CN102536745A - Heat radiating device for heat pipes - Google Patents
Heat radiating device for heat pipes Download PDFInfo
- Publication number
- CN102536745A CN102536745A CN2011103986358A CN201110398635A CN102536745A CN 102536745 A CN102536745 A CN 102536745A CN 2011103986358 A CN2011103986358 A CN 2011103986358A CN 201110398635 A CN201110398635 A CN 201110398635A CN 102536745 A CN102536745 A CN 102536745A
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- heat
- main
- sink
- heat pipe
- dissipating cover
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- 238000009833 condensation Methods 0.000 claims abstract description 7
- 230000005494 condensation Effects 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 25
- 230000003044 adaptive effect Effects 0.000 claims description 2
- 238000005336 cracking Methods 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000005057 refrigeration Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000004378 air conditioning Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000012149 noodles Nutrition 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat radiating device for heat pipes. A main heat radiating device is sleeved on the surface of a shell of a compressor; a secondary heat radiating device is arranged on a middle baffle of an external unit of an air conditioner; heat pipes are arranged in both the main heat radiating device and the secondary heat radiating device, and the heat pipes of the two devices are communicated; and the secondary heat radiating device is also provided with a refrigerator for heat exchange and condensation of the heat pipe in the secondary heat radiating device. According to the heat radiating device for the heat pipes, the temperature of a compressor of an air conditioner can be rapidly and efficiently reduced by high-efficiency cooperation of the main heat radiating device and the secondary heat radiating device, so that the compressor can be kept running in better working conditions, therefore, the stable operation of the compressor is guaranteed, and the service life of the compressor is prolonged; and meanwhile, stable and high-efficiency running of the air conditioner is guaranteed.
Description
Technical field
The present invention relates to refrigeration technology field, more particularly, relate to a kind of heat-pipe radiating apparatus that is used on the compressor.
Background technique
When air conditioner freezes under summer high temperature environment; The compressor body heat is difficult to distribute; Especially under the T3 work condition environment, thereby the body temperature that causes the compressor heat to gather raises and causes that compressor exhaust temperature in the air-conditioning system is too high and jump and stop that air conditioner stops cisco unity malfunction.In case compressor is jumped machine, just can resume operation automatically more than wanting half an hour at least, and can jump machine once more very soon, the formation vicious circle.The central diaphragm of outdoor unit is kept apart compressor and fan system, and the heat that makes compressor more difficulty distributes.The compressor heat sink conception of existing technology is the adjustment that the refrigerant through refrigeration system flows to, and part low temperature refrigerant is introduced volatilization cooling in the compressor, but is cost with the sacrificial system performance.
Summary of the invention
The object of the invention is in order to overcome the deficiency that above-mentioned prior art exists, and a kind of scientific and reasonable, heat-pipe radiating apparatus that radiating efficiency is high is provided.
The technological scheme that the present invention adopts is: a kind of heat-pipe radiating apparatus; Surface of shell at compressor is arranged with main sink; Secondary sink is set on the central diaphragm of machine outside air conditioner; The heat pipe that heat pipe and stream oriented device all are set in said main sink and the secondary sink is communicated with, and said secondary sink also is provided with the refrigerator that makes the heat pipe heat exchanging condensation in the secondary sink.
Said main sink is assembled by main dissipating cover and main cooling fin fin base sleeve, is embedded with the heat pipe of coiling.
Said main dissipating cover and the involutory surface of main cooling fin fin base are equipped with groove, are made up of the cavity volume of heat pipe the groove combination of main dissipating cover and main cooling fin fin base.
Said main dissipating cover is provided with and cracks, adaptive locking buckle and the draw-in groove of being provided with in the both sides of cracking.
Said secondary sink comprises refrigerator, secondary dissipating cover and secondary cooling fin fin base; Said secondary dissipating cover and secondary cooling fin fin base are fitted and are embedded with heat pipe; Said secondary dissipating cover and the involutory surface of secondary cooling fin fin base are equipped with groove; Constitute cavity volume, said refrigerator and the secondary dissipating cover contact heat-exchanging of heat pipe by the groove combination of secondary dissipating cover and secondary cooling fin fin base.
Said refrigerator comprises semiconductor refrigerating sheet and secondary sink main leaf.
Compared with prior art, the present invention has the following advantages:
Efficient collaboration, both through main sink and secondary sink; The present invention can reduce the temperature of air condition compressor quickly and efficiently, compressor is remained on preferably move under the operating mode, has guaranteed the stable operation of compressor and has prolonged its working life; Simultaneously, also guarantee the air-conditioning stable and high effective operation.
Description of drawings
Fig. 1 is the air-conditioning outer machine structural representation that heat-pipe radiating apparatus of the present invention is installed;
Fig. 2 is secondary sink understructure schematic representation;
Fig. 3 is the structural representation of secondary sink lid;
Fig. 4 is the structural representation of secondary sink main leaf;
Fig. 5 is secondary sink heat pipe scheme of installation;
Fig. 6 is the structural representation of secondary sink;
Fig. 7 is the structural representation of main dissipating cover;
Fig. 8 is the enlarged view of the locking buckle part of Fig. 7;
Fig. 9 is the structural representation of main cooling fin fin base;
Figure 10 is the schematic perspective view of main sink;
Figure 11 is the plan view of main sink;
Figure 12 is the side view of main sink.
Embodiment
We know that after the semiconductor chip energising, the chip both ends of the surface can form cold junction and hot junction.
Simultaneously, we know that also heat pipe principle is utilized sweat cooling exactly, make that heat pipe two ends temperature difference is very big, realize that heat conducts fast.Heat pipe is made up of shell, wick and end cap.Inside heat pipe is to be pumped into negative pressure state, charges into suitable liquid, and this boiling point of liquid is low, easily volatilization.Tube wall has wick, and it is made up of the capillary porous material.Heat pipe is a vaporizing end for one section, and other one section is condensation end, when heat pipe one end is heated; Liquid in the capillary tube evaporates rapidly, and steam flows to an other end under small pressure difference, and discharges heat; Regelation becomes liquid; Liquid leans on the effect of capillary force to flow back to evaporator section along porous material again, and so circulation is more than, and heat reaches an other end by heat pipe one end.This circulation is carried out fast, and heat can be come by conduction continuously.Heat pipe has very high thermal conductivity: inside heat pipe mainly leans on the vapour of working liquid body, liquid phase to become heat transfer, and thermal resistance is very little, therefore has the very high capacity of heat transmission.It has made full use of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, is delivered to rapidly outside the thermal source through the heat of heat pipe with thermal objects, and its capacity of heat transmission surpasses the capacity of heat transmission of any known metal.The present invention is exactly science utilization heat pipe principle and semiconductor refrigeration principle, processes heat-pipe radiating apparatus efficiently.
Referring to Fig. 1; Be that a heat-pipe radiating apparatus of invention is made up of main sink and secondary sink; Both link together through heat pipe; Main sink is enclosed within on the shell of compressor, and the heat of compressor is passed on the secondary sink through the heat pipe in the main sink, is absorbed by the semiconductor chip refrigeration.Specify as follows:
Referring to Fig. 2-12, secondary sink comprises: secondary sink base 31, secondary sink lid 32, secondary sink main leaf 33, secondary sink lock screw hole 34, secondary sink mounting screw hole 35, semiconductor refrigerating sheet 36, heat pipe 5; Wherein secondary sink base comprises: secondary sink base heat pipe groove 311, secondary sink lock screw hole 34, secondary sink mounting screw hole 35; Secondary sink lid comprises: secondary sink covers heat pipe groove 321, semiconductor refrigerating sheet mount grooves 322, secondary sink lock screw hole 34, secondary sink mounting screw hole 35; Secondary sink main leaf comprises: secondary sink main leaf base 331, secondary sink main leaf fin 332, semiconductor refrigerating sheet mount grooves 333, secondary sink mounting screw hole 35.Described main sink comprises: main cooling fin fin base 61, main dissipating cover 62, main radiating fin lock screw hole 63, and wherein main dissipating cover comprises: main locking arm 621, secondary locking arm 622, locking buckle 623, draw-in groove 624, ring base 625, main dissipating cover heat pipe groove 626, main radiating fin lock screw hole 63; Wherein main cooling fin fin base comprises: main heat dissipation base heat pipe groove 611, slit 612, ring base 622, main radiating fin lock screw hole 63.
Be provided with a rectangular semiconductor refrigerating sheet mount grooves 333 in the middle of the secondary sink main leaf 33, the length of this groove 333 and wide size according to semiconductor refrigerating sheet 36 are decided, and the degree of depth is 2mm; Secondary sink main leaf 33 and groove 333 relative one sides are provided with the secondary sink main leaf fin 332 of several equidistance, should pair sink main leaf fin 332 during assembling with consistent with airflow direction.Secondary sink main leaf 33 also is provided with 6 secondary sink mounting screw holes 35 because secondary sink base 31, secondary sink lid 32 and secondary sink main leaf 33 all are provided with 6 secondary sink mounting screw holes 35 of position consistency; So during screw-driving, can be once more with refrigeration semiconductor refrigerating sheet 36 applying tightly of secondary sink base 31, secondary sink lid 32, secondary sink main leaf 33 and sandwich.
Earlier the heat pipe that designs 5 is placed according to the heat pipe groove location, then secondary sink base 31 and secondary sink lid 32 are closed tightly, tighten through secondary sink lock screw hole 34 with screw.Coat heat-conducting silicone grease uniformly in the semiconductor refrigerating sheet mount grooves 333 of secondary sink main leaf 33 and semiconductor refrigerating sheet mount grooves 322 bottoms of sink lid 32 respectively; Then the huyashi-chuuka (cold chinese-style noodles) of semiconductor refrigerating sheet 36 is attached to and the semiconductor refrigerating sheet mount grooves 322 of secondary sink lid 32 on; At last secondary sink main leaf 33 is covered; This moment, hot side and the secondary sink main leaf 33 semiconductor refrigerating sheet mount grooves 333 of semiconductor refrigerating sheet 36 were fitted, with screw through secondary sink mounting screw hole 35 with secondary sink base 31, sink cover 32, semiconductor refrigerating sheet 36 and secondary sink main leaf 33 tighten with outdoor unit central diaphragm 4 on.
Main cooling fin fin base 61 is a toroidal, and its internal diameter is a bit larger tham the external diameter of compressor casing, and its length is consistent with the length of main dissipating cover 62.Main dissipating cover 62 outer walls are provided with main heat dissipation base heat pipe groove 611, and the radius of this groove 611 is slightly less than heat pipe 5 radiuses of arranging, and consistent on the position of this groove 611 and the main dissipating cover heat pipe groove 626.Main cooling fin fin base 61 also is provided with a slit 612, and this slit 612 is consistent with the seam shape size of main dissipating cover 62.
During assembling, earlier the heat pipe that designs 5 is placed the heat pipe groove location according to Figure 10, then main cooling fin fin base 61 is closed tightly with main dissipating cover 62, tighten through main radiating fin lock screw hole 63 with screw.Ring base 622 internal surfaces of the main radiating fin 6 that assembles are evenly coated heat-conducting silicone grease, then according to the outer surface that is enclosed within the motor place part of compressor 7 shown in Figure 8.Firmly main locking arm 621, secondary locking arm 622 are compressed to the centre; The card shape of locking buckle 623 receives pressure deformation in the ring base center of circle of the outside internal surface of secondary locking arm draw-in groove 624; When being seated; The card shape of locking buckle 623 is not receiving external force, locks buckle 623 this moment because original elastic reaction restores to the original state.The card shape of locking buckle 623 tightly block secondary locking arm 624 outer surfaces.Because ring base 622 internal diameters behind the locking card 623 button chuckings can dwindle, therefore ring base 622 shell of encircling compressor tightly of the main sink 6 after the locking.Main sink 6 is adjacent to through the high-efficiency heat conduction silicone grease with the shell of compressor 7; Thereby guaranteed the thermal conductive resin of main sink 6 and compressor 7; Described heat pipe 5, for fear of air conditioner heat pipe 5 serious vibration when moving, heat pipe need design many several U-shaped shapes to reduce the vibration of pipeline.
During the air conditioner operation; The compressor casing temperature is higher; The end that heat pipe 5 is inserted on the main sink 6 is a vaporizing end, and the liquid in this end capillary tube evaporates rapidly, and steam flows to an other end under small pressure difference; And the 5 condensation end condensations of the heat pipe in secondary sink 3 discharge heat, the secondary sink 3 of these heat transferred.When work, add the VDC of 12V at the two ends of semiconductor refrigerating sheet 36.When electric current by the N of semiconductor refrigerating sheet PN junction during through P, electric field makes the hole reverse flow of electronic current in P among the N, the heat that their produce is from the heat energy of lattice.Be attached to the huyashi-chuuka (cold chinese-style noodles) heat absorption that sink covers 32 semiconductor-on-insulator refrigerating sheets 36, siphon away the heat that heat pipe passes on the sink lid 32; And in the hot side heat release of the other end, the heat transfer of generation is to secondary sink main leaf 33.The wind eddies stream that utilizes the outdoor fan running to form forms convection heat exchange and cools off secondary sink main leaf 33, makes heat shed rapidly.The liquid of condensation leans on the effect of capillary force to flow back to the evaporator section of heat pipe in the main sink 6 along porous material again in the heat pipe 5 of secondary sink 3 ends; So circulation is more than; Heat reaches an other end by heat pipe one end, and promptly heat is delivered to main sink 6 by compressor, is delivered to secondary sink 3 through heat pipe 5 by main sink 6; Utilize secondary in bulk the putting of refrigeration cooling of semiconductor refrigerating sheet 36 then; The wind eddies stream that utilizes the outdoor fan running to form forms convection heat exchange and cools off secondary sink main leaf 33, thereby reaches the effect that reduces the compressor electric motor temperature, has effectively guaranteed the reliability of compressor operating.
Claims (6)
1. heat-pipe radiating apparatus; It is characterized in that: the surface of shell at compressor is arranged with main sink; Secondary sink is set on the central diaphragm of machine outside air conditioner; The heat pipe that heat pipe and stream oriented device all are set in said main sink and the secondary sink is communicated with, and said secondary sink also is provided with the refrigerator that makes the heat pipe heat exchanging condensation in the secondary sink.
2. heat-pipe radiating apparatus according to claim 1 is characterized in that: said main sink is assembled by main dissipating cover and main cooling fin fin base sleeve, is embedded with the heat pipe of coiling.
3. heat-pipe radiating apparatus according to claim 2 is characterized in that: said main dissipating cover and the involutory surface of main cooling fin fin base are equipped with groove, are made up of the cavity volume of heat pipe the groove combination of main dissipating cover and main cooling fin fin base.
4. heat-pipe radiating apparatus according to claim 3 is characterized in that: said main dissipating cover is provided with and cracks, adaptive locking buckle and the draw-in groove of being provided with in the both sides of cracking.
5. heat-pipe radiating apparatus according to claim 4; It is characterized in that: said secondary sink comprises refrigerator, secondary dissipating cover and secondary cooling fin fin base; Said secondary dissipating cover and secondary cooling fin fin base are fitted and are embedded with heat pipe; Said secondary dissipating cover and the involutory surface of secondary cooling fin fin base are equipped with groove, are made up of cavity volume, said refrigerator and the secondary dissipating cover contact heat-exchanging of heat pipe the groove combination of secondary dissipating cover and secondary cooling fin fin base.
6. heat-pipe radiating apparatus according to claim 5 is characterized in that: said refrigerator comprises semiconductor refrigerating sheet and secondary sink main leaf.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103986358A CN102536745A (en) | 2011-12-05 | 2011-12-05 | Heat radiating device for heat pipes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103986358A CN102536745A (en) | 2011-12-05 | 2011-12-05 | Heat radiating device for heat pipes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102536745A true CN102536745A (en) | 2012-07-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103986358A Pending CN102536745A (en) | 2011-12-05 | 2011-12-05 | Heat radiating device for heat pipes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102536745A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104896982A (en) * | 2015-05-20 | 2015-09-09 | 澳柯玛股份有限公司 | Refrigeration system for cooling compressor through heat pipe |
| CN105464948A (en) * | 2015-12-18 | 2016-04-06 | 华南理工大学 | Device for enhancing heat dissipation performance of freezer compressor shell |
| CN105987464A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
| CN107314572A (en) * | 2016-04-27 | 2017-11-03 | 诺而达奥托铜业（中山）有限公司 | Detachable radiating subassembly |
| CN110887263A (en) * | 2018-09-10 | 2020-03-17 | 安徽美芝制冷设备有限公司 | Compressor system |
| WO2023103522A1 (en) * | 2021-12-06 | 2023-06-15 | 青岛海尔空调器有限总公司 | Method and apparatus for controlling air conditioner, and air conditioner and storage medium |
| WO2023175119A1 (en) * | 2022-03-16 | 2023-09-21 | Knf Neuberger Gmbh | Pump comprising a pressure chamber and a cooling system |
| CN117450713A (en) * | 2023-12-22 | 2024-01-26 | 珠海格力电器股份有限公司 | Refrigerating equipment, control method thereof and refrigerator |
-
2011
- 2011-12-05 CN CN2011103986358A patent/CN102536745A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105987464A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
| CN105987464B (en) * | 2015-02-05 | 2023-03-17 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
| CN104896982A (en) * | 2015-05-20 | 2015-09-09 | 澳柯玛股份有限公司 | Refrigeration system for cooling compressor through heat pipe |
| CN105464948A (en) * | 2015-12-18 | 2016-04-06 | 华南理工大学 | Device for enhancing heat dissipation performance of freezer compressor shell |
| CN107314572A (en) * | 2016-04-27 | 2017-11-03 | 诺而达奥托铜业（中山）有限公司 | Detachable radiating subassembly |
| CN110887263A (en) * | 2018-09-10 | 2020-03-17 | 安徽美芝制冷设备有限公司 | Compressor system |
| CN110887263B (en) * | 2018-09-10 | 2021-07-13 | 安徽美芝制冷设备有限公司 | Compressor system |
| WO2023103522A1 (en) * | 2021-12-06 | 2023-06-15 | 青岛海尔空调器有限总公司 | Method and apparatus for controlling air conditioner, and air conditioner and storage medium |
| WO2023175119A1 (en) * | 2022-03-16 | 2023-09-21 | Knf Neuberger Gmbh | Pump comprising a pressure chamber and a cooling system |
| CN117450713A (en) * | 2023-12-22 | 2024-01-26 | 珠海格力电器股份有限公司 | Refrigerating equipment, control method thereof and refrigerator |
| CN117450713B (en) * | 2023-12-22 | 2024-04-09 | 珠海格力电器股份有限公司 | Refrigerating equipment, control method thereof and refrigerator |
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Legal Events
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20120704 |