CN204042816U - A kind of LED radiator based on vapor chamber heat dissipation technology - Google Patents
A kind of LED radiator based on vapor chamber heat dissipation technology Download PDFInfo
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- CN204042816U CN204042816U CN201420497364.0U CN201420497364U CN204042816U CN 204042816 U CN204042816 U CN 204042816U CN 201420497364 U CN201420497364 U CN 201420497364U CN 204042816 U CN204042816 U CN 204042816U
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Abstract
The utility model discloses a kind of LED radiator based on vapor chamber heat dissipation technology, comprise vapor chamber body, it is characterized in that: vapor chamber body comprises heat absorption base plate and condensation cover plate, described heat absorption base plate and condensation cover plate are connected to become vacuum chamber, the junction of heat absorption base plate and condensation cover plate is provided with heat resistant layer, heat absorption plate inner wall arranges micro-conducting strip, described micro-conducting strip arranges some micropores, described vacuum chamber holds the working medium of easily vaporization of being heated, and described micro-conducting strip is immersed in working medium.The utility model is based on vapor chamber heat dissipation technology, heat resistant layer between heat absorption base plate and condensation cover plate, the temperature difference between heat absorption base plate and condensation cover plate can be improved, improve condensation rate, increase radiating efficiency, the micro-conducting strip simultaneously heat absorption base plate arranged, adds heat conduction area, improves heat dissipation uniformity.
Description
Technical field
The utility model relates to LED radiator field, and more particularly, it relates to a kind of LED radiator based on vapor chamber heat dissipation technology.
Background technology
At present, LED illumination product is replacing traditional lighting gradually becomes main flow illuminating product.For high-power LED lamp, the height of light efficiency is key factor, however the heat radiation of LED be realize long-life and specular removal to pass factor.Therefore, the heat radiation how improving heavy-power LED product is the important topic increased the service life.As everyone knows, LED photovoltaic conversion efficiency is between 15-20%, remaining electric energy almost all converts heat energy to, therefore, when LED lamp illumination, a large amount of heats can be produced, so, how the heat radiation of maximal efficiency, becomes current LED radiator main direction of studying, integrated and microminiaturized along with electronic product, radiator should meet high cooling efficiency, meet the requirement that volume is little again, therefore, traditional radiating mode such as aluminium radiating fin, heat-conducting plastic shell, fan etc. can not meet its functional requirement.
In this, heat pipe and vapor chamber heat dissipation technology are there is in the market.Typical heat pipe is made up of shell, liquid-sucking core and end cap, fill with appropriate operation material (working medium) after being pumped into certain negative pressure in pipe, make to be close to be full of liquid in the liquid-sucking core pore of inside pipe wall after sealed, working medium carburation by evaporation when heat pipe one end is heated in capillary wick, steam flows to after the other end releases heat and condenses into liquid under small pressure reduction, liquid flows back to evaporation ends along porous material by capillary force and gravity again, so the continuous transferring heat of circulation; Soaking plate is the vacuum cavity that an inwall has fine structure, is usually made of copper.When heat by heat source to evaporating area time, cooling fluid in cavity starts the gasification phenomenon producing cooling fluid after being heated in the environment of rough vacuum, now absorb heat energy and rapid spatial expansion, the cooling medium of gas phase is full of rapidly whole cavity, just the phenomenon of condensation can be produced when gas-phase working medium touches a colder region, phenomenon by condensation discharges the heat of the accumulation when evaporating, cooling fluid after condensation can return evaporation thermal source place by the capillary channel of micro-structural, and this running will go round and begin again and carry out in cavity.
In fact we know, for heat pipe heat radiation, heat pipe heat radiation has certain orientation in fact, the misrouting of directionality, just likely cause heat-pipe radiator radiating effect not good, also just say, in heat pipe, condensed liquid is by capillary force and gravity reflux, if and condensed liquid backflow direction is contrary with gravity direction, so the effect of heat pipe heat radiation will be subject to larger impact; Vapor chamber technology is similar to heat pipe from principle, but distinguish to some extent on conduction pattern, heat pipe is one-dimensional linear heat transfer, heat in vapor chamber is then conduct on a two-dimentional face, and evaporate, the whole process that refluxes and distance very short, be subject to gravity effect also just relatively little, therefore efficiency is higher, specifically, liquid bottom vacuum chamber is after absorption chip heat, evaporation and diffusion, in vacuum chamber, by heat conduction on radiating fin, is condensed into liquid subsequently and gets back to bottom.The evaporation of this similar refrigerator and air conditioner, condensation process Rapid Circulation in vacuum chamber, achieve quite high radiating efficiency.
But, vapor chamber for great power LED cooling, key is to increase the temperature difference at hot plate two ends, increase the condensation rate of working medium, thus improve the circulation rate of heat absorption, heat conduction, heat radiation, in addition, due to LED work time, caloric value is concentrated, and easily causes localized hyperthermia, therefore, also need the uniformity improving its heat radiation, and, increase the contact area of working medium and hot plate, radiating efficiency can be improved further.Thus, the LED radiator based on vapor chamber heat dissipation technology still haves much room for improvement part, and target remains the radiating efficiency further strengthening LED, improves the service life of LED.
Utility model content
For the deficiency that prior art exists, the purpose of this utility model is to provide a kind of LED radiator based on vapor chamber heat dissipation technology, compared to traditional LED radiator, its efficiency is higher, more can be satisfied with the requirement of great power LED and high cooling efficiency simultaneously.
For achieving the above object, the utility model provides following technical scheme: a kind of LED radiator based on vapor chamber heat dissipation technology, comprise vapor chamber body, it is characterized in that: vapor chamber body comprises heat absorption base plate and condensation cover plate, described heat absorption base plate and condensation cover plate are connected to become vacuum chamber, the junction of heat absorption base plate and condensation cover plate is provided with heat resistant layer, heat absorption plate inner wall arranges micro-conducting strip, described micro-conducting strip arranges some micropores, described vacuum chamber accommodates working medium, and described micro-conducting strip is immersed in working medium.
By adopting technique scheme, in general, heat absorption base plate is temperature end, condensation end is low-temperature end, if heat absorption base plate is integrally connected setting with condensation cover plate, then heat absorption base plate and condensation cover plate are exactly an overall thermal source, have a narrow range of temperature, when working medium becomes gaseous state, being equivalent to become gaseous state is filled in vacuum chamber, the slow not even condensation of condensation rate after arrival condensation end, heat resistant layer between heat absorption base plate and condensation cover plate, hot base plate and condensation cover plate is made not to be overall thermals source, the temperature difference between heat absorption base plate and condensation cover plate can be improved, improve condensation rate, increase radiating efficiency, the micro-conducting strip simultaneously heat absorption base plate arranged, further increase heat dissipation uniformity and efficiency.Compared to existing vapor chamber radiator, the utility model improves the temperature difference between heat absorption base plate and condensation cover plate by heat resistant layer, add working fluid condenses speed, thus improve the circulation rate of heat absorption, heat conduction, heat radiation, simultaneously, the micro-conducting strip that base plate is arranged of absorbing heat in vacuum chamber adds the contact area of working medium and thermal source on the one hand, avoid heat absorption base plate on the other hand and produce localized hyperthermia, improve the uniformity of heat radiation, and the micropore of micro-conducting strip improves the mobility of working medium between micro-conducting strip.
The utility model is set to further: described heat absorption base plate outer wall is provided with installation portion, and the distance between the inwall of the heat absorption base plate that described installation portion is corresponding and condensation cover plate is greater than the distance of absorbing heat between all the other inwalls of base plate and condensation cover plate.
By adopting technique scheme, installation portion is the thermal source generating unit of LED, therefore the heat of installation portion is high, caloric receptivity is herein needed to be greater than other positions, therefore, distance between the inwall of the heat absorption base plate that installation portion is corresponding and condensation cover plate is greater than the distance of absorbing heat between all the other inwalls of base plate and condensation cover plate, and the working medium at the inwall place of the heat absorption base plate that installation portion is corresponding is more, ensures the uniformity of heat conduction in vacuum chamber.
The utility model is set to further: described micro-conducting strip comprises link and evaporation ends, and described link is that array distribution is fixedly connected on heat absorption plate inner wall, and described evaporation ends is equal to the distance of condensation cover plate.
By adopting technique scheme, micro-conducting strip is connected with heat absorption base plate one, and reduce thermal resistance, evaporation ends improves the evaporation rate of working medium.
The utility model is set to further: described condensation cover plate is provided with some radiating fins.
By adopting technique scheme, heat passes to condensation cover plate place by working medium, is distributed heat in air by radiating fin.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of LED radiator based on vapor chamber heat dissipation technology of this practicality;
Fig. 2 is A-A view of a kind of LED radiator Fig. 1 based on vapor chamber heat dissipation technology of this practicality;
Fig. 3 is B-B partial enlarged drawing of a kind of LED radiator Fig. 2 based on vapor chamber heat dissipation technology of this practicality;
Fig. 4 is micro-conducting strip schematic diagram of a kind of LED radiator based on vapor chamber heat dissipation technology of this practicality.
Accompanying drawing illustrates: 1, condensation cover plate; 2, absorb heat base plate; 3, installation portion; 4, micro-conducting strip; 5, working medium; 6, radiating fin; 7, heat resistant layer; 8, micropore; 9, link; 10, evaporation ends.
Detailed description of the invention
Referring to figs. 1 through Fig. 4, a kind of LED radiator embodiment based on vapor chamber heat dissipation technology of the utility model is described further.
A kind of LED radiator based on vapor chamber heat dissipation technology, comprise vapor chamber body, as shown in Figure 1, vapor chamber body comprises heat absorption base plate 2 and condensation cover plate 1, at heat absorption base plate 2, the junction of condensation cover plate 1 is provided with heat resistant layer 7, heat absorption base plate 2 inwall arranges micro-conducting strip 4, as shown in Figure 4, micro-conducting strip 4 comprises link 9 and evaporation ends 10, link 9 is fixedly connected on heat absorption base plate 2 inwall in array distribution, evaporation ends 10 is equal to the distance of condensation cover plate 1, micro-conducting strip 4 arranges some micropores 8, the working medium 5 of easily vaporization of being heated is had in vacuum chamber, micro-conducting strip 4 is immersed in working medium 5, heat absorption base plate 2 outer wall arranges installation portion 3, distance between the inwall of the heat absorption base plate 2 of installation portion 3 correspondence and condensation cover plate 1 is greater than the distance of absorbing heat between all the other inwalls of base plate 2 and condensation cover plate 1, condensation cover plate 1 outer wall is provided with some radiating fins 6.
In embodiment, heat absorption base plate 2 and condensation cover plate 1 adopt copper material to make, and heat resistant layer 7 adopts heat-insulating material to make, micro-conducting strip 4 is one-body molded with heat absorption base plate 2, radiating fin 6 is one-body molded with condensation cover plate 1, and the micropore 8 on micro-conducting strip 4 is through hole, can become arbitrary shape.
Pass through embodiment, the beneficial effect brought is: the heat resistant layer 7 between heat absorption base plate 2 and condensation cover plate 1, the temperature difference between heat absorption base plate 2 and condensation cover plate 1 can be improved, improve condensation rate, increase radiating efficiency, the micro-conducting strip 4 simultaneously heat absorption base plate 2 arranged, further increases heat dissipation uniformity and efficiency.Compared to existing vapor chamber radiator, the utility model improves the temperature difference between heat absorption base plate 2 and condensation cover plate 1 by heat resistant layer 7, add working medium 5 condensation rate, thus improve the circulation rate of heat absorption, heat conduction, heat radiation, simultaneously, micro-conducting strip 4 one aspect that base plate 2 is arranged of absorbing heat in vacuum chamber adds the contact area of working medium 5 and thermal source, avoid heat absorption base plate 2 on the other hand and produce localized hyperthermia, improve the uniformity of heat radiation, and the micropore 8 of micro-conducting strip 4 improves the mobility of working medium 5 between micro-conducting strip 4.
The above is only preferred embodiment of the present utility model, protection domain of the present utility model be not only confined to above-described embodiment, and all technical schemes belonged under the utility model thinking all belong to protection domain of the present utility model.It should be pointed out that for those skilled in the art, do not departing from the some improvements and modifications under the utility model principle prerequisite, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (4)
1. the LED radiator based on vapor chamber heat dissipation technology, comprise vapor chamber body, it is characterized in that: vapor chamber body comprises heat absorption base plate and condensation cover plate, described heat absorption base plate and condensation cover plate are connected to become vacuum chamber, the junction of heat absorption base plate and condensation cover plate is provided with heat resistant layer, heat absorption plate inner wall arranges micro-conducting strip, described micro-conducting strip arranges some micropores, described vacuum chamber accommodates working medium, and described micro-conducting strip is immersed in working medium.
2. a kind of LED radiator based on vapor chamber heat dissipation technology according to claim 1, it is characterized in that: described heat absorption base plate outer wall is provided with installation portion, and the distance between the inwall of the heat absorption base plate that described installation portion is corresponding and condensation cover plate is greater than the distance of absorbing heat between all the other inwalls of base plate and condensation cover plate.
3. a kind of LED radiator based on vapor chamber heat dissipation technology according to claim 1 and 2, it is characterized in that: described micro-conducting strip comprises link and evaporation ends, described link is that array distribution is fixedly connected on heat absorption plate inner wall, and described evaporation ends is equal to the distance of condensation cover plate.
4. a kind of LED radiator based on vapor chamber heat dissipation technology according to claim 3, is characterized in that: described condensation cover plate is provided with some radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497364.0U CN204042816U (en) | 2014-08-30 | 2014-08-30 | A kind of LED radiator based on vapor chamber heat dissipation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497364.0U CN204042816U (en) | 2014-08-30 | 2014-08-30 | A kind of LED radiator based on vapor chamber heat dissipation technology |
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| CN204042816U true CN204042816U (en) | 2014-12-24 |
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| CN201420497364.0U Expired - Fee Related CN204042816U (en) | 2014-08-30 | 2014-08-30 | A kind of LED radiator based on vapor chamber heat dissipation technology |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
| CN107589813A (en) * | 2016-10-31 | 2018-01-16 | 东莞市立川五金制品有限公司 | The mounting structure of vacuum chamber radiator |
| CN108207097A (en) * | 2018-02-09 | 2018-06-26 | 中兴通讯股份有限公司 | A kind of heat-proof device and electronic product |
| CN112492853A (en) * | 2020-12-03 | 2021-03-12 | 西安交通大学 | Liquid cavity heat dissipation device based on pool boiling heat dissipation |
-
2014
- 2014-08-30 CN CN201420497364.0U patent/CN204042816U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
| CN107589813A (en) * | 2016-10-31 | 2018-01-16 | 东莞市立川五金制品有限公司 | The mounting structure of vacuum chamber radiator |
| CN108207097A (en) * | 2018-02-09 | 2018-06-26 | 中兴通讯股份有限公司 | A kind of heat-proof device and electronic product |
| US11229130B2 (en) | 2018-02-09 | 2022-01-18 | Zte Corporation | Heat-insulation device and electronic product |
| CN112492853A (en) * | 2020-12-03 | 2021-03-12 | 西安交通大学 | Liquid cavity heat dissipation device based on pool boiling heat dissipation |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20160830 |