on the computer includes a temperature equalizing plate body 10 and at least one fin group 20, wherein: the temperature equalizing plate body 10 includes an upper plate body 11 and a lower plate body 12 and the lower plate body 12 is composed of a rectangular bottom plate and side plates extending upwards from the periphery of the bottom plate. When the upper plate n is covered and connected to the lower plate 12, the upper plate n
M267517 四、創作說明（3) 與下板體1 2間形成有一中空容腔i 3，於該中 二複數熱管“，該熱管14係呈一扁平狀，其内具J1 工 並於管體内部形成一真空狀態，各該熱管 觸與上板體11及下板體12之内壁貼附接 觸 各該熱官14係為並列設置；最後，再對組合後均㈤ =本體1◦施以彎曲加工，而成形為一「U」型均溫板本: 組20係由多數鰭片21所組成，且其係可直向方 式或k向方式（如第六圖所示）設置連接於上板 =上养：ΐ該鰭片21之上、下對應邊分別彎折成= #、，而接=1增加均溫板本體10與各該鰭片21之接觸面 :、、酋：…、傳效果；並於任二相鄰之鰭片21間形成有一 I、他於該鱗片組2°與均溫板本體1〇之上板體"間留 組合時係可於各該鰭片2 i之折緣2丨 _之表面塗佈一導熱介質24(請斤參緣閱 貧或錫膏，來增加均溫板本體丨。與各該韓 片21 = δ ρ、效果；如此，以形成一均溫 圖，;示，係為本創作之使用。剖視 -發執元件3ί :二Λ板本體10之下板體12底面貼平於 ”、、το件30上（如中央處理器），當該發埶元件 生熱量時，該下板體12係直接吸收 二均勾傳導至均溫板本體10内之各熱管“上，；辭：二 14之液乳相變化’而將熱量快速導引到均溫板本‘。二 第7頁 M267517 創作說明（4) 方處’藉均溫板本體i 〇與鰭片組2 〇間之大面積接觸及高熱 傳速度’以迅速地將熱量傳導至各鰭片2〗上；如是，而增 加散熱器之熱傳效果及散熱效率。 曰 另者’可於該均溫板本體1 〇之一侧處或上方，且 該鰭片組20之流道23方向，設有_風扇（圖未示），藉由風' 扇吹送氣流並導引至各該鰭片21間之流道23處，以將 於各該鰭片21與流道23間之熱量吹出，而達成更佳之埶= 散逸效果。 一請參閱『第七及八圖』所示，係分別為本創 四貫施例之使用狀態側向示意目，該鰭片組2〇,係 八M267517 IV. Creation instructions (3) A hollow volume i 3 is formed between the lower plate body 12 and the middle two or more heat pipes ". The heat pipe 14 is a flat shape, which has J1 work inside and is inside the pipe body. A vacuum state is formed, and each of the heat pipes is in contact with the inner wall of the upper plate body 11 and the lower plate body 12 and is attached side by side. Each of the heat pipes 14 is arranged side by side; finally, after the combination, all of the heat pipes 14 are subjected to bending processing. And formed into a "U" type temperature-equalizing plate: Group 20 is composed of most fins 21, and it can be connected to the upper plate in a straight or k-direction (as shown in the sixth figure) = Upper raising: 对应 The upper and lower corresponding sides of the fin 21 are respectively bent into ##, and then connected = 1 to increase the contact surface between the temperature equalizing plate body 10 and each of the fins 21: ,, chief: ..., transmission effect And an I is formed between any two adjacent fins 21, which can be placed between each of the fins 2 i when the plate group is above 2 ° of the scale group and the isothermal plate body 10 A thermally conductive medium 24 is coated on the surface of the fold 2 丨 (please refer to the reference point or solder paste to increase the temperature equalizing plate body 丨. And the Korean film 21 = δ ρ, the effect; so, the shape An average temperature chart, shown, is for the purpose of this creation. Sectional view-hair extension element 3ί: the bottom surface of the two Λ board body 10 under the board 12 is flat on the ", το 30 (such as the central processing unit) When the hair lock element generates heat, the lower plate 12 directly absorbs the two uniform hooks and conducts them to the heat pipes in the temperature-equating plate body 10; Guided to the isothermal plate book. II. Page 7 M267517 Creative Instructions (4) Fang '' Large area contact between the isothermal plate body 〇 and the fin group 2 〇 and high heat transfer speed 'to quickly transfer heat Conducted to each fin 2; if so, the heat transfer effect and heat dissipation efficiency of the heat sink are increased. Alternatively, 'may be at or above one side of the temperature equalizing plate body 10, and the fin group 20 In the direction of the flow channel 23, a fan (not shown) is provided, and the air is blown by the wind fan and guided to the flow channel 23 between the fins 21 so that the fins 21 and the flow channels 23 The heat is blown out in time to achieve a better 埶 = dissipation effect. 1. Please refer to the "Seventh and Eighth Figures", which are the uses of the original four consistent examples. Schematic side mesh state, the fin group 2〇, eight lines
有-第-_片組201、一第二鰭片組2〇2 J 二，該第-鱗片組201之一端連接於下板體12 -之 緣處，該第二鰭片組202係可為 卜 )圖：：），而第三鰭片組203則係連接於下板體ΐ2之： -第二韓片組2〇2，或一第二·讀片H及弟片組201及 ? in夕έ日人作儿— 々、、且ζ υ ζ及一第三鰭片組 2 03之組合紇化，藉以因應各種不 熱量高低相應配置。 …兀件30所產生之 明參閱『第九圖』所示，係為本創杏 用狀態側向示意圖，該_片組2Q 貝^•歹1之使 2〇卜—第二韓片組202、—第三韩V；且弟=片組 組204，㈣一,鰭片組2〇1之一端係可為03及一弟四籍片 示)方式連接於下板體12之左側外緣處二。二？片=二 m 第8頁 M267517 四、創作說明（5) 第三鰭片組2 03^之^一端則係各別連接於上板體η之二相對 應面上，並於第一鰭片組202與第三鰭片組2〇3間形成有一 間隙β，而该第四鰭片組2 0 4之一端則係連接於下板體〗2之 右側外緣處；如此，可使該鰭片組2〇”能因應電腦主機周 圍環境之限制，而做適度之變化配置，能大幅降低開設模 具之費用。 請參聞『第十圖』所示，係為本創作之另一均溫板立 體分解圖，該均溫板本體10之中空容腔13内，除可如上述 實施例設有複數熱管14外，亦可於該中空容腔13内間隔設 置有毛細組織15及導熱體16，先將上板體u、下板體12、 毛細組織1 5及導熱體1 6施以彎曲成形後，再依序置入連会士 組合，於上、下板體11、1 2之相接處桿接封合，再注入適 量工作流體（圖未示）後，並對該均溫板本體1〇之内部抽成 一真空狀態；其中該導熱體16係可為一熱管、支 他具有良好導熱性之元件所製成。 / 綜上所述，本創作均溫板散熱器（四）可有效改善習用 之種種缺點’可將發熱元件所產生之熱量迅速導出了二辦 加散熱之熱傳效果及散熱效率，使本創作之？生处、 步、更實用、更符合使用者之所須，確已符合新 請之要件’爰依法提出專利申請。 惟以上所述者，僅為本創作之較佳實施例而已，去 能以此限定本創作實施之範圍；故，凡依本創作 ^ 範圍及創作說明書内容所作之簡單的等效變化與修:，比 應仍屬本創作專利涵蓋之範圍内。 〃 & ’皆There are-the second fin group 201 and a second fin group 201 2 J. One end of the first fin group 201 is connected to the edge of the lower plate 12-the second fin group 202 may be (B) Figure: :), and the third fin group 203 is connected to the lower plate ΐ2:-the second Korean film group 202, or a second · reading film H and the younger film group 201 and? In Xi Zhe Ren Zuo Er — 纥, and ζ υ ζ and a third fin group 203 combination of 纥, so as to respond to various non-heat levels. … The clearness of the element 30 is shown in the "ninth picture", which is a schematic side view of the state of the original apricot. --- Third Han V; and the brother = film group group 204, one, one end of the fin group 201 can be 03 and one brother four books)) connected to the left outer edge of the lower plate 12 two. two? Piece = two m Page 8 M267517 IV. Creation Instructions (5) One end of the third fin group 2 03 ^^ is connected to the corresponding surface of the upper plate η two respectively, and on the first fin group A gap β is formed between 202 and the third fin group 203, and one end of the fourth fin group 204 is connected to the right outer edge of the lower plate 2; thus, the fin can be made Group 20 "can be appropriately changed in accordance with the surrounding environment of the host computer, which can greatly reduce the cost of mold opening. Please see the" Tenth Picture ", which is another three-dimensional isothermal plate for this creation. In an exploded view, in addition to the plurality of heat pipes 14 provided in the above-mentioned embodiment, in the hollow volume cavity 13 of the temperature equalizing plate body 10, capillary tissues 15 and heat conductors 16 may be arranged at intervals in the hollow volume cavity 13, first, After the upper plate u, the lower plate 12, the capillary structure 15 and the heat conductor 16 are subjected to bending forming, they are sequentially inserted into the Lian Huishi combination and placed at the junction of the upper and lower plates 11, 12 After the rods are sealed, and then an appropriate amount of working fluid (not shown) is injected, a vacuum state is drawn to the inside of the isothermal plate body 10; The heating body 16 can be made of a heat pipe and other components with good thermal conductivity. / In summary, this creation of the isothermal plate radiator (4) can effectively improve the various disadvantages of conventional use. The heat generated quickly led to the heat transfer effect and heat dissipation efficiency of the second office plus heat dissipation, which made this creation more healthy, more practical, more in line with the needs of users, and indeed met the requirements of the new request. Patent application. However, the above are only the preferred embodiments of this creation, so as to limit the scope of implementation of this creation; therefore, any simple equivalent changes made according to the scope of this creation ^ and the content of the creation manual And repair :, should still fall within the scope of this creative patent. 〃 & '都
第9頁 M267517 圖式簡單說明 【圖示簡單說明】 第一圖係習用散熱器之組 第二圖係本創作之均溫板 第三圖係本創作第一實施 第四圖係本創作第一實施 第五圖係本創作第一實施 第六圖係本創作第二實施 第七圖係本創作第三實施 第八圖係本創作第四實施 第九圖係本創作第五實施 第十圖係本創作之另一均 【主要元件符號說明】 (習用部分） 底座1 Oa 鑛片3 0 a (本創作部分） 均溫板本體1 0 下板體1 2 熱管14 導熱體16 鰭片組20 、 20’ 、 20 第一鰭片組201 第三鰭片組203 合示意圖。 立體分解圖。 例之立體分解圖。 例之組合示意圖。 例之使用狀態剖視圖。 例之立體分解圖。 例之使用狀態側向示意圖。 例之使用狀態側向示意圖。 例之使用狀態側向示意圖。 溫板立體分解圖。 熱管20a 發熱元件40a 上板體1 1 中空容腔1 3 毛細組織1 5 第二鰭片組202 第四鰭片組204Page 9 M267517 Simple illustration of the diagram [Simplified illustration of the diagram] The first picture is a group of conventional radiators. The second picture is a temperature equalizing plate for this creation. The third picture is the first implementation of this creation. The fourth picture is the first for this creation. Implementing the fifth illustration is the first implementation of the sixth illustration. This is the second implementation of the seventh illustration. This is the third implementation of the eighth illustration. This is the fourth implementation. The ninth illustration is the fifth implementation of the tenth illustration. The other part of this creation [Description of the main component symbols] (conventional part) base 1 Oa ore sheet 3 0 a (part of this creation) isothermal plate body 1 0 lower plate body 1 2 heat pipe 14 heat conductor 16 fin group 20, 20 ', 20 The first fin group 201 and the third fin group 203 are combined. Three-dimensional exploded view. Example of a three-dimensional exploded view. Example combination diagram. Example of a sectional view of the use state. Example of a three-dimensional exploded view. Example side view of the use state. Example side view of the use state. Example side view of the use state. Stereoscopic exploded view. Heat pipe 20a Heating element 40a Upper plate 1 1 Hollow cavity 1 3 Capillary tissue 1 5 Second fin group 202 Fourth fin group 204
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