CN117450713B - Refrigerating equipment, control method thereof and refrigerator - Google Patents
Refrigerating equipment, control method thereof and refrigerator Download PDFInfo
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- CN117450713B CN117450713B CN202311783229.2A CN202311783229A CN117450713B CN 117450713 B CN117450713 B CN 117450713B CN 202311783229 A CN202311783229 A CN 202311783229A CN 117450713 B CN117450713 B CN 117450713B
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- cooling
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 194
- 238000005057 refrigeration Methods 0.000 claims abstract description 113
- 238000001816 cooling Methods 0.000 claims description 169
- 239000004065 semiconductor Substances 0.000 claims description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000005452 bending Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/062—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation in household refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/003—General constructional features for cooling refrigerating machinery
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/003—Arrangement or mounting of control or safety devices for movable devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides refrigeration equipment, a control method thereof and a refrigerator. The refrigeration equipment comprises a shell, wherein a compressor cavity and a heat dissipation cavity are formed in the shell; the compressor is arranged in the compressor cavity; a first heat dissipation mechanism; and a second heat dissipation mechanism. According to the refrigeration equipment, the control method thereof and the refrigerator, the heat dissipation cavity for heat dissipation is arranged in the shell of the refrigeration equipment, and the heat generated by the compressor and the condenser in the compressor cavity is transferred into the heat dissipation cavity for dissipation by utilizing the first heat dissipation mechanism in the compressor cavity and the second heat dissipation mechanism in the heat dissipation cavity, so that the problem that the heat dissipation efficiency is low due to the fact that the compressor cavity is located in a deep part of a preset structure and only can be used for dissipating heat through a gap between the shell and the preset structure in the prior art is solved, the heat dissipation effect on the compressor cavity is effectively improved, the working efficiency and reliability of the compressor and the condenser in the compressor cavity are guaranteed, and the working efficiency and reliability of the refrigerator are improved.
Description
Technical Field
The invention relates to the technical field of refrigeration equipment, in particular to refrigeration equipment, a control method thereof and a refrigerator.
Background
With the popularization of refrigerators in life, the refrigerators are taken as a hot spot technology breakthrough direction of the household appliance industry, so that the embedded refrigerator has been generated as a part of household decoration along with the development of the times, and how the refrigerators are suitable for the requirements of modern household appliances and decoration. The embedded refrigerator has the characteristics of large door opening angle, small embedded gap, integration with a cabinet and the like. Because the embedded refrigerator is deeply embedded into the cabinet, how to reliably radiate the compressor and the condenser becomes a great problem, the traditional non-embedded refrigerator adopts the built-in condenser and radiates heat by means of metal shells at two sides of the refrigerator, and the embedded refrigerator cannot use the radiating method because of small space at two sides.
The existing embedded refrigerator generally dissipates heat to the condenser and the compressor through a mode of externally adding a fan to the surrounding type suspended wing condenser, and because the embedded requirement needs to be met, the space is relatively airtight, the optimal effect of dissipating heat to the compressor still cannot be achieved through the heat dissipation mode, the working efficiency and the reliability of the compressor are affected, and the problem that the refrigerating effect and the reliability of the refrigerator are poor is caused.
Disclosure of Invention
In order to solve the technical problems of poor refrigerating effect and poor reliability of a refrigerator caused by poor radiating effect of a compressor of an embedded refrigerator in the prior art, a refrigerating device provided with a second radiating mechanism for guiding heat in a compressor cavity into a radiating cavity for additional radiating so as to improve radiating efficiency and radiating reliability, a control method thereof and the refrigerator are provided.
A refrigeration appliance comprising:
a housing in which a compressor chamber and a heat dissipation chamber are formed;
the compressor is arranged in the compressor cavity;
the first heat dissipation mechanism is arranged in the compressor cavity;
the second heat dissipation mechanism is arranged in the heat dissipation cavity, and the second heat dissipation mechanism and the first heat dissipation mechanism are mutually communicated to form a heat dissipation medium circulation pipeline;
the heat dissipation cavity is communicated with the outside of the shell.
The refrigerating equipment is embedded in the accommodating groove with the preset structure, and the heat dissipation cavity is positioned between the compressor cavity and the opening of the accommodating groove.
The refrigeration equipment further comprises a first cooling fan, the first cooling fan is arranged in the cooling cavity, and the air outlet direction of the first cooling fan faces the second cooling mechanism.
The refrigeration equipment comprises a heat exchange pipeline, part of the heat exchange pipeline is positioned in the compressor cavity to form the first heat dissipation mechanism, and part of the heat exchange pipeline is positioned in the heat dissipation cavity to form the second heat dissipation mechanism.
The heat exchange pipeline in the compressor cavity is in a continuous bending shape; and/or the heat exchange pipeline positioned in the heat dissipation cavity is in a continuous bending shape.
The refrigeration equipment further comprises a semiconductor refrigeration mechanism, the semiconductor refrigeration mechanism is arranged in the heat dissipation cavity, and the cold end of the semiconductor refrigeration mechanism is attached to the communicating pipeline of the first heat dissipation mechanism and the communicating pipeline of the second heat dissipation mechanism.
The refrigeration equipment further comprises a second cooling fan, the second cooling fan is arranged in the cooling cavity, and the air outlet direction of the second cooling fan points to the hot end of the semiconductor refrigeration mechanism.
The refrigeration equipment further comprises a condenser, the condenser is positioned in the compressor cavity, and a communication pipeline between the first heat dissipation mechanism and the second heat dissipation mechanism is arranged on the condenser in a penetrating way; or, a heat dissipation medium channel is arranged on the condenser, and the first heat dissipation mechanism is communicated with the second heat dissipation mechanism through the heat dissipation medium channel.
The refrigeration equipment further comprises a third cooling fan, the third cooling fan is arranged on one side, far away from the compressor, of the first cooling mechanism, and the air outlet direction of the third cooling fan faces the first cooling mechanism.
The refrigeration equipment further comprises a water receiving disc, the water receiving disc is arranged in the shell, an inlet of the first heat dissipation mechanism is communicated with the water receiving disc, and an outlet of the second heat dissipation mechanism is communicated with the water receiving disc.
The control method of the refrigeration equipment further comprises a first cooling fan, the first cooling fan is arranged in the cooling cavity, the air outlet direction of the first cooling fan faces the second cooling mechanism, the refrigeration equipment further comprises a semiconductor refrigeration mechanism, the semiconductor refrigeration mechanism is arranged in the cooling cavity, the cold end of the semiconductor refrigeration mechanism is attached to communication pipes of the first cooling mechanism and the second cooling mechanism, the refrigeration equipment further comprises a second cooling fan, the second cooling fan is arranged in the cooling cavity, the air outlet direction of the second cooling fan faces the hot end of the semiconductor refrigeration mechanism, the refrigeration equipment further comprises a third cooling fan, the third cooling fan is arranged on one side, far away from the compressor, of the first cooling mechanism, and the air outlet direction of the third cooling fan faces the first cooling mechanism, and the control method comprises the following steps:
acquiring a real-time temperature T in a compressor cavity, and comparing the real-time temperature T with a preset temperature T0;
and if T is more than T0, controlling the working states of the first cooling fan, the second cooling fan, the third cooling fan and the semiconductor refrigerating mechanism according to preset conditions.
If T > T0, controlling the working states of the first cooling fan, the second cooling fan, the third cooling fan and the semiconductor refrigeration mechanism according to preset conditions, further includes:
acquiring a real-time rotating speed V of the compressor, and comparing the real-time rotating speed V with a first preset rotating speed V1;
if V is less than V1, controlling the third radiator fan and the first radiator fan to work, and stopping the semiconductor refrigeration mechanism and the second radiator fan from working;
and if V is more than or equal to V1, controlling the third cooling fan, the first cooling fan, the semiconductor refrigerating mechanism and the second cooling fan to work.
If V is greater than or equal to V1, then in controlling third radiator fan, first radiator fan, semiconductor refrigeration mechanism and second radiator fan to all work, still include:
comparing the real-time rotating speed V with a second preset rotating speed V2;
if V1 is less than or equal to V2, controlling the third cooling fan to work at a first rotating speed, the first cooling fan to work at a second rotating speed, the semiconductor refrigerating mechanism to work at a first power, and the second cooling fan to work at a third rotating speed;
if V is more than or equal to V2, controlling the third cooling fan to work at a fourth rotating speed, the first cooling fan to work at a fifth rotating speed, the semiconductor refrigerating mechanism to work at a second power, and the second cooling fan to work at a sixth rotating speed;
the fourth rotating speed is larger than the first rotating speed, the fifth rotating speed is larger than the second rotating speed, the sixth rotating speed is larger than the third rotating speed, and the second power is larger than the first power.
If T > T0, after controlling the working states of the first cooling fan, the second cooling fan, the third cooling fan and the semiconductor refrigeration mechanism according to preset conditions, the method further includes:
if T is less than T0-a, controlling the first cooling fan, the second cooling fan, the third cooling fan and the semiconductor refrigeration mechanism to stop working;
a is a preset constant.
A refrigerator comprises the refrigerating equipment or a control method applying the refrigerating equipment.
According to the refrigeration equipment, the control method thereof and the refrigerator, the heat dissipation cavity for heat dissipation is arranged in the shell of the refrigeration equipment, and the heat generated by the compressor and the condenser in the compressor cavity is transferred into the heat dissipation cavity for dissipation by utilizing the first heat dissipation mechanism in the compressor cavity and the second heat dissipation mechanism in the heat dissipation cavity, so that the problem that the heat dissipation efficiency is low due to the fact that the compressor cavity is located in a deep part of a preset structure and only can be used for dissipating heat through a gap between the shell and the preset structure in the prior art is solved, the heat dissipation effect on the compressor cavity is effectively improved, the working efficiency and reliability of the compressor and the condenser in the compressor cavity are guaranteed, and the working efficiency and reliability of the refrigerator are improved.
Drawings
Fig. 1 is a schematic structural diagram of a refrigeration device according to an embodiment of the present invention;
fig. 2 is another schematic structural diagram of a refrigeration apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a condenser according to an embodiment of the present invention;
fig. 4 is a control flow chart of a refrigeration device according to an embodiment of the present invention;
in the figure:
11. a compressor chamber; 12. a heat dissipation cavity; 2. a compressor; 3. a first heat dissipation mechanism; 4. a second heat dissipation mechanism; 5. a first heat radiation fan; 6. a semiconductor refrigeration mechanism; 7. a second heat radiation fan; 8. a condenser; 81. a heat dissipation medium channel; 9. a third heat radiation fan; 10. and (5) a water receiving tray.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other environments. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "configured," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected, can be indirectly connected through an intermediate medium, and can also be communicated with the inside of two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to the specific circumstances.
Because the embedded refrigerator is deeply embedded into the cabinet, how to reliably radiate the compressor and the condenser becomes a great problem, the traditional non-embedded refrigerator adopts the built-in condenser and radiates heat by means of metal shells at two sides of the refrigerator, and the embedded refrigerator cannot use the radiating method because of small space at two sides. The existing embedded refrigerator generally dissipates heat to the condenser and the compressor through a mode of externally adding a fan to the surrounding type suspended wing condenser, and because the embedded requirement needs to be met, the space is relatively airtight, the optimal effect of dissipating heat to the compressor still cannot be achieved through the heat dissipation mode, the working efficiency and the reliability of the compressor are affected, and the problem that the refrigerating effect and the reliability of the refrigerator are poor is caused. To this end, the present application provides a refrigeration apparatus as shown in fig. 1 to 4, comprising: a housing in which a compressor chamber 11 and a heat dissipation chamber 12 are formed; a compressor 2, the compressor 2 being disposed within the compressor chamber 11; a first heat dissipation mechanism 3, wherein the first heat dissipation mechanism 3 is arranged in the compressor cavity 11; the second heat dissipation mechanism 4 is arranged in the heat dissipation cavity 12, and the second heat dissipation mechanism 4 and the first heat dissipation mechanism 3 are communicated with each other to form a heat dissipation medium circulation pipeline; the heat dissipation chamber 12 communicates with the outside of the housing. The heat dissipation cavity 12 for heat dissipation is arranged in the shell of the refrigeration equipment, and heat generated by the compressor 2 and the condenser in the compressor cavity 11 is transferred into the heat dissipation cavity 12 for dissipation by utilizing the first heat dissipation mechanism 3 in the compressor cavity 11 and the second heat dissipation mechanism 4 in the heat dissipation cavity 12, so that the problem that the heat dissipation efficiency is low due to the fact that the compressor cavity 11 is located in a deep part of a preset structure and only can be dissipated through a gap between the shell and the preset structure in the prior art is solved, the heat dissipation effect on the compressor cavity 11 is effectively improved, the working efficiency and reliability of the compressor 2 and the condenser in the compressor cavity 11 are guaranteed, and the working efficiency and reliability of the refrigerator are improved.
Because refrigeration plant is embedded equipment, refrigeration plant embeds in the holding tank of predetermineeing the structure, be provided with on the casing and be used for getting the inside door body of the inside casing of putting to casing inside, other sides except the door body all are located the holding tank, and the gap between the inner wall of side and holding tank is less in order to improve embedded equipment's installation effectiveness, also be provided with the opening that is used for the door body to open and close on the holding tank simultaneously, and the opening of holding tank can communicate with predetermineeing structure place space (indoor), for this reason, heat dissipation chamber 12 is located compressor chamber 11 with between the opening of holding tank, heat dissipation chamber 12 can be close to predetermineeing structure place space (indoor) as far as, thereby can be faster for compressor chamber 11 with heat dissipation, for the structure that only has compressor chamber 11 in the prior art, can effectually accelerate the radiating efficiency, thereby guaranteed compressor 2 in the compressor chamber 11, condenser's work efficiency and reliability have improved refrigerator.
In order to further improve the heat dissipation efficiency of the second heat dissipation mechanism 4, the refrigeration device further comprises a first heat dissipation fan 5, the first heat dissipation fan 5 is arranged in the heat dissipation cavity 12, the air outlet direction of the first heat dissipation fan 5 faces the second heat dissipation mechanism 4, and the first heat dissipation fan 5 is utilized to outlet air to the second heat dissipation mechanism 4, so that the heat dissipation efficiency of the second heat dissipation mechanism 4 is improved, the absorption efficiency of the first heat dissipation mechanism 3 in the compressor cavity 11 can be further increased, and the heat dissipation efficiency of the compressor cavity 11 is increased.
As an embodiment, the refrigeration device includes a heat exchange pipeline, a part of the heat exchange pipeline is located in the compressor cavity 11 to form the first heat dissipation mechanism 3, and a part of the heat exchange pipeline is located in the heat dissipation cavity 12 to form the second heat dissipation mechanism 4. The heat exchange pipeline is utilized to realize the circulation flow of the heat dissipation medium between the heat dissipation cavity 12 and the compressor cavity 11, so that the heat dissipation effect of the compressor cavity 11 is ensured. Specifically, the heat exchange pipeline in the compressor cavity 11 is in a continuous bending shape, and the length of the heat exchange pipeline in the compressor cavity 11 can be increased by using the bending shape, so that the flow path of the heat dissipation medium in the compressor cavity 11 is increased, the absorption of the heat dissipation medium to the heat in the compressor cavity 11 is increased, and the heat in the compressor cavity 11 can be transferred to the heat dissipation cavity 12 for heat dissipation as soon as possible. Likewise, the heat exchange pipeline in the heat dissipation cavity 12 is in a continuous bending shape, so that the length of the heat exchange pipeline in the heat dissipation cavity 12 can be increased, the flow path of the heat dissipation medium in the heat dissipation cavity 12 is improved, the heat dissipation effect of the heat dissipation medium in the heat dissipation cavity 12 is improved, the heat dissipation medium can be cooled rapidly to circulate to the compressor cavity 11 for absorbing heat, and the heat dissipation efficiency of the compressor cavity 11 can be improved. Preferably, as shown in fig. 1, the heat exchange pipeline in the heat dissipation cavity 12 is in a spiral shape, and the central axis of the spiral shape is parallel to the air outlet direction of the first heat dissipation mechanism 3, so that the heat dissipation efficiency of the air outlet of the first heat dissipation mechanism 3 to the spiral heat exchange pipeline is improved, the volume of the first heat dissipation mechanism 3 can be reduced, the first heat dissipation mechanism 3 only needs to cover the spiral cross-section area, the volume of the heat dissipation cavity 12 is reduced, and the utilization rate of the shell is improved. Similarly, the heat exchange pipeline in the compressor cavity 11 is in a continuous U shape, so that the arrangement length of the heat exchange pipeline can be increased as much as possible in the limited space of the compressor cavity 11, thereby improving the absorption of heat in the compressor cavity 11 by the heat dissipation medium and improving the heat dissipation efficiency of the compressor cavity 11.
The refrigeration equipment further comprises a semiconductor refrigeration mechanism 6, the semiconductor refrigeration mechanism 6 is arranged in the heat dissipation cavity 12, and the cold end of the semiconductor refrigeration mechanism 6 is attached to the communicating pipeline of the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4. By utilizing the Peltier effect, namely when current passes through loops formed by different conductors, irreversible Joule heat is generated, heat absorption and heat release phenomena can occur at joints of different conductors respectively along with different current directions, and the cold end of the semiconductor refrigeration mechanism 6 further cools a heat dissipation medium circulating between the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4, so that the temperature of the heat dissipation medium reaching the inside of the compressor cavity 11 is reduced, the heat absorption capacity of the heat dissipation medium in the compressor cavity 11 is improved, and the heat dissipation efficiency of the compressor cavity 11 is further improved. Still further, the refrigeration device further includes a second cooling fan 7, the second cooling fan 7 is disposed in the cooling cavity 12, and an air outlet direction of the second cooling fan 7 is directed to a hot end of the semiconductor refrigeration mechanism 6. The heat generated by the hot end of the semiconductor refrigeration mechanism 6 is taken away by the air flow by the second cooling fan 7, so that the semiconductor refrigeration mechanism 6 can reliably work, and meanwhile, the temperature of the hot end is low, the temperature of the cold end is further reduced, and the cooling capacity of a cooling medium is improved.
The refrigeration equipment further comprises a condenser 8, the refrigeration equipment needs to refrigerate other compartments of the shell, the evaporator and the condenser 8 are simultaneously needed for refrigerant heat exchange circulation, the evaporator is used for refrigerating the compartments, the condenser 8 is used for releasing heat to ensure normal work of the refrigerant heat exchange circulation, in order to avoid the influence of the condenser 8 on the temperature of the compartments, the condenser 8 is positioned in the compressor cavity 11, when the first heat dissipation mechanism 3 dissipates heat of the compressor cavity 11, the compressor 2 and the condenser 8 can be cooled at the same time, namely, the working efficiency and the reliability of the compressor 2 can be improved, the temperature of the condenser 8 can be further reduced to improve the heat exchange efficiency of the refrigerant, the refrigerating capacity of the refrigerant heat exchange circulation is improved, and in order to further cool the condenser 8, a communication pipeline between the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 is arranged on the condenser 8 in a penetrating way, so that a low-temperature heat dissipation medium passes through the condenser 8 is cooled, and the heat dissipation medium flowing through the condenser 8 can not be cooled by the first heat dissipation mechanism 3, the heat dissipation mechanism can be fully cooled by the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4, and the refrigerating capacity can be fully improved by the first heat dissipation mechanism 11. For example, the heat exchange pipeline is inserted between the heat exchange pipe and the fin of the condenser 8, so that heat exchange with the heat exchange pipe and the fin in the condenser 8 is realized, and the condenser 8 is cooled.
Alternatively, the condenser 8 is provided with a heat dissipation medium channel 81, and the first heat dissipation mechanism 3 is communicated with the second heat dissipation mechanism 4 through the heat dissipation medium channel 81. A heat dissipation medium channel 81 is directly formed on the condenser 8, and the heat dissipation medium channel 81, the heat exchange tubes and the fins are in contact heat exchange, so that the condenser 8 is cooled.
The refrigeration equipment further comprises a third cooling fan 9, the third cooling fan 9 is arranged on one side, far away from the compressor 2, of the first cooling mechanism 3, and the air outlet direction of the third cooling fan 9 faces the first cooling mechanism 3. The third cooling fan 9 is used for increasing the air flow flowing through the first cooling mechanism 3, so that the cooling effect of the first cooling mechanism 3 on the compressor cavity 11 is improved, and the air outlet of the third cooling fan 9 can reach the compressor 2 after passing through the first cooling mechanism 3 due to the fact that the third cooling fan 9 is located on one side of the first cooling mechanism 3 far away from the compressor 2, and the compressor 2 can be cooled rapidly. Preferably, as shown in fig. 1, the compressor 2, the first heat dissipation mechanism 3, the third heat dissipation fan 9 and the condenser 8 are sequentially arranged from the left side to the right side in the drawing, and the heat exchange pipeline bypasses the third heat dissipation fan 9 to form the first heat dissipation mechanism 3 after passing through the supercooling condenser 8, so that the heat dissipation medium cooled by the second heat dissipation mechanism 4 and the semiconductor refrigeration mechanism 6 cools the condenser 8 first, and the temperature of the heat dissipation medium cooled by the condenser 8 is still smaller than that of the compressor 2, therefore, the air flow blown by the third heat dissipation fan 9 can flow through the first heat dissipation mechanism 3 and then reach the compressor 2, thereby heat dissipation can be carried out on the compressor 2, effectively improving the cold utilization of the heat dissipation medium, and improving the cooling effect on the compressor cavity 11, the compressor 2 and the condenser 8, and the working efficiency and reliability of the refrigeration equipment.
The refrigeration equipment can produce the comdenstion water at the in-process of refrigerating the compartment in the casing, therefore refrigeration equipment still includes water collector 10, water collector 10 set up in the casing utilizes water collector 10 to receive the comdenstion water that produces to with comdenstion water as the radiating medium and avoid refrigeration equipment to introduce other radiating medium and cause pollution scheduling problem, also can improve refrigeration equipment's utilization efficiency to the resource, wherein, the entry of first cooling mechanism 3 with water collector 10 intercommunication, the export of second cooling mechanism 4 with water collector 10 intercommunication. The condensed water collected in the water receiving disc 10 is firstly sent into the first heat dissipation mechanism 3 to dissipate heat of the compressor cavity 11, then flows into the second heat dissipation mechanism 4 to be cooled, and finally flows back into the water receiving disc 10 to realize circulation of the condensed water. As an implementation manner, as shown in fig. 1, condensed water in the water pan 10 is pumped into a heat exchange pipeline by a water pump, flows through the condenser 8 and the first heat dissipation mechanism 3 in sequence according to the heat exchange pipeline, enters the second heat dissipation mechanism 4 in the heat dissipation cavity 12, and flows back into the water pan 10 after being cooled by the semiconductor refrigeration mechanism 6, so that heat dissipation circulation of the condensed water is realized.
The control method of the refrigeration equipment, the refrigeration equipment further comprises a first cooling fan 5, the first cooling fan 5 is arranged in the cooling cavity 12, the air outlet direction of the first cooling fan 5 faces the second cooling mechanism 4, the refrigeration equipment further comprises a semiconductor refrigeration mechanism 6, the semiconductor refrigeration mechanism 6 is arranged in the cooling cavity 12, the cold end of the semiconductor refrigeration mechanism 6 is attached to the communicating pipe of the first cooling mechanism 3 and the second cooling mechanism 4, the refrigeration equipment further comprises a second cooling fan 7, the second cooling fan 7 is arranged in the cooling cavity 12, the air outlet direction of the second cooling fan 7 faces the hot end of the semiconductor refrigeration mechanism 6, the refrigeration equipment further comprises a third cooling fan 9, the third cooling fan 9 is arranged on one side of the first cooling mechanism 3 far away from the compressor 2, and the air outlet direction of the third cooling fan 9 faces the first cooling mechanism 3, the control method comprises:
acquiring a real-time temperature T in the compressor cavity 11, and comparing the real-time temperature T with a preset temperature T0, wherein the real-time temperature can be the temperature of the compressor 2 or the average value of the temperatures near the compressor 2, the third cooling fan 9 and the condenser 8 in the compressor cavity 11;
if T > T0, indicating that there is a heat dissipation requirement in the compressor chamber 11, the working states of the first heat dissipation fan 5, the second heat dissipation fan 7, the third heat dissipation fan 9 and the semiconductor refrigeration mechanism 6 are controlled according to preset conditions.
Specifically, in the case where T > T0, the operation states of the first cooling fan 5, the second cooling fan 7, the third cooling fan 9, and the semiconductor refrigeration mechanism 6 are controlled according to the preset conditions, the method further includes:
the real-time rotating speed V of the compressor 2 is obtained, the real-time rotating speed V is compared with a first preset rotating speed V1, and the heat dissipation requirement in the compressor cavity 11 is judged, so that the third heat dissipation fan 9 and the first heat dissipation fan 5 can work according to the heat dissipation requirement, the semiconductor refrigeration mechanism 6 and the second heat dissipation fan 7 are respectively adjusted, and different cooling methods are adopted, so that accurate, energy-saving and effective cooling is achieved, and the working efficiency of the refrigerator is greatly improved;
if V is less than V1, the compressor 2 is in a low-rotation speed mode, and the heat generation amount is not high, the third cooling fan 9 and the first cooling fan 5 are controlled to work, and the semiconductor refrigeration mechanism 6 and the second cooling fan 7 stop working;
if V is greater than or equal to V1, the rotation speed of the compressor 2 is higher, and the heat generation amount is also higher, the third cooling fan 9, the first cooling fan 5, the semiconductor refrigerating mechanism 6 and the second cooling fan 7 are controlled to work, and the semiconductor refrigerating mechanism 6 participates in cooling the cooling medium, so that the cooling efficiency of the cooling medium is improved.
In order to further improve the accuracy matching of the heat dissipation requirement of the compressor cavity 11, when V is greater than or equal to V1, the third heat dissipation fan 9, the first heat dissipation fan 5, the semiconductor refrigeration mechanism 6 and the second heat dissipation fan 7 are controlled to operate, the method further comprises:
comparing the real-time rotating speed V with a second preset rotating speed V2;
if V1 is less than or equal to V2, and the compressor 2 is in a medium speed mode and the heat generation amount is large, controlling the third cooling fan 9 to work at a first speed (D1 gear), the first cooling fan 5 to work at a second speed, the semiconductor refrigeration mechanism 6 to work at a first power, and the second cooling fan 7 to work at a third speed;
if V is greater than or equal to V2, the compressor 2 is in a high-speed mode, the heat generation amount is maximum, and the heat dissipation efficiency of the compressor cavity 11 needs to be increased, the third heat dissipation fan 9 is controlled to work at a fourth speed (D2 gear), the first heat dissipation fan 5 is controlled to work at a fifth speed, the semiconductor refrigeration mechanism 6 is controlled to work at a second power, and the second heat dissipation fan 7 is controlled to work at a sixth speed;
the fourth rotating speed is larger than the first rotating speed, the fifth rotating speed is larger than the second rotating speed, the sixth rotating speed is larger than the third rotating speed, and the second power is larger than the first power. For example, the second rotation speed is N1, the third rotation speed is 1.5N1, the fifth rotation speed is 2N1, and the sixth rotation speed is 2N1.
After controlling the operation states of the first cooling fan 5, the second cooling fan 7, the third cooling fan 9, and the semiconductor refrigeration mechanism 6 according to the preset conditions if T > T0, the method further includes:
if T is less than T0-a, indicating that the temperature of the compressor cavity 11 is reduced to the set level at the moment, and heat dissipation of the compressor cavity 11 can be stopped, controlling the first cooling fan 5, the second cooling fan 7, the third cooling fan 9 and the semiconductor refrigeration mechanism 6 to stop working;
a is a preset constant, wherein the value of a ranges from 2 ℃ to 10 ℃, and is preferably 5 ℃.
A refrigerator comprises the refrigerating equipment or a control method applying the refrigerating equipment.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (12)
1. A refrigeration device, characterized by: comprising the following steps:
a housing in which a compressor chamber (11) and a heat dissipation chamber (12) are formed;
-a compressor (2), the compressor (2) being arranged within the compressor chamber (11);
a first heat dissipation mechanism (3), the first heat dissipation mechanism (3) being disposed within the compressor chamber (11);
the second heat dissipation mechanism (4) is arranged in the heat dissipation cavity (12), and the second heat dissipation mechanism (4) and the first heat dissipation mechanism (3) are mutually communicated to form a heat dissipation medium circulation pipeline;
the heat dissipation cavity (12) is communicated with the outside of the shell;
the refrigerating equipment is embedded into a containing groove with a preset structure, and the radiating cavity (12) is positioned between the compressor cavity (11) and an opening of the containing groove;
the refrigeration equipment further comprises a condenser (8), the condenser (8) is positioned in the compressor cavity (11), and a communication pipeline between the first heat dissipation mechanism (3) and the second heat dissipation mechanism (4) is arranged on the condenser (8) in a penetrating way; or, a heat dissipation medium channel (81) is arranged on the condenser (8), and the first heat dissipation mechanism (3) is communicated with the second heat dissipation mechanism (4) through the heat dissipation medium channel (81);
the refrigeration equipment further comprises a water receiving disc (10), the water receiving disc (10) is arranged in the shell, an inlet of the first heat dissipation mechanism (3) is communicated with the water receiving disc (10), and an outlet of the second heat dissipation mechanism (4) is communicated with the water receiving disc (10).
2. The refrigeration appliance of claim 1 wherein: the refrigeration equipment further comprises a first cooling fan (5), the first cooling fan (5) is arranged in the cooling cavity (12), and the air outlet direction of the first cooling fan (5) faces the second cooling mechanism (4).
3. The refrigeration appliance of claim 1 wherein: the refrigeration equipment comprises a heat exchange pipeline, part of the heat exchange pipeline is positioned in the compressor cavity (11) to form the first heat dissipation mechanism (3), and part of the heat exchange pipeline is positioned in the heat dissipation cavity (12) to form the second heat dissipation mechanism (4).
4. A refrigeration unit as recited in claim 3 wherein: the heat exchange pipeline in the compressor cavity (11) is in a continuous bending shape; and/or the heat exchange pipeline in the heat dissipation cavity (12) is in a continuous bending shape.
5. The refrigeration appliance of claim 1 wherein: the refrigeration equipment further comprises a semiconductor refrigeration mechanism (6), the semiconductor refrigeration mechanism (6) is arranged in the heat dissipation cavity (12), and the cold end of the semiconductor refrigeration mechanism (6) is attached to the communicating pipe of the first heat dissipation mechanism (3) and the communicating pipe of the second heat dissipation mechanism (4).
6. The refrigeration appliance of claim 5 wherein: the refrigerating equipment further comprises a second cooling fan (7), the second cooling fan (7) is arranged in the cooling cavity (12), and the air outlet direction of the second cooling fan (7) points to the hot end of the semiconductor refrigerating mechanism (6).
7. The refrigeration appliance of claim 1 wherein: the refrigeration equipment further comprises a third cooling fan (9), the third cooling fan (9) is arranged on one side, far away from the compressor (2), of the first cooling mechanism (3), and the air outlet direction of the third cooling fan (9) faces the first cooling mechanism (3).
8. A control method of a refrigeration apparatus according to any one of claims 1 to 7, characterized by: the refrigeration equipment further comprises a first cooling fan (5), the first cooling fan (5) is arranged in the cooling cavity (12), the air outlet direction of the first cooling fan (5) faces towards the second cooling mechanism (4), the refrigeration equipment further comprises a semiconductor refrigeration mechanism (6), the semiconductor refrigeration mechanism (6) is arranged in the cooling cavity (12), the cold end of the semiconductor refrigeration mechanism (6) is attached to the communicating pipe of the first cooling mechanism (3) and the second cooling mechanism (4), the refrigeration equipment further comprises a second cooling fan (7), the second cooling fan (7) is arranged in the cooling cavity (12), the air outlet direction of the second cooling fan (7) faces towards the hot end of the semiconductor refrigeration mechanism (6), the refrigeration equipment further comprises a third cooling fan (9), the third cooling fan (9) is arranged on one side, far away from the compressor (2), of the first mechanism (3) and faces towards the first cooling mechanism (3), and the air outlet direction of the third cooling fan (9) faces towards the cooling mechanism (3).
Acquiring a real-time temperature T in the compressor cavity (11), and comparing the real-time temperature T with a preset temperature T0;
if T is more than T0, the working states of the first cooling fan (5), the second cooling fan (7), the third cooling fan (9) and the semiconductor refrigerating mechanism (6) are controlled according to preset conditions.
9. The control method according to claim 8, characterized in that: if T > T0, controlling the operation states of the first cooling fan (5), the second cooling fan (7), the third cooling fan (9) and the semiconductor refrigeration mechanism (6) according to preset conditions, further comprising:
acquiring a real-time rotating speed V of the compressor (2), and comparing the real-time rotating speed V with a first preset rotating speed V1;
if V is less than V1, the third cooling fan (9) and the first cooling fan (5) are controlled to work, and the semiconductor refrigeration mechanism (6) and the second cooling fan (7) stop working;
and if V is more than or equal to V1, controlling the third cooling fan (9), the first cooling fan (5), the semiconductor refrigerating mechanism (6) and the second cooling fan (7) to work.
10. The control method according to claim 9, characterized in that: if V is more than or equal to V1, then in controlling third radiator fan (9), first radiator fan (5), semiconductor refrigeration mechanism (6) and second radiator fan (7) all to work, still include:
comparing the real-time rotating speed V with a second preset rotating speed V2;
if V1 is less than or equal to V2, controlling the third cooling fan (9) to work at a first rotating speed, the first cooling fan (5) to work at a second rotating speed, the semiconductor refrigeration mechanism (6) to work at a first power, and the second cooling fan (7) to work at a third rotating speed;
if V is more than or equal to V2, controlling the third cooling fan (9) to work at a fourth rotating speed, the first cooling fan (5) to work at a fifth rotating speed, the semiconductor refrigerating mechanism (6) to work at a second power, and the second cooling fan (7) to work at a sixth rotating speed;
the fourth rotating speed is larger than the first rotating speed, the fifth rotating speed is larger than the second rotating speed, the sixth rotating speed is larger than the third rotating speed, and the second power is larger than the first power.
11. The control method according to claim 8, characterized in that: if T > T0, after controlling the operating states of the first cooling fan (5), the second cooling fan (7), the third cooling fan (9) and the semiconductor refrigeration mechanism (6) according to preset conditions, the method further comprises:
if T is less than T0-a, controlling the first cooling fan (5), the second cooling fan (7), the third cooling fan (9) and the semiconductor refrigeration mechanism (6) to stop working;
a is a preset constant.
12. A refrigerator, characterized in that: a control method comprising the refrigeration appliance of any one of claims 1 to 7 or applying the refrigeration appliance of any one of claims 8 to 11.
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| CN202311783229.2A CN117450713B (en) | 2023-12-22 | 2023-12-22 | Refrigerating equipment, control method thereof and refrigerator |
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| CN117450713A CN117450713A (en) | 2024-01-26 |
| CN117450713B true CN117450713B (en) | 2024-04-09 |
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| KR970028327A (en) * | 1995-11-17 | 1997-06-24 | 배순훈 | Machine room heat radiating means of the refrigerator |
| KR19990041822A (en) * | 1997-11-24 | 1999-06-15 | 전주범 | Heat dissipation device for small refrigerator |
| CN102536745A (en) * | 2011-12-05 | 2012-07-04 | Tcl空调器(中山)有限公司 | Heat radiating device for heat pipes |
| CN107725332A (en) * | 2017-09-27 | 2018-02-23 | 安徽瑞田机械有限公司 | A kind of water cooling plant of air compressor |
| WO2018149032A1 (en) * | 2017-02-15 | 2018-08-23 | 美的集团股份有限公司 | Heat dissipation assembly and refrigeration device |
| CN113819668A (en) * | 2021-09-09 | 2021-12-21 | 珠海格力电器股份有限公司 | Refrigerating device |
| CN114508887A (en) * | 2022-04-19 | 2022-05-17 | 合肥美的电冰箱有限公司 | Embedded refrigerator |
| CN116771644A (en) * | 2023-06-21 | 2023-09-19 | 珠海格力电器股份有限公司 | Heat abstractor and have its oxygenerator |
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2023
- 2023-12-22 CN CN202311783229.2A patent/CN117450713B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970028327A (en) * | 1995-11-17 | 1997-06-24 | 배순훈 | Machine room heat radiating means of the refrigerator |
| KR19990041822A (en) * | 1997-11-24 | 1999-06-15 | 전주범 | Heat dissipation device for small refrigerator |
| CN102536745A (en) * | 2011-12-05 | 2012-07-04 | Tcl空调器(中山)有限公司 | Heat radiating device for heat pipes |
| WO2018149032A1 (en) * | 2017-02-15 | 2018-08-23 | 美的集团股份有限公司 | Heat dissipation assembly and refrigeration device |
| CN107725332A (en) * | 2017-09-27 | 2018-02-23 | 安徽瑞田机械有限公司 | A kind of water cooling plant of air compressor |
| CN113819668A (en) * | 2021-09-09 | 2021-12-21 | 珠海格力电器股份有限公司 | Refrigerating device |
| CN114508887A (en) * | 2022-04-19 | 2022-05-17 | 合肥美的电冰箱有限公司 | Embedded refrigerator |
| CN116771644A (en) * | 2023-06-21 | 2023-09-19 | 珠海格力电器股份有限公司 | Heat abstractor and have its oxygenerator |
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|---|---|
| CN117450713A (en) | 2024-01-26 |
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