CN103673172A - Heat pipe heat-exchange-type semiconductor refrigeration device - Google Patents
Heat pipe heat-exchange-type semiconductor refrigeration device Download PDFInfo
- Publication number
- CN103673172A CN103673172A CN201310575927.3A CN201310575927A CN103673172A CN 103673172 A CN103673172 A CN 103673172A CN 201310575927 A CN201310575927 A CN 201310575927A CN 103673172 A CN103673172 A CN 103673172A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- condenser
- evaporator
- interior
- pipe condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000005057 refrigeration Methods 0.000 title claims abstract description 16
- 230000005484 gravity Effects 0.000 claims abstract description 20
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound 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[Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract 4
- 239000012530 fluid Substances 0.000 abstract 1
- 238000004378 air conditioning Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000001105 regulatory Effects 0.000 description 1
Abstract
The invention discloses a heat pipe heat-exchange-type semiconductor refrigeration device which is mainly composed of a semiconductor refrigerating sheet, an outer heat pipe evaporator, an outer heat pipe condenser, an inner heat pipe evaporator, an inner heat pipe condenser, a fan of the outer heat pipe condenser, a fan of the inner heat pipe evaporator, an air guiding pipe, a liquid guiding pipe and a control circuit. The fan of the outer heat pipe condenser is installed on the outer heat pipe condenser, the outer heat pipe evaporator is in close contact with the heating face of the semiconductor refrigerating sheet, the fan of the inner heat pipe evaporator is installed on the inner heat pipe evaporator, and the inner heat pipe condenser is in close contact with the heating face of the semiconductor refrigerating sheet. In this way, the radiating area of the semiconductor refrigerating face and the radiating area of the semiconductor heating face are increased through the gravity heat pipe heat conducting technology, the temperature of the indoor environment is indirectly changed, useless energy of the heating face of the semiconductor refrigerating sheet is transmitted out, compressed refrigerating fluid is replaced by the semiconductor refrigerating sheet to conduct refrigeration, and the heat pipe heat-exchange-type semiconductor refrigeration device is safe, reliable and free of environment pollution.
Description
Technical field
The invention belongs to cold and hot energy transporting technical field, relate to a kind of heat pipe exchanging type semiconductor cooling device of heat pipe heat exchanging system and semiconductor semiconductor chilling plate being combined to carry out cold and hot energy transporting.
Background technology
For regulating and controlling the air-conditioning system chief component of environment temperature, be indoor heat exchanger and outdoor heat exchanger at present, this air-conditioning system can realize by the highly energy-consuming of compressor in indoor heat exchanger the temperature adjusting to condensing agent, thereby indirectly change indoor environment temperature, this air-conditioning system does not accomplish well to save the energy, thereby the unnecessary waste that causes electric energy, operation costs are high, and refrigerant external leakage often occur to environment in using.
Summary of the invention
The problem existing for solving prior art, the invention provides a kind of simple in structure, implement easily, the heat pipe exchanging type semiconductor cooling devices of energy-saving and emission-reduction, by semiconductor chilling plate refrigeration and gravity assisted heat pipe heat transfer technology, dispel the heat, thereby realize good refrigeration, reduce energy waste simultaneously and improve environment-friendly quality.
Technical solution problem of the present invention adopts following technical scheme:
A heat pipe exchanging type semiconductor cooling device, comprises semiconductor chilling plate, outer heat pipe evaporator, outer heat pipe condenser, interior heat pipe condenser, interior heat pipe evaporator, the blower fan of interior heat pipe evaporator, the blower fan of outer heat pipe condenser, wireway, catheter and control circuit; The assembling of described outer heat pipe condenser is outside on heat pipe condenser, and outer heat pipe evaporator is with the face that the heats phase close contact of semiconductor chilling plate; The assembling of described interior heat pipe evaporator is on interior heat pipe evaporator, and interior heat pipe condenser is with the face that the heats phase close contact of semiconductor chilling plate; Described outer heat pipe evaporator is identical with the structure of interior heat pipe condenser, is all direct-cooling type microchannel flat metal tube; The structure of described outer heat pipe condenser and interior heat pipe condenser is identical, is all microchannel heat sink; Like this, heat pipe condenser and interior heat pipe evaporator are connected as one and are formed an interior gravity assisted heat pipe system by wireway and catheter, and interior heat pipe condenser is on the top of interior heat pipe evaporator, necessarily has a difference in height between the two; Outer heat pipe condenser and outer heat pipe evaporator are connected as one and are formed an outer gravity assisted heat pipe system by wireway and catheter, and the outer heat pipe condenser top of heat pipe evaporator outside, necessarily have a difference in height between the two; In described outer gravity assisted heat pipe system and interior gravity assisted heat pipe system, be filled with refrigeration working medium, by gravity assisted heat pipe heat transfer technology, increase semiconductor refrigerating face and the area of dissipation that heats face like this, indirectly change indoor environment temperature.
The above outer heat pipe evaporator and interior heat pipe condenser are the good direct-cooling type aluminum micro-channel of thermal diffusivity flat tubes.
The above outer heat pipe evaporator and interior heat pipe condenser are the good direct-cooling type copper of thermal diffusivity micro-channel flat.
The microchannel bore of the flat metal tube of the above outer heat pipe evaporator and interior heat pipe condenser is square.
The microchannel bore of the flat metal tube of the above outer heat pipe evaporator and interior heat pipe condenser is circular.
The above control circuit is connected with the blower fan of semiconductor chilling plate, outer heat pipe condenser and the blower fan of interior heat pipe evaporator.
The present invention compared with prior art, uses semiconductor chilling plate to replace compressed refrigerant refrigeration, without any need for cold-producing medium, cost-saving during use, and safe and reliable non-environmental-pollution; The energy that the chill surface of semiconductor chilling plate is produced is delivered to the room that needs heat radiation via heat transfer technology of heat pipe, the useless energy that the face that the heats face of semiconductor chilling plate produces dispels the heat via heat transfer technology of heat pipe, increased like this semiconductor chilling plate area of dissipation, thereby realize good heat radiating, guarantee the job stability of semiconductor chilling plate, and realized remotely transferring, this outer heat pipe exchanging type semiconductor cooling device can be applied to the heat radiation temperature control in the fields such as base station, machine room and large electric appliances equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the structural representation of direct-cooling type flat metal tube radiator of the present invention.
In figure: (1) semiconductor chilling plate; (2) outer heat pipe evaporator; (3) interior heat pipe condenser; (4) interior heat pipe evaporator; (5) outer heat pipe condenser; (6) blower fan of interior heat pipe evaporator; (7) blower fan of outer heat pipe condenser.
The specific embodiment
The structural representation of heat pipe exchanging type semiconductor cooling device of the present invention as shown in Figure 1, comprises blower fan (7), wireway, catheter and the control circuit of semiconductor chilling plate (1), outer heat pipe evaporator (2), outer heat pipe condenser (5), interior heat pipe condenser (3), interior heat pipe condenser (4), the blower fan (6) of interior heat pipe evaporator, outer heat pipe condenser; It is upper that the blower fan of described outer heat pipe condenser (7) is arranged on outer heat pipe condenser (5), the face that the heats phase close contact of the same semiconductor chilling plate of outer heat pipe evaporator (2) (1); It is upper that the blower fan of described interior heat pipe evaporator (6) is arranged on interior heat pipe evaporator (4), the face that the heats phase close contact of the same semiconductor chilling plate of interior heat pipe condenser (3) (1); Described outer heat pipe evaporator (2) is identical with the structure of interior heat pipe condenser (3), is all direct-cooling type microchannel flat metal tube; Described outer heat pipe condenser (5) is identical with the structure of interior heat pipe condenser (3), is all microchannel heat sink; Like this, heat pipe condenser (3) is connected as one and is formed an interior gravity assisted heat pipe system by wireway and catheter with interior heat pipe evaporator (4), and interior heat pipe condenser (3), on the top of interior heat pipe evaporator (4), necessarily has a difference in height between the two; Outer heat pipe condenser (5) and outer heat pipe evaporator (2) are connected as one and are formed an outer gravity assisted heat pipe system by wireway and catheter, and outer heat pipe condenser (5) top of heat pipe evaporator (2) outside, necessarily have a difference in height between the two; In described outer gravity assisted heat pipe system and interior gravity assisted heat pipe system, be filled with refrigeration working medium, by gravity assisted heat pipe heat transfer technology, increase semiconductor refrigerating face and the area of dissipation that heats face like this, indirectly change indoor environment temperature.
Operation principle of the present invention is such: when heat pipe exchanging type semiconductor cooling device is worked, control circuit is that the blower fan (7) of semiconductor chilling plate (1), outer heat pipe condenser and the blower fan (6) of interior heat pipe evaporator are carried suitable electric current, blower fan (6) at interior heat pipe evaporator drives Air Flow and the interior heat pipe evaporator (4) of Indoor Thermal to carry out heat exchange, the liquid refrigeration working medium of heat pipe evaporator (4) like this, absorb heat and be evaporated to gas, the gaseous state refrigeration working medium that evaporation forms enters into interior heat pipe condenser (3) by wireway, the chill surface phase close contact of interior heat pipe condenser (3) and semiconductor chilling plate (1), refrigeration working medium in interior heat pipe condenser (3) is condensed into liquid, and emit heat, the liquid-working-medium that condensation forms enters interior heat pipe evaporator (4) by catheter under the effect of gravity, like this semiconductor chilling plate (1) by interior heat pipe condenser (3) continuously from draw heat in room, and heat is passed on outer heat pipe evaporator (2) and dispelled the heat, liquid refrigeration working medium in outer heat pipe evaporator (2), absorb heat and be evaporated to gas, the gaseous state refrigeration working medium that evaporation forms enters into outer heat pipe condenser (5) by wireway, outer heat pipe condenser (5) contacts with outdoor cold source, and be condensed into liquid, and emit heat, the liquid-working-medium that condensation forms enters outer heat pipe evaporator (2) by catheter under the effect of gravity, so endlessly indoor thermal energy is transferred out, reduce temperature in room, reach the object of refrigeration, because outer heat pipe evaporator (2) is direct-cooling type micro-channel heat exchanger with interior heat pipe condenser (3), can be respectively and the face that heats and the chill surface phase close contact of semiconductor chilling plate (1), the face that heats of semiconductor chilling plate (1) and the area of dissipation of chill surface have been increased, improved the heat exchange coefficient of semiconductor chilling plate (1) with outer heat pipe evaporator (2) and interior heat pipe condenser (3), add gravity assisted heat pipe system and there is very high heat transfer efficiency, can take away expeditiously useless heat, fully reduce the temperature difference between interior heat pipe condenser (3) and outer heat pipe evaporator (2), improved greatly the refrigerating efficiency of semiconductor chilling plate (1).
Claims (6)
1. a heat pipe exchanging type semiconductor cooling device, it is characterized in that, comprise blower fan (7), wireway, catheter and the control circuit of semiconductor chilling plate (1), outer heat pipe evaporator (2), outer heat pipe condenser (5), interior heat pipe condenser (3), interior heat pipe evaporator (4), the blower fan (6) of interior heat pipe evaporator, outer heat pipe condenser; It is upper that the blower fan of described outer heat pipe condenser (7) is arranged on outer heat pipe condenser (5), the face that the heats phase close contact of the same semiconductor chilling plate of outer heat pipe evaporator (2) (1); It is upper that the blower fan of described interior heat pipe evaporator (6) is arranged on interior heat pipe evaporator (4), the face that the heats phase close contact of the same semiconductor chilling plate of interior heat pipe condenser (3) (1); Described outer heat pipe evaporator (2) is identical with the structure of interior heat pipe condenser (3), is all direct-cooling type microchannel flat metal tube; Described outer heat pipe condenser (5) is identical with the structure of interior heat pipe condenser (3), is all microchannel heat sink; Like this, heat pipe condenser (3) is connected as one and is formed an interior gravity assisted heat pipe system by wireway and catheter with interior heat pipe evaporator (4), and interior heat pipe condenser (3), on the top of interior heat pipe evaporator (4), necessarily has a difference in height between the two; Outer heat pipe condenser (5) and outer heat pipe evaporator (2) are connected as one and are formed an outer gravity assisted heat pipe system by wireway and catheter, and outer heat pipe condenser (5) top of heat pipe evaporator (2) outside, necessarily have a difference in height between the two; In described outer gravity assisted heat pipe system and interior gravity assisted heat pipe system, be filled with refrigeration working medium, by gravity assisted heat pipe heat transfer technology, increase semiconductor refrigerating face and the area of dissipation that heats face like this, indirectly change indoor environment temperature.
2. a kind of heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, described outer heat pipe evaporator (2) is the good direct-cooling type aluminum micro-channel of thermal diffusivity flat tube with interior heat pipe condenser (3).
3. a kind of heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, described outer heat pipe evaporator (2) is the good direct-cooling type copper of thermal diffusivity micro-channel flat with interior heat pipe condenser (3).
4. a kind of heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, described outer heat pipe evaporator (2) is square with the microchannel bore of the flat metal tube of interior heat pipe condenser (3).
5. a kind of heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, described outer heat pipe evaporator (2) is circular with the microchannel bore of the flat metal tube of interior heat pipe condenser (3).
6. a kind of heat pipe exchanging type semiconductor cooling device according to claim 1, is further characterized in that, described control circuit is connected with the blower fan (7) of semiconductor chilling plate (1), outer heat pipe condenser and the blower fan (6) of interior heat pipe evaporator.
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| CN201310575927.3A CN103673172B (en) | 2013-11-18 | 2013-11-18 | A kind of heat pipe heat-exchange-type semiconductor refrigeration device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106196706A (en) * | 2016-08-05 | 2016-12-07 | 吴小峰 | Quasiconductor overlay cryogenic energy storage refrigerating plant and method of work thereof |
| CN108488891A (en) * | 2018-02-02 | 2018-09-04 | 清华大学 | A kind of flat-plate heat pipe heating end of combination semiconductor |
| CN110749140A (en) * | 2019-09-20 | 2020-02-04 | 邓明星 | Multifunctional semiconductor thermoelectric refrigerator temperature regulator |
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| CN2708195Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | A semiconductor refrigerating system |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| KR101063248B1 (en) * | 2011-06-03 | 2011-09-07 | (주)동양테크놀로지 | Waste heat recovery system using separated heat-pipe |
| CN103307683A (en) * | 2013-07-04 | 2013-09-18 | 北京德能恒信科技有限公司 | Hot pipe and air conditioner all-in-one machine |
| CN203561016U (en) * | 2013-11-18 | 2014-04-23 | 北京德能恒信科技有限公司 | Heat pipe heat exchange type semiconductor refrigeration device |
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| CN106196706A (en) * | 2016-08-05 | 2016-12-07 | 吴小峰 | Quasiconductor overlay cryogenic energy storage refrigerating plant and method of work thereof |
| CN106196706B (en) * | 2016-08-05 | 2019-02-12 | 吴小峰 | Semiconductor overlay cryogenic energy stores refrigerating plant and its working method |
| CN108488891A (en) * | 2018-02-02 | 2018-09-04 | 清华大学 | A kind of flat-plate heat pipe heating end of combination semiconductor |
| CN110749140A (en) * | 2019-09-20 | 2020-02-04 | 邓明星 | Multifunctional semiconductor thermoelectric refrigerator temperature regulator |
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