CN204373311U - Semiconductor wine cabinet - Google Patents

Abstract

The utility model provides a kind of semiconductor wine cabinet, two the heat conduction inner bags be spaced comprising shell and arrange in the housing, wine frame is provided with in described heat conduction inner bag, each described heat conduction inner bag is provided with semiconductor refrigeration module, described semiconductor refrigerating module comprises semiconductor refrigerating module, cold junction radiator and hot-side heat dissipation device, described cold junction radiator is connected to the cold junction of described semiconductor refrigerating module, described hot-side heat dissipation device is connected to the hot junction of described semiconductor refrigerating module, and described cold junction radiator is also connected with described heat conduction inner bag.The refrigerating capacity controlling semiconductor refrigerating module as required, to realize many warm areas refrigeration, meets the refrigeration requirement of different drinks.

Description

Semiconductor wine cabinet

Technical field

The utility model relates to refrigerating plant, particularly relates to a kind of semiconductor wine cabinet.

Background technology

At present, wine cabinet is electrical equipment conventional in people's daily life, and usually have refrigeration system in wine cabinet, generally refrigeration system is made up of compressor, condenser and evaporimeter, can realize the refrigeration compared with low temperature.But along with the development of semiconductor refrigerating technology, the wine cabinet adopting semiconductor refrigerating module to carry out freezing also is widely used.Semiconductor wine cabinet of the prior art is freezed to the wine on wine frame in cabinet by the cold junction released cold quantity of semiconductor refrigerating module.But in actual use, the cryogenic temperature of semiconductor wine cabinet is single, many warm areas refrigeration can not be realized, the refrigeration requirement of different drinks cannot be met.How to design a kind of can realize many warm areas refrigeration with the refrigeration of satisfied different drinks require semiconductor wine cabinet be technical problem to be solved in the utility model.

Utility model content

Technical problem to be solved in the utility model is: provide a kind of semiconductor wine cabinet, realizes many warm areas refrigeration with the refrigeration requirement of satisfied different drinks.

The technical scheme that the utility model provides is, a kind of semiconductor wine cabinet, two the heat conduction inner bags be spaced comprising shell and arrange in the housing, wine frame is provided with in described heat conduction inner bag, each described heat conduction inner bag is provided with semiconductor refrigeration module, described semiconductor refrigerating module comprises semiconductor refrigerating module, cold junction radiator and hot-side heat dissipation device, described cold junction radiator is connected to the cold junction of described semiconductor refrigerating module, described hot-side heat dissipation device is connected to the hot junction of described semiconductor refrigerating module, described cold junction radiator is also connected with described heat conduction inner bag.

The semiconductor wine cabinet that the utility model provides, by adopting multiple spaced heat conduction inner bag, and corresponding semiconductor refrigerating module is independently set for each heat conduction inner bag, in the semiconductor refrigerating module course of work, semiconductor refrigerating module is by heat conduction inner bag released cold quantity corresponding with it, and cold is directly dispersed into the storage space of its inside by heat conduction inner bag, due to mutually isolated between heat conduction inner bag, the storage space that different heat conduction inner bag is formed can form independently warm area scope, thus the refrigerating capacity that can control semiconductor refrigerating module is as required freezed to realize many warm areas, meet the refrigeration requirement of different drinks.Meanwhile, because the cold junction radiator of semiconductor refrigerating module is directly freezed to the storage space that heat conduction inner bag is formed by heat conduction inner bag, refrigerating efficiency is better, improves the refrigeration performance of semiconductor wine cabinet.

Accompanying drawing explanation

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

Fig. 1 is the structural representation of the utility model semiconductor wine cabinet embodiment;

Fig. 2 is the explosive view of the utility model semiconductor wine cabinet embodiment;

Fig. 3 is the structural representation of casing in the utility model semiconductor wine cabinet embodiment;

Fig. 4 is the partial sectional view of casing in the utility model semiconductor wine cabinet embodiment;

Fig. 5 is the structural representation of installing plate in the utility model semiconductor wine cabinet embodiment;

Fig. 6 is the structural representation of cold junction radiator in the utility model semiconductor wine cabinet embodiment;

Fig. 7 is the assembly drawing of cold junction radiator and heat conduction inner bag in the utility model semiconductor wine cabinet embodiment;

Fig. 8 is the sectional view of the first heat carrier in the utility model semiconductor wine cabinet embodiment;

Fig. 9 is the assembled relation figure of the first heat carrier and keeper in the utility model semiconductor wine cabinet embodiment;

Figure 10 is the structural representation one of hot-side heat dissipation device in the utility model semiconductor wine cabinet embodiment;

Figure 11 is the structural representation two of hot-side heat dissipation device in the utility model semiconductor wine cabinet embodiment;

Figure 12 is the flow principles figure of Figure 11 apoplexy in groups of fins;

Figure 13 is the structural representation of the second heat carrier in the utility model semiconductor wine cabinet embodiment.

Detailed description of the invention

For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.

As Figure 1-Figure 2, the present embodiment semiconductor wine cabinet, comprise shell 101 and be arranged on two in the shell 101 heat conduction inner bags 100 be spaced, wine frame is provided with in inner bag 100, each described heat conduction inner bag 100 is provided with semiconductor refrigeration module, described semiconductor refrigerating module comprises semiconductor refrigerating module 200, cold junction radiator 300 and hot-side heat dissipation device 400, described cold junction radiator 300 is connected to the cold junction of described semiconductor refrigerating module 200, described hot-side heat dissipation device 400 is connected to the hot junction of described semiconductor refrigerating module 200, described cold junction radiator 300 is also connected with described heat conduction inner bag 100.

Specifically, the present embodiment semiconductor wine cabinet comprises two heat conduction inner bags 100, is provided with heat-insulation layer between shell 101 and heat conduction inner bag 100, and heat conduction inner bag 100 forms storage space for refrigeration or frozen goods.Wherein, each heat conduction inner bag 100 is to there being semiconductor refrigerating module, semiconductor refrigerating module is by the storage space in the refrigeration heat conduction inner bag 100 of correspondence, and the cold that in semiconductor refrigerating module, the cold junction of semiconductor refrigerating module 200 produces is delivered on heat conduction inner bag 100 by cold junction radiator 300, freezed rapidly cold being discharged in the storage space that formed in it by heat conduction inner bag 100, and the heat that the hot junction of semiconductor refrigerating module 200 produces is dispelled the heat by hot-side heat dissipation device 400.And due to the setting of multiple heat conduction inner bag 100 intervals, simultaneously, each heat conduction inner bag 100 is independently freezed by corresponding semiconductor refrigerating module 200, in actual use, can require different according to the article refrigeration stored in different heat conduction inner bag 100, control the cold that corresponding semiconductor refrigerating module 200 discharges adaptive capacity, realize many warm areas refrigeration.

Wherein, be provided with thermal insulating connectors 102 between adjacent two described heat conduction inner bags 100, adjacent two described heat conduction inner bags 100 are linked together by described thermal insulating connectors 102.Concrete, as shown in Figure 3-Figure 5, thermal insulating connectors 102 1 aspect can play and be linked together by adjacent two heat conduction inner bags 100, can also be reduced by thermal insulating connectors 102 or block between adjacent two heat conduction inner bags 100 on the other hand and heat transfer occurs, thus the warm area that each heat conduction inner bag 100 is formed be more independent.Thermal insulating connectors 102 can adopt various ways, such as: described thermal insulating connectors 102 is provided with the slot 1021 arranged dorsad, described heat conduction inner bag 100 is inserted in described slot 1021, when assembling two heat conduction inner bags 100, the edge of heat conduction inner bag 100 is inserted in slot 1021, realize two heat conduction inner bags 100 to link together, and heat conduction inner bag 100 is inserted in after in described slot 1021 and can adopts gluing, the modes such as screw is fixing are fastening, preferably, described heat conduction inner bag 100 is installed in slot 1021, concrete, the end that described heat conduction inner bag 100 is inserted in described slot 1021 is provided with barb structure 1001, the sidewall of described slot 1021 is provided with the fixture block 1022 coordinated with described barb structure 1001, described barb structure 1001 is stuck on described fixture block 1022.In addition, between the multiple heat conduction inner bags 100 in the present embodiment, can horizontal arrangement be adopted, preferably, multiple described heat conduction inner bags 100 stacked arrangement from top to bottom, and semiconductor refrigerating module 200 is all positioned on the described heat conduction inner bag 100 of topmost.Concrete, semiconductor refrigerating module 200 is unified to be arranged on the heat conduction inner bag 100 of topmost, and equal semiconductor refrigerating module 200 is conveniently installed, on the described heat conduction inner bag being positioned at topmost, 100 are provided with installing plate 103, and described semiconductor refrigerating module 200 is fixed on described installing plate 103.Installing plate 103 can adopt heat-barrier material to support, to avoid heat conduction inner bag 100 by there is heat trnasfer between installing plate 103 and semiconductor refrigerating module 200, and stiffener 1031 in installing plate 103, can also be provided with, the structural strength of installing plate 103 is strengthened by stiffener 1031.

In actual use, the equipment of existing employing semiconductor refrigerating adopts fin to carry out forced convertion usually, with by cold by being dispersed in storage space, and in order to make, the heat of semiconductor refrigerating module 200 cold junction is more effective to freeze to storage space, and guarantee being evenly distributed of cold, as shown in Fig. 6-Fig. 9, described cold junction radiator 300 in the present embodiment comprises the first heat carrier 31 and Duo Gen first heat pipe 32, cavity (not shown) is formed in described first heat carrier 31, described first heat pipe 32 seals and is inserted in described first heat carrier 31 and is communicated with described cavity, described first heat carrier 31 is attached to the cold junction of described semiconductor refrigerating module 200, and described first heat pipe 32 is attached on described heat conduction inner bag 100, and the first heat pipe 32 realizes with the cold junction of semiconductor refrigerating module 200 thermally coupled by the first heat carrier 31.Concrete, the cold that the cold junction of semiconductor refrigerating module 200 produces passes to the first heat pipe 32 by the first heat carrier 31, and cold can be distributed on heat conduction inner bag 100 by the first heat pipe 32 fast, cold directly can be discharged into its inner storage space formed and freeze by heat conduction inner bag 100, effectively raise refrigerating efficiency, the cold that the cold junction avoiding semiconductor refrigerating module 200 produces adopts fin carry out cold scattering and occur the phenomenon that refrigerating efficiency is low.Wherein, first heat carrier 31 offers multiple jack 311, described first heat pipe 32 sealing is inserted in described jack 311, the first through hole 312 is provided with between adjacent two described jacks 311, described first heat pipe 32 end opens be inserted in described jack 311 has the second through hole (not shown), described first through hole and described second through hole are interconnected formation passage, and described passage is described cavity.In cold junction radiator 300 actual assembled process, first heat pipe 32 is inserted in jack 311, by the position of the second through hole in the degree of depth of appropriate design jack 311 and the first heat pipe 32, first through hole 312 is communicated with the second through hole and forms passage, or, in actual assembled process, first heat carrier 31 is first provided with jack 311, first heat pipe 32 is being inserted into after in jack 311, the through hole of through first heat carrier 31 and the first heat pipe 32 is offered from the sidewall of the first heat carrier 31, to form cavity in the first heat carrier 31, then, gas-liquid phase transition refrigerant filling will to be used in heat pipe again in the first heat pipe 32 and cavity, the first heat pipe 32 is made to have the performance of heat pipe speed heat.And the first heat pipe 32 can be entered into fast for the ease of the cold-producing medium of post liquefaction and freeze, the bottom of described first heat carrier 31 offers described jack 311.Wherein, described first heat carrier 31 is also provided with can the filler 313 of switch, described filler 313 is communicated with described cavity, cold-producing medium can be poured into easily in the first heat pipe 32 by filler 313, and in actual use, normally can not run in order to avoid making semiconductor refrigerating module 200 because of fault and cause the excessive generation bombing of the pressure in the first heat pipe 32, first heat carrier 31 is also provided with safe pressure valve 314, described safe pressure valve 314 is communicated with described cavity, after the pressure in the first heat pipe 32 exceedes setting value, safe pressure valve 314 will open release pressure, to guarantee use safety.For the cold-producing medium of perfusion, need perfusion cold-producing medium working medium can commonly use cold-producing medium for refrigerator refrigeration system in first heat pipe 32, as R134a, R600a, CO2 etc., choosing of concrete cold-producing medium working medium can be determined according to combined factors such as versatility requirement, system pressure requirements, cold delivery request, working medium physical property, environmental protection.Preferably, in order to reduce the quantity of the first heat pipe 32, simultaneously, meet the uniform requirement of cold scattering, cold junction radiator 300 comprises two described first heat pipes 32, described first heat carrier 31 offers four described jacks 311, the both ends of described first heat pipe 32 are all inserted in corresponding described jack 311; The wherein one first bending both sides being distributed in described heat conduction inner bag 100 of heat pipe 32, the first bending back being distributed in described heat conduction inner bag 100 of heat pipe 32 described in another.Concrete, the both ends of the first heat pipe 32 are all inserted in jack 311, the first heat pipe 32 is made to realize the cold scattering ability of two heat pipes, and wherein one first heat pipe 32 bends the both sides being distributed in heat conduction inner bag 100, another bending back being distributed in heat conduction inner bag 100 of the first heat pipe 32, in the first heat pipe 32 cold scattering process of passing through, first heat pipe 32 of bending distribution is larger with the contact area of heat conduction inner bag 100, thus make heat conduction inner bag 100 can obtain cold more uniformly, simultaneously, the both sides of heat conduction inner bag 100 and back are distributed with the first heat pipe 31 and carry out cold scattering, heat conduction inner bag 100 is made to form the cold scattering surface of encircling type, thus guarantee inner storage space refrigeration evenly.And transmit to make the first heat pipe 31 to be extended from its end by cold fast, first heat pipe 32 bends extension respectively inclined downward from its both ends, concrete, cold-producing medium in first heat pipe 32 is liquefied as liquid after catching a cold, and gas is gasificated into when being heated, by adopting the mode bent inclined downward to extend the first heat pipe 32, and in the first heat pipe 32 cold scattering process, the cold-producing medium of liquefaction can flow downward under gravity, and gasification cold-producing medium can along tilt the first heat pipe 32 rise to first heat carrier 31 formed cavity in freeze, wherein, first heat pipe 32 will form straight length and bend loss after bending extension, angle of inclination for the straight length of the first heat pipe 32 is: the pipeline diameter (hereinafter referred to as caliber) in units of millimeter of the first heat pipe 32 is configured to the 1.2-1.3 of the inclination angle theta relative to horizontal direction in units of degree being more than or equal to the first heat pipe 32 doubly, in actual production, the straight length of each first heat pipe 32 is arranged with the angular slope with respect to the horizontal plane in 10 ° to 70 ° to ensure that liquid refrigerant relies on free gravity to flow within it, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for the both ends symmetrically downward-sloping bending extension of mode of single first heat pipe 32, first heat pipe 32.

And needing semiconductor refrigerating module 200 to be installed in the process of heat conduction inner bag 100, installing plate 103 on heat conduction inner bag 100 is formed with again draw-in groove 1032, first heat carrier 31 is inserted in slot 1032, and arranges heat-conducting silicone grease between semiconductor refrigerating module 200 and the first heat carrier 31 and be installed on installing plate 103 by the first heat carrier 31.Preferably, the peripheral sleeve of semiconductor refrigerating module 200 has sealing ring 201, installing plate 103 is also fixedly installed auxiliary mounting deck 202, auxiliary mounting deck 202 is provided with installing port 2021, sealing ring 201 is arranged in installing port 2021, more firmly semiconductor refrigerating module 200 can be carried out installation by sealing ring 201 and auxiliary mounting deck 202 to fix, simultaneously, sealing ring 201 can, by the peripheral sealing of semiconductor refrigerating module 200, avoid cold to scatter and disappear from the periphery of semiconductor refrigerating module 200 again.And in order to position the first heat pipe 32, avoid carrying out the first heat pipe 32 stressed displacement when foaming processes before to heat conduction inner bag 100 and shell 101, the bending place of the first heat pipe 32 is provided with keeper 104, and described keeper 104 is fixed on described heat conduction inner bag 100.The bending place of the first heat pipe 32 is positioned by keeper 104, keeper 104 can keep the bending state of the first heat pipe 32, make in foaming process and routine use, the case of bending of the first heat pipe 32 remains unchanged, and avoids appearance first heat pipe 32 to be shifted simultaneously.Wherein, keeper 104 comprises locating piece 1041 and joint pin 1042, described locating piece 1041 is connected on described joint pin 1042, described joint pin 1042 is fixed on described heat conduction inner bag 100, described first heat pipe 32 is on described joint pin 1042 and between described locating piece 1041 and described heat conduction inner bag 100, in an assembling process, first heat pipe 32 bends around joint pin 1042, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and described heat conduction inner bag 100, for the connection between keeper 104 and heat conduction inner bag 100, on heat conduction inner bag 100, riveted joint has riveting nut 105, described keeper 104 offers through hole 1043, described riveting nut 105 is arranged in described through hole 1043, screw 106 is inserted in described through hole 1043 and is threaded in described riveting nut 105.

In actual use, the equipment of existing employing semiconductor refrigerating adopts fan to carry out wind-cooling heat dissipating to the hot junction of semiconductor refrigeration module 200 usually, operating noise is comparatively serious always to need to consume a large amount of electric energy and fan, as shown in figs. 2 and 10, hot-side heat dissipation device 400 in the present embodiment comprises the second heat carrier 41, many second heat pipes 42 and groups of fins 43, described second heat pipe 42 is connected on described second heat carrier 41, and described groups of fins 43 is connected on described second heat pipe 42.Concrete, second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, the heat that the hot junction of semiconductor refrigerating module 200 produces passes to the second heat pipe 42 by the second heat carrier 41, second heat pipe 42 can transfer heat in groups of fins 43 fast, and groups of fins 43 can make the radiator of larger area as required, groups of fins 43 can utilize self larger area of dissipation to carry out quick heat radiating to the heat that the second heat pipe 42 transmits, thus without the need to directly being dispelled the heat to the hot junction of semiconductor refrigeration module 200 by fan.Wherein, dispel the heat to utilize each groups of fins 43 fully, second heat carrier 41 is also connected with the 3rd heat pipe 44, described 3rd heat pipe 44 in arbitrary described hot-side heat dissipation device 400 is also connected with the described groups of fins 43 in hot-side heat dissipation device 400 described in all the other.In actual use, when the heat that the work of each semiconductor refrigerating module 200 produces is identical, each semiconductor refrigerating module 200 is dispelled the heat by respective groups of fins 43, and when the heat dissipation capacity of some semiconductor refrigerating modules 200 is larger, heat is delivered in the groups of fins 43 of other semiconductor refrigerating module 200 correspondences by the 3rd heat pipe 44 by the second heat carrier 41 being connected to this semiconductor refrigerating module 200 heat, thus whole groups of fins 43 can be utilized to dispel the heat more efficiently; In the design process, each second heat carrier 41 can carry out thermally coupled with remaining groups of fins 43 by the 3rd heat pipe 44, for the heat-sinking capability of whole groups of fins 43, thus realizes nature cooling.And in order to strengthen the draught capacity of groups of fins 43, groups of fins 43 comprises multi-disc radiating fin 431, described radiating fin 431 is provided with air vent 432, the multiple described air vent 432 be positioned on same axis forms air channel, groups of fins 43 is except utilizing the interval between radiating fin 431 and ventilating, also utilize air vent 432 to form air channel to ventilate, thus effectively can strengthen the draught capacity of groups of fins 43.And run under each semiconductor refrigerating module 200 is in relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 and groups of fins 43 are arranged side by side and are positioned at the side in air channel, the direction air-out that fan 45 extends towards air channel, the wind that fan 45 blows out enters into air channel to accelerate the flowing of air channel apoplexy, and comparatively gently easily flow upward due to hot-air, in air vent 432, the wind of percolation will make hot-air vortex flow between two radiating fins 431, farthest utilize the area of radiating fin 431 to dispel the heat.As shown in Figure 10-Figure 12, dispel the heat to utilize radiating fin 431 more fully, except being positioned at the radiating fin 431 in outside, all the other radiating fins 431 offer breach 433, the breach 433 be positioned on sustained height position forms auxiliary air channel, groups of fins 43 is also provided with cover body 46, described fan 45 is also positioned at the inner side in auxiliary air channel and is fixed on cover body 46, cover body 46 hides in groups of fins 43, the bottom of cover body 46 forms air inlet, and the upper end of cover body 46 forms air outlet, fan 45 starts in backward auxiliary air channel dries, accelerate the air flowing between radiating fin 431, and hot-air rising exports from air outlet, extraneous cold air is made to enter between radiating fin 431 from the air inlet of bottom, make cold wind can from bottom to up in motion process, through the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431, and cover body 46 also offers ventilating opening 461 for the position of provided with fan 45, the wind in the external world is further incorporated in radiating fin 431 by ventilating opening 461 by fan 45.Wherein, the both sides of each second heat carrier 41 are respectively arranged with groups of fins 43, and fan 45 is simultaneously between two groups of fins 43.And be connected with the second heat carrier 41 for the ease of heat pipe, as shown in figure 13, second heat carrier 41 is formed with multiple installing hole 410, described second heat pipe 42 and described 3rd heat pipe 44 are inserted in corresponding described installing hole 410, heat pipe is inserted in installing hole 410 contact area that can increase between the second heat carrier 41, improves heat conduction efficiency; And the second heat carrier 41 comprises two surfaces arranges reeded briquetting 411, two described briquettings 411 are fixed together, two corresponding described grooves form described installing hole 410, adopt two briquettings 411 to form the second heat carrier 41, the assembly and connection between heat pipe and the second heat carrier 41 can be convenient to.

Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.

Claims (27)

1. a semiconductor wine cabinet, it is characterized in that, two the heat conduction inner bags be spaced comprising shell and arrange in the housing, wine frame is provided with in described heat conduction inner bag, each described heat conduction inner bag is provided with semiconductor refrigeration module, described semiconductor refrigerating module comprises semiconductor refrigerating module, cold junction radiator and hot-side heat dissipation device, described cold junction radiator is connected to the cold junction of described semiconductor refrigerating module, described hot-side heat dissipation device is connected to the hot junction of described semiconductor refrigerating module, and described cold junction radiator is also connected with described heat conduction inner bag.

2. semiconductor wine cabinet according to claim 1, is characterized in that, is provided with thermal insulating connectors between two described heat conduction inner bags, and two described heat conduction inner bags are linked together by described thermal insulating connectors.

3. semiconductor wine cabinet according to claim 1, is characterized in that, two described heat conduction inner bag stacked on top are arranged.

4. semiconductor wine cabinet according to claim 3, is characterized in that, on all superposed described heat conduction inner bag of described semiconductor refrigerating module.

5. according to the arbitrary described semiconductor wine cabinet of claim 1-4, it is characterized in that, described cold junction radiator comprises the first heat carrier and Duo Gen first heat pipe, is formed with cavity in described first heat carrier, and described first heat pipe seals and is inserted in described first heat carrier and is communicated with described cavity; Described first heat carrier is attached to the cold junction of described semiconductor refrigerating module, and described first heat pipe is attached on described heat conduction inner bag.

6. semiconductor wine cabinet according to claim 5, it is characterized in that, described first heat carrier offers multiple jack, described first heat pipe sealing is inserted in described jack, the first through hole is provided with between adjacent two described jacks, the described first heat pipe end opens be inserted in described jack has the second through hole, and described first through hole and described second through hole are interconnected formation passage, and described passage is described cavity.

7. semiconductor wine cabinet according to claim 6, is characterized in that, the bottom of described first heat carrier offers described jack.

8. semiconductor wine cabinet according to claim 5, is characterized in that, described first heat carrier is also provided with can the filler of switch, and described filler is communicated with described cavity.

9. semiconductor wine cabinet according to claim 5, is characterized in that, described first heat carrier is also provided with safe pressure valve, and described safe pressure valve is communicated with described cavity.

10. semiconductor wine cabinet according to claim 6, is characterized in that, described cold junction radiator comprises two described first heat pipes, described first heat carrier offers four described jacks, and the both ends of described first heat pipe are all inserted in corresponding described jack; Wherein one first heat pipe bends the both sides being distributed in described heat conduction inner bag, and the first heat pipe described in another is distributed in the back of described heat conduction inner bag.

11. semiconductor wine cabinets according to claim 10, is characterized in that, described first heat pipe bends extension respectively inclined downward from its both ends.

12. semiconductor wine cabinets according to claim 11, is characterized in that, the both ends symmetrically downward-sloping bending extension of mode of described first heat pipe.

13. semiconductor wine cabinets according to claim 11, it is characterized in that, the pipeline diameter in units of millimeter of described first heat pipe is configured to the 1.2-1.3 of the inclination angle theta relative to horizontal direction in units of degree being more than or equal to described first heat pipe doubly.

14. semiconductor wine cabinets according to claim 12, it is characterized in that, the bending place of described first heat pipe is provided with keeper, described keeper is fixed on described heat conduction inner bag.

15. semiconductor wine cabinets according to claim 14, it is characterized in that, described keeper comprises locating piece and joint pin, described locating piece is connected on described joint pin, described joint pin is fixed on described heat conduction inner bag, and described first heat pipe is on described joint pin and between described locating piece and described heat conduction inner bag.

16. semiconductor wine cabinets according to claim 14, it is characterized in that, on described heat conduction inner bag, riveted joint has riveting nut, and described joint pin offers through hole, described riveting nut is arranged in described through hole, and screw is inserted in described through hole and is threaded in described riveting nut.

17. according to the arbitrary described semiconductor wine cabinet of claim 1-4, it is characterized in that, described hot-side heat dissipation device comprises the second heat carrier, many second heat pipes and groups of fins, and described second heat pipe is connected on described second heat carrier, and described groups of fins is connected on described second heat pipe.

18. semiconductor wine cabinets according to claim 17, is characterized in that, described second heat carrier are also connected with the 3rd heat pipe, and described 3rd heat pipe in hot-side heat dissipation device described in is also connected with the described groups of fins in hot-side heat dissipation device described in another.

19. semiconductor wine cabinets according to claim 17, it is characterized in that, described groups of fins comprises multi-disc radiating fin, and described radiating fin is provided with air vent, and multiple described air vent forms air channel; Described hot-side heat dissipation device is also provided with fan, and described fan and described groups of fins are arranged side by side and are positioned at the side in described air channel.

20. semiconductor wine cabinets according to claim 19, is characterized in that, described hot-side heat dissipation device comprises two groups of fins, and described fan and described second heat carrier are between two described groups of fins.

21. semiconductor wine cabinets according to claim 19, it is characterized in that, described radiating fin is vertically arranged, the outer surface of described groups of fins is also provided with cover body, and the bottom of described cover body forms air inlet, and the upper end of described cover body forms air outlet.

22. semiconductor wine cabinets according to claim 21, it is characterized in that, for single described groups of fins, except being positioned at outermost described radiating fin, radiating fin described in all the other offers breach, the described breach being positioned at sustained height forms auxiliary air channel, and described fan is also positioned at the inner side in described auxiliary air channel and is fixed on described cover body.

23. semiconductor wine cabinets according to claim 22, it is characterized in that, the position described cover body being provided with described fan also offers ventilating opening.

24. semiconductor wine cabinets according to claim 17, is characterized in that, described second heat carrier is formed with multiple installing hole, and described second heat pipe and described 3rd heat pipe are inserted in corresponding described installing hole.

25. semiconductor wine cabinets according to claim 24, is characterized in that, described second heat carrier comprises two surfaces and arranges reeded briquetting, and two described briquettings are fixed together, and two corresponding described grooves form described installing hole.

26. semiconductor wine cabinets according to claim 2, it is characterized in that, described thermal insulating connectors is provided with the slot arranged dorsad, and described heat conduction inner bag is inserted in described slot.

27. semiconductor wine cabinets according to claim 26, it is characterized in that, the end that described heat conduction inner bag is inserted in described slot is provided with barb structure, and the sidewall of described slot is provided with the fixture block coordinated with described barb structure, and described barb structure is stuck on described fixture block.