CN204373474U - Heat-exchange device and semiconductor refrigerating equipment - Google Patents

Abstract

The utility model provides a kind of heat-exchange device and semiconductor refrigerating equipment.Heat-exchange device, comprise heat carrier and two heat pipes, described heat carrier offers multiple jack, described heat pipe sealing is inserted in described jack, be provided with the first through hole between adjacent two described jacks, the described heat pipe end opens be inserted in described jack has the second through hole, and described first through hole and described second through hole are interconnected formation passage, described passage end mouth is provided with filler, and another port is provided with safe pressure valve.By heat carrier, the cold junction cold of semiconductor refrigerating module is passed to heat pipe, cold can be distributed on whole piece heat pipe by heat pipe fast, and the bulk temperature of heat pipe is even, in cold can be delivered to by heat pipe fast storage space that inner bag formed, thus guarantee that the cold of inner storage space is evenly distributed, improve the refrigeration performance of semiconductor refrigerating equipment.

Description

Heat-exchange device and semiconductor refrigerating equipment

Technical field

The utility model relates to refrigerating plant, particularly relates to a kind of heat-exchange device and semiconductor refrigerating equipment.

Background technology

At present, refrigeration plant (such as refrigerator, refrigerator, wine cabinet) is electrical equipment conventional in people's daily life, usually have refrigeration system in refrigeration plant, generally refrigeration system is made up of compressor, condenser and evaporimeter, can realize the refrigeration compared with low temperature.But along with the development of semiconductor refrigerating technology, the refrigeration plant adopting semiconductor chilling plate to carry out freezing also is widely used.Semiconductor refrigerating equipment of the prior art is freezed to the storage space in casing by the cold junction released cold quantity of semiconductor refrigerating module.But, in actual use, the cold junction of semiconductor refrigerating module usually adopt fin carry out forced convertion with by cold by being dispersed in storage space, need to be transported in the storage space of refrigeration plant by cold by fan, refrigerating efficiency is lower.How designing a kind of semiconductor refrigerating equipment that can realize transmitting fast released cold quantity, is technical problem to be solved in the utility model to improve refrigerating efficiency.

Utility model content

Technical problem to be solved in the utility model is: provide a kind of heat-exchange device and semiconductor refrigerating equipment, realizes transmitting released cold quantity fast by heat-exchange device, improves semiconductor refrigerating equipment refrigerating efficiency.

The technical scheme that the utility model provides is, a kind of heat-exchange device, comprise heat carrier and two heat pipes, described heat carrier offers multiple jack, and described heat pipe sealing is inserted in described jack, is provided with the first through hole between adjacent two described jacks, the described heat pipe end opens be inserted in described jack has the second through hole, described first through hole and described second through hole are interconnected formation passage, and described passage end mouth is provided with filler, and another port is provided with safe pressure valve.

The utility model also provides a kind of semiconductor refrigerating equipment, comprise heat conduction inner bag and semiconductor refrigerating module, the hot junction of described semiconductor refrigerating module is provided with radiator, also comprise above-mentioned heat-exchange device, the heat pipe of described heat-exchange device is attached on described heat conduction inner bag, and the heat carrier of described heat-exchange device is attached to the cold junction of described semiconductor refrigerating module.

The heat-exchange device that the utility model provides and semiconductor refrigerating equipment, by heat carrier, the cold junction cold of semiconductor refrigerating module is passed to heat pipe, cold can be distributed on whole piece heat pipe by heat pipe fast, and the bulk temperature of heat pipe is even, in cold can be delivered to by heat pipe fast storage space that inner bag formed, thus guarantee that the cold of inner storage space is evenly distributed, improve the refrigeration performance of semiconductor refrigerating equipment.Meanwhile, by being connected with safe pressure valve on passage, when hypertonia in heat pipe, safe pressure valve can releasing pressure automatically, and avoids heat pipe bombing, improves security performance.

Accompanying drawing explanation

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

Fig. 1 is the structural representation of the utility model semiconductor refrigerating equipment embodiment;

Fig. 2 is the explosive view of the utility model semiconductor refrigerating equipment embodiment;

Fig. 3 is the structural representation of casing in the utility model semiconductor refrigerating equipment embodiment;

Fig. 4 is the partial sectional view of casing in the utility model semiconductor refrigerating equipment embodiment;

Fig. 5 is the structural representation of installing plate in the utility model semiconductor refrigerating equipment embodiment;

Fig. 6 is the structural representation of heat-exchange device in the utility model semiconductor refrigerating equipment embodiment;

Fig. 7 is the assembly drawing of heat-exchange device and heat conduction inner bag in the utility model semiconductor refrigerating equipment embodiment;

Fig. 8 is the sectional view of the first heat carrier in the utility model semiconductor refrigerating equipment embodiment;

Fig. 9 is the assembled relation figure of the first heat carrier and keeper in the utility model semiconductor refrigerating equipment embodiment;

Figure 10 is the structural representation one of hot-side heat dissipation device in the utility model semiconductor refrigerating equipment embodiment;

Figure 11 is the structural representation two of hot-side heat dissipation device in the utility model semiconductor refrigerating equipment embodiment;

Figure 12 is the flow principles figure of Figure 11 apoplexy in groups of fins;

Figure 13 is the structural representation of the second heat carrier in the utility model semiconductor refrigerating equipment embodiment.

Detailed description of the invention

For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.

As Figure 1-Figure 2, the present embodiment semiconductor refrigerating equipment, comprise heat conduction inner bag 100 and semiconductor refrigerating module, described semiconductor refrigerating module comprises semiconductor refrigerating module 200, heat-exchange device 300 and hot-side heat dissipation device 400, described heat-exchange device 300 is connected to the cold junction of described semiconductor refrigerating module 200, described hot-side heat dissipation device 400 is connected to the hot junction of described semiconductor refrigerating module 200, described heat-exchange device 300 is also connected with described inner bag 100, wherein, as shown in Fig. 6-Fig. 9, described heat-exchange device 300 in the present embodiment comprises the first heat carrier 31 and two first heat pipes 32, first heat carrier 31 offers multiple jack 311, described first heat pipe 32 sealing is inserted in described jack 311, the first through hole 312 is provided with between adjacent two described jacks 311, described first heat pipe 32 end opens be inserted in described jack 311 has the second through hole (not shown), described first through hole and described second through hole are interconnected formation passage, the cold-producing medium that gas-liquid two-phase coexists is provided with in passage and described first heat pipe 32, one end of passage is connected with can the filler 313 of switch, the other end is connected with safe pressure valve 314, described first heat carrier 31 is attached to the cold junction of described semiconductor refrigerating module 200, and described first heat pipe 32 is attached on described inner bag 100, and the first heat pipe 32 realizes with the cold junction of semiconductor refrigerating module 200 thermally coupled by the first heat carrier 31.

Specifically, the cold that the cold junction of semiconductor refrigerating module 200 produces passes to the first heat pipe 32 by the first heat carrier 31, and cold can be distributed on heat conduction inner bag 100 by the first heat pipe 32 fast, cold directly can be discharged into its inner storage space formed and freeze by heat conduction inner bag 100, effectively raise refrigerating efficiency, the cold that the cold junction avoiding semiconductor refrigerating module 200 produces adopts fin carry out cold scattering and occur the phenomenon that refrigerating efficiency is low.In heat-exchange device 300 actual assembled process, first heat pipe 32 is inserted in jack 311, by the position of the second through hole in the degree of depth of appropriate design jack 311 and the first heat pipe 32, first through hole 312 is communicated with the second through hole and forms passage, or, in actual assembled process, first heat carrier 31 is first provided with jack 311, first heat pipe 32 is being inserted into after in jack 311, the through hole of through first heat carrier 31 and the first heat pipe 32 is offered from the sidewall of the first heat carrier 31, to form passage in the first heat carrier 31, then, gas-liquid phase transition refrigerant filling will to be used in heat pipe again in the first heat pipe 32 and cavity, the first heat pipe 32 is made to have the performance of heat pipe speed heat.And the first heat pipe 32 can be entered into fast for the ease of the cold-producing medium of post liquefaction and freeze, the bottom of described first heat carrier 31 offers described jack 311.Wherein, described first heat carrier 31 is also provided with can the filler 313 of switch, described filler 313 is communicated with described cavity, cold-producing medium can be poured into easily in the first heat pipe 32 by filler 313, and in actual use, normally can not run in order to avoid making semiconductor refrigerating module 200 because of fault and cause the excessive generation bombing of the pressure in the first heat pipe 32, first heat carrier 31 is also provided with safe pressure valve 314, described safe pressure valve 314 is communicated with described cavity, after the pressure in the first heat pipe 32 exceedes setting value, safe pressure valve 314 will open release pressure, to guarantee use safety.For the cold-producing medium of perfusion, need perfusion cold-producing medium working medium can commonly use cold-producing medium for refrigerator refrigeration system in first heat pipe 32, as R134a, R600a, CO2 etc., choosing of concrete cold-producing medium working medium can be determined according to combined factors such as versatility requirement, system pressure requirements, cold delivery request, working medium physical property, environmental protection.Preferably, in order to reduce the quantity of the first heat pipe 32, simultaneously, meet the uniform requirement of cold scattering, heat-exchange device 300 comprises two described first heat pipes 32, described first heat carrier 31 offers four described jacks 311, the both ends of described first heat pipe 32 are all inserted in corresponding described jack 311; The wherein one first bending both sides being distributed in described heat conduction inner bag 100 of heat pipe 32, the first bending back being distributed in described heat conduction inner bag 100 of heat pipe 32 described in another.Concrete, the both ends of the first heat pipe 32 are all inserted in jack 311, the first heat pipe 32 is made to realize the cold scattering ability of two heat pipes, and wherein one first heat pipe 32 bends the both sides being distributed in heat conduction inner bag 100, another bending back being distributed in heat conduction inner bag 100 of the first heat pipe 32, in the first heat pipe 32 cold scattering process of passing through, first heat pipe 32 of bending distribution is larger with the contact area of heat conduction inner bag 100, thus make heat conduction inner bag 100 can obtain cold more uniformly, simultaneously, the both sides of heat conduction inner bag 100 and back are distributed with the first heat pipe 31 and carry out cold scattering, heat conduction inner bag 100 is made to form the cold scattering surface of encircling type, thus guarantee inner storage space refrigeration evenly.And transmit to make the first heat pipe 31 to be extended from its end by cold fast, first heat pipe 32 bends extension respectively inclined downward from its both ends, concrete, cold-producing medium in first heat pipe 32 is liquefied as liquid after catching a cold, and gas is gasificated into when being heated, by adopting the mode bent inclined downward to extend the first heat pipe 32, and in the first heat pipe 32 cold scattering process, the cold-producing medium of liquefaction can flow downward under gravity, and gasification cold-producing medium can along tilt the first heat pipe 32 rise to first heat carrier 31 formed cavity in freeze, wherein, first heat pipe 32 will form straight length and bend loss after bending extension, angle of inclination for the straight length of the first heat pipe 32 is: the pipeline diameter (hereinafter referred to as caliber) in units of millimeter of the first heat pipe 32 is configured to the 1.2-1.3 of the inclination angle theta relative to horizontal direction in units of degree being more than or equal to the first heat pipe 32 doubly, in actual production, the straight length of each first heat pipe 32 is arranged with the angular slope with respect to the horizontal plane in 10 ° to 70 ° to ensure that liquid refrigerant relies on free gravity to flow within it, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for the both ends symmetrically downward-sloping bending extension of mode of single first heat pipe 32, first heat pipe 32.

Wherein, the present embodiment semiconductor refrigerating equipment can comprise multiple heat conduction inner bag 100, each heat conduction inner bag 100 is to there being semiconductor refrigerating module, semiconductor refrigerating module is by the storage space in the refrigeration heat conduction inner bag 100 of correspondence, and the cold that in semiconductor refrigerating module, the cold junction of semiconductor refrigerating module 200 produces is delivered on heat conduction inner bag 100 by heat-exchange device 300, freezed rapidly cold being discharged in the storage space that formed in it by heat conduction inner bag 100, and the heat that the hot junction of semiconductor refrigerating module 200 produces is dispelled the heat by hot-side heat dissipation device 400.And due to the setting of multiple heat conduction inner bag 100 intervals, simultaneously, each heat conduction inner bag 100 is independently freezed by corresponding semiconductor refrigerating module 200, in actual use, can require different according to the article refrigeration stored in different heat conduction inner bag 100, control the cold that corresponding semiconductor refrigerating module 200 discharges adaptive capacity, realize many warm areas refrigeration.

In addition, be provided with thermal insulating connectors 102 between adjacent two described heat conduction inner bags 100, adjacent two described heat conduction inner bags 100 are linked together by described thermal insulating connectors 102.Concrete, as shown in Figure 3-Figure 5, thermal insulating connectors 102 1 aspect can play and be linked together by adjacent two heat conduction inner bags 100, can also be reduced by thermal insulating connectors 102 or block between adjacent two heat conduction inner bags 100 on the other hand and heat transfer occurs, thus the warm area that each heat conduction inner bag 100 is formed be more independent.Thermal insulating connectors 102 can adopt various ways, such as: described thermal insulating connectors 102 is provided with the slot 1021 arranged dorsad, described heat conduction inner bag 100 is inserted in described slot 1021, when assembling two heat conduction inner bags 100, the edge of heat conduction inner bag 100 is inserted in slot 1021, realize two heat conduction inner bags 100 to link together, and heat conduction inner bag 100 is inserted in after in described slot 1021 and can adopts gluing, the modes such as screw is fixing are fastening, preferably, described heat conduction inner bag 100 is installed in slot 1021, concrete, the end that described heat conduction inner bag 100 is inserted in described slot 1021 is provided with barb structure 1001, the sidewall of described slot 1021 is provided with the fixture block 1022 coordinated with described barb structure 1001, described barb structure 1001 is stuck on described fixture block 1022.In addition, between the multiple heat conduction inner bags 100 in the present embodiment, can horizontal arrangement be adopted, preferably, multiple described heat conduction inner bags 100 stacked arrangement from top to bottom, and semiconductor refrigerating module 200 is all positioned on the described heat conduction inner bag 100 of topmost.Concrete, semiconductor refrigerating module 200 is unified to be arranged on the heat conduction inner bag 100 of topmost, and equal semiconductor refrigerating module 200 is conveniently installed, on the described heat conduction inner bag being positioned at topmost, 100 are provided with installing plate 103, and described semiconductor refrigerating module 200 is fixed on described installing plate 103.Installing plate 103 can adopt heat-barrier material to support, to avoid heat conduction inner bag 100 by there is heat trnasfer between installing plate 103 and semiconductor refrigerating module 200, and stiffener 1031 in installing plate 103, can also be provided with, the structural strength of installing plate 103 is strengthened by stiffener 1031.

And needing semiconductor refrigerating module 200 to be installed in the process of heat conduction inner bag 100, installing plate 103 on heat conduction inner bag 100 is formed with again draw-in groove 1032, first heat carrier 31 is inserted in slot 1032, and arranges heat-conducting silicone grease between semiconductor refrigerating module 200 and the first heat carrier 31 and be installed on installing plate 103 by the first heat carrier 31.Preferably, the peripheral sleeve of semiconductor refrigerating module 200 has sealing ring 201, installing plate 103 is also fixedly installed auxiliary mounting deck 202, auxiliary mounting deck 202 is provided with installing port 2021, sealing ring 201 is arranged in installing port 2021, more firmly semiconductor refrigerating module 200 can be carried out installation by sealing ring 201 and auxiliary mounting deck 202 to fix, simultaneously, sealing ring 201 can, by the peripheral sealing of semiconductor refrigerating module 200, avoid cold to scatter and disappear from the periphery of semiconductor refrigerating module 200 again.And in order to position the first heat pipe 32, avoid carrying out the first heat pipe 32 stressed displacement when foaming processes before to heat conduction inner bag 100 and shell 101, the bending place of the first heat pipe 32 is provided with keeper 104, and described keeper 104 is fixed on described heat conduction inner bag 100.The bending place of the first heat pipe 32 is positioned by keeper 104, keeper 104 can keep the bending state of the first heat pipe 32, make in foaming process and routine use, the case of bending of the first heat pipe 32 remains unchanged, and avoids appearance first heat pipe 32 to be shifted simultaneously.Wherein, keeper 104 comprises locating piece 1041 and joint pin 1042, described locating piece 1041 is connected on described joint pin 1042, described joint pin 1042 is fixed on described heat conduction inner bag 100, described first heat pipe 32 is on described joint pin 1042 and between described locating piece 1041 and described heat conduction inner bag 100, in an assembling process, first heat pipe 32 bends around joint pin 1042, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and described heat conduction inner bag 100, for the connection between keeper 104 and heat conduction inner bag 100, on heat conduction inner bag 100, riveted joint has riveting nut 105, described keeper 104 offers through hole 1043, described riveting nut 105 is arranged in described through hole 1043, screw 106 is inserted in described through hole 1043 and is threaded in described riveting nut 105.

In actual use, hot-side heat dissipation device 400 can adopt the mode of the direct wind-cooling heat dissipating of prior art fan, preferably, as shown in figs. 2 and 10, hot-side heat dissipation device 400 in the present embodiment comprises the second heat carrier 41, many second heat pipes 42 and groups of fins 43, described second heat pipe 42 is connected on described second heat carrier 41, and described groups of fins 43 is connected on described second heat pipe 42.Concrete, second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, the heat that the hot junction of semiconductor refrigerating module 200 produces passes to the second heat pipe 42 by the second heat carrier 41, second heat pipe 42 can transfer heat in groups of fins 43 fast, and groups of fins 43 can make the radiator of larger area as required, groups of fins 43 can utilize self larger area of dissipation to carry out quick heat radiating to the heat that the second heat pipe 42 transmits, thus without the need to directly being dispelled the heat to the hot junction of semiconductor refrigeration module 200 by fan.Wherein, dispel the heat to utilize each groups of fins 43 fully, second heat carrier 41 is also connected with the 3rd heat pipe 44, described 3rd heat pipe 44 in arbitrary described hot-side heat dissipation device 400 is also connected with the described groups of fins 43 in hot-side heat dissipation device 400 described in all the other.In actual use, when the heat that the work of each semiconductor refrigerating module 200 produces is identical, each semiconductor refrigerating module 200 is dispelled the heat by respective groups of fins 43, and when the heat dissipation capacity of some semiconductor refrigerating modules 200 is larger, heat is delivered in the groups of fins 43 of other semiconductor refrigerating module 200 correspondences by the 3rd heat pipe 44 by the second heat carrier 41 being connected to this semiconductor refrigerating module 200 heat, thus whole groups of fins 43 can be utilized to dispel the heat more efficiently; In the design process, each second heat carrier 41 can carry out thermally coupled with remaining groups of fins 43 by the 3rd heat pipe 44, for the heat-sinking capability of whole groups of fins 43, thus realizes nature cooling.And in order to strengthen the draught capacity of groups of fins 43, groups of fins 43 comprises multi-disc radiating fin 431, described radiating fin 431 is provided with air vent 432, the multiple described air vent 432 be positioned on same axis forms air channel, groups of fins 43 is except utilizing the interval between radiating fin 431 and ventilating, also utilize air vent 432 to form air channel to ventilate, thus effectively can strengthen the draught capacity of groups of fins 43.And run under each semiconductor refrigerating module 200 is in relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 and groups of fins 43 are arranged side by side and are positioned at the side in air channel, the direction air-out that fan 45 extends towards air channel, the wind that fan 45 blows out enters into air channel to accelerate the flowing of air channel apoplexy, and comparatively gently easily flow upward due to hot-air, in air vent 432, the wind of percolation will make hot-air vortex flow between two radiating fins 431, farthest utilize the area of radiating fin 431 to dispel the heat.As shown in Figure 10-Figure 12, dispel the heat to utilize radiating fin 431 more fully, except being positioned at the radiating fin 431 in outside, all the other radiating fins 431 offer breach 433, the breach 433 be positioned on sustained height position forms auxiliary air channel, groups of fins 43 is also provided with cover body 46, described fan 45 is also positioned at the inner side in auxiliary air channel and is fixed on cover body 46, cover body 46 hides in groups of fins 43, the bottom of cover body 46 forms air inlet, and the upper end of cover body 46 forms air outlet, fan 45 starts in backward auxiliary air channel dries, accelerate the air flowing between radiating fin 431, and hot-air rising exports from air outlet, extraneous cold air is made to enter between radiating fin 431 from the air inlet of bottom, make cold wind can from bottom to up in motion process, through the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431, and cover body 46 also offers ventilating opening 461 for the position of provided with fan 45, the wind in the external world is further incorporated in radiating fin 431 by ventilating opening 461 by fan 45.Wherein, the both sides of each second heat carrier 41 are respectively arranged with groups of fins 43, and fan 45 is simultaneously between two groups of fins 43.And be connected with the second heat carrier 41 for the ease of heat pipe, as shown in figure 13, second heat carrier 41 is formed with multiple installing hole 410, described second heat pipe 42 and described 3rd heat pipe 44 are inserted in corresponding described installing hole 410, heat pipe is inserted in installing hole 410 contact area that can increase between the second heat carrier 41, improves heat conduction efficiency; And the second heat carrier 41 comprises two surfaces arranges reeded briquetting 411, two described briquettings 411 are fixed together, two corresponding described grooves form described installing hole 410, adopt two briquettings 411 to form the second heat carrier 41, the assembly and connection between heat pipe and the second heat carrier 41 can be convenient to.

Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.

Claims (8)

1. a heat-exchange device, it is characterized in that, comprise heat carrier and two heat pipes, described heat carrier offers multiple jack, and described heat pipe sealing is inserted in described jack, is provided with the first through hole between adjacent two described jacks, the described heat pipe end opens be inserted in described jack has the second through hole, described first through hole and described second through hole are interconnected formation passage, and described passage end mouth is provided with filler, and another port is provided with safe pressure valve.

2. heat-exchange device according to claim 1, is characterized in that, the both ends of described heat pipe all seal and are inserted in described heat carrier.

3. heat-exchange device according to claim 2, is characterized in that, described heat pipe down bends extension from its sloped-end.

4. heat-exchange device according to claim 3, is characterized in that, the symmetrically downward-sloping bending extension of mode of the both ends of heat pipe described in every root.

5. heat-exchange device according to claim 3, is characterized in that, the pipeline diameter in units of millimeter of described heat pipe is configured to the 1.2-1.3 of the inclination angle theta relative to horizontal direction in units of degree being more than or equal to described heat pipe doubly.

6. heat-exchange device according to claim 1, is characterized in that, the bottom of described heat carrier offers described jack.

7. a semiconductor refrigerating equipment, comprise heat conduction inner bag and semiconductor refrigerating module, the hot junction of described semiconductor refrigerating module is provided with radiator, it is characterized in that, also comprise heat-exchange device as claimed in claim 1, the heat pipe of described heat-exchange device is attached on described heat conduction inner bag, and the heat carrier of described heat-exchange device is attached to the cold junction of described semiconductor refrigerating module.

8. semiconductor refrigerating equipment according to claim 7, it is characterized in that, the both ends of described heat pipe are all inserted in described heat carrier, described heat pipe bends extension respectively inclined downward from its both ends, the bending place of described heat pipe is provided with keeper, and described keeper is fixed on described heat conduction inner bag.