CN105716318A - Heat exchange device and semiconductor refrigerating equipment - Google Patents

Abstract

The invention provides a heat exchange device and semiconductor refrigerating equipment. The heat exchange device comprises a heat conductor and two heat pipes. A plurality of insertion holes are formed in the heat conductor. The heat pipes are inserted into the insertion holes in a sealed mode. A first through hole is formed between every two adjacent insertion holes. A second through hole is formed in the end, inserted into the corresponding insertion hole, of each heat pipe. The first through holes communicate with the second through holes to form a channel. A filling port is formed in one end opening of the channel, and a safe pressure valve is arranged at the other end opening of the channel. Cold of the cold end of a semiconductor refrigerating module is transferred to the heat pipes through the heat conductor, the cold can be distributed on the whole heat pipes rapidly through the heat pipes, the bulk temperature of the heat pipes is uniform, and therefore the cold can be rapidly transferred into a storage space defined by liners through the heat pipes, so that the effect that the cold of the internal storage space is distributed uniformly is guaranteed, and the refrigerating capacity of the semiconductor refrigerating equipment is improved.

Description

Heat-exchange device and semiconductor refrigerating equipment

Technical field

The present invention relates to refrigerating plant, particularly relate to a kind of heat-exchange device and semiconductor refrigerating equipment.

Background technology

At present, refrigeration plant (such as refrigerator, refrigerator, wine cabinet) is electrical equipment conventional in people's daily life, is generally of refrigeration system in refrigeration plant, and generally refrigeration system is made up of compressor, condenser and vaporizer, it is possible to realize the refrigeration of relatively low temperature.But, along with the development of semiconductor refrigerating technology, adopt the refrigeration plant that semiconductor chilling plate carries out freezing to be also widely used.Storage space in casing is freezed by semiconductor refrigerating equipment of the prior art by the cold end released cold quantity of semiconductor refrigerating module.But, in actual use, the cold end of semiconductor refrigerating module generally adopts fin to carry out forced convertion to pass through to be dispersed in storage space by cold, it is necessary to can being transported in the storage space of refrigeration plant by cold by fan, refrigerating efficiency is relatively low.How to design a kind of semiconductor refrigerating equipment being capable of quickly transmitting released cold quantity, be the technical problem to be solved to improve refrigerating efficiency.

Summary of the invention

The technical problem to be solved is: provides a kind of heat-exchange device and semiconductor refrigerating equipment, it is achieved quickly transmitted released cold quantity by heat-exchange device, improves semiconductor refrigerating equipment refrigerating efficiency.

Technical scheme provided by the invention is, a kind of heat-exchange device, including heat carrier and two heat pipes, offering multiple jack on described heat carrier, described heat pipe seals and is inserted in described jack, is provided with the first through hole between adjacent two described jacks, the end opens that described heat pipe is inserted in described jack has the second through hole, described first through hole and described second through hole are interconnected formation passage, and described passage end mouth is provided with filler, and another port is provided with safe pressure valve.

The present invention also provides for a kind of semiconductor refrigerating equipment, including heat conduction inner bag and semiconductor refrigerating module, the hot junction of described semiconductor refrigerating module is provided with radiator, also include above-mentioned heat-exchange device, the heat pipe of described heat-exchange device is attached on described heat conduction inner bag, and the heat carrier of described heat-exchange device is attached to the cold end of described semiconductor refrigerating module.

Heat-exchange device provided by the invention and semiconductor refrigerating equipment, by heat carrier, the cold end cold of semiconductor refrigerating module is passed to heat pipe, cold can be quickly distributed on whole piece heat pipe by heat pipe, and the bulk temperature of heat pipe is uniform, heat pipe is made quickly to be delivered to by cold in the storage space that inner bag is formed, so that it is guaranteed that the cold of the storage space of inside is evenly distributed, improve the refrigeration performance of semiconductor refrigerating equipment.Meanwhile, by being connected to safe pressure valve on passage, when hypertonia in heat pipe, safe pressure valve can releasing pressure automatically, and avoid heat pipe bombing, improve security performance.

Accompanying drawing explanation

In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.

Fig. 1 is the structural representation of semiconductor refrigerating equipment embodiment of the present invention；

Fig. 2 is the explosive view of semiconductor refrigerating equipment embodiment of the present invention；

Fig. 3 is the structural representation of casing in semiconductor refrigerating equipment embodiment of the present invention；

Fig. 4 is the partial sectional view of casing in semiconductor refrigerating equipment embodiment of the present invention；

Fig. 5 is the structural representation of installing plate in semiconductor refrigerating equipment embodiment of the present invention；

Fig. 6 is the structural representation of heat-exchange device in semiconductor refrigerating equipment embodiment of the present invention；

Fig. 7 is the assembling figure of heat-exchange device and heat conduction inner bag in semiconductor refrigerating equipment embodiment of the present invention；

Fig. 8 is the sectional view of the first heat carrier in semiconductor refrigerating equipment embodiment of the present invention；

Fig. 9 is the assembled relation figure of the first heat carrier and keeper in semiconductor refrigerating equipment embodiment of the present invention；

Figure 10 is the structural representation one of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；

Figure 11 is the structural representation two of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；

Figure 12 is Figure 11 apoplexy flow principles figure in groups of fins；

Figure 13 is the structural representation of the second heat carrier in semiconductor refrigerating equipment embodiment of the present invention.

Detailed description of the invention

For making the purpose of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.

As Figure 1-Figure 2, the present embodiment semiconductor refrigerating equipment, including heat conduction inner bag 100 and semiconductor refrigerating module, described semiconductor refrigerating module includes semiconductor refrigerating module 200, heat-exchange device 300 and hot-side heat dissipation device 400, described heat-exchange device 300 is connected to the cold end of described semiconductor refrigerating module 200, described hot-side heat dissipation device 400 is connected to the hot junction of described semiconductor refrigerating module 200, described heat-exchange device 300 is also connected with described inner bag 100, wherein, as shown in Fig. 6-Fig. 9, described heat-exchange device 300 in the present embodiment includes the first heat carrier 31 and two first heat pipes 32, first heat carrier 31 offers multiple jack 311, described first heat pipe 32 seals and is inserted in described jack 311, it is provided with the first through hole 312 between adjacent two described jacks 311, the end opens that described first heat pipe 32 is inserted in described jack 311 has the second through hole (not shown), described first through hole and described second through hole are interconnected formation passage, passage and described first heat pipe 32 are provided with the cold-producing medium that gas-liquid two-phase coexists, one end of passage is connected to switchable filler 313, the other end is connected to safe pressure valve 314；Described first heat carrier 31 is attached to the cold end of described semiconductor refrigerating module 200, and described first heat pipe 32 is attached on described inner bag 100, and the first heat pipe 32 realizes the cold end thermally coupled with semiconductor refrigerating module 200 by the first heat carrier 31.

Specifically, the cold that the cold end of semiconductor refrigerating module 200 produces passes to the first heat pipe 32 by the first heat carrier 31, and cold can be quickly distributed on heat conduction inner bag 100 by the first heat pipe 32, cold directly can be discharged into its storage space being internally formed and freeze by heat conduction inner bag 100, effectively raise refrigerating efficiency, it is to avoid the cold that the cold end of semiconductor refrigerating module 200 produces adopts fin to carry out cold scattering and the phenomenon that refrigerating efficiency is low occur.In heat-exchange device 300 actual assembled process, first heat pipe 32 is inserted in jack 311, by the position of the second through hole in the degree of depth of appropriate design jack 311 and the first heat pipe 32, the first through hole 312 is made to connect formation passage with the second through hole, or, in actual assembled process, first heat carrier 31 is first provided with jack 311, after the first heat pipe 32 is inserted in jack 311, the through hole of through first heat carrier 31 and the first heat pipe 32 is offered from the sidewall of the first heat carrier 31, to form passage in the first heat carrier 31, then, to be used in heat pipe gas-liquid phase transition refrigerant filling again in the first heat pipe 32 and cavity, the first heat pipe 32 is made to have the performance of heat pipe speed heat.And can quickly enter into for the ease of the cold-producing medium of post liquefaction and the first heat pipe 32 freezes, the bottom of described first heat carrier 31 offers described jack 311.Wherein, described first heat carrier 31 is additionally provided with switchable filler 313, described filler 313 connects with described cavity, can easily to perfusion cold-producing medium in the first heat pipe 32 by filler 313, and in actual use, in order to avoid causing the excessive generation bombing of the pressure in the first heat pipe 32 because fault makes semiconductor refrigerating module 200 be not normally functioning, first heat carrier 31 is additionally provided with safe pressure valve 314, described safe pressure valve 314 connects with described cavity, after the pressure in the first heat pipe 32 exceedes setting value, safe pressure valve 314 will open release pressure, to guarantee to use safety.Cold-producing medium for perfusion, first heat pipe 32 need perfusion cold-producing medium working medium can commonly use cold-producing medium for refrigerator refrigeration system, such as R134a, R600a, CO2 etc., choosing of concrete cold-producing medium working medium can be determined according to combined factors such as versatility requirement, system pressure requirements, cold delivery request, working medium physical property, environmental protection.Preferably, in order to reduce the quantity of the first heat pipe 32, simultaneously, meet the uniform requirement of cold scattering, heat-exchange device 300 includes two described first heat pipes 32, and described first heat carrier 31 offers four described jacks 311, and the both ends of described first heat pipe 32 are all inserted in the described jack 311 of correspondence；Wherein one first heat pipe 32 bending is distributed in the both sides of described heat conduction inner bag 100, and another described first heat pipe 32 bending is distributed in the back of described heat conduction inner bag 100.Concrete, the both ends of the first heat pipe 32 are all inserted in jack 311, the first heat pipe 32 is made to realize the cold scattering ability of two heat pipes, and wherein one first heat pipe 32 bending is distributed in the both sides of heat conduction inner bag 100, the bending of another first heat pipe 32 is distributed in the back of heat conduction inner bag 100, by in the first heat pipe 32 cold scattering process, first heat pipe 32 of bending distribution is bigger with the contact area of heat conduction inner bag 100, so that heat conduction inner bag 100 can obtain cold more uniformly, simultaneously, the both sides of heat conduction inner bag 100 and back are distributed with the first heat pipe 31 and carry out cold scattering, heat conduction inner bag 100 is made to form the cold scattering surface of encircling type, so that it is guaranteed that the storage space refrigeration of inside is uniformly.And so that cold quickly can be extended transmission by the first heat pipe 31 from its end, first heat pipe 32 bends extension respectively inclined downward from its both ends, concrete, cold-producing medium in first heat pipe 32 is liquefied as liquid after catching a cold, and it is being heated seasonal epidemic pathogens formation gas, by adopting the mode bent inclined downward to extend the first heat pipe 32, and in the first heat pipe 32 cold scattering process, the cold-producing medium of liquefaction can flow downward under gravity, and the cold-producing medium gasified can rise to along the first heat pipe 32 tilted and freeze in the cavity that the first heat carrier 31 is formed, wherein, first heat pipe 32 will form straight length and bend loss after bending extension, angle of inclination for the straight length of the first heat pipe 32 is: the pipeline diameter (hereinafter referred to as caliber) in units of millimeter of the first heat pipe 32 is configured to 1.2-1.3 times of the inclination angle theta relative to horizontal direction in units of degree more than or equal to the first heat pipe 32, in actual production, the straight length of each first heat pipe 32 is with respect to the horizontal plane to be obliquely installed to ensure that liquid refrigerant within it relies on free gravity to flow in the angle of 10 ° to 70 °, to improve the cold scattering efficiency of the first heat pipe 32.It addition, for single first heat pipe 32, the both ends downward-sloping bending extension of symmetrically mode of the first heat pipe 32.

Wherein, the present embodiment semiconductor refrigerating equipment can include multiple heat conduction inner bag 100, each heat conduction inner bag 100 is to there being semiconductor refrigerating module, semiconductor refrigerating module is by the storage space in corresponding refrigeration heat conduction inner bag 100, and the cold that in semiconductor refrigerating module, the cold end of semiconductor refrigerating module 200 produces is delivered on heat conduction inner bag 100 by heat-exchange device 300, freezed rapidly cold being discharged in the storage space formed in it by heat conduction inner bag 100, and the heat that the hot junction of semiconductor refrigerating module 200 produces is dispelled the heat by hot-side heat dissipation device 400.And owing to multiple heat conduction inner bag 100 intervals are arranged, simultaneously, each heat conduction inner bag 100 is carried out independent refrigeration by corresponding semiconductor refrigerating module 200, in actual use, difference can be required according to stored article refrigeration in different heat conduction inner bags 100, control corresponding semiconductor refrigerating module 200 and discharge the cold of adaptive capacity, it is achieved many warm areas freeze.

It addition, be provided with thermal insulating connectors 102 between adjacent two described heat conduction inner bags 100, adjacent two described heat conduction inner bags 100 are linked together by described thermal insulating connectors 102.Concrete, as shown in Figure 3-Figure 5, thermal insulating connectors 102 1 aspect can play and be linked together by two adjacent heat conduction inner bags 100, thermal insulating connectors 102 can also be passed through on the other hand reduce or block generation conduction of heat between adjacent two heat conduction inner bags 100, so that the warm area that each heat conduction inner bag 100 is formed is more independent.Thermal insulating connectors 102 can adopt various ways, such as: described thermal insulating connectors 102 is provided with the slot 1021 arranged dorsad, described heat conduction inner bag 100 is inserted in described slot 1021, when assembling two heat conduction inner bags 100, the edge of heat conduction inner bag 100 is inserted in slot 1021, realize two heat conduction inner bags 100 to link together, and heat conduction inner bag 100 can adopt gluing after being inserted in described slot 1021, the modes such as screw is fixing fasten, preferably, described heat conduction inner bag 100 is installed in slot 1021, concrete, described heat conduction inner bag 100 is inserted in the end of described slot 1021 and is provided with barb structure 1001, the sidewall of described slot 1021 is provided with the fixture block 1022 coordinated with described barb structure 1001, described barb structure 1001 is stuck on described fixture block 1022.It addition, can adopt horizontal arrangement between multiple heat conduction inner bags 100 in the present embodiment, it is preferred that multiple described heat conduction inner bag 100 stacked arrangement from top to bottom, and semiconductor refrigerating module 200 is respectively positioned on the described heat conduction inner bag 100 of topmost.Concrete, semiconductor refrigerating module 200 is unified to be arranged on the heat conduction inner bag 100 of topmost, and in order to convenient, equal semiconductor refrigerating module 200 is installed, and it being positioned on the described heat conduction inner bag of topmost and 100 be provided with installing plate 103, described semiconductor refrigerating module 200 is fixed on described installing plate 103.Installing plate 103 can adopt heat-barrier material to support, to avoid heat conduction inner bag 100 by there is heat transmission between installing plate 103 and semiconductor refrigerating module 200, and installing plate 103 is also provided with strengthening plate 1031, the structural strength of installing plate 103 is strengthened by strengthening plate 1031.

And semiconductor refrigerating module 200 is installed in the process of heat conduction inner bag 100 needing, installing plate 103 on heat conduction inner bag 100 is formed with again draw-in groove 1032, first heat carrier 31 is inserted in slot 1032, and arranges heat-conducting silicone grease between semiconductor refrigerating module 200 and the first heat carrier 31 and be installed on installing plate 103 by the first heat carrier 31.Preferably, the periphery of semiconductor refrigerating module 200 is cased with sealing ring 201, installing plate 103 is further fixedly arranged on auxiliary mounting deck 202, auxiliary mounting deck 202 is provided with installing port 2021, sealing ring 201 is arranged in installing port 2021, more firmly can be undertaken semiconductor refrigerating module 200 installing by sealing ring 201 and auxiliary mounting deck 202 and fix, simultaneously, sealing ring 201 again can by the peripheral sealing of semiconductor refrigerating module 200, it is to avoid cold scatters and disappears from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32 is positioned, avoid carrying out the first heat pipe 32 stress displacement when foaming processes before to heat conduction inner bag 100 and shell 101, the bending place of the first heat pipe 32 is provided with keeper 104, and described keeper 104 is fixed on described heat conduction inner bag 100.The bending place of the first heat pipe 32 is positioned by keeper 104, keeper 104 can keep the bending state of the first heat pipe 32, making in foaming process and routine use, the case of bending of the first heat pipe 32 remains unchanged, and avoids the occurrence of the first heat pipe 32 simultaneously and shifts.Wherein, keeper 104 includes locating piece 1041 and joint pin 1042, described locating piece 1041 is connected on described joint pin 1042, described joint pin 1042 is fixed on described heat conduction inner bag 100, described first heat pipe 32 is wound on described joint pin 1042 and between described locating piece 1041 and described heat conduction inner bag 100, in an assembling process, first heat pipe 32 is wound on joint pin 1042 and bends, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and described heat conduction inner bag 100, for the connection between keeper 104 and heat conduction inner bag 100, on heat conduction inner bag 100, riveted joint has riveting nut 105, described keeper 104 offers through hole 1043, described riveting nut 105 is arranged in described through hole 1043, screw 106 is inserted in described through hole 1043 and is threaded in described riveting nut 105.

In actual use, hot-side heat dissipation device 400 can adopt prior art wind to fan the mode of direct wind-cooling heat dissipating, preferably, as shown in figs. 2 and 10, hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, many second heat pipes 42 and groups of fins 43, described second heat pipe 42 is connected on described second heat carrier 41, and described groups of fins 43 is connected on described second heat pipe 42.Concrete, second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, the heat that the hot junction of semiconductor refrigerating module 200 produces passes to the second heat pipe 42 by the second heat carrier 41, second heat pipe 42 can quickly transfer heat in groups of fins 43, and groups of fins 43 can make the radiator of larger area as required, groups of fins 43 can utilize the heat that the second heat pipe 42 is transmitted by the area of dissipation that self is bigger to carry out quick heat radiating, directly is dispelled the heat in the hot junction of quasiconductor refrigeration module 200 from without by fan.Wherein, in order to utilize each groups of fins 43 to dispel the heat fully, being also associated with the 3rd heat pipe 44 on second heat carrier 41, described 3rd heat pipe 44 in arbitrary described hot-side heat dissipation device 400 is also connected with the described groups of fins 43 in hot-side heat dissipation device 400 all the other described.In actual use, when the heat that the work of each semiconductor refrigerating module 200 produces is identical, each semiconductor refrigerating module 200 is dispelled the heat by respective groups of fins 43, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is bigger, the second heat carrier 41 being connected to this semiconductor refrigerating module 200 heat passes through in the groups of fins 43 that the 3rd heat pipe 44 transfers heat to other semiconductor refrigerating module 200 correspondences, such that it is able to utilize whole groups of fins 43 to dispel the heat more efficiently；In the design process, each second heat carrier 41 can pass through the 3rd heat pipe 44 and carry out thermally coupled with remaining groups of fins 43, for the heat-sinking capability of whole groups of fins 43, thus realizing natural cooling.And in order to strengthen the draught capacity of groups of fins 43, groups of fins 43 includes multi-disc radiating fin 431, described radiating fin 431 is provided with air vent 432, the multiple described air vent 432 being positioned on same axis forms air channel, outside groups of fins 43 is aerated other than with the interval between radiating fin 431, also utilize air vent 432 to form air channel to be aerated, such that it is able to effectively strengthen the draught capacity of groups of fins 43.And run when each semiconductor refrigerating module 200 is under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 and groups of fins 43 are arranged side by side and are positioned at the side in air channel, the direction air-out that fan 45 extends towards air channel, the wind of fan 45 blowout enters in air channel to accelerate the flowing of air channel apoplexy, and relatively gently easily flow upward due to hot-air, in air vent 432, the wind of percolation will make hot-air vortex flow between two radiating fins 431, farthest utilize the area of radiating fin 431 to dispel the heat.As shown in Figure 10-Figure 12, in order to utilize radiating fin 431 to dispel the heat more fully, except being positioned at the radiating fin 431 in outside, all the other radiating fins 431 offer breach 433, it is positioned at the breach 433 on sustained height position and forms auxiliary air channel, groups of fins 43 is additionally provided with cover body 46, described fan 45 is also located at the inner side in auxiliary air channel and is fixed on cover body 46, cover body 46 hides in groups of fins 43, the bottom of cover body 46 forms air inlet, and the upper end of cover body 46 forms air outlet, fan 45 starts in backward auxiliary air channel dries, accelerate the air flowing between radiating fin 431, and hot-air rises from air outlet output, the cold air making the external world enters between radiating fin 431 from the air inlet of bottom, make the cold wind can from bottom to up in motor process, whole surface through radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；And the position being used for installing fan 45 on cover body 46 is further opened with vent 461, extraneous wind is further incorporated in radiating fin 431 by fan 45 by vent 461.Wherein, the both sides of each second heat carrier 41 are respectively arranged with groups of fins 43, and fan 45 is simultaneously between two groups of fins 43.And connect for the ease of heat pipe and the second heat carrier 41, as shown in figure 13, second heat carrier 41 is formed multiple installing hole 410, described second heat pipe 42 and described 3rd heat pipe 44 are inserted in the described installing hole 410 of correspondence, heat pipe is inserted in installing hole 410 and can increase the contact area between the second heat carrier 41, improve heat conduction efficiency；And the second heat carrier 41 includes two reeded briquettings 411 of surface configuration, two described briquettings 411 are fixed together, two corresponding described grooves form described installing hole 410, two briquettings 411 are adopted to form the second heat carrier 41, it is possible to be easy to the assembly and connection between heat pipe and the second heat carrier 41.

Last it is noted that above example is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent replacement；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (8)

1. a heat-exchange device, it is characterized in that, including heat carrier and two heat pipes, offering multiple jack on described heat carrier, described heat pipe seals and is inserted in described jack, is provided with the first through hole between adjacent two described jacks, the end opens that described heat pipe is inserted in described jack has the second through hole, described first through hole and described second through hole are interconnected formation passage, and described passage end mouth is provided with filler, and another port is provided with safe pressure valve.

2. heat-exchange device according to claim 1, it is characterised in that the both ends of described heat pipe all seal and are inserted in described heat carrier.

3. heat-exchange device according to claim 2, it is characterised in that described heat pipe down bends extension from its sloped-end.

4. heat-exchange device according to claim 3, it is characterised in that the both ends of the every described heat pipe downward-sloping bending extension of symmetrically mode.

5. heat-exchange device according to claim 3, it is characterised in that the pipeline diameter in units of millimeter of described heat pipe is configured to 1.2-1.3 times of the inclination angle theta relative to horizontal direction in units of degree more than or equal to described heat pipe.

6. heat-exchange device according to claim 1, it is characterised in that the bottom of described heat carrier offers described jack.

7. a semiconductor refrigerating equipment, including heat conduction inner bag and semiconductor refrigerating module, the hot junction of described semiconductor refrigerating module is provided with radiator, it is characterized in that, also include heat-exchange device as claimed in claim 1, the heat pipe of described heat-exchange device is attached on described heat conduction inner bag, and the heat carrier of described heat-exchange device is attached to the cold end of described semiconductor refrigerating module.

8. semiconductor refrigerating equipment according to claim 7, it is characterized in that, the both ends of described heat pipe are all inserted in described heat carrier, described heat pipe bends extension respectively inclined downward from its both ends, the bending place of described heat pipe is provided with keeper, and described keeper is fixed on described heat conduction inner bag.