CN219889932U - Heat radiating device and refrigerator - Google Patents
Heat radiating device and refrigerator Download PDFInfo
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- CN219889932U CN219889932U CN202321151818.4U CN202321151818U CN219889932U CN 219889932 U CN219889932 U CN 219889932U CN 202321151818 U CN202321151818 U CN 202321151818U CN 219889932 U CN219889932 U CN 219889932U
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- compressor
- cooling medium
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- 239000003507 refrigerant Substances 0.000 claims abstract description 136
- 239000007788 liquid Substances 0.000 claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- 239000002826 coolant Substances 0.000 claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 20
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000191 radiation effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to the technical field of household appliances and discloses a heat dissipation device. The heat dissipation device is used for dissipating heat of a high-temperature refrigerant in the heat pump system; the heat dissipating device includes: the refrigerant pipe comprises a liquid inlet end and a liquid outlet end, and can be connected into a refrigerant circulation pipeline of the heat pump system in parallel through the liquid inlet end and the liquid outlet end; and a radiator tank for filling the first cooling medium; the refrigerant pipe is arranged in the heat dissipation box in an S-shaped detouring way, and the first cooling medium in the heat dissipation box can dissipate heat for the high-temperature refrigerant flowing through the refrigerant pipe. The heat dissipation device dissipates heat of the led-out high-temperature refrigerant through the cooling medium, and is beneficial to improving the heat dissipation effect of the high-temperature refrigerant. The utility model also discloses a refrigerator.
Description
Technical Field
The utility model relates to the technical field of household appliances, in particular to a heat dissipation device and a refrigerator.
Background
Refrigerators generally include a heat pump system and transfer thermal energy of a low temperature heat source to a high temperature heat source by a phase change of a refrigerant in the heat pump system. The heat pump system comprises a condenser, the high-temperature refrigerant condenses in the condenser to release heat, and waste heat generated by the high-temperature refrigerant in the condenser needs to be discharged to the external environment so as to ensure the normal operation of the heat pump system.
In the related art, a fan is arranged at one side of a condenser, and air flow around the condenser is accelerated by rotation of the fan, so that the heat dissipation effect on a high-temperature refrigerant is improved.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
in the related art, the air flow around the condenser is accelerated by the fan, so that the influence of the ambient temperature is large, and the heat dissipation effect on the high-temperature refrigerant is required to be further improved.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the utility model and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides a heat dissipation device and a refrigerator, which are beneficial to improving the heat dissipation effect of a high-temperature refrigerant by radiating the led-out high-temperature refrigerant through a cooling medium.
In some embodiments, the heat dissipating device is configured to dissipate heat from a high-temperature refrigerant in the heat pump system; the heat dissipating device includes: the refrigerant pipe comprises a liquid inlet end and a liquid outlet end, and can be connected into a refrigerant circulation pipeline of the heat pump system in parallel through the liquid inlet end and the liquid outlet end; and a radiator tank for filling the first cooling medium; the refrigerant pipe is arranged in the heat dissipation box in an S-shaped detouring way, and the first cooling medium in the heat dissipation box can dissipate heat for the high-temperature refrigerant flowing through the refrigerant pipe.
In some embodiments, the heat dissipating case includes a top wall configured with a first relief hole adapted to allow a liquid inlet end of the refrigerant tube to pass therethrough in a sealed manner and a second relief hole adapted to allow a liquid outlet end of the refrigerant tube to pass therethrough in a sealed manner.
In some embodiments, the material of the refrigerant pipe is metal, and/or the material of the heat dissipation box is metal; and/or the first cooling medium comprises water.
In some embodiments, the first cooling medium in the heat sink is charged in an amount of 1/2 to 4/5 of the heat sink capacity.
In some embodiments, the heat dissipating device further comprises: the radiating pipe is arranged on the outer wall surface of the radiating box and used for circulating a second cooling medium so as to radiate the radiating box.
In some embodiments, the radiating pipes are arranged on the outer wall surface of the radiating box in an S-shaped detour way; and/or the second cooling medium comprises water.
In some embodiments, a refrigerator includes: a refrigerator main body; the heat pump system comprises a refrigerant circulation pipeline, a compressor and a condenser; the compressor bin is arranged at the top or bottom of the refrigerator main body and is provided with a compressor and a condenser; the heat dissipating device of any one of the embodiments is disposed at a rear side of the compressor compartment, and a refrigerant pipe of the heat dissipating device is connected in parallel with a part of the refrigerant circulation pipeline.
In some embodiments, the compressor includes a discharge end, the condenser includes a liquid outlet, and the refrigerant circulation line includes a first tube segment positioned between the discharge end of the compressor and the liquid outlet of the condenser; the refrigerant pipe of the heat dissipating device is connected with part or all of the first pipe sections in parallel.
In some embodiments, the height of the heat sink is equal to the height of the compressor compartment, the length of the heat sink is equal to the length of the refrigerator body, and the sum of the width of the heat sink and the width of the compressor is equal to the width of the refrigerator body.
In some embodiments, the heat dissipating tube of the heat dissipating device is disposed on a side of the heat dissipating box that is remote from the compressor compartment.
The heat dissipation device and the refrigerator provided by the embodiment of the disclosure can realize the following technical effects:
according to the heat dissipating device provided by the embodiment of the disclosure, the high-temperature refrigerant in the refrigerant circulating pipeline is led out through the refrigerant pipe, the refrigerant pipe is arranged in the heat dissipating box in an S-shaped roundabout manner, and the first cooling medium in the heat dissipating box can exchange heat with the refrigerant pipe to dissipate heat of the high-temperature refrigerant flowing through the refrigerant pipe. The first cooling medium in the heat dissipation box dissipates heat for the high-temperature refrigerant flowing through the refrigerant pipe, so that the influence of the ambient temperature on heat dissipation can be reduced, and the heat dissipation effect on the high-temperature refrigerant is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the utility model.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
FIG. 1 is an exploded view of a heat sink provided in accordance with an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a heat dissipating device according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a refrigerator according to an embodiment of the present disclosure;
fig. 4 is a schematic structural view of another refrigerator provided in an embodiment of the present disclosure.
Reference numerals:
1. a refrigerant pipe; 2. a heat radiation box; 3. a heat radiating pipe; 4. a refrigerator main body; 5. and a compressor bin.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.
In addition, the terms "disposed," "connected," "secured" and "affixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.
Refrigerators generally include a heat pump system and transfer thermal energy of a low temperature heat source to a high temperature heat source by a phase change of a refrigerant in the heat pump system. The heat pump system comprises a condenser, the high-temperature refrigerant condenses in the condenser to release heat, and waste heat generated by the high-temperature refrigerant in the condenser needs to be discharged to the external environment so as to ensure the normal operation of the heat pump system.
In the related art, a fan is arranged at one side of a condenser, and air flow around the condenser is accelerated by rotation of the fan, so that the heat dissipation effect on a high-temperature refrigerant is improved. However, the related art accelerates the air flow around the condenser by the fan, is greatly affected by the ambient temperature, and has a further improved heat dissipation effect on the high-temperature refrigerant.
The embodiment of the disclosure provides a heat dissipation device and a refrigerator, which are beneficial to improving the heat dissipation effect of a high-temperature refrigerant by radiating the led-out high-temperature refrigerant through a cooling medium.
In one aspect, embodiments of the present disclosure provide a heat dissipating device.
The heat dissipating device provided by the embodiment of the disclosure is used for dissipating heat of a high-temperature refrigerant in a heat pump system, and is shown in fig. 1 and 2, and the heat dissipating device provided by the embodiment of the disclosure comprises a refrigerant pipe 1 and a heat dissipating box 2.
The refrigerant pipe 1 comprises a liquid inlet end and a liquid outlet end, and the refrigerant pipe 1 can be connected into a refrigerant circulation pipeline of the heat pump system in parallel through the liquid inlet end and the liquid outlet end.
The radiator tank 2 is used for filling the first cooling medium. The refrigerant pipe 1 is arranged in the heat dissipation box 2 in an S-shaped detour manner, and the first cooling medium in the heat dissipation box 2 can dissipate heat for the high-temperature refrigerant flowing through the refrigerant pipe 1.
According to the heat dissipating device provided by the embodiment of the disclosure, the high-temperature refrigerant in the refrigerant circulation pipeline is led out through the refrigerant pipe 1, the refrigerant pipe 1 is arranged in the heat dissipating box 2 in an S-shaped roundabout manner, and the first cooling medium in the heat dissipating box 2 can exchange heat with the refrigerant pipe 1 to dissipate heat of the high-temperature refrigerant flowing through the refrigerant pipe 1. The first cooling medium in the heat radiation box 2 radiates heat for the high-temperature refrigerant flowing through the refrigerant pipe 1, so that the influence of the ambient temperature on heat radiation can be reduced, and the heat radiation effect on the high-temperature refrigerant is improved.
Optionally, the heat dissipation box 2 is flat, so that the space occupied by the heat dissipation box can be reduced, and the size of the refrigerator can be reduced.
In some embodiments, the heat dissipation case 2 includes a top wall, and the top wall is configured with a first avoidance hole and a second avoidance hole, where the first avoidance hole is suitable for the liquid inlet end of the refrigerant pipe 1 to pass through in a sealing manner, and the second avoidance hole is suitable for the liquid outlet end of the refrigerant pipe 1 to pass through in a sealing manner.
Through structure first hole and the second hole of dodging at the roof of cooling tank, the feed liquor end and the play liquid end of being convenient for refrigerant pipe 1 pass to with refrigerant circulation pipeline intercommunication, draw forth high temperature refrigerant. Through dodging hole and second dodging the hole setting in the roof, be convenient for arrange.
In some embodiments, the refrigerant tube 1 is made of metal. For example, the material of the refrigerant pipe 1 includes aluminum or copper. The heat conductivity coefficient of the metal is higher, and the heat exchange effect of the high-temperature refrigerant in the refrigerant pipe and the first heat exchange medium can be improved by setting the material of the refrigerant pipe 1 to be metal, so that the heat dissipation effect of the high-temperature refrigerant is improved.
In some embodiments, the heat-dissipating case 2 is made of metal. For example, the material of the heat radiation box 2 includes aluminum or copper. The heat conductivity coefficient of the metal is higher, and the heat exchange effect between the first heat exchange medium and the external environment can be improved by setting the material of the heat dissipation box 2 to be metal, so that the heat dissipation of the first heat exchange medium in the heat dissipation box 2 is facilitated.
In some embodiments, the first cooling medium comprises water. The water is cheap and easy to obtain, the specific heat capacity is high, and the water is pollution-free, and the heat dissipation effect on the high-temperature refrigerant in the refrigerant pipe 1 can be guaranteed by setting the first cooling medium as water, so that the cost and the pollution are reduced.
In some embodiments, the first cooling medium in the radiator tank 2 is filled in an amount of 1/2 to 4/5 of the capacity of the radiator tank 2. For example, the first cooling medium is charged in an amount of 1/2,2/3,3/4, or 4/5 of the capacity of the radiator tank 2.
By limiting the filling amount of the first cooling medium in the heat radiation box to the above range, the heat radiation effect of the high-temperature refrigerant can be ensured, and the reliability and the service life of the heat radiation box 2 can be improved. Further, if the filling amount of the first cooling medium is too small, the heat dissipation effect on the high temperature refrigerant in the refrigerant pipe 1 is poor, and if the filling amount of the first cooling medium is too large, the pressure in the heat dissipation box 2 may be too large, and the reliability of the heat dissipation box 2 may be reduced.
In some embodiments, as shown in fig. 3, the heat dissipating device further includes a heat dissipating tube 3, where the heat dissipating tube 3 is disposed on an outer wall surface of the heat dissipating box 2, and the heat dissipating tube 3 is used for circulating a second cooling medium to dissipate heat of the heat dissipating box 2. The radiating pipe 3 is arranged to radiate heat of the radiating box 2, so that the radiating capacity of the radiating box 2 to high-temperature refrigerants is guaranteed.
Optionally, the refrigerator further comprises a pump body for driving the second cooling medium to flow.
In some embodiments, as shown in connection with fig. 3, the radiating pipe 3 is arranged in an S-shaped detour on the outer wall surface of the radiating tank 2. The radiating pipes 3 are arranged in an S-shaped roundabout manner, so that the contact area between the radiating pipes 3 and the radiating box 2 is favorably increased, and the radiating effect on the radiating box 2 is improved.
In some embodiments, the second cooling medium comprises water. The water is cheap and easy to obtain, the specific heat capacity is high, and the heat dissipation effect on the first cooling medium in the heat dissipation box 2 can be guaranteed by setting the second cooling medium as water, and the heat dissipation box is beneficial to reducing the cost and pollution.
For example, the liquid inlet end of the radiating tube 3 is connected with a household water source, and the liquid outlet end of the radiating tube 3 is connected with a waste liquid collecting box. The arrangement is convenient. Or the refrigerator is provided with a water storage tank, and the liquid inlet end and the liquid outlet end of the radiating pipe are communicated with the water storage tank.
In some embodiments, the radiating pipe 3 is made of metal. For example, the material of the radiating pipe 3 includes aluminum or copper. The heat conductivity coefficient of the metal is higher, and the heat exchange effect of the high-temperature refrigerant in the refrigerant pipe and the first heat exchange medium can be improved by setting the material of the radiating pipe 3 to be metal, so that the heat dissipation effect of the high-temperature refrigerant is improved.
In another aspect, an embodiment of the present disclosure provides a refrigerator.
As shown in fig. 3 and 4, the refrigerator provided in the embodiment of the present disclosure includes a refrigerator main body 4, a heat pump system, a compressor compartment 5, and a heat dissipating device of any one of the above embodiments.
The heat pump system comprises a refrigerant circulation pipeline, a compressor and a condenser.
The compressor bin 5 is arranged at the top or bottom of the refrigerator main body, and a compressor and a condenser are arranged in the compressor bin 5.
The heat abstractor is arranged at the rear side of the compressor bin 5, and the refrigerant pipe 1 of the heat abstractor is connected with part of refrigerant circulation pipelines in parallel.
According to the refrigerator provided by the embodiment of the disclosure, the high-temperature refrigerant in the refrigerant circulation pipeline of the heat pump system is led out through the refrigerant pipe 1, the refrigerant pipe 1 is arranged in the heat dissipation box 2 in an S-shaped roundabout manner, and the first cooling medium in the heat dissipation box 2 can exchange heat with the refrigerant pipe 1 to dissipate heat of the high-temperature refrigerant flowing through the refrigerant pipe 1. The first cooling medium in the heat radiation box 2 radiates heat for the high-temperature refrigerant flowing through the refrigerant pipe 1, so that the influence of the ambient temperature on heat radiation can be reduced, and the heat radiation effect on the high-temperature refrigerant is improved.
The heat pump system of the refrigerator generally comprises a refrigerant circulating pipeline, and a compressor, a condenser, a throttling device and an evaporator which are sequentially arranged on the refrigerant circulating pipeline. The compressor sucks the gaseous refrigerant and compresses the gaseous refrigerant into a high-temperature high-pressure gaseous refrigerant; the high-temperature high-pressure gaseous refrigerant enters a condenser, is condensed in the condenser and releases heat; then, the refrigerant flows through the throttling device, and the temperature is further reduced; then, the refrigerant enters the evaporator, and evaporates and absorbs heat in the evaporator, so that the temperature of the surrounding environment is reduced, and the refrigerator is provided with cold energy. The high-temperature refrigerant is a refrigerant between the exhaust port of the compressor and the liquid outlet end of the condenser, and the temperature of the part of the refrigerant is high.
For the embedded refrigerator, the compressor bin 5 is arranged at the top or bottom of the refrigerator main body, so that the internal space of the refrigerator main body 4 is not occupied, the internal storage space of the refrigerator main body 4 is larger, and the refrigerator drawer is more regular in appearance. When the compressor housing 5 is provided at the top of the refrigerator main body, since the density of the hot air is small, the hot air generally flows upward, and by providing the compressor housing 5 at the top of the refrigerator main body, the influence of heat generated by the components in the compressor housing 5 on the refrigerator main body 4 can be reduced. When the compressor bin 5 is arranged at the bottom of the refrigerator main body, the refrigerator is heavier relative to the upper part and the lower part of the refrigerator, so that the risk of toppling of the refrigerator can be reduced, and the safety is improved.
The heat dissipating device is arranged at the rear side of the compressor bin 5, and cannot be observed from the front side of the refrigerator, so that the consistency of the appearance of the refrigerator is improved.
In some embodiments, the compressor includes a discharge end, the condenser includes a liquid outlet, and the refrigerant circulation line includes a first tube segment positioned between the discharge end of the compressor and the liquid outlet of the condenser. Wherein, the refrigerant pipe 1 of the heat dissipating device is connected with part or all of the first pipe sections in parallel. The cooling temperature in the first pipe section is higher, and the cooling effect on the high-temperature cooling medium is improved by leading out the cooling medium in the first pipe section and utilizing the cooling box 2 to cool the cooling medium.
For example, the liquid inlet end of the refrigerant pipe is connected with the exhaust end of the compressor, and the liquid outlet end of the refrigerant pipe is connected with the liquid inlet of the condenser; or the liquid inlet end of the refrigerant pipe is connected with the exhaust end of the compressor, and the liquid outlet end of the refrigerant pipe is connected with the liquid outlet of the condenser; or the liquid inlet end of the refrigerant pipe is connected with a pipe section positioned between the exhaust end of the compressor and the liquid inlet end of the refrigerant pipe, and the liquid outlet end of the refrigerant pipe is connected with the liquid inlet of the condenser; or the liquid inlet end of the refrigerant pipe is connected with the liquid inlet of the condenser, and the liquid outlet end of the refrigerant pipe is connected with the liquid outlet of the condenser, namely the refrigerant pipe is connected with the condenser in parallel. By the arrangement, the heat dissipation effect on the high-temperature refrigerant can be improved.
In some embodiments, the height of the heat sink 2 is equal to the height of the compressor compartment, the length of the heat sink 2 is equal to the length of the refrigerator body, and the sum of the width of the heat sink 2 and the width of the compressor is equal to the width of the refrigerator body. Wherein, the height direction of the heat dissipation box 2 refers to the direction z shown in fig. 3; the length direction of the heat dissipation box refers to the direction shown by x in fig. 3; the width direction of the heat radiation box is the direction indicated by y in fig. 3. The arrangement is beneficial to improving the uniformity of the appearance of the refrigerator.
In some embodiments, the radiator tube of the radiator is provided on the side of the radiator tank 2 remote from the compressor compartment. So set up, be convenient for overhaul the cooling tube.
Optionally, the refrigerator is further provided with a storage cavity, an evaporator chamber, an air inlet duct and an air outlet duct. The evaporator chamber is provided with an evaporator, the temperature of the evaporator surface being low, the evaporator being capable of reducing the temperature of the wind flow over its surface. The air inlet of the air inlet duct is communicated with the storage cavity so as to absorb air from the storage cavity, and the air outlet of the air inlet duct is communicated with the air inlet side of the evaporator chamber. An air inlet of the air outlet air duct is communicated with an air outlet side of the evaporator chamber, and an air outlet of the air outlet air duct is communicated with the storage cavity so as to convey cold air to the storage cavity, reduce the temperature of the storage cavity and provide a low-temperature environment for articles.
The refrigerator absorbs gas from the storage cavity through the air inlet of the air inlet duct to form air flow, the temperature of the air flow flowing through the evaporator chamber is reduced, and then the air flow is sent into the storage cavity again through the air outlet of the air outlet duct. Thus, the air cooling of the storage cavity is realized.
Optionally, the refrigerator further comprises an air supply assembly, the air supply assembly can absorb air from the storage cavity through an air channel air inlet of the air inlet channel to form air flow, the air flow flows through the evaporator chamber, and then the air flow is sent into the storage cavity again through an air channel air outlet of the air outlet channel. By arranging the air supply assembly, power can be provided for the flow of the wind current.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. The heat dissipating device is characterized by being used for dissipating heat of a high-temperature refrigerant in a heat pump system; the heat dissipating device includes:
the refrigerant pipe comprises a liquid inlet end and a liquid outlet end, and can be connected into a refrigerant circulation pipeline of the heat pump system in parallel through the liquid inlet end and the liquid outlet end; and, a step of, in the first embodiment,
the heat dissipation box is used for filling a first cooling medium; the refrigerant pipe is arranged in the heat dissipation box in an S-shaped detouring way, and the first cooling medium in the heat dissipation box can dissipate heat for the high-temperature refrigerant flowing through the refrigerant pipe.
2. The heat dissipating device of claim 1, wherein the heat dissipating case comprises a top wall configured with a first relief hole adapted to allow the liquid inlet end of the refrigerant tube to pass therethrough in a sealed manner and a second relief hole adapted to allow the liquid outlet end of the refrigerant tube to pass therethrough in a sealed manner.
3. The heat dissipating device of claim 1, wherein the material of the refrigerant tube is metal and/or the material of the heat dissipating box is metal; and/or the first cooling medium comprises water.
4. The heat sink of claim 1 wherein the first cooling medium in the heat sink is charged in an amount of 1/2 to 4/5 of the heat sink capacity.
5. The heat dissipating device of any of claims 1 to 4, further comprising:
the radiating pipe is arranged on the outer wall surface of the radiating box and used for circulating a second cooling medium so as to radiate the radiating box.
6. The heat dissipating device of claim 5, wherein the heat dissipating tube is arranged in an S-shaped detour on the outer wall surface of the heat dissipating box; and/or the second cooling medium comprises water.
7. A refrigerator, comprising:
a refrigerator main body;
the heat pump system comprises a refrigerant circulation pipeline, a compressor and a condenser;
the compressor bin is arranged at the top or bottom of the refrigerator main body and is provided with a compressor and a condenser;
the heat dissipating device as defined in any one of claims 1-6, disposed at a rear side of the compressor compartment, wherein the refrigerant pipe of the heat dissipating device is connected in parallel with a portion of the refrigerant circulation line.
8. The refrigerator of claim 7, wherein the compressor includes a discharge end, the condenser includes a liquid outlet, and the refrigerant circulation line includes a first pipe section between the discharge end of the compressor and the liquid outlet of the condenser; the refrigerant pipe of the heat dissipating device is connected with part or all of the first pipe sections in parallel.
9. The refrigerator of claim 7 or 8, wherein a height of the heat-dissipating case is equal to a height of the compressor compartment, a length of the heat-dissipating case is equal to a length of the refrigerator main body, and a sum of a width of the heat-dissipating case and a width of the compressor is equal to a width of the refrigerator main body.
10. The refrigerator of claim 7 or 8, wherein the heat radiating pipe of the heat radiating device is provided at a side of the heat radiating box remote from the compressor compartment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321151818.4U CN219889932U (en) | 2023-05-12 | 2023-05-12 | Heat radiating device and refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321151818.4U CN219889932U (en) | 2023-05-12 | 2023-05-12 | Heat radiating device and refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219889932U true CN219889932U (en) | 2023-10-24 |
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ID=88402980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321151818.4U Active CN219889932U (en) | 2023-05-12 | 2023-05-12 | Heat radiating device and refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219889932U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117308474A (en) * | 2023-11-29 | 2023-12-29 | 泰州安吉电子有限公司 | Heat exchanger assembly for refrigerator |
-
2023
- 2023-05-12 CN CN202321151818.4U patent/CN219889932U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117308474A (en) * | 2023-11-29 | 2023-12-29 | 泰州安吉电子有限公司 | Heat exchanger assembly for refrigerator |
| CN117308474B (en) * | 2023-11-29 | 2024-02-09 | 泰州安吉电子有限公司 | Heat exchanger assembly for refrigerator |
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