CN2352902Y - Forced heat conducting type refrigerator - Google Patents
Forced heat conducting type refrigerator Download PDFInfo
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- CN2352902Y CN2352902Y CN 98225136 CN98225136U CN2352902Y CN 2352902 Y CN2352902 Y CN 2352902Y CN 98225136 CN98225136 CN 98225136 CN 98225136 U CN98225136 U CN 98225136U CN 2352902 Y CN2352902 Y CN 2352902Y
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- radiator
- pipe
- heat pipe
- fin
- semiconductor cooler
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Abstract
The utility model relates to a reinforced heat transfer type refrigerator. The utility model comprises a heat insulating box (8) whose sandwich layer is charged with plastic foam, the top of a box body is provided with a semiconductor freezer (1) whose hot end side is contacted with a hot end radiator (4), and the cold end side is contacted with a cold end radiator (3). The utility model is characterized in that the radiator contacted with the hot end of the semiconductor freezer (1) is a special designed plane type heat pipe radiator (4) which is mainly composed of a plane base plate (15) and condensing finned pipes (17), and the inner part of each finned pipe is charged with heat transfer fluid ammonia; the cold end radiator (3) can be an ordinary aluminium section radiator; one side of the radiator (3) can be provided with a fan (14).
Description
The utility model is addressed a kind of augmentation of heat transfer type refrigerating box, particularly adopts the refrigerating box of semiconductor cooler, belongs to the semiconductor refrigerating technology field.
The multiple semiconductor refrigerating refrigerating box of production and supply in the market, the refrigerating box of vehicle-mounted type, the type of camping and hotel room type etc. for example, its advantage be adopt whole solid-state devices, in light weight, volume is little, do not have environmental pollution, but all these semiconductor refrigerating refrigerating boxes on performance no more than mechanical compression type or absorption refrigerate, the refrigerating capacity that also is these semiconductor refrigerating refrigerating boxes is less, and efficient is also lower.
Under present existing semiconductor refrigerating manufacturing technology, improve the refrigerating function and the efficient of semiconductor refrigerating refrigerating box, its effective way is to strengthen the heat radiation in semiconductor cooler hot junction, and the heat radiation of suitably strengthening the semiconductor cooler cold junction.
The semiconductor refrigerating refrigerating box of production and supply in the market, generic name are called semiconductor travlling refrigerator or automobile refrigerator.This kind refrigerating box includes a body of thermal insulating box, be filled with foamed plastics as heat-insulating material in the casing interlayer, the casing top is provided with the semiconductor refrigerator, the hot junction of semiconductor cooler upside contacts (referring to Fig. 1) with the hot-side heat dissipation device, and the cold junction of semiconductor cooler downside contacts with the cold junction radiator by an aluminium block; At the radiator side corresponding radiator fan is arranged respectively, make radiator work in the operating mode of forced convection; Fan is driven by the small machine of a double headed roller axle.Hot-side heat dissipation device and cold junction radiator all adopt the aluminium section bar radiator at present, the aluminium section bar radiator is made by extrusion forming process, its shortcoming is that fin height and spacing of fins have certain restriction, with the fin number that causes unit length seldom, also be on the unit floor space area of dissipation seldom, so radiating effect is relatively poor, its radiating efficiency is also lower.If semiconductor cooler is 40 * 40mm, maximum operating currenbt is I
Max=6A, then hot-side temperature T
hWith environment temperature T
RDifference surpass 20 ℃, summer, then the semiconductor cooler hot-side temperature can surpass 50 ℃, i.e. T when if environment temperature is 30 ℃
h＞50 ℃.As refrigerating box, the temperature inside the box should remain on+and about 5 ℃, so the cold junction temperature Tc of semiconductor cooler must remain on about Tc=0 ℃.50 ℃ of the big whats of the work temperature difference of semiconductor cooler meeting at this moment, under such work temperature difference, the refrigerating capacity of semiconductor cooler is obviously too little, is difficult to keep refrigerating box the temperature inside the box about 5 ℃.
The another kind of semiconductor refrigerating technology that adopts at present is, the heat radiation in semiconductor cooler cold junction and hot junction is by the widely different road of circulating of water in the middle of one, and the left side is the widely different road of refrigeration, and the right side is heat radiation widely different road (referring to Fig. 2).The hot junction on semiconductor cooler right side contacts with the hot junction water heat exchanger, and the cold junction in left side contacts with the cold junction water heat exchanger.The middle recirculated water in hot junction is squeezed into the hot junction water heat exchanger by little pump by circulating water pipeline, and then through another fin-tube type heat exchanger, heat is distributed in the outside air goes, the water that is cooled is at last returned in the water heat exchanger of hot junction by little pump again again again, circulation and so forth makes the hot-side heat dissipation cooling.The radiating effect of one fan with enhanced tube fin type heat interchanger can be set in addition.The operation principle of left side cold junction is identical with the hot junction, right side, only cold loop.Be provided with expansion vessel in the loop, in order to absorb the Volume Changes that water capacity produces because of variations in temperature in the water loops.The technical method of water-flow circuit can improve the efficient of semiconductor cooler preferably in the middle of adopting, main cause is that water heat exchanger is more far better than the radiating effect of aforesaid aluminium section bar radiator, and heat is loose in surrounding air, be to have adopted the fin-tube type heat exchanger, this is a close-coupled aluminum soldering thermal interchanger, and effect is better.Therefore this method can make the work temperature difference of semiconductor cooler obviously reduce, thereby improves refrigerating efficiency.But the shortcoming of this technical method is to have increased a huge middle water circulation system, has increased by two covering device equipment, as little pump, and expansion vessel, fin-tube type heat exchanger etc., wherein aluminium soldering fin-tube type heat exchanger price is very expensive, can improve manufacturing cost.In addition because middle water circular flow is arranged, recirculated water might local evaporation and have corrosion phenomenon after one, two year, and therefore needs regularly replace recirculated water and part of appliance.
The purpose of this utility model is to overcome the existing at present shortcoming that exists in this Refrigeration Technique method of partly leading, the i.e. heat radiation that makes the semiconductor cooler hot junction of means and method by augmentation of heat transfer obtains improvement in essence, thereby hot-side temperature is descended, the also corresponding thereupon decline of cold junction temperature, dwindle the work temperature difference of semiconductor cooler, to improve the refrigerating efficiency of semiconductor cooler.
The purpose of this utility model reaches by following technological means and method.
The utility model augmentation of heat transfer type refrigerating box mainly includes the body of thermal insulating box that an interlayer is filled with foamed plastics, a semiconductor cooler, the radiator of a semiconductor cooler hot junction side, the radiator of a semiconductor cooler cold junction side, and the radiator fan of radiator side.The casing top is provided with the semiconductor refrigerator, and the hot-side heat dissipation device contacts with the hot junction of semiconductor cooler, and the cold junction radiator contacts with the cold junction of semiconductor cooler; It is characterized in that with the contacted radiator in semiconductor cooler hot junction being the planar heat pipe radiator of a particular design, it is mainly by being formed as the plane substrate of heat pipe evaporator section with as the condensing fin pipe that the fin of the condenser pipe of heat pipe condenser section and pipe shaft outside thereof constitutes, be filled with the working medium ammonia that can carry out the gas-liquid phase transformation in the heat pipe, the heat pipe inwall can be provided with the tube core that the micropore porous mass constitutes.Condensation segment at heat pipe is higher than under the operating mode of evaporator section, or the condensation segment of heat pipe at last evaporator section under following in vertical state operating mode, this moment, heat pipe was gravity assisted heat pipe, gravity assisted heat pipe can not be provided with tube core.All adopted gravity assisted heat pipe in the utility model.The plane evaporation substrate of planar heat pipe radiator has smooth smooth plane, can closely contact with the plane of semiconductor cooler hot junction side.The plane substrate is an aluminium block, can be solid, also can be that its inside has duct or chamber, communicates with above-mentioned condenser pipe by tube connector.Can be general aluminium section bar radiator with the contacted radiator of semiconductor cooler cold junction, also can be and above-mentioned similar planar heat pipe radiator.Also can be provided with the fan of forced convection heat radiation at the radiator side.With the contacted planar heat pipe radiator in semiconductor cooler hot junction can be for having the single tube form of single condensing fin pipe, can be for having the double hose form of two condensing fin pipes that are set up in parallel, also can also be the multitube form that is the square formation layout greater than three for having the three-tube type form of three condensing fin pipes that are set up in parallel.Preferred plan in the utility model is the three-tube type form with three condensing fin pipes that are set up in parallel.The fin of its pipe shaft of condensing fin pipe and pipe shaft outside is to be processed by heavy wall aluminum pipe integral body.Fin be shaped as circle.The planar heat pipe radiator is all made by metallic aluminium.
Semiconductor cooler mainly is the semiconductor subassembly that the paired P-N type bismuth telluride semiconductor rectangular blocks grain mat copper sheet by One's name is legion is in series, under direct current forward energising situation, each self-forming hot junction and cold junction in the semiconductor subassembly both sides, place the object that is cooled of cold junction, its heat is flowed to the hot junction from cold junction, and discharge in ambient atmosphere through the radiator and the fan of hot junction side setting, finally make the object cooling.The temperature in semiconductor cooler hot junction is the key factor that influences semiconductor refrigerating efficient, therefore strengthens the heat radiation in hot junction, reduces the temperature in hot junction, is key issue to be solved in the utility model.
Operation principle of the present utility model underdraws as follows: the heat of semiconductor cooler hot junction side is passed to the evaporation substrate with the planar heat pipe radiator of its plane contact, heat-transfer working medium ammonia in the heat pipe is converted into gaseous state from liquid state after absorbing heat, gaseous ammonia enters the condenser pipe of condensation segment by tube connector from substrate, when gaseous ammonia contacts with the inwall of condenser pipe, heat just is dispersed in the surrounding air by tube wall and the outer circular fin of pipe shaft and goes, and this moment, ammonia was liquid phase by vapor condensation, liquid ammonia is back to the evaporation substrate along the condenser pipe inwall, form the circulation of an evaporation and condensation, circulation can reduce the temperature in semiconductor cooler hot junction to a great extent and so forth.The exothermic coefficient of ammonia when evaporation and condensation is 5000W/M
2℃, the exothermic coefficient of water when the cooling heating is 1000W/M
2About ℃, and the exothermic coefficient of air when forced convection generally is not more than 100W/M
2℃.Because ammonia has so high exothermic coefficient when evaporation and condensation, so help dispersing of heat; The application of heat pipe is equivalent to increase largely the area of dissipation of condensation segment in addition, and has also improved fin efficiency.
In addition, the cold junction of semiconductor cooler also can adopt a less planar heat pipe radiator in the utility model, it is opposite that this planar heat pipe radiator and aforementioned person act on, promptly in the heat-pipe radiator as condensation segment be the plane substrate, and be finned tube as evaporator section; What contact with the semiconductor cooler cold junction is plane condensation substrate, and finned tube is to play the heat absorption evaporation in case.The planar heat pipe radiator of cold junction has been strengthened the radiating effect of cold junction, thereby the work temperature difference of semiconductor cooler is reduced, thereby has improved refrigerating efficiency.
Advantage of the present utility model and effect thereof are tangible, because radiator has adopted a kind of planar heat pipe radiator of particular design, means and method by augmentation of heat transfer, the hot-side temperature of semiconductor cooler is reduced to a certain degree effectively, thereby reduced the work temperature difference of semiconductor cooler, thereby improved the refrigerating efficiency of semiconductor refrigerating.In addition, because the efficient height of hot junction planar heat pipe radiator,, can be the hotel so can adopt the low-noise fan that rotating speed is low, noise is little, the guest room is designed to almost noiseless small-sized refrigerating box.Characteristics such as refrigerating box of the present utility model has the apparatus structure compactness, volume is little, noise is little, refrigeration performance is good.Its refrigerating efficiency in some cases even be higher than traditional mechanical compression type refrigerating box.The utility model refrigerating box can be widely used in every field, and for example it can be used as a kind of comparatively ideal semiconductor travelling refrigerator, vehicle refrigerator, hotel room refrigerator etc.
Now that description of drawings is as follows:
Fig. 1 is the structural representation of semiconductor refrigeration box in the prior art
Fig. 2 is the schematic diagram of water-flow circuit heat radiation refrigeration in the middle of the available technology adopting.
Fig. 3 is the structural representation that the semiconductor cooler hot junction is provided with the refrigerating box of double hose planar heat pipe radiator.
Fig. 4 is the hot junction of semiconductor cooler and the schematic diagram that cold junction is provided with the refrigerating box of planar heat pipe radiator.
Fig. 5 is a double hose planar heat pipe radiator schematic diagram.
Fig. 6 is the structural representation that the semiconductor cooler hot junction is provided with the refrigerating box of three-tube type planar heat pipe radiator.
Fig. 7 is a three-tube type planar heat pipe radiator schematic diagram.
Now in conjunction with the accompanying drawings and by embodiment the utility model is described in detail in following:
Fig. 1 is the structural representation of the present general semiconductor refrigerating refrigerating box that uses in the prior art, the meaning representation of each digital code is as follows among the figure: the 1-semiconductor cooler, 2-aluminum metal piece, 3-cold junction radiator, 4-hot-side heat dissipation device, 5-twin shaft small machine, 6-hot junction fan, 7-cold junction fan, the 8-body of thermal insulating box.
Fig. 2 is the schematic diagram that the water-flow circuit heat radiation is freezed in the middle of the cold and hot end of semiconductor cooler adopts in the prior art.The meaning representation of each digital code is as follows among the figure: the 1-semiconductor cooler, 9,9 '-the hot junction water heat exchanger, 10,10 '-circulating water line, 11,11 '-little water pump, 12,12 '-expansion vessel, 13,13 '-hot junction, cold junction fin-tube type heat exchanger, 14,14 '-fan.
Embodiment one
Mainly include the body of thermal insulating box 8 that an interlayer is filled with foamed plastics referring to Fig. 3, Fig. 4, Fig. 5, the utility model augmentation of heat transfer type refrigerating box, be provided with a semiconductor cooler 1 at casing 8 tops, the hot junction side of semiconductor cooler is provided with a double hose planar heat pipe radiator 4, semiconductor cooler cold junction side is provided with an aluminium section bar radiator 3, be that semiconductor cooler 1 is positioned at hot-side heat dissipation device and cold junction radiator between the two, and all be the plane contact that is adjacent to.Contacted with semiconductor cooler 1 hot junction is a kind of double hose planar heat pipe radiator 4 (referring to Fig. 5) of particular design, it is mainly by being formed as the plane substrate 15 of heat pipe evaporator section with as the condensing fin pipe that the circular fin 18 of the condenser pipe 17 of heat pipe condenser section and pipe shaft outside thereof constitutes, be filled with heat-transfer working medium ammonia in the heat pipe, the heat pipe inwall can be provided with the tube core that the micropore porous mass constitutes.In the present embodiment, following, the dawn is gravity assisted heat pipe to the condensation segment of heat pipe in vertical state at last evaporator section, and gravity assisted heat pipe can not be provided with tube core.Plane evaporation substrate 15 has smooth smooth plane, can be directly and semiconductor cooler 1 hot junction make plane contact.Substrate 15 is an aluminium block, and its inside has duct or chamber, communicates with above-mentioned condenser pipe 17 by tube connector 16.With the contacted radiator 3 of semiconductor cooler 1 cold junction be general aluminium section bar radiator.Respectively be provided with the fan 14 of a forced convection heat radiation at cool and heat ends radiator side.Double hose planar heat pipe radiator is all made by metallic aluminium, has the condenser pipe 17 of circular fin 18, and promptly the condensing fin pipe is to be processed by heavy wall aluminum pipe integral body.In the present embodiment, semiconductor cooler 1 is the TM127-1.4-0.6M model of the Russian NORD of employing company, be of a size of 40 * 40mm, plane substrate 15 is of a size of 62 * 60 * 20mm, condenser pipe is of a size of φ 15 * 1.5mm, the external diameter of circular fin 18 is φ 40mm, and finned tube length is 120mm, and spacing of fin is 2.3mm; Adopt two identical finned tubes that are arranged in parallel side by side as condensation segment.The fan specification of hot-side heat dissipation device side is 120 * 120mm, and the fan specification of cold junction radiator side is 80 * 80mm or 100 * 100mm.The volume of refrigerating box is 50～60 liters in the present embodiment, and refrigerated storage temperature is 5 ℃.
In addition, in the present embodiment also can semiconductor cooler 1 cold junction adopt less planar heat pipe radiator (as single hose or double hose) replace aforesaid aluminium section bar radiator (referring to Fig. 4), in the case, opposite with aforesaid effect, be the condensation segment of plane substrate 19, and the pipe 21 that has a circular fin 20 is that finned tube is the evaporator section as heat pipe as heat pipe.19 heat release condensations of plane condensation substrate, and finned tube plays the heat absorption evaporation.Adopt the planar heat pipe radiator at cold junction, can strengthen the radiating effect of cold junction, the work temperature difference of semiconductor cooler is reduced, thereby improved refrigerating efficiency.
But, in actual use, cold junction adopts general aluminium section bar radiator also to be fine, and is much smaller because the refrigerating capacity of cold junction is compared with the hot-side heat dissipation amount, and the former is the latter's 15～30% approximately only, still is passable with general aluminium section bar radiator therefore.Like this, manufacturing cost also can be hanged down.
Embodiment two
Consult Fig. 6 and Fig. 7, present embodiment is the preferred plan of the utility model, and its structure and the main device that is adopted and servicing unit are basic and embodiment one is identical.Its difference is that the planar heat pipe radiator 4 that adopt in semiconductor cooler 1 hot junction is to have three condensing fin pipes that be arranged in parallel side by side as condensation segment, has the corresponding condenser pipe 17 of three tube connectors 16 and each to communicate on the plane evaporation substrate 15.The finned tube that condenser pipe 17 and circular fin 18 constitute is that integral body processes.In the present embodiment, semiconductor cooler 1 is the TM127-1.4-0.6M model of the Russian NORD of employing company, be of a size of 40 * 40mm, planar heat pipe radiator evaporation substrate 15 is of a size of 62 * 60 * 20mm, condenser pipe is of a size of φ 15 * 1.5mm, and circular fin external diameter is φ 40mm, and finned tube length is 120mm, spacing of fin is 2.3mm, and the finned tube that uses three identical planar row layouts arranged side by side is as condensation segment.Hot junction fan specification is 120 * 120mm, and cold junction fan specification is 80 * 80mm or 100 * 100mm.The volume of this refrigerating box is 50～60 liters, and refrigerated storage temperature is 5 ℃.
Claims (5)
1. an augmentation of heat transfer type refrigerating box mainly includes the body of thermal insulating box (8) that an interlayer is filled with foamed plastics, semiconductor refrigerator (1), semiconductor refrigerator hot-side heat dissipation device (4), semiconductor refrigerator cold junction radiator (3) and fan (14); Casing (8) top is provided with semiconductor refrigerator (1), and hot-side heat dissipation device (4) contacts with the hot junction of semiconductor cooler (1), and cold junction radiator (3) contacts with the cold junction of semiconductor cooler (1); It is characterized in that with the contacted radiator in semiconductor cooler (1) hot junction be the planar heat pipe radiator (4) of a particular design, it is mainly by being formed as the plane substrate (15) of heat pipe evaporator section with as the condenser pipe (17) of heat pipe condenser section and the condensing fin pipe of the formation of the fin (18) outside the pipe shaft thereof, be filled with the working medium ammonia that can carry out the gas-liquid phase transformation in the heat pipe, the heat pipe inwall can be provided with the tube core that the micropore porous mass constitutes, condensation segment at heat pipe is higher than under the operating mode of evaporator section, or condensation segment at last evaporator section under following in vertical state operating mode, be gravity assisted heat pipe, gravity assisted heat pipe can not be provided with tube core, plane substrate (15) has smooth smooth plane, can be directly and semiconductor cooler (1) hot junction make plane contact; Substrate is an aluminium block, can be solid, and also portion has duct or chamber within it, communicates with above-mentioned condenser pipe (17) by tube connector (16); Can be general aluminium section bar radiator with the contacted radiator of semiconductor cooler (1) cold junction (3); Also can be provided with the fan (14) of forced convection heat radiation at the radiator side.
2. a kind of augmentation of heat transfer type refrigerating box as claimed in claim 1, it is characterized in that described and the contacted planar heat pipe radiator in semiconductor cooler (1) hot junction can be for having the single hose form of single condensing fin pipe (17), can be for having the double hose form of two condensing fin pipes (17) that are set up in parallel, also can also be the multitube form that is the square formation layout greater than three for having the three-tube type form of three condensing fin pipes (17) that are set up in parallel;
3. a kind of augmentation of heat transfer type refrigerating box as claimed in claim 1 or 2 is characterized in that described plane radiator (4) all made by metallic aluminium; Described fin (18) is rounded, the described condenser pipe (17) that has circular fin (18), and promptly the condensing fin pipe is to be processed by heavy wall aluminum pipe integral body.
4. a kind of augmentation of heat transfer type refrigerating box as claimed in claim 1 or 2, it is characterized in that described and semiconductor cooler (1) the contacted planar heat pipe radiator in hot junction (4), optimal scheme is the three-tube type form with three condensing fin pipes (17) that are set up in parallel; Described semiconductor cooler (1) is Russian NORD company's T M127-1.4-0.6M model, is of a size of 40 * 40mm; Identical and the size condenser pipe (17) that is arranged in juxtaposition of three of planar heat pipe radiator (4) condensation segment is φ 15 * 1.5mm, and the external diameter of fin (18) is φ 40mm, and finned tube length is 120mm, and spacing of fin is 2.3mm; Evaporation substrate (15) is of a size of 62 * 60 * 20mm; Fan (4) specification of described hot junction side is 120 * 120mm.
5. a kind of augmentation of heat transfer type refrigerating box as claimed in claim 4, it is characterized in that described and the contacted radiator of semiconductor cooler (1) cold junction (3) also can be a kind of planar heat pipe radiator, in the case, opposite with aforesaid effect, substrate (14) is as the condensation segment of heat pipe, and the pipe (21) that has fin (20) is that finned tube is the evaporator section as heat pipe; The specification of cold junction fan (14) is 80 * 80mm or 100 * 100mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98225136 CN2352902Y (en) | 1998-09-18 | 1998-09-18 | Forced heat conducting type refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98225136 CN2352902Y (en) | 1998-09-18 | 1998-09-18 | Forced heat conducting type refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2352902Y true CN2352902Y (en) | 1999-12-08 |
Family
ID=33975881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98225136 Expired - Fee Related CN2352902Y (en) | 1998-09-18 | 1998-09-18 | Forced heat conducting type refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2352902Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100396999C (en) * | 2005-09-27 | 2008-06-25 | 上海理工大学 | Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system |
| CN101377392B (en) * | 2007-08-27 | 2012-02-22 | Abb研究有限公司 | Heat exchanger |
| CN106091522A (en) * | 2016-06-13 | 2016-11-09 | 山东大学 | Cold-storage delivery case based on semiconductor refrigerating |
| CN107166860A (en) * | 2017-05-08 | 2017-09-15 | 青岛海尔股份有限公司 | For the dry and wet point storage drawer of refrigerator, and the refrigerator with it |
| CN107611821A (en) * | 2017-09-28 | 2018-01-19 | 中科电力装备集团有限公司 | A kind of new distribution automation terminal |
| CN109425247A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | A kind of radiator, outdoor unit and air conditioner |
| CN109724051A (en) * | 2019-03-18 | 2019-05-07 | 江苏洪昌科技股份有限公司 | A kind of laser headlight for vehicles radiator based on semiconductor cooler |
-
1998
- 1998-09-18 CN CN 98225136 patent/CN2352902Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100396999C (en) * | 2005-09-27 | 2008-06-25 | 上海理工大学 | Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system |
| CN101377392B (en) * | 2007-08-27 | 2012-02-22 | Abb研究有限公司 | Heat exchanger |
| CN106091522A (en) * | 2016-06-13 | 2016-11-09 | 山东大学 | Cold-storage delivery case based on semiconductor refrigerating |
| CN107166860A (en) * | 2017-05-08 | 2017-09-15 | 青岛海尔股份有限公司 | For the dry and wet point storage drawer of refrigerator, and the refrigerator with it |
| CN109425247A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | A kind of radiator, outdoor unit and air conditioner |
| CN107611821A (en) * | 2017-09-28 | 2018-01-19 | 中科电力装备集团有限公司 | A kind of new distribution automation terminal |
| CN109724051A (en) * | 2019-03-18 | 2019-05-07 | 江苏洪昌科技股份有限公司 | A kind of laser headlight for vehicles radiator based on semiconductor cooler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |