CN105716456B - Heat-exchange device and semiconductor refrigerating equipment - Google Patents
Heat-exchange device and semiconductor refrigerating equipment Download PDFInfo
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- CN105716456B CN105716456B CN201410711537.9A CN201410711537A CN105716456B CN 105716456 B CN105716456 B CN 105716456B CN 201410711537 A CN201410711537 A CN 201410711537A CN 105716456 B CN105716456 B CN 105716456B
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Abstract
The present invention provides a kind of heat-exchange device and semiconductor refrigerating equipment.Heat-exchange device, including heat carrier and Duo Gen heat pipe are formed with cavity in the heat carrier, and the heat pipe seals respectively to be inserted in the heat carrier and be connected to the cavity, and the refrigerant that gas-liquid two-phase coexists is provided in the cavity and the heat pipe.The cold end cooling capacity of semiconductor refrigerating module is passed into heat pipe by heat carrier, cooling capacity can be quickly distributed on whole heat pipe by heat pipe, and the bulk temperature of heat pipe is uniform, heat pipe that cooling capacity is quickly transmitted to liner to be formed by storage space, so that it is guaranteed that the cooling capacity of internal storage space is evenly distributed, the refrigeration performance of semiconductor refrigerating equipment is improved.
Description
Technical field
The present invention relates to refrigerating plant more particularly to a kind of heat-exchange devices and semiconductor refrigerating equipment.
Background technique
Currently, refrigeration equipment (such as refrigerator, refrigerator, wine cabinet) is common electric appliance, refrigeration equipment in people's daily life
In usually have refrigeration system, refrigeration system is made of compressor, condenser and evaporator under normal circumstances, can be realized lower
The refrigeration of temperature.However, with the development of semiconductor refrigerating technology, the refrigeration equipment to be freezed using semiconductor chilling plate also by
It is widely used.Semiconductor refrigerating equipment in the prior art is intracorporal to case by the cold end released cold quantity of semiconductor refrigerating module
Storage space freezes.But in actual use, the cold end of semiconductor refrigerating module generallys use cooling fin progress
Forced convertion is by being dispersed into storage space, to need that cooling capacity refrigeration equipment can be transported to by fan cooling capacity
In storage space, refrigerating efficiency is lower.How a kind of semiconductor refrigerating equipment that can be realized quickly transmitting released cold quantity is designed,
It is the technical problems to be solved by the invention to improve refrigerating efficiency.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of heat-exchange device and semiconductor refrigerating equipment, realize logical
It crosses heat-exchange device and quickly transmits released cold quantity, improve semiconductor refrigerating equipment refrigerating efficiency.
Technical solution provided by the invention is a kind of heat-exchange device, including heat carrier and Duo Gen heat pipe, the heat carrier
In be formed with cavity, the heat pipe seals respectively to be inserted in the heat carrier and is connected to the cavity, the cavity and described
The refrigerant that gas-liquid two-phase coexists is provided in heat pipe.
It is described partly to lead the present invention also provides a kind of semiconductor refrigerating equipment, including thermally conductive liner and semiconductor refrigerating module
The hot end of body refrigeration module is provided with radiator, further includes above-mentioned heat-exchange device, and the heat pipe of the heat-exchange device is attached to institute
It states on thermally conductive liner, the heat carrier of the heat-exchange device is attached to the cold end of the semiconductor refrigerating module.
Heat-exchange device and semiconductor refrigerating equipment provided by the invention, by heat carrier by the cold of semiconductor refrigerating module
End cooling capacity passes to heat pipe, and cooling capacity can be quickly distributed on whole heat pipe by heat pipe, and the bulk temperature of heat pipe is uniform, makes
Cooling capacity quickly can be transmitted to liner and is formed by storage space by heat pipe, so that it is guaranteed that internal storage space is cold
Amount is evenly distributed, and improves the refrigeration performance of semiconductor refrigerating equipment.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of semiconductor refrigerating equipment embodiment of the present invention；
Fig. 2 is the explosive view of semiconductor refrigerating equipment embodiment of the present invention；
Fig. 3 is the structural schematic diagram of cabinet in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 4 is the partial sectional view of cabinet in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 5 is the structural schematic diagram of mounting plate in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 6 is the structural schematic diagram of heat-exchange device in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 7 is the assembling figure of heat-exchange device and thermally conductive liner in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 8 is the cross-sectional view of the first heat carrier in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 9 is the assembled relation figure of the first heat carrier and locating piece in semiconductor refrigerating equipment embodiment of the present invention；
Figure 10 is the structural schematic diagram one of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；
Figure 11 is the structural schematic diagram two of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；
Figure 12 is flow principles figure of Figure 11 apoplexy in cooling fin group；
Figure 13 is the structural schematic diagram of the second heat carrier in semiconductor refrigerating equipment embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, the present embodiment semiconductor refrigerating equipment, including thermally conductive liner 100 and semiconductor refrigerating mould group,
The semiconductor refrigerating mould group includes semiconductor refrigerating module 200, heat-exchange device 300 and hot-side heat dissipation device 400, and the heat is handed over
Changing device 300 is connected to the cold end of the semiconductor refrigerating module 200, and the hot-side heat dissipation device 400 is connected to the semiconductor
The hot end of refrigeration module 200, the heat-exchange device 300 are also connect with the liner 100, wherein as shown in Fig. 6-Fig. 9, this
The heat-exchange device 300 in embodiment includes the first heat carrier 31 and the first heat pipe of Duo Gen 32, first heat carrier 31
In be formed with cavity (not shown), first heat pipe 32 sealing is inserted in first heat carrier 31 and connects with the cavity
It is logical, the refrigerant that gas-liquid two-phase coexists is provided in cavity and first heat pipe 32；First heat carrier 31 is attached to described
The cold end of semiconductor refrigerating module 200, first heat pipe 32 are attached on the liner 100, and the first heat pipe 32 is led by first
Hot body 31 is realized to be thermally connected with the cold end of semiconductor refrigerating module 200.
Specifically, the cooling capacity that the cold end of semiconductor refrigerating module 200 generates passes to first by the first heat carrier 31
Heat pipe 32, and cooling capacity can be quickly distributed on thermally conductive liner 100 by the first heat pipe 32, thermally conductive liner 100 can directly by
Cooling capacity is discharged into its internal storage space formed and freezes, and effectively raises refrigerating efficiency, avoids semiconductor refrigerating
The cooling capacity that the cold end of module 200 generates carries out cold scattering using cooling fin and the low phenomenon of refrigerating efficiency occurs.Wherein, first is thermally conductive
Multiple jacks 311 are offered on body 31, the sealing of the first heat pipe 32 is inserted in the jack 311, the two neighboring jack
The first through hole 312 is provided between 311, the end that first heat pipe 32 is inserted in the jack 311 offers second and passes through
Through-hole (not shown), first through hole and second through hole, which are interconnected, forms channel, and the channel is the chamber
Body.During 300 actual assembled of heat-exchange device, the first heat pipe 32 is inserted into jack 311, by rationally designing jack
The position of second through hole in 311 depth and the first heat pipe 32, so that the first through hole 312 is connected to shape with the second through hole
At channel, alternatively, being first provided with jack 311 on the first heat carrier 31 during actual assembled, it is inserted by the first heat pipe 32
After into jack 311, the perforation of perforation the first heat carrier 31 and the first heat pipe 32 is offered from the side wall of the first heat carrier 31
Then hole, then will be used in heat pipe gas-liquid phase transition refrigerant filling to the first heat pipe to form cavity in the first heat carrier 31
32 and cavity in so that the first heat pipe 32 have heat pipe speed heat performance.And it can be fast for the ease of the refrigerant after liquefaction
Entering in the first heat pipe 32 for speed is freezed, and the lower end of first heat carrier 31 offers the jack 311.Its
In, switchable filler 313 is additionally provided on first heat carrier 31, the filler 313 is connected to the cavity, is led to
Crossing filler 313 easily can be perfused refrigerant into the first heat pipe 32, and in actual use, in order to avoid for some reason
Barrier is so that semiconductor refrigerating module 200 is not normally functioning and leads to the excessive generation bombing of pressure in the first heat pipe 32, and first
Safe pressure valve 314 is additionally provided on heat carrier 31, the safe pressure valve 314 is connected to the cavity, when the first heat pipe 32
In pressure be more than setting value after, safe pressure valve 314 releases stress opening, to ensure using safe.For the system of perfusion
Cryogen, refrigerant can often be used for refrigerator refrigeration system by needing to be perfused refrigerant working medium in the first heat pipe 32, as R134a,
The selection of R600a, CO2 etc., specific refrigerant working medium can be wanted according to versatility requirement, system pressure requirements, cooling capacity transmitting
It asks, working medium physical property, the combined factors such as environmental protection determine.Preferably, in order to reduce the quantity of the first heat pipe 32, meanwhile, meet cold scattering
Uniform to require, heat-exchange device 300 includes two first heat pipes 32, opens up that there are four institutes on first heat carrier 31
Jack 311 is stated, the both ends of first heat pipe 32 are inserted in the corresponding jack 311；Wherein one first heat pipe 32 is curved
Song is distributed in the both sides of the thermally conductive liner 100, and another bending of first heat pipe 32 is distributed in the thermally conductive liner 100
Back.Specifically, the both ends of the first heat pipe 32 are inserted in jack 311, so that the first heat pipe 32 realizes dissipating for two heat pipes
Cold energy power, and wherein the bending of one first heat pipe 32 is distributed in the both sides of thermally conductive liner 100, another bending of first heat pipe 32 distribution
At the back of thermally conductive liner 100, during passing through the first 32 cold scattering of heat pipe, it is bent the first heat pipe 32 and thermally conductive liner of distribution
100 contact area is bigger, so that the acquisition cooling capacity that thermally conductive liner 100 can be more uniform, meanwhile, thermally conductive liner 100
Both sides and back be distributed with the first heat pipe 31 carry out cold scattering so that thermally conductive liner 100 formed encircling type cold scattering surface,
So that it is guaranteed that internal storage space refrigeration is uniform.And in order to enable the first heat pipe 31 can quickly prolong cooling capacity from its end
Transmitting is stretched, bending extends the first heat pipe 32 inclined downward respectively from its both ends, specifically, the refrigerant in the first heat pipe 32
It is gasificated into gas when heated being liquefied as liquid after being cooled, passes through the first heat pipe 32 using bending inclined downward
Mode extends, and during the first 32 cold scattering of heat pipe, liquefied refrigerant can flow downward under the effect of gravity, and gasify
Refrigerant can be risen to along inclined first heat pipe 32 first heat carrier 31 formation cavity in freeze, wherein
First heat pipe 32 will form straight pipe and bend loss after bending extends, for the tilt angle of the straight pipe of the first heat pipe 32
Are as follows: the pipeline diameter (hereinafter referred to as caliber) in millimeters of the first heat pipe 32 is configured to be greater than or equal to the first heat pipe
1.2-1.3 times of 32 inclination angle theta relative to horizontal direction as unit of spending, in actual production, each first heat pipe 32
Straight pipe to be with respect to the horizontal plane in 10 ° to 70 ° of angle tilt setting to guarantee liquid refrigerant in it by gravity
It flows freely, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for single first heat pipe 32, the both ends of the first heat pipe 32
Portion tilts down bending in symmetric mode and extends.
Wherein, the present embodiment semiconductor refrigerating equipment may include multiple thermally conductive liners 100, and each thermally conductive liner 100 is right
There should be a semiconductor refrigerating mould group, semiconductor refrigerating mould group is by the storage space in the corresponding thermally conductive liner 100 of refrigeration, and semiconductor
The cooling capacity that the cold end of semiconductor refrigerating module 200 generates in refrigeration module is transmitted to thermally conductive liner 100 by heat-exchange device 300
On, rapidly cooling capacity will be discharged into the storage space formed in it by thermally conductive liner 100 and freezed, and semiconductor refrigerating
The heat that the hot end of module 200 generates is radiated by hot-side heat dissipation device 400.And due to the multiple thermally conductive interval of liner 100 settings, together
When, each thermally conductive liner 100 carries out independent refrigeration by corresponding semiconductor refrigerating module 200, in actual use, can
Difference is required according to the article refrigeration stored in different thermally conductive liners 100, corresponding semiconductor refrigerating module 200 is controlled and discharges
The cooling capacity of adaptive capacity realizes multi-temperature zone refrigeration.
In addition, thermal insulating connectors 102 are provided between the two neighboring thermally conductive liner 100, it is two neighboring described thermally conductive
Liner 100 is linked together by the thermal insulating connectors 102.Specifically, as shown in Figure 3-Figure 5,102 1 side of thermal insulating connectors
Face, which can play, links together two adjacent thermally conductive liners 100, on the other hand can also be subtracted by thermal insulating connectors 102
Heat transfer occurs less or between the two neighboring thermally conductive liner 100 of blocking, so that each thermally conductive liner 100 is formed by warm area
It is more independent.Thermal insulating connectors 102 can use various ways, such as: the thermal insulating connectors 102 are provided with backwards to arrangement
Slot 1021, the thermally conductive liner 100 is inserted in the slot 1021, when assembling two thermally conductive liners 100, will it is thermally conductive in
The edge of gallbladder 100 is inserted into slot 1021, realizes that two thermally conductive liners 100 link together, and thermally conductive liner 100 is inserted in institute
It can be fastened using modes such as gluing, screw fixations after stating in slot 1021, it is preferred that the thermally conductive liner 100 is installed on slotting
In slot 1021, specifically, the end that the thermally conductive liner 100 is inserted in the slot 1021 is provided with barb structure 1001, it is described
The side wall of slot 1021 is provided with the fixture block 1022 with the barb structure 1001 cooperation, and the barb structure 1001 is stuck in described
On fixture block 1022.In addition, horizontal arrangement can be used between multiple thermally conductive liners 100 in the present embodiment, it is preferred that Duo Gesuo
Thermally conductive liner 100 is stated from top to bottom to be stacked, and semiconductor refrigerating module 200 is respectively positioned on the thermally conductive liner of topmost
On 100.Specifically, semiconductor refrigerating module 200 is uniformly mounted on the thermally conductive liner 100 of topmost, and in order to facilitate the installation of
Equal semiconductor refrigerating module 200,100 are provided with mounting plate 103, the semiconductor system on the thermally conductive liner of topmost
Cold module 200 is fixed on the mounting plate 103.Mounting plate 103 can be supported using heat-barrier material, to avoid thermally conductive liner
100 by occurring heat transmitting between mounting plate 103 and semiconductor refrigerating module 200, and be also provided with and add in mounting plate 103
Strong plate 1031, enhances the structural strength of mounting plate 103 by stiffening plate 1031.
And during needing semiconductor refrigerating module 200 being installed to thermally conductive liner 100, on thermally conductive liner 100
Mounting plate 103 is formed with card slot 1032 again, and the first heat carrier 31 is inserted in slot 1032, and semiconductor refrigerating module 200 and
Heat-conducting silicone grease is set between one heat carrier 31 and is installed on mounting plate 103 by the first heat carrier 31.Preferably, semiconductor system
The periphery of cold module 200 is cased with sealing ring 201, and auxiliary mounting deck 202, auxiliary mounting deck are further fixedly arranged on mounting plate 103
Installing port 2021 is provided on 202, sealing ring 201 is located in installing port 2021, passes through sealing ring 201 and auxiliary mounting deck 202
Stronger semiconductor refrigerating module 200 can be subjected to installation fixation, meanwhile, sealing ring 201 again can be by semiconductor system
The peripheral sealing of cold module 200 avoids cooling capacity from scattering and disappearing from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32
It is positioned, first heat pipe, 32 stress when carrying out foaming processing before to thermally conductive liner 100 and shell 101 is avoided to shift, the
The bending place of one heat pipe 32 is provided with locating piece 104, and the locating piece 104 is fixed on the thermally conductive liner 100.First heat pipe
32 bending place is positioned by locating piece 104, and locating piece 104 is able to maintain the bending state of the first heat pipe 32, so that
In foaming process and routine use, the bending state of the first heat pipe 32 is remained unchanged, while avoiding the occurrence of the shifting of the first heat pipe 32
Position.Wherein, locating piece 104 includes locating piece 1041 and connecting column 1042, and the locating piece 1041 is connected to the connecting column
On 1042, the connecting column 1042 is fixed on the thermally conductive liner 100, and first heat pipe 32 is wound on the connecting column 1042
It goes up and is located between the locating piece 1041 and the thermally conductive liner 100, in an assembling process, the first heat pipe 32 is wound on connecting column
1042 bendings, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and the thermally conductive liner 100, for locating piece
Connection between 104 and thermally conductive liner 100, riveting has riveting nut 105 on thermally conductive liner 100, and the locating piece 104 offers logical
Hole 1043, the riveting nut 105 are located in the through-hole 1043, and screw 106 is inserted in the through-hole 1043 and is threaded in institute
It states in riveting nut 105.
In actual use, hot-side heat dissipation device 400 can be using the side of the direct wind-cooling heat dissipating of fan in the prior art
Formula, it is preferred that as shown in figs. 2 and 10, the hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, more second
Heat pipe 42 and cooling fin group 43, second heat pipe 42 are connected on second heat carrier 41, and the cooling fin group 43 connects
On second heat pipe 42.Specifically, the second heat carrier 41 is attached to the hot end of semiconductor refrigerating module 200, and cooling fin group
43 are attached on shell 101, and the heat that the hot end of semiconductor refrigerating module 200 generates passes to the second heat by the second heat carrier 41
Pipe 42, the second heat pipe 42 can quickly transfer heat in cooling fin group 43, and cooling fin group 43 can be made as needed
At the radiator of larger area, heat that cooling fin group 43 can transmit the second heat pipe 42 using itself biggish heat dissipation area
Rapid cooling is carried out, without directly radiating to the hot end of semiconductor refrigeration module 200 by fan.Wherein, in order to
It is adequately radiated using each cooling fin group 43, third heat pipe 44, any heat is also connected on the second heat carrier 41
The third heat pipe 44 in the radiator 400 of end is also connect with the cooling fin group 43 in hot-side heat dissipation device 400 described in remaining.
In actual use, when the heat that the work of each semiconductor refrigerating module 200 generates is identical, each semiconductor refrigerating mould
Block 200 is radiated by respective cooling fin group 43, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is larger,
The second heat carrier 41 for being connected to 200 heat of semiconductor refrigerating module transfers heat to other by third heat pipe 44 and partly leads
In the corresponding cooling fin group 43 of body refrigeration module 200, so as to more efficiently be radiated using whole cooling fin groups 43；
In the design process, each second heat carrier 41 can be thermally connected by third heat pipe 44 and remaining cooling fin group 43,
For the heat-sinking capability of whole cooling fin groups 43, to realize natural cooling.And in order to enhance the draught capacity of cooling fin group 43,
Cooling fin group 43 includes multi-disc radiating fin 431, is provided with ventilation hole 432 on the radiating fin 431, is located on same axis
Multiple ventilation holes 432 form air ducts, cooling fin group 43 using the interval between radiating fin 431 in addition to being aerated
Outside, it also forms air duct using ventilation hole 432 to be aerated, so as to effectively enhance the draught capacity of cooling fin group 43.And
It runs when each semiconductor refrigerating module 200 is under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 and dissipates
Backing group 43 is arranged side by side and is located at the side in air duct, the direction outlet air that fan 45 extends towards air duct, the wind that fan 45 is blown out
It enters in air duct and accelerates the flowing of air duct apoplexy, and since hot-air is gentlier easy to flow upward, it is worn in ventilation hole 432
The wind of stream will be so that hot-air vortex flow between two radiating fins 431, utilizes the face of radiating fin 431 to the greatest extent
Product radiates.As shown in Figure 10-Figure 12, in order to more fully be radiated using radiating fin 431, in addition to being located at outside
Outside radiating fin 431, remaining radiating fin 431 opens up jagged 433, and the notch 433 on sustained height position forms auxiliary
Air duct is helped, cover 46 is additionally provided in cooling fin group 43, the fan 45 is also located at the inside in auxiliary air duct and is fixed on cover
On 46, cover 46 is covered in cooling fin group 43, and the lower end of cover 46 forms air inlet, and the upper end of cover 46 is formed out
Air port, fan 45 are dried after starting into auxiliary air duct, and the air flowing between radiating fin 431 is accelerated, and hot-air rises
It is exported from air outlet, so that extraneous cold air enters between radiating fin 431 from the air inlet of bottom, enables cold wind
From bottom to up in motion process, by the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；
And it is also provided with ventilation opening 461 for installing the position of fan 45 on cover 46, fan 45 passes through ventilation opening 461 for extraneous wind
Further it is introduced into radiating fin 431.Wherein, the two sides of each second heat carrier 41 are respectively arranged with cooling fin group 43,
And fan 45 is located between two cooling fin groups 43 simultaneously.And connect for the ease of heat pipe with the second heat carrier 41, such as Figure 13 institute
Show, multiple mounting holes 410 are formed on the second heat carrier 41, and second heat pipe 42 and the third heat pipe 44 are inserted in corresponding
In the mounting hole 410, heat pipe is inserted in the contact area being capable of increasing between the second heat carrier 41 in mounting hole 410, improves
Heat conduction efficiency；And the second heat carrier 41 includes that reeded briquetting 411 is arranged in two surfaces, two briquettings 411 are fixed
It links together, corresponding two grooves form the mounting hole 410, form the second heat carrier using two briquettings 411
41, it can be convenient for the assembly and connection between heat pipe and the second heat carrier 41.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (4)
1. a kind of semiconductor refrigerating equipment, including thermally conductive liner and semiconductor refrigerating module, the heat of the semiconductor refrigerating module
End is provided with radiator, which is characterized in that further includes heat-exchange device, the heat-exchange device includes heat carrier and Duo Gen heat
It manages, is formed with cavity in the heat carrier, the heat pipe seals respectively to be inserted in the heat carrier and be connected to the cavity, institute
It states and is provided with the refrigerant that gas-liquid two-phase coexists in cavity and the heat pipe；The heat pipe is attached on the thermally conductive liner, described
Heat carrier is attached to the cold end of the semiconductor refrigerating module, and the both ends of the heat pipe are inserted in the heat carrier, the heat
From its both ends, bending extends pipe inclined downward respectively, and the bending place of the heat pipe is provided with locating piece, and the locating piece is solid
It being scheduled on the thermally conductive liner, the locating piece includes locating piece and connecting column, and the locating piece is connected on the connecting column,
The connecting column is fixed on the thermally conductive liner, and the heat pipe is wound on the connecting column and is located at the locating piece and described
Between thermally conductive liner；In an assembling process, the heat pipe is wound on the connecting column bending, and the bending place of the heat pipe is clipped in institute
It states between locating piece and the thermally conductive liner；During the heat pipe cold scattering, liquefied refrigerant under the effect of gravity along
The inclined heat pipe flows downward, and the refrigerant to gasify can rise to the thermally conductive bodily form along the inclined heat pipe
At cavity in freeze.
2. semiconductor refrigerating equipment according to claim 1, which is characterized in that the pipe in millimeters of the heat pipe
Road diameter is configured to 1.2-1.3 times of the inclination angle theta relative to horizontal direction as unit of spending equal to the heat pipe.
3. semiconductor refrigerating equipment according to claim 1, which is characterized in that be additionally provided on the heat carrier switchable
Filler, the filler is connected to the cavity.
4. semiconductor refrigerating equipment according to claim 1, which is characterized in that be additionally provided with safe pressure on the heat carrier
Power valve, the safe pressure valve are connected to the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711537.9A CN105716456B (en) | 2014-12-01 | 2014-12-01 | Heat-exchange device and semiconductor refrigerating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711537.9A CN105716456B (en) | 2014-12-01 | 2014-12-01 | Heat-exchange device and semiconductor refrigerating equipment |
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| CN105716456A CN105716456A (en) | 2016-06-29 |
| CN105716456B true CN105716456B (en) | 2018-12-18 |
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| CN204373477U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Heat-exchange device and semiconductor refrigerating equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100344918C (en) * | 2005-05-26 | 2007-10-24 | 王双玲 | Dedicated evaporation cavity of semiconductor electronic refrigerator, and preparation method |
| US8893513B2 (en) * | 2012-05-07 | 2014-11-25 | Phononic Device, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2129909Y (en) * | 1992-01-31 | 1993-04-14 | 哈尔滨工业大学 | Hot tube semiconductor thermal electric refrigerator |
| JPH08145522A (en) * | 1994-11-16 | 1996-06-07 | Fuji Electric Co Ltd | Electronic freezing refrigerator |
| CN2366800Y (en) * | 1999-01-20 | 2000-03-01 | 河北节能投资有限责任公司 | Temp. different electric refrigerator using circulation flow type heat pipe conducting radiator |
| CN101387478A (en) * | 2008-11-03 | 2009-03-18 | 吴鸿平 | Four-element heat radiator |
| CN101907369A (en) * | 2010-08-17 | 2010-12-08 | 陈创新 | Portable heat pipe semiconductor refrigeration device |
| CN204373477U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Heat-exchange device and semiconductor refrigerating equipment |
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| Publication number | Publication date |
|---|---|
| CN105716456A (en) | 2016-06-29 |
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