CN100396999C - Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system - Google Patents
Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system Download PDFInfo
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- CN100396999C CN100396999C CNB2005100300223A CN200510030022A CN100396999C CN 100396999 C CN100396999 C CN 100396999C CN B2005100300223 A CNB2005100300223 A CN B2005100300223A CN 200510030022 A CN200510030022 A CN 200510030022A CN 100396999 C CN100396999 C CN 100396999C
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- heat pipe
- thermoelectric
- cooling
- oscillating heat
- pipe radiator
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The present invention discloses a compound cooling temperature control system of a thermoelectric refrigeration oscillation heat pipe, which is composed of an oscillation heat pipe radiator used as a heat radiation carrier and a thermoelectric refrigeration device used as an electronic component, wherein the cooled electronic component is connected with the cold end of the thermoelectric refrigeration device, the hot end of the thermoelectric refrigeration device is fixedly connected with the oscillation heat pipe radiator via a connecting piece, and the evaporation end of the oscillation heat pipe radiator is formed; the other end of the oscillation heat pipe radiator is a condensing end; power is supplied to the thermoelectric refrigeration device by a power supply, and an adjustable resistor is connected between the power supply and the thermoelectric refrigeration device. The technology of thermoelectric refrigeration and the technology of the oscillation heat pipe radiator are combined by the present invention, the thermoelectric refrigeration device and the oscillation heat pipe radiator can exert respective advantages, heat is obtained by using the cold end of the thermoelectric refrigeration and the electronic component, and the oscillation heat pipe radiator is used as the hot end of the thermoelectric refrigeration for heat radiation. Thus, heat quantity generated during the operation of the electronic component can be extracted by the present invention with high efficiency, and the present invention has the capability of controlling the temperature of the electronic component.
Description
Technical field
The present invention relates to a kind of compound thermoelectric cooling, oscillating heat pipe is the cooling temperature control system of one, especially a kind of low-temperature receiver that is used for electronic devices and components (Infrared Detectors, transistor, light-sensitive device, precision resistance components and parts, computer CPU, instrument and meter, medicine equipment, thermoelectric cooling refrigerator and air conditioner, power laser diode etc.) realizes that cooling electronic component cooling and temperature controlled compound thermoelectric cooling, oscillating heat pipe are the cooling temperature control system of one.
Background technology
Thermoelectric cooling is to utilize the pyroelectric effect of thermoelectric material to freeze, need not cold-producing medium and do not have mechanical moving element, thereby have cleaning, noise is little, refrigeration is rapid, be easy to regulate, be easy to the advantage of miniaturization, is widely used in fields such as military affairs, aviation, scientific research, instrument and meter, health care.Hot-side heat dissipation is crucial to the thermoelectric cooling influence, and the hot junction thermal resistance is more little, temperature is low more, and cold junction temperature is low more, and refrigeration is good more.Simultaneously because material cause requires hot-side temperature must not surpass certain limit.The fin (see figure 1) is generally adopted in present thermoelectric cooling hot junction, and fin and connected mode have diversified structure, and blower fan is not essential.Also have cold junction to adopt heat-pipe radiator to constitute thermoelectric cooling-heat pipe combined cooling system (see figure 2), heat pipe, fin and connected mode have diversified structure, and blower fan is not essential.
When single heat pipe caliber is little to a certain degree the time, because the restriction of the capillary limit, the adopting heat pipes for heat transfer ability is very limited.At this moment the idea that single heat pipe is connected has just been arranged, so oscillating heat pipe just occurred.Oscillating heat pipe no longer is the heat pipe of common meaning, and the working solution in the heat pipe will form the vapour-liquid Oscillation Flows, run around on sinister errands, dash forward and neglect shakiness because of reasons such as evaporation, condensation, surface tension.The strong point of oscillating heat pipe is that its thermal resistance is little, and heat-sinking capability is strong, and heat increases along with adding, heat-transfer capability also increases, also have compactness, efficient, be easy to characteristics such as extrusion modling, be applied to small-sized or the micromodule equipment heat radiation has the certain development potentiality.But can not provide to components and parts and be lower than the heat sink of environment temperature.
Therefore, two kinds of technology of thermoelectric cooling and oscillating heat pipe radiator are combined, performance strong point separately, utilize the thermoelectric cooling cold junction to the electronic devices and components heat-obtaining, utilize the oscillating heat pipe radiator to be the thermoelectric cooling hot-side heat dissipation, cause thermoelectric cooling-oscillating heat pipe combined-cooling temperature control system, this will be a more satisfactory electronic equipment thermal control technology.Still there is not this combined-cooling temperature control system at present.
Summary of the invention
The present invention will combine thermoelectric cooling and oscillating heat pipe radiator, and a kind of thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system of new model is provided.The heat that this system produces in the time of efficiently extracting electronic devices and components work has electronic devices and components is carried out temperature controlled ability.
Technical scheme of the present invention is achieved like this: a kind of thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system, it is by forming as the oscillating heat pipe radiator of heat radiation carrier with as the thermoelectric cooling device of electronic devices and components low-temperature receiver.The electronic devices and components that are cooled are connected with the cold junction of thermoelectric cooling device, one end of the hot junction of thermoelectric cooling device and oscillating heat pipe radiator is fixedlyed connected the evaporation ends that forms the oscillating heat pipe radiator by connector, and the other end of oscillating heat pipe radiator is its condensation end.Thermoelectric cooling device is powered by power supply, is connected with adjustable resistance between power supply and the thermoelectric cooling device, is used for the regulating system refrigerating capacity.
On the condensation end of oscillating heat pipe radiator fin is housed.Blower fan is equipped with in the condensation end front of oscillating heat pipe radiator.Thermoelectric cooling device is single-stage or multistage thermoelectric cooling series connection device.
The present invention combines two kinds of technology of thermoelectric cooling and oscillating heat pipe radiator, can bring into play strong point separately, utilizes the thermoelectric cooling cold junction to the electronic devices and components heat-obtaining, utilizes the oscillating heat pipe radiator to be the thermoelectric cooling hot-side heat dissipation.Therefore, the heat that the present invention produces in the time of efficiently extracting electronic devices and components work has electronic devices and components is carried out temperature controlled ability.
Description of drawings
Fig. 1 is the thermoelectric cooling temperature control system schematic diagram that fin is adopted in the hot junction;
Fig. 2 is a thermoelectric cooling heat-pipe radiator temperature control system schematic diagram;
Fig. 3 is a thermoelectric-cooling oscillating heat pipe radiator temperature control system schematic diagram of the present invention.
The specific embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
As shown in Figure 3, thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system.The electronic devices and components 1 that are cooled are connected with the cold junction 3 of thermoelectric cooling device 2, the thermic load of electronic devices and components 1 is passed to the cold junction 3 of thermoelectric cooling device 2, one thermograde is arranged between the two, thereby form from electronic devices and components 1 to thermoelectric cooling device the continuous hot-fluid of 2 cold junction 3.In thermoelectric cooling device 2 inside, realize heat is extracted into hot junction 4 continuously from cold junction 3 according to peltier effect.The hot junction 4 of thermoelectric cooling device 2 and oscillating heat pipe radiator 5 one ends carry out heat with being connected of machinery, this end is an oscillating heat pipe radiator evaporation ends 7 together with connector 6.The heat that oscillating heat pipe radiator evaporation ends 7 absorbs from the hot junction 4 of thermoelectric cooling device 2.The other end of oscillating heat pipe radiator 5 is a condensation end 8.Condensation end 8 can finned 9, also can not add.Near oscillating heat pipe condensation end 8, can adorn blower fan 10 and strengthen itself and environment exchange, also can not adorn.Heat radiation by 5 heat conduction of oscillating heat pipe radiator and condensation end 8, fin 9 is extracted into heat in the surrounding environment, realizes the high-efficiency and continuous cooling to electronic devices and components.Oscillating heat pipe radiator 5 has the self-regulation exchange capability of heat.Thermoelectric cooling device 2 is by power supply 11 power supplies, and 12 is adjustable resistance, can directly carry out the thermoelectric cooling device adjusting by regulating, thereby the regulating system refrigerating capacity reaches electronic devices and components are carried out temperature controlled purpose.Thermoelectric cooling device 2 can be single-stage or multistage thermoelectric cooling series connection device.Oscillating heat pipe radiator 5, fin 9 and connector 6 can have diversified structure.
The heat that thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system produces in the time of efficiently extracting electronic devices and components work has electronic devices and components is carried out temperature controlled ability.
Claims (4)
1. thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system, by forming as the oscillating heat pipe radiator of heat radiation carrier with as the thermoelectric cooling device of electronic devices and components low-temperature receiver, it is characterized in that the electronic devices and components that are cooled (1) are connected with the cold junction (3) of thermoelectric cooling device (2); The hot junction (4) of thermoelectric cooling device (2) and an end of oscillating heat pipe radiator (5) are fixedlyed connected the evaporation ends (7) that forms oscillating heat pipe radiator (5) by connector (6), the other end of oscillating heat pipe radiator (5) is condensation end (8), described thermoelectric cooling device (2) is powered by power supply (11), be connected with adjustable resistance (12) between power supply (11) and the thermoelectric cooling device (2), be used for the regulating system refrigerating capacity.
2. thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system according to claim 1 is characterized in that, on the condensation end (8) of described oscillating heat pipe radiator (5) fin (9) is housed.
3. thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system according to claim 1 is characterized in that, blower fan (10) is equipped with in condensation end (8) front of described oscillating heat pipe radiator (5).
4. thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system according to claim 1 is characterized in that, described thermoelectric cooling device (2) is single-stage or multistage thermoelectric cooling series connection device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100300223A CN100396999C (en) | 2005-09-27 | 2005-09-27 | Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system |
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CNB2005100300223A CN100396999C (en) | 2005-09-27 | 2005-09-27 | Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system |
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CN1743765A CN1743765A (en) | 2006-03-08 |
CN100396999C true CN100396999C (en) | 2008-06-25 |
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CNB2005100300223A Expired - Fee Related CN100396999C (en) | 2005-09-27 | 2005-09-27 | Thermoelectric-cooling oscillating heat pipe combined-cooling temperature control system |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100445685C (en) * | 2007-07-17 | 2008-12-24 | 山东省科学院能源研究所 | Compound heat-exchanger |
CN111148407A (en) * | 2020-01-08 | 2020-05-12 | 中国船舶重工集团公司第七二四研究所 | Electronic fluorination liquid cooling device based on thermoelectric refrigerating sheet |
Citations (7)
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CN2129909Y (en) * | 1992-01-31 | 1993-04-14 | 哈尔滨工业大学 | Hot tube semiconductor thermal electric refrigerator |
CN2284360Y (en) * | 1996-01-31 | 1998-06-17 | 刘第垲 | Electronic thermotube air conditioner |
CN2352902Y (en) * | 1998-09-18 | 1999-12-08 | 郑万烈 | Forced heat conducting type refrigerator |
US6233944B1 (en) * | 1997-10-21 | 2001-05-22 | Morix Co., Ltd. | Thermoelectric module unit |
JP2003269816A (en) * | 2001-12-06 | 2003-09-25 | Internatl Business Mach Corp <Ibm> | Heatpipe provided with photonic crystal, heat transfer apparatus and data processing system |
JP2004266145A (en) * | 2003-03-03 | 2004-09-24 | Okano Electric Wire Co Ltd | Cooling device |
CN2837741Y (en) * | 2005-09-27 | 2006-11-15 | 上海理工大学 | Thermoelectric refrigerating and oscillation heat pipe combined cooling temperature control device |
-
2005
- 2005-09-27 CN CNB2005100300223A patent/CN100396999C/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2129909Y (en) * | 1992-01-31 | 1993-04-14 | 哈尔滨工业大学 | Hot tube semiconductor thermal electric refrigerator |
CN2284360Y (en) * | 1996-01-31 | 1998-06-17 | 刘第垲 | Electronic thermotube air conditioner |
US6233944B1 (en) * | 1997-10-21 | 2001-05-22 | Morix Co., Ltd. | Thermoelectric module unit |
CN2352902Y (en) * | 1998-09-18 | 1999-12-08 | 郑万烈 | Forced heat conducting type refrigerator |
JP2003269816A (en) * | 2001-12-06 | 2003-09-25 | Internatl Business Mach Corp <Ibm> | Heatpipe provided with photonic crystal, heat transfer apparatus and data processing system |
JP2004266145A (en) * | 2003-03-03 | 2004-09-24 | Okano Electric Wire Co Ltd | Cooling device |
CN2837741Y (en) * | 2005-09-27 | 2006-11-15 | 上海理工大学 | Thermoelectric refrigerating and oscillation heat pipe combined cooling temperature control device |
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