CN201837956U - External radiator of notebook computer and portable small heat emitting machine - Google Patents
External radiator of notebook computer and portable small heat emitting machine Download PDFInfo
- Publication number
- CN201837956U CN201837956U CN2010206130627U CN201020613062U CN201837956U CN 201837956 U CN201837956 U CN 201837956U CN 2010206130627 U CN2010206130627 U CN 2010206130627U CN 201020613062 U CN201020613062 U CN 201020613062U CN 201837956 U CN201837956 U CN 201837956U
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- heat pipe
- flat
- notebook computer
- plate
- plate heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model relates to an external radiator of a notebook computer and a portable small heat emitting machine. The external radiator of the notebook computer comprises a flat-panel heat pipe which is in a flat-panel micro heat pipe array structure formed by metal materials through extrusion, encapsulation and molding. The equivalent diameter of each micro heat pipe is 0.55mm to 2.8mm. The evaporation section of the flat-panel heat pipe is provided with a surface which can be in direct or indirect contact with the heat emitting bottom plate of the notebook computer, and the condensation section of the flat-panel heat pipe is in contact with air or is connected with a radiating part. The external radiator has the advantages of no power consumption, high radiating efficiency, no noise, light weight and convenience in use, and can satisfy the radiation need of the notebook computer.
Description
Technical field
The utility model relates to the external heating radiator of a kind of heat dissipation technology of heat-producing device, particularly a kind of notebook computer, also relates to the external heating radiator of other portable small-sized heating machines.
Background technology
Notebook computer is in use because the heat release of devices such as high power central processing unit, make the notebook computer surface temperature especially the temperature of its base plate raise, external heat dissipation technology of traditional notebook computer and product normally fan-type heating radiator or the phase-change heat-storage heating radiator of dispelling the heat, the fan-type heating radiator not only needs to consume extra electric power, and noise is big, volume is big, defective is obvious, the phase-change heat-storage heating radiator is then because the regenerative capacity of phase change heat storage material is limited, after the heat-storing material phase transformation is saturated, can seriously hinder the further heat radiation of notebook computer, even can cause minus effect, so this heating radiator can not long-time continuous use, and heavy, defective also clearly.
The utility model content
The utility model need consume extra electric power at the external fan-type heating radiator of existing notebook computer, and noise is big, volume is big, external phase-change heat-storage heating radiator is then because the regenerative capacity of phase change heat storage material is limited, heat-storing material is in the problem of saturated back influence heat radiation, a kind of novel external heating radiator is provided, need not to consume electric power, the radiating efficiency height, also have noiseless, lightweight advantage easily, can satisfy the radiating requirements of notebook computer.The utility model also provides a kind of external heating radiator of other portable small-sized heating machines.
The technical solution of the utility model is as follows:
A kind of external heating radiator of notebook computer is characterized in that, comprises flat-plate heat pipe, and described flat-plate heat pipe is the flat micro heat pipe array structure of metal material through the extruding encapsulated moulding, and the equivalent diameter of described micro heat pipe is 0.55mm～2.8mm; The evaporator section of described flat-plate heat pipe has the direct or indirect bonding surfaces of heating base plate that is suitable for notebook computer, and its condensation segment is connected with thermal component with air contact or condensation segment.
Described flat-plate heat pipe is arranged side by side for two or more, and the outer setting of flat-plate heat pipe has the web member of the metal heat-conducting material of fixedly connected all flat-plate heat pipes.
Described thermal component is the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment.
Described heat dissipation metal parts are radiating fin.
Described flat-plate heat pipe extends an end of notebook computer length or Width along described micro heat pipe pipe range direction.
Described indirect applying is meant between the evaporator section of the heating base plate of notebook computer and described flat-plate heat pipe and is provided with thermal conductive metal plate.
Described two or more flat-plate heat pipe closely is provided with or setting at regular intervals side by side, and described spacing range is 2mm～200mm, fixedly connected all flat-plate heat pipes of described thermal conductive metal plate.
The some little fin that has extrusion modling on the described micro heat pipe inwall with capillary and augmentation of heat transfer effect.
The distance of adjacent two little fins is 0.1mm～0.4mm, and the height of little fin is 0.3mm～0.8mm.
The external heating radiator of portable small-sized heating machine is characterized in that, comprises flat-plate heat pipe, and described flat-plate heat pipe is the flat micro heat pipe array structure of metal material through the extruding encapsulated moulding, and the equivalent diameter of described micro heat pipe is 0.2mm～6mm; The evaporator section of described flat-plate heat pipe has heating base plate or the direct or indirect bonding surfaces of heating sidewall that is suitable for small-sized heating machine, and its condensation segment is connected with thermal component with air contact or condensation segment.
Technique effect of the present utility model is as follows:
The external heating radiator of the notebook computer that the utility model relates to, flat micro heat pipe array with the equivalent diameter with the particular range that adapts with factors such as the condition of work of notebook computer and heat generation characteristics constitutes flat-plate heat pipe, to form specific heating radiator, the evaporator section of flat-plate heat pipe is arranged to have the direct or indirect bonding surfaces of heating base plate that is suitable for notebook computer, and its condensation segment is connected with thermal component with air contact or condensation segment.Flat-plate heat pipe is flat micro heat pipe array structure, naturally form the heat pipe effect in each micro heat pipe, flat-plate heat pipe absorbs the heat of the heating base plate of notebook computer by the coating surface of evaporator section, liquid working substance heat absorption back carburation by evaporation in the evaporator section, naturally flow to condensation segment, condensation segment distributes heat by the air that is in contact with it or through thermal component, liquefaction simultaneously, and rely on gravity or capillary force effect to flow back to evaporator section, automatically finish circulation, this structure is more conducive to heat interchange, reaches the notebook computer cooling purpose.The heat radiation process need not to consume additional power, and solve the external fan-type heating radiator of existing notebook computer and need consume extra electric power, and big, the bulky problem of noise; Because heat pipe has the high advantage of heat transfer efficiency, simultaneously again because be flat-plate heat pipe, the heating base plate of its evaporator section and notebook computer is fitted, make that the contact area of heating base plate of flat-plate heat pipe and notebook computer can be very big, so make that the heat conduction equivalent thermal resistance is very little, further improved heat transfer efficiency, also improved simultaneously the radiating efficiency of notebook computer, solved the limited problem that to dispel the heat after saturated of causing of the regenerative capacity of the external phase-change heat-storage heating radiator of existing notebook computer, heating radiator of the present utility model can continue to use, have rapid heat dissipation, lightweight, easy to carry, save maintenance cost, the advantage that life-span is long, and owing to be extrusion modling, technology is simple.Consider the heat dissipation characteristics of heating base plate of notebook computer and the architectural characteristics such as environment for use of notebook computer, the equivalent diameter that micro heat pipe is set is 0.55mm～2.8mm, both strengthen the exchange capability of heat of the liquid working substance in the micro heat pipe, and can effectively reduce thermal contact resistance again.
Thermal component is that the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment carry out the air cooling, the heat dissipation metal parts are radiating fin etc., all can augmentation of heat transfer, accelerate flat-plate heat pipe in the condensation segment heat release, make the quick heat release condensation of liquid working substance flow back to the evaporator section of flat-plate heat pipe.
It is good to be provided with heat conduction between the evaporator section of the heating base plate of notebook computer and described flat-plate heat pipe, and the thermal conductive metal plate that uniformity coefficient is high, make the heating base plate of notebook computer and the evaporator section of described flat-plate heat pipe fit indirectly, fixedly connected all flat-plate heat pipes of thermal conductive metal plate, can not require between the flat-plate heat pipe that is arranged side by side and closely be provided with this moment, certain spacing can be arranged, just the spacing between the flat-plate heat pipe that is arranged side by side this moment can be arranged on 2mm～200mm, like this, even there is individual nodes to produce the heat of concentrating on the heating base plate of notebook computer, also can heat evenly be led out, these node temperatures are risen cause the notebook computer radiating efficiency to reduce or life-span decline.
On the micro heat pipe inwall, have the exchange capability of heat that some little fins can further strengthen liquid working substance in the micro heat pipe, and has capillary force between little fin that is provided with in the micro heat pipe and the micro heat pipe inwall, also can produce capillary force if distance is suitable between little fin and the little fin, the formation of capillary force has promoted flowing of working medium, also helps to strengthen heat-transfer capability.The distance that adjacent two little fins are set is 0.1mm～0.4mm, and the height of little fin is 0.3mm～0.8mm, not only very high heat-transfer capability can be arranged, and significantly strengthens mechanical properties such as the bending resistance of flat-plate heat pipe own, heat resistanceheat resistant.
Above-mentioned effect is equally applicable to adopt the external heating radiator of other portable small-sized heating machine of flat-plate heat pipe.
Description of drawings
Fig. 1 is the structural representation of the external heating radiator of preferred notebook computer.
Fig. 2 is the perspective view of the external heating radiator of notebook computer shown in Figure 1.
Fig. 3 is the perspective view of the external heating radiator of another preferred notebook computer.
Fig. 4 is a flat-plate heat pipe cross section structure synoptic diagram shown in Figure 3.
Fig. 5 is the structural representation of the external heating radiator of the third preferred notebook computer.
Fig. 6 is external heating radiator shown in Figure 5 and the notebook computer cross section structure synoptic diagram of fitting indirectly.
Fig. 7 is the perspective view of the external heating radiator of the 4th kind of preferred notebook computer.
Each label lists as follows among the figure:
The 1-notebook computer; The 2-flat-plate heat pipe; The 3-radiating fin; The 4-micro heat pipe; The little fin of 5-; The 6-thermal conductive metal plate.
Embodiment
Below in conjunction with accompanying drawing the utility model is described.
Fig. 1 is the structural representation of the external heating radiator of preferred notebook computer, and Fig. 2 is the perspective view of the external heating radiator of notebook computer shown in Figure 1.This external heating radiator comprises flat-plate heat pipe 2, this flat-plate heat pipe 2 is the flat micro heat pipe array structure of metal material through the extruding encapsulated moulding, the thickness of flat-plate heat pipe 2 is 1mm～10mm, the micro heat pipe array is the micro heat pipe 4 of two or more parallel arrangements, the micro heat pipe 4 of parallel arrangement is parallel to the surface of flat-plate heat pipe 2 transverse width broads, the channel cross-section of the micro heat pipe 4 among this embodiment is shaped as square, the equivalent diameter of micro heat pipe 4 is 0.55mm～2.8mm, be filled with liquid working substance and sealed at both ends in the micro heat pipe 4, micro heat pipe 4 conducts heat in the mode of phase-change heat-exchange, forms the heat pipe effect naturally; Symmetria bilateralis is provided with the some little fin 5 with capillary and augmentation of heat transfer effect of extrusion modling about micro heat pipe 4 inwalls, this slightly fin 5 by metal material in the extrusion modling process simultaneously the extruding form, can further strengthen the exchange capability of heat of liquid working substance in the micro heat pipe 4, little fin 5 can also be in side in micro heat pipe 4 inwalls or both sides or three sides or four side settings arbitrarily, and has capillary force between little fin 5 and micro heat pipe 4 inwalls, also can produce capillary force if distance is suitable between little fin 5 and the little fin 5, the formation of capillary force has promoted flowing of working medium, also helps to strengthen heat-transfer capability; The distance that adjacent two little fins preferably are set is 0.1mm～0.4mm, and the height of little fin is 0.3mm～0.8mm, not only very high heat-transfer capability can be arranged, and significantly strengthens mechanical properties such as the bending resistance of flat-plate heat pipe own, heat resistanceheat resistant.The evaporator section of flat-plate heat pipe 2 has the direct or indirect bonding surfaces of heating base plate that is suitable for notebook computer 1, flat-plate heat pipe 2 is directly fitted by this surface of evaporator section and the heating base plate of notebook computer 1, its condensation segment dispels the heat by connecting radiating fin 3, and this radiating fin 3 can be equipped with by aluminium or copper.
Flat-plate heat pipe 2 absorbs the heat of the heating base plate of notebook computer 1 by the applying plane of evaporator section, liquid working substance heat absorption back carburation by evaporation in the evaporator section, naturally flow to condensation segment, condensation segment is through radiating fin 3 heat releases, liquefaction simultaneously, and rely on gravity or capillary force effect to flow back to evaporator section, and finish circulation automatically, reach the notebook computer cooling purpose.The contact area of the heating base plate of flat-plate heat pipe 2 and notebook computer 1 can be very big, so make that the heat conduction equivalent thermal resistance is very little, improved heat transfer efficiency, also improved the radiating efficiency of notebook computer simultaneously, and heat radiation power can reach 10W～100W.
Fig. 3 is the perspective view of the external heating radiator of another preferred notebook computer.Can see intuitively among this embodiment that the length of flat-plate heat pipe 2 is greater than the length of notebook computer 1, flat-plate heat pipe 2 extends an end of notebook computer 1 length direction along self length direction.Certainly, if the length of notebook computer 1 is less than the width of flat-plate heat pipe 2, then to be horizontally installed on the flat-plate heat pipe 2 also be a kind of preferred version to notebook computer 1.In addition, also flat-plate heat pipe can be designed to other size makes it to be complementary with the heating base plate of notebook computer.Face beyond flat-plate heat pipe 2 is directly fitted with notebook computer 1 is the condensation segment of flat-plate heat pipe 2, is provided with radiating fin 3 at condensation segment and dispels the heat as thermal component.Fig. 4 is flat-plate heat pipe 2 cross section structure synoptic diagram, what the flat-plate heat pipe among this embodiment was different with flat-plate heat pipe shown in Figure 1 is, the channel cross-section of each micro heat pipe 4 in the flat-plate heat pipe among this embodiment is shaped as circle, and be provided with little fin 5 that a large amount of Heat Conduction Materials is made all around on the inwall, suitably can form capillary wick along distance between the adjacent little fin 5 of micro heat pipe 4 length directions, further, along the formation based on capillary slot of arranging of the adjacent little fin 5 of micro heat pipe 4 length directions, little fin, the setting of capillary wick and based on capillary slot (also can be understood as low-grade fever nest of tubes or microflute group structure that low-grade fever tube bank in groups constitutes) can be strengthened the exchange capability of heat of micro heat pipe.Certainly the channel cross-section of micro heat pipe 4 can not form the random geometry that stress is concentrated for other polygon (as triangle and rectangle etc.), ellipse or other yet.
The external heating radiator of the notebook computer that the utility model relates to, the heating base plate of the evaporator section of flat-plate heat pipe 2 and notebook computer 1 can directly be fitted, also can fit indirectly, directly fitting is meant that the evaporator section of flat-plate heat pipe 2 directly is close on the heating base plate of notebook computer 1; The heating base plate of the evaporator section of flat-plate heat pipe 2 and notebook computer 1 also can be fitted indirectly, promptly between the evaporator section of the heating base plate of notebook computer 1 and flat-plate heat pipe 2, the thermal conductive metal plate 6 that heat conduction is good and uniformity coefficient is high is set, as aluminium sheet, the structural representation of the external heating radiator of the preferred notebook computer of as shown in Figure 5 and Figure 6 the third and the cross section structure synoptic diagram of fitting indirectly.Thermal conductive metal plate 6 can be the sheet metal of a monoblock, also can be that sheet metal close proximity more than two is put together, the flat-plate heat pipe 2 of this moment can be one, also can be arranged side by side for two or more, when flat-plate heat pipe 2 when being a plurality of, the thermal conductive metal plate 6 of this moment can be used as the web member of fixedly connected all flat-plate heat pipes.Can closely be provided with side by side between a plurality of flat-plate heat pipes 2, also can closely not be provided with, can be at regular intervals between the flat-plate heat pipe 2 that promptly is arranged side by side, this spacing range can be arranged on 2mm～200mm.Like this,, also can heat evenly be led out, these node temperatures are risen cause the notebook computer radiating efficiency to reduce or life-span decline even there is individual nodes to produce the heat of concentrating on the heating base plate of notebook computer 1.In addition, also thermal conductive metal plate 6 can be made a thermal conductive shell all flat-plate heat pipes are wrapped in its inside, the perspective view of the external heating radiator of the 4th kind of preferred notebook computer as shown in Figure 7, thermal conductive shell internal fixation among the figure is provided with a plurality of flat-plate heat pipes 2, the radiating fin 3 of this moment is arranged on the outside of thermal conductive metal plate 6 of the condensation segment corresponding position of each flat-plate heat pipe 2, can be understood as the condensation segment of each flat-plate heat pipe 2 and is connected indirectly with radiating fin 3 as thermal component.
The condensation segment of flat-plate heat pipe 2 also can be by radiating fin 3 these heat dissipation metal parts heat radiations, and for example, condensation segment can be by connecting the water cooling equipment heat radiation.The external radiator heat-dissipation of notebook computer of the present utility model is fast, need not to consume electric power, and energy savings also has noiseless, and lightweight is convenient, saves maintenance cost, the advantage that the life-span is long.And, this external heating radiator can also be applicable to other portable heat radiation of small-sized heating machine with heating base plate or heating sidewall, the product that these small-sized heating machines need in time distribute such as ipad etc. has the electronic product of heating surface and other heatings.The external heating radiator of small-sized heating machine comprises flat-plate heat pipe equally, described flat-plate heat pipe is the flat micro heat pipe array structure of metal material through the extruding encapsulated moulding, the equivalent diameter of described micro heat pipe is 0.2mm～6mm, according to different small-sized heating machines, equivalent diameter can be more greater or lesser than the equivalent diameter of the external heating radiator of notebook computer, to satisfy the requirement of different heat flow densities; The evaporator section of described flat-plate heat pipe has heating base plate or the direct or indirect bonding surfaces of heating sidewall that is suitable for small-sized heating machine, and its condensation segment is connected with thermal component with air contact or condensation segment.
Should be pointed out that the above embodiment can make those skilled in the art more fully understand the invention, but do not limit the present invention in any way creation.Therefore; although this instructions has been described in detail the invention with reference to drawings and Examples; but; those skilled in the art are to be understood that; still can make amendment or be equal to replacement the invention; in a word, all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the invention, and it all should be encompassed in the middle of the protection domain of the invention patent.
Claims (10)
1. the external heating radiator of a notebook computer is characterized in that, comprises flat-plate heat pipe, and described flat-plate heat pipe is the flat micro heat pipe array structure of metal material through the extruding encapsulated moulding, and the equivalent diameter of described micro heat pipe is 0.55mm～2.8mm; The evaporator section of flat-plate heat pipe has the direct or indirect bonding surfaces of heating base plate that is suitable for notebook computer, and its condensation segment is connected with thermal component with air contact or condensation segment.
2. the external heating radiator of notebook computer according to claim 1 is characterized in that, described flat-plate heat pipe is arranged side by side for two or more, and the outer setting of flat-plate heat pipe has the web member of the metal heat-conducting material of fixedly connected all flat-plate heat pipes.
3. the external heating radiator of notebook computer according to claim 1 is characterized in that, described thermal component is the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment.
4. the external heating radiator of notebook computer according to claim 3 is characterized in that, described heat dissipation metal parts are radiating fin.
5. the external heating radiator of notebook computer according to claim 1 is characterized in that, described flat-plate heat pipe extends an end of notebook computer length or Width along described micro heat pipe pipe range direction.
6. the external heating radiator of notebook computer according to claim 2 is characterized in that, described indirect applying is meant between the evaporator section of the heating base plate of notebook computer and described flat-plate heat pipe and is provided with thermal conductive metal plate.
7. the external heating radiator of notebook computer according to claim 6, it is characterized in that, described two or more flat-plate heat pipe closely is provided with or setting at regular intervals side by side, and described spacing range is 2mm～200mm, fixedly connected all flat-plate heat pipes of described thermal conductive metal plate.
8. according to the external heating radiator of the described notebook computer of one of claim 1 to 7, it is characterized in that, have the some little fin with augmentation of heat transfer effect of extrusion modling on the described micro heat pipe inwall.
9. the external heating radiator of notebook computer according to claim 8 is characterized in that, the distance of adjacent two little fins is 0.1mm～0.4mm, and the height of little fin is 0.3mm～0.8mm.
10. the external heating radiator of portable small-sized heating machine is characterized in that, comprises flat-plate heat pipe, and described flat-plate heat pipe is the flat micro heat pipe array structure of metal material through the extruding encapsulated moulding, and the equivalent diameter of described micro heat pipe is 0.2mm～6mm; The evaporator section of described flat-plate heat pipe has heating base plate or the direct or indirect bonding surfaces of heating sidewall that is suitable for small-sized heating machine, and its condensation segment is connected with thermal component with air contact or condensation segment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206130627U CN201837956U (en) | 2010-11-17 | 2010-11-17 | External radiator of notebook computer and portable small heat emitting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206130627U CN201837956U (en) | 2010-11-17 | 2010-11-17 | External radiator of notebook computer and portable small heat emitting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201837956U true CN201837956U (en) | 2011-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206130627U Expired - Lifetime CN201837956U (en) | 2010-11-17 | 2010-11-17 | External radiator of notebook computer and portable small heat emitting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201837956U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
| CN107677155A (en) * | 2017-11-03 | 2018-02-09 | 中国科学院理化技术研究所 | A kind of flat heat pipe radiator |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
-
2010
- 2010-11-17 CN CN2010206130627U patent/CN201837956U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
| CN107677155A (en) * | 2017-11-03 | 2018-02-09 | 中国科学院理化技术研究所 | A kind of flat heat pipe radiator |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110518 |
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| CX01 | Expiry of patent term |