CN110887263A - Compressor system - Google Patents
Compressor system Download PDFInfo
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- CN110887263A CN110887263A CN201811051849.6A CN201811051849A CN110887263A CN 110887263 A CN110887263 A CN 110887263A CN 201811051849 A CN201811051849 A CN 201811051849A CN 110887263 A CN110887263 A CN 110887263A
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- Prior art keywords
- evaporator
- condenser
- compressor
- cylinder
- channel
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
- F25B1/02—Compression machines, plants or systems with non-reversible cycle with compressor of reciprocating-piston type
Abstract
The invention discloses a compressor system, which comprises a compressor and a thermosiphon heat exchange device for cooling components of the compressor. The compressor system provided by the invention adopts the thermosiphon heat exchange device to cool the components of the compressor, can realize larger heat exchange amount by adopting a smaller heat exchanger, does not need external power, and can effectively reduce the temperature of the compressor.
Description
Technical Field
The invention relates to the technical field of compressors, in particular to a compressor system.
Background
The compressor is a heart of a refrigeration cycle system, for example, a reciprocating compressor, which sucks a low-temperature and low-pressure refrigerant gas, and compresses the refrigerant gas into a high-temperature and high-pressure refrigerant gas by driving a piston to reciprocate in a cylinder by a crank link mechanism. The compression process can be divided into isentropic compression, polytropic compression and isothermal compression. The isothermal compression process has the minimum power consumption, the temperature of the compressed gas is higher than that of variable compression and isentropic compression, and the design size of a condenser in a refrigeration cycle system can be effectively reduced and the cost is reduced due to the reduction of the temperature after compression. In order to realize isothermal compression, a heat exchange device is arranged on the compressor to cool the compressor.
However, the conventional heat exchange device for cooling the compressor has a large size and a limited amount of heat exchange.
Disclosure of Invention
The invention aims to solve the problems that a heat exchange device for cooling a compressor in the prior art is large in size and limited in heat exchange amount.
In order to achieve the above object, an aspect of the present invention provides a compressor system, including a compressor and a thermosiphon heat exchange device for cooling components of the compressor;
preferably, the thermosiphon heat exchange device comprises a condenser and an evaporator installed in the compressor, a first pipeline is connected between an outlet of the evaporator and an inlet of the condenser, and a second pipeline is connected between an outlet of the condenser and an inlet of the evaporator; the evaporator is internally provided with a plurality of first micro-channels, each first micro-channel is communicated to an inlet and an outlet of the evaporator respectively, refrigerant in the evaporator absorbs heat and is gasified and then enters the condenser from the evaporator along the first pipeline, and the refrigerant releases heat in the condenser and then enters the evaporator along the second pipeline.
Preferably, the compressor includes a cylinder portion having a cylinder passage, an annular groove is formed on an end surface of the cylinder portion, the evaporator is of an annular structure inserted into the annular groove, and the first pipe extends from an upper portion of the cylinder portion and the second pipe extends from a lower portion of the cylinder portion.
Preferably, the compressor includes a cylinder part having a cylinder passage, and the evaporator is covered on an upper surface of the cylinder part.
Preferably, the compressor comprises a cylinder part with a cylinder passage, a cylinder cover for blocking the cylinder passage is arranged on the end surface of the cylinder part, and the evaporator covers the outer surface of the cylinder cover.
Preferably, the compressor includes a cylinder portion having a cylinder passage, a cylinder cover is disposed on an end surface of the cylinder portion, the evaporator is provided in an L-shaped structure including a first side portion and a second side portion bent with respect to the first side portion, the first side portion of the evaporator covers an upper surface of the cylinder portion, and the second side portion covers the cylinder cover.
Preferably, the evaporator comprises an evaporator main body and a first cover plate, wherein a plurality of first grooves are formed on the outer surface of the evaporator main body; the first cover plate covers the first grooves on the outer surface of the evaporator body so that the first grooves form the first microchannels.
Preferably, a first passage communicating with an outlet of the evaporator and a second passage communicating with an inlet of the evaporator are formed between the evaporator main body and the first cover plate;
each of the first microchannels is in communication with the first channel and the second channel, respectively.
Preferably, the second cover plate is a heat insulating material.
Preferably, the condenser includes a condenser main body and a second cover plate, a plurality of second grooves are formed on an outer surface of the condenser main body, and the second cover plate covers the outer surface of the condenser main body to close the second grooves, so that the second grooves form second microchannels inside the condenser for circulation of refrigerant and respectively communicated with an inlet and an outlet of the condenser.
Preferably, a third channel communicated with an inlet of the condenser and a fourth channel communicated with an outlet of the condenser are formed between the condenser main body and the second cover plate;
each second microchannel is respectively communicated with the third channel and the fourth channel.
Preferably, the compressor system further comprises a heat exchanger for exchanging heat with the condenser.
The compressor system provided by the invention adopts the thermosiphon heat exchange device to exchange heat for the compressor, and has the following advantages that: firstly, the evaporator has the characteristics of larger heat exchange amount and smaller flow resistance, so that the requirement of larger heat exchange amount can be realized by smaller size of the heat exchanger; secondly, as the refrigerant fluid overcomes the flow resistance by means of gravity or density difference, no external power is needed; in addition, by adopting the thermosiphon heat exchange microcirculation, the temperature of the compressor part can be effectively reduced, the temperature distribution is more uniform, the approximate isothermal compression process is realized, the compression efficiency of the compressor is improved, the temperature of compressed gas can be reduced, the design size of a condenser in the refrigeration cycle is reduced, and the cost is reduced.
Drawings
FIG. 1 is a schematic sectional view of a compressor system according to an embodiment of the present invention;
FIG. 2 is an exploded view of the compressor system (with the compressor showing only the crankcase);
FIG. 3 is a schematic view of a crankcase having a cylinder portion;
FIG. 4 is a schematic view of the evaporator;
FIG. 5 is a sectional view of the evaporator;
FIG. 6 is a schematic diagram of a compressor system according to another embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a compressor system according to yet another embodiment of the present invention;
fig. 8 is a schematic view showing a structure of a compressor system according to still another embodiment of the present invention;
fig. 9 is an exploded schematic view of the structure shown in fig. 8.
Description of the reference numerals
1-a compressor; 2-a cylinder part; 21-an annular groove; 3-an evaporator; 31-an evaporator body; 311-a first channel; 312 — a second channel; 313-a first trench; 32-a first cover plate; 33-a first side; 34-a second side portion; 4-a condenser; 41-a condenser body; 411-a third channel; 412-a fourth channel; 413-a second trench; 42-a second cover plate; 5-a first pipeline; 6-a second pipeline; 7-heat exchanger.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In addition, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "central", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. The term "inside" and "outside" refer to the inside and the outside of the contour of each member itself.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
The invention provides a compressor system, which comprises a compressor and a thermosiphon heat exchange device for cooling the compressor;
as shown in fig. 1 and 2, the thermosiphon heat exchange device includes a condenser 4 and an evaporator 3 installed in the compressor housing, a first pipeline 5 is connected between an outlet of the evaporator 3 and an inlet of the condenser 4, and a second pipeline 6 is connected between an outlet of the condenser 4 and an inlet of the evaporator 3; the evaporator 3 is provided with a plurality of first micro-channels, each of the first micro-channels is respectively communicated to an inlet and an outlet of the evaporator 3, after the refrigerant in the evaporator 3 absorbs heat and is gasified, the refrigerant enters the condenser 4 from the evaporator 3 along the first pipeline 5, and after the refrigerant releases heat in the condenser 4, the refrigerant enters the evaporator 3 along the second pipeline 6.
In the circulation process of the thermosiphon heat exchange device, a low-temperature liquid refrigerant flows from a condenser 4 to an evaporator 3 through a second pipeline 6 by means of the gravity of the low-temperature liquid refrigerant, the evaporator 3 exchanges heat with a high-temperature part of a compressor, and the low-temperature refrigerant liquid absorbs heat and is gasified in a first micro-channel inside the evaporator 3. The gasified refrigerant generates power by the generated density difference (potential energy difference), flows to the condenser 4 from the evaporator 3, radiates heat to the outside in the condenser 4, is converted into refrigerant liquid, and completes the cycle. The heat exchange of the compressor by adopting the thermosiphon heat exchange device has the following advantages: firstly, a plurality of first microchannels are designed in the evaporator 3, and the evaporator designed by the first microchannels has the characteristics of large heat exchange amount and small flow resistance, so that the requirement of large heat exchange amount can be met by the small size of the heat exchanger; secondly, as the refrigerant fluid overcomes the flow resistance by means of gravity or density difference, no external power is needed; in addition, by adopting the thermosiphon heat exchange microcirculation, the temperature of the compressor part can be effectively reduced, the temperature distribution is more uniform, the approximate isothermal compression process is realized, the compression efficiency of the compressor is improved, the temperature of compressed gas can be reduced, the design size of a condenser in the refrigeration cycle is reduced, and the cost is reduced.
The technical solution provided by the present invention is described below according to a specific embodiment.
In one embodiment of the present invention, as shown in fig. 1 and 2, the compressor 1 includes a cylinder part 2 of a crankcase, the cylinder part 2 having a cylinder passage, wherein an annular groove 21 is formed on an end surface of the cylinder part 2, the evaporator 3 is of an annular structure inserted into the annular groove 21, the first pipe 5 extends from an upper portion of the cylinder part 2, and the second pipe 6 extends from a lower portion of the cylinder part 2, that is, the first pipe 5 and the second pipe 5 extend from opposite sides of the evaporator 3. Thus, the refrigerant in the evaporator 3 is vaporized by heat absorption and then enters the condenser 4 along the first pipe 5 by the thermosiphon principle, and the liquid refrigerant formed by heat release in the condenser 4 can flow into the evaporator 3 through the second pipe 6 by its own weight.
In this embodiment, the evaporator 3 is designed to be placed in the annular groove 21 of the cylinder part 2, and can effectively exchange heat with the cylinder channel of the cylinder part 2 of the compressor, so that the temperature distribution in the cylinder channel of the cylinder part 2 is more uniform.
To facilitate the processing of the evaporator 3, as shown in fig. 2 and fig. 4 to 5, the evaporator 3 is configured to include an evaporator main body 31 and a first cover plate 32, and a plurality of first grooves 313 are formed on an outer surface of the evaporator main body 31; the first cover plate 32 covers the outer surface of the evaporator body 31 to close the first grooves 313 so that the first grooves 313 form the first microchannels in the evaporator 3. To avoid heat exchange between the evaporator 3 and the environment other than the compressor components, the first cover plate 32 may be made of a low thermal conductivity insulating material, such as plastic or fiber.
In order to allow the refrigerant in the micro-channels of the evaporator 3 to flow to the inlet and the outlet of the evaporator 3, a first channel 311 communicated with the outlet of the evaporator 3 and a second channel 312 communicated with the inlet of the evaporator 3 are formed between the evaporator main body 31 and the first cover plate 32; each of the first microchannels is in communication with a first channel 311 and a second channel 312, respectively.
More specifically, in the present embodiment, as shown in fig. 2 and 3, an annular groove 21 is provided on an end surface of the cylinder portion 2 of the compressor 1, and the evaporator 3 has an annular structure fitted to the annular groove 21. Further, as shown in fig. 4 and 5, the evaporator body 31 of the evaporator 3 is of an annular structure, a plurality of annular grooves 313 are circumferentially arranged on the outer surface of the evaporator body 31 at intervals, and the first cover plate 32 is also of an annular structure and is sleeved on the outer side of the evaporator body 31, so as to form a plurality of microchannels in the evaporator 3 together with the annular grooves 313. In the present embodiment, the outlet of the evaporator 3 connected to the first pipe 5 and the inlet connected to the second pipe 6 are respectively provided on the first cover plate 32, the first passage 311 and the second passage 312 are respectively provided inside the first cover plate 32, and the first passage 311 is provided at the outlet of the evaporator 3 to communicate with the outlet, and the second passage 312 is provided at the inlet of the evaporator 3 to communicate with the inlet.
Of course, it should be understood that the evaporator 3 is not limited to the above arrangement, for example, a plurality of first grooves 313 extending along the axial direction may be provided on the outer surface of the evaporator main body 31, a first passage 311 and a second passage 312 extending along the circumferential direction and communicating with the plurality of first grooves 313 are provided on the outer surface of the evaporator main body 31, and the first cover plate 32 covers the outer surface of the evaporator main body 31, and the outlet and the inlet provided thereon correspond to the positions of the first passage 311 and the second passage 312, respectively.
It will also be appreciated by those skilled in the art that the design of the evaporator 3 is not limited to the ring-like configuration shown in fig. 1 and 2, and that other configurations are possible that are suitable for cooling the high temperature components of the compressor.
For example, in the embodiment shown in fig. 6, the evaporator 3 is provided to cover the upper surface of the cylinder part 2 of the compressor, and the evaporator 3 exchanges heat in direct contact with the upper surface of the cylinder part 2.
Further, the evaporator 3 is of a substantially plate-like structure adapted to cover the upper surface of the cylinder portion 2, and similarly, for the sake of easy processing, the evaporator 3 is also provided with a structure including an evaporator main body 31 and a first cover plate 32, and a plurality of first grooves 313 extending in parallel are formed on the outer surface of the evaporator main body 31; the first cover plate 32 covers the outer surface of the evaporator body 31 to close the first grooves 313 so that the first grooves 313 form the first microchannels in the evaporator 3. Wherein, the outlet connected with the first pipeline 5 and the inlet connected with the second pipeline 6 are also arranged on the first cover plate 32, a first channel 311 corresponding to the outlet position of the evaporator and a second channel 312 corresponding to the inlet position of the evaporator are respectively formed on the two opposite sides of the outer surface of the evaporator main body 31, and the first channel 311 and the second channel 312 are respectively communicated with the plurality of parallel first grooves 313.
In this embodiment, the first pipe 5 and the second pipe 6 are substantially arranged in parallel, so that a thermosiphon micro-circulation is formed between the evaporator 3 and the condenser 4, the first pipe 5 and the second pipe 6 may be arranged in such a manner that the refrigerant which absorbs heat and is gasified from the evaporator 3 can enter the condenser 4 along the first pipe 5, and the refrigerant which releases heat in the condenser 4 can enter the evaporator 3 along the second pipe 6 to realize circulation. The arrangement of the inside of the first and second pipes 5, 6 is not the focus of the present invention and is not described in detail herein. Of course, it is also possible to provide the first pipe 5 above and the second pipe 6 below to achieve thermosiphon micro-circulation.
In the embodiment shown in fig. 7, a cylinder head 8 for closing the cylinder passage is provided on the end face of the cylinder part 2 of the compressor 1, and the evaporator 3 is covered on the outer surface of the cylinder head 8.
In the present embodiment, the evaporator 3 is substantially similar in structure to the evaporator 3 in the embodiment shown in fig. 6, except that an outlet of the evaporator to which the first duct 5 is connected and an inlet of the evaporator to which the second duct 6 is connected are provided at the top of the evaporator main body 31.
In the embodiment shown in fig. 8 and 9, the end surface of the cylinder part 2 of the compressor 1 is provided with the cylinder cover 8, the evaporator 3 is provided with an L-shaped structure comprising a first side part 33 and a second side part 34 bent relative to the first side part 33, the first side part 33 of the evaporator 3 covers the upper surface of the cylinder part 2, and the second side part 34 covers the cylinder cover 8, so that the evaporator 3 can simultaneously contact with the upper surface of the cylinder part 2 and the cylinder cover 8 for heat exchange, and the temperature in the cylinder channel of the cylinder part 2, the cylinder cover 8 and the cylinder part 2 can be effectively reduced.
In this embodiment, the evaporator 3 also includes an evaporator main body 31 and a first cover plate 32, wherein both the evaporator main body 31 and the first cover plate 32 are provided in an L-shape.
The arrangement of the condenser 4 in the thermosiphon microcirculatory system will be described in detail below.
The condenser 4 may or may not be designed to have a microchannel disposed therein. In each of the embodiments described above, the condenser 4 is provided with a microchannel inside.
Specifically, as shown in fig. 2, 6, 7 and 9, the condenser 4 includes a condenser main body 41 and a second cover plate 42, a plurality of second grooves 413 are formed on an outer surface of the condenser main body 41, and the second cover plate 42 covers the outer surface of the condenser main body 41 to close the second grooves 413, so that the second grooves 413 form second microchannels for refrigerant circulation inside the condenser 4 and respectively communicated with an inlet and an outlet of the condenser 4.
Also, the condenser 4 is provided similarly to the evaporator 3, and a third passage 411 communicating with an inlet of the condenser 4 and a fourth passage 412 communicating with an outlet of the condenser 4 are formed between the condenser main body 41 and the second cover plate 42, respectively.
It should be understood that the structure of the condenser 4 is not limited to the plate-like structure in the embodiment provided by the present invention, and other heat exchangers can be used for the condenser 4.
In addition, in the technical scheme provided by the invention, the compressor system also comprises a heat exchanger 7 for exchanging heat with the condenser 4, and the heat exchanger 7 can be a heat exchanger in other circulating systems and can take away the heat of the condenser 4, so that the cooling effect of the evaporator 3 on the compressor can be improved.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, numerous simple modifications can be made to the technical solution of the invention, including combinations of the specific features in any suitable way, and the invention will not be further described in relation to the various possible combinations in order to avoid unnecessary repetition. Such simple modifications and combinations should be considered within the scope of the present disclosure as well.
Claims (12)
1. A compressor system includes a compressor and a thermosiphon heat exchange device for cooling components of the compressor.
2. The compressor system according to claim 1, wherein the thermosiphon heat exchange device comprises a condenser (4) and an evaporator (3) mounted in the compressor housing, a first pipeline (5) is connected between an outlet of the evaporator (3) and an inlet of the condenser (4), and a second pipeline (6) is connected between an outlet of the condenser (4) and an inlet of the evaporator (3); the evaporator (3) is internally provided with a plurality of first micro-channels, each first micro-channel is communicated to an inlet and an outlet of the evaporator (3), refrigerant in the evaporator (3) absorbs heat and is gasified, then enters the condenser (4) from the evaporator (3) along the first pipeline (5), releases heat in the condenser (4), and then enters the evaporator (3) along the second pipeline (6).
3. The compressor system according to claim 1, wherein the compressor comprises a cylinder portion (2) having a cylinder passage, an annular groove (21) is formed on an end surface of the cylinder portion (2), the evaporator (3) is of an annular structure inserted into the annular groove (21), and the first pipe (5) extends from an upper portion of the cylinder portion (2), and the second pipe (6) extends from a lower portion of the cylinder portion (2).
4. A compressor system according to claim 1, characterized in that the compressor comprises a cylinder part (2) with a cylinder channel, the evaporator (3) being overlaid on the upper surface of the cylinder part (2).
5. The compressor system according to claim 1, characterized in that the compressor comprises a cylinder part (2) having a cylinder passage, a cylinder head (8) closing off the cylinder passage is provided on an end face of the cylinder part (2), and the evaporator (3) is covered on an outer surface of the cylinder head (8).
6. A compressor system according to claim 1, characterized in that the compressor comprises a cylinder part (2) having a cylinder channel, a cylinder head (8) is arranged on an end surface of the cylinder part (2), the evaporator (3) is arranged in an L-shaped configuration comprising a first side part (33) and a second side part (34) bent in relation to the first side part (33), the first side part (33) of the evaporator (3) is overlying an upper surface of the cylinder part (2), and the second side part (34) is overlying the cylinder head (8).
7. -compressor system according to any one of the claims 1 to 6, characterised in that the evaporator (3) comprises an evaporator body (31) and a first cover plate (32), the evaporator body (31) having a plurality of first grooves (313) formed on its outer surface; the first cover plate (32) covers the outer surface on the evaporator body (31) closing the first grooves (313) so that the first grooves (313) form the first microchannels.
8. -compressor system according to claim 7, characterised in that between the evaporator body (31) and the first cover plate (31) there are formed a first channel (311) communicating with the outlet of the evaporator (3) and a second channel (312) communicating with the inlet of the evaporator (3);
each of the first microchannels communicates with the first channel (311) and the second channel (312), respectively.
9. The compressor system of claim 7, wherein the second cover plate (32) is a thermally insulating material.
10. The compressor system according to any one of claims 1 to 6, wherein the condenser (4) comprises a condenser main body (41) and a second cover plate (42), the condenser main body (41) having a plurality of second grooves (413) formed on an outer surface thereof, the second cover plate (42) covering the second grooves (413) on the outer surface of the condenser main body (41) such that the second grooves (413) form second microchannels inside the condenser (4) for circulation of the refrigerant and communicating with an inlet and an outlet of the condenser (4), respectively.
11. -compressor system according to claim 10, characterised in that between the condenser body (41) and the second cover plate (42) there is formed a third channel (411) communicating with the inlet of the condenser (4) and a fourth channel (412) communicating with the outlet of the condenser (4);
each of the second microchannels communicates with the third channel (411) and the fourth channel (412), respectively.
12. A compressor system according to any one of claims 1-6, characterized in that the compressor system further comprises a heat exchanger (7) for exchanging heat with the condenser (4).
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| CN201811051849.6A CN110887263B (en) | 2018-09-10 | 2018-09-10 | Compressor system |
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| CN201811051849.6A CN110887263B (en) | 2018-09-10 | 2018-09-10 | Compressor system |
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| CN110887263A true CN110887263A (en) | 2020-03-17 |
| CN110887263B CN110887263B (en) | 2021-07-13 |
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| CN205349720U (en) * | 2016-01-04 | 2016-06-29 | 广东美芝制冷设备有限公司 | Rotary compressor and have its refrigeration cycle device |
| CN106879227A (en) * | 2017-01-23 | 2017-06-20 | 西安电子科技大学 | A kind of micro-channel heat exchanger and fluid interchange experimental provision |
| CN107003072A (en) * | 2014-11-11 | 2017-08-01 | 丹麦丹腾制冷股份公司 | Thermal siphon block and thermosiphon system for heat transfer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1046594A (en) * | 1989-04-20 | 1990-10-31 | 上海新新机器厂 | Heat pipe enclosed refrigeration compressor |
| CN2167329Y (en) * | 1993-05-04 | 1994-06-01 | 陈展元 | Compressor with heat-pipe for refrigerator |
| CN1688854A (en) * | 2002-10-07 | 2005-10-26 | 株式会社东芝 | Refrigerator |
| CN2854131Y (en) * | 2004-10-26 | 2007-01-03 | 财团法人工业技术研究院 | Reciprocating compressor |
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| CN105526813A (en) * | 2015-12-10 | 2016-04-27 | 上海理工大学 | Microchannel heat radiator |
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| CN106879227A (en) * | 2017-01-23 | 2017-06-20 | 西安电子科技大学 | A kind of micro-channel heat exchanger and fluid interchange experimental provision |
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| CN110887263B (en) | 2021-07-13 |
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