CN2129909Y

CN2129909Y - Hot tube semiconductor thermal electric refrigerator

Info

Publication number: CN2129909Y
Application number: CN 92202399
Authority: CN
Inventors: 刘纪福; 孙宏伟; 夏新林
Original assignee: Harbin Institute of Technology
Current assignee: Harbin Institute of Technology
Priority date: 1992-01-31
Filing date: 1992-01-31
Publication date: 1993-04-14
Anticipated expiration: 2002-01-31

Abstract

The utility model provides a hot tube semiconductor thermal electric refrigerator with a hot tube as the main heat transferring component, and is mainly characterized in that the utility model is assembled by a plurality of hot tubes whose one end is equipped with a fin tail and metal blocks with excellent heat-conducting property to become one or two general heat transferring components. The cold and hot ends of the semiconductor refrigeration plate are respectively combined with two heat transferring components according to different application requests. The utility model provides a hot tube semiconductor thermoelectric refrigerating air-conditioning box and a hot tube semiconductor thermoelectric refrigerating fresh keeping box, and has the advantages of simple structure, strong universal property, convenient operation and maintenance, short settle time and high refrigerating efficiency.

Description

Hot tube semiconductor thermal electric refrigerator

The utility model relates to a kind of semiconductor thermoelectric refrigeration device that utilizes heat pipe as heat transfer element.The general heat-transferring assembly that utilization the utility model proposes can the food prepared therefrom antistaling box, semiconductor thermoelectric refrigeration devices such as little space air-conditioning box.This utility model belongs to the technical field of refrigeration air-conditioner, Engineering Thermophysics.

At present, adopt the heat absorption of aluminium box at home and abroad in the existing semiconductor thermoelectric refrigeration antistaling box, casing, outside thermal resistance is big with finned aluminium block heat radiation, and the cold and hot surface temperature difference is big, and refrigerating capacity is little, and refrigerating efficiency is low, and the utmost point is waited to improve.The semiconductor thermoelectric refrigeration device that is used for air-conditioning that has, water need be attended by water tank and water circulation system as low-temperature receiver, uses very inconvenient.The patent that also has has been reported and adopted heat pipe in thermoelectric cooling unit, but its application purpose is the part cooling of some electric elements, with the utility model a great difference is arranged all on design feature and type of device.

The purpose of this utility model is to design a kind of semiconductor thermoelectric refrigeration heat-transferring assembly that combines with heat-pipe elements efficiently, and utilizes the various combination of this assembly, makes different semiconductor thermoelectric refrigeration devices such as antistaling box, air-conditioning box.Because combine closely with the general heat-transferring assembly of design respectively in two surfaces of semiconductor chilling plate, thereby the heat transfer property of device is improved greatly, thereby reach the purpose that improves refrigerating efficiency or increase refrigerating capacity.

The utility model heat pipe-type semiconductor thermoelectric refrigeration device comprises: 1. heat-pipe elements; 2. block; 3. semiconductor chilling plate; 4. casing; 5. rectifier; 6. fan.Wherein several heat-pipe elements and block are made of one, and become a heat-transferring assembly.

The operation principle of this machine is: (1) utilizes paltie effect to freeze.So-called peltier effect is exactly when electric current flows through the loop of being made up of two kinds of different materials, just produces the temperature difference in the junction of two kinds of materials, and an end temperature is low, can absorb heat from environment, i.e. refrigeration; Other end temperature is higher, dispels the heat to the external world.(2) utilize the general heat-transferring assembly that the utility model proposes to strengthen the heat transfer of semiconductor refrigerating layer both ends of the surface.A heat-transferring assembly is close to the cold junction face of semiconductor chilling plate, and places refrigeration space together, in order to the heat in absorption refrigeration space efficiently, to reach the purpose of refrigeration; Another heat-transferring assembly is close to the hot junction face of semiconductor refrigerating gas, and is exposed to together in the surrounding air, by the fraction of free convection or forced convertion heat is passed to atmosphere.

Heat pipe is by sealed metal tube, after the centre is evacuated, adds a certain amount of working medium and makes.After the evaporator section of heat pipe is heated, working medium will be seethed with excitement or evaporate, absorb the latent heat of vaporization from thermal source, the steam that produces flow to the section of condensing, steam runs into cold wall and can condense into liquid and emit the latent heat of vaporization simultaneously, pass to the low-temperature receiver of outside by tube wall, the capillary force that liquid that condensation is got off relies on gravity or imbibition core to produce is back to evaporator section again, restarts to evaporate endothermic process.The heat-pipe elements that the utility model is designed, (1) inside pipe wall has the screw thread groove liquid sucking core, tube outer surface one end is a light pipe, insert in the block, and with its tight contact; An other end is a finned tube, is exposed in the air ambient.

Block (2) is to be made by the heat conductivility good metal, the one side of block have two with the contacted boss of semiconductor chilling plate (3), another side is exposed in the air admittedly, there is fin on the surface.Each block is inner to insert six heat pipes that are arranged in parallel, and forms a general heat-transferring assembly jointly.

By Fig. 1 and Fig. 2 as seen, the heat-pipe elements in the heat-transferring assembly can be a straight tube, also can be bend pipe, to adapt to different installation positions and body structure.In addition, heat-transferring assembly is when being installed on casing, and the angle of heat-pipe elements and horizontal direction is controlled at 1～3 °.

At antistaling box or air-conditioning box inside fan is not installed, by the free convection cycle heat exchange; In the casing outside 1～2 fan is installed, can opens as required or stop using, to regulate the radiating effect of external heat transfer assembly.In addition, by changing the sense of current that feeds semiconductor chilling plate, the refrigeration side can be changed into heated side, and antistaling box promptly can be used as incubator and uses.

By the 40 liter antistaling boxes that the utility model principle is made, 3～5 ℃ of the temperature inside the box, from starting to half an hour stabilization time, actual power consumption is 50w; From 160 liter air-conditioning boxs, the temperature inside the box is lower 10～15 ℃ than environment temperature, and consumed power is 50～70W, and be half an hour stabilization time.

Description of drawings:

Fig. 1 is the former figure of structure of the utility model heat pipe-type semiconductor thermoelectric refrigeration air-conditioning box

Fig. 2 is the structure principle chart of the utility model heat pipe-type semiconductor thermoelectric refrigeration antistaling box

1----heat-pipe elements in the accompanying drawing; The 2----block; The 3----semiconductor chilling plate; The 4----casing; The 5----rectifier; The 6----fan.

Claims

1, a kind of semiconductor thermoelectric refrigeration device comprises finned heat-pipe elements, block.Semiconductor chilling plate, body of thermal insulating box, rectifier and fan; It is characterized in that by in some the parallel insertion blocks of heat pipe; Insertion portion is a light pipe, exposed portions serve is a finned tube, the one side of block has two and the contacted boss of semiconductor chilling plate (3), another side props up fin, is exposed in the air, and heat-pipe elements can be straight, also can partly curve the right angle with exposing block, the semiconductor refrigerating element is clipped in two heat-transferring assemblies, and a heat-transferring assembly places in the casing, and another piece places outside the casing.

2, the semiconductor thermoelectric refrigeration device formed of claim 1 described heat-transferring assembly, it is characterized in that of the heat transfer free convection of the box house of the semiconductor thermoelectric refrigeration air-conditioning box made by heat transfer piece, case spare and semiconductor chilling plate and semiconductor thermoelectric refrigeration antistaling box by air, outside by the free convection of air or the forced-convection heat transfer of fan, the mounting means of heat-transferring assembly should guarantee that heat-pipe elements and horizontal direction keep certain inclination angle 1-3 °, heat-transferring assembly can keep flat, can be positioned over the casing top, also can be positioned over the side or the back of casing.