CN2837741Y - Thermoelectric refrigerating and oscillation heat pipe combined cooling temperature control device - Google Patents

Abstract

The utility model discloses a thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device, which is composed of an oscillating heat pipe radiator as a heat dissipation carrier and a thermoelectric refrigeration device as a cold source for electronic components. The cooled electronic components are connected to the cold end of the thermoelectric cooling device, the hot end of the thermoelectric cooling device is fixedly connected to one end of the oscillating heat pipe radiator through a connecting piece to form the evaporation end of the oscillating heat pipe radiator, and the other end of the oscillating heat pipe radiator One end is the condensation end. The thermoelectric cooling device is powered by a power supply, and an adjustable resistance is connected between the power supply and the thermoelectric cooling device. The utility model combines the two technologies of thermoelectric refrigeration and oscillating heat pipe radiator, can exert their respective advantages, utilizes the cold end of thermoelectric refrigeration to obtain heat from electronic components, and utilizes the oscillating heat pipe radiator to dissipate heat for the hot end of thermoelectric refrigeration. Therefore, the utility model can efficiently extract the heat generated when the electronic components work, and has the ability to control the temperature of the electronic components.

Description

Thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device

Technical field

The utility model relates to a cooling temperature control device integrating thermoelectric refrigeration and an oscillating heat pipe, in particular to a cooling and temperature control device for electronic components (infrared detectors, transistors, photosensitive devices, precision resistance components, computer CPUs, instruments, meters, Medical equipment, thermoelectric refrigeration refrigerator air conditioners, power lasers, etc.), a cooling and temperature control device that realizes heat dissipation and cooling of electronic components and temperature control of composite thermoelectric refrigeration, and an oscillating heat pipe.

Background technique

Thermoelectric refrigeration uses the thermoelectric effect of thermoelectric materials for refrigeration. It does not require refrigerants and has no mechanical moving parts. Therefore, it has the advantages of cleanliness, low noise, rapid cooling, easy adjustment, and easy miniaturization. It is widely used in military, aviation, scientific research, Instrumentation, medical and health and other fields. The heat dissipation of the hot end is the key to thermoelectric cooling. The smaller the thermal resistance of the hot end, the lower the temperature, and the lower the temperature of the cold end, the better the cooling effect. At the same time, due to material reasons, the temperature of the hot end must not exceed a certain limit. At present, heat sinks are commonly used at the hot end of thermoelectric cooling (see Figure 1). There are various structures of heat sinks and connection methods, and fans are optional. There are also heat pipe radiators used at the cold end to form a thermoelectric refrigeration-heat pipe composite cooling system (see Figure 2). There are various structures of heat pipes, heat sinks and connection methods, and fans are optional.

When the diameter of a single heat pipe is small to a certain extent, due to the limitation of capillary limit, the heat transfer capacity of the heat pipe is very limited. At this moment, there is the idea of connecting the single heat pipes, so the oscillating heat pipes appear. The oscillating heat pipe is no longer a heat pipe in the ordinary sense. The working fluid in the heat pipe will form a vapor-liquid oscillating flow, jump up and down, and suddenly become unstable due to evaporation, condensation, surface tension and other reasons. The advantage of the oscillating heat pipe is that it has small thermal resistance and strong heat dissipation capacity. With the increase of heating capacity, the heat transfer capacity also increases. It also has the characteristics of compactness, high efficiency, and easy extrusion molding. development potential. However, it is not possible to provide components with a heat sink below the ambient temperature.

Therefore, the two technologies of thermoelectric refrigeration and oscillating heat pipe radiator are combined to give full play to their respective strengths, use the cold end of thermoelectric refrigeration to obtain heat from electronic components, and use the oscillating heat pipe radiator to dissipate heat from the hot end of thermoelectric refrigeration, resulting in thermoelectric refrigeration—oscillating heat pipe Composite cooling temperature control device, which will be an ideal thermal control technology for electronic equipment. There is no such composite cooling temperature control device at present.

Contents of the invention

The utility model combines thermoelectric refrigeration and oscillating heat pipe radiator to provide a new form of thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device. The device can efficiently extract the heat generated when the electronic components work, and has the ability to control the temperature of the electronic components.

The technical solution of the utility model is realized as follows: a thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device, which is composed of an oscillating heat pipe radiator as a heat dissipation carrier and a thermoelectric refrigeration device as a cold source for electronic components. The cooled electronic components are connected to the cold end of the thermoelectric cooling device, the hot end of the thermoelectric cooling device is fixedly connected to one end of the oscillating heat pipe radiator through a connecting piece to form the evaporation end of the oscillating heat pipe radiator, and the other end of the oscillating heat pipe radiator One end is its condensing end. The thermoelectric cooling device is powered by a power supply, and an adjustable resistor is connected between the power supply and the thermoelectric cooling device to adjust the cooling capacity of the system.

The condensing end of the oscillating heat pipe radiator is provided with cooling fins. A fan is installed in front of the condensing end of the oscillating heat pipe radiator. Thermoelectric cooling devices are single-stage or multi-stage thermoelectric cooling series devices.

The utility model combines the two technologies of thermoelectric refrigeration and oscillating heat pipe radiator, can exert their respective advantages, utilizes the cold end of thermoelectric refrigeration to obtain heat from electronic components, and utilizes the oscillating heat pipe radiator to dissipate heat for the hot end of thermoelectric refrigeration. Therefore, the invention can efficiently extract the heat generated when the electronic components work, and has the ability to control the temperature of the electronic components.

Description of drawings

Figure 1 is a schematic diagram of a thermoelectric refrigeration temperature control system with heat sinks at the hot end;

Fig. 2 is a schematic diagram of the temperature control system of the thermoelectric refrigeration heat pipe radiator;

Fig. 3 is a schematic diagram of the temperature control system of the thermoelectric refrigeration oscillating heat pipe radiator of the present invention.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is described further.

As shown in Figure 3, thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device. The cooled electronic component 1 is connected to the cold end 3 of the thermoelectric cooling device 2, the heat load of the electronic component 1 is transmitted to the cold end 3 of the thermoelectric cooling device 2, and there is a temperature gradient between the two, thereby forming a thermal load from the electronic component 1 to the continuous heat flow of the cold side 3 of the thermoelectric cooling device 2. Inside the thermoelectric refrigeration device 2, heat is continuously extracted from the cold end 3 to the hot end 4 according to the Peltier effect. The hot end 4 of the thermoelectric refrigeration device 2 is thermally and mechanically connected to one end of the oscillating heat pipe radiator 5 , and this end together with the connecting piece 6 is the evaporating end 7 of the oscillating heat pipe radiator. The evaporating end 7 of the oscillating heat pipe radiator absorbs heat from the hot end 4 of the thermoelectric cooling device 2 . The other end of the oscillating heat pipe radiator 5 is a condensation end 8 . The condensing end 8 can be equipped with cooling fins 9 or not. Fan 10 can be installed near the condensing end 8 of the oscillating heat pipe to strengthen its heat exchange with the environment, or not. Through the heat conduction of the oscillating heat pipe radiator 5 and the heat dissipation of the condensing end 8 and the heat sink 9, the heat is pumped into the surrounding environment to realize efficient and continuous cooling of electronic components. The oscillating heat pipe radiator 5 has self-regulating heat exchange capability. The thermoelectric cooling device 2 is powered by a power supply 11, and 12 is an adjustable resistor. Through adjustment, the thermoelectric cooling device can be directly adjusted to adjust the cooling capacity of the system and achieve the purpose of temperature control of electronic components. The thermoelectric cooling device 2 may be a single-stage or multi-stage thermoelectric cooling series device. The oscillating heat pipe radiator 5, the cooling fins 9 and the connectors 6 can have various structures.

The thermoelectric refrigeration oscillating heat pipe composite cooling temperature control system can efficiently extract the heat generated by electronic components when they are working, and has the ability to control the temperature of electronic components.

Claims (4)

1. A thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device is composed of an oscillating heat pipe radiator as a heat dissipation carrier and a thermoelectric refrigeration device as a cold source for electronic components, and is characterized in that the cooled electronic components (1) and The cold end (3) of the thermoelectric cooling device (2) is connected; the hot end (4) of the thermoelectric cooling device (2) is fixedly connected with one end of the oscillating heat pipe radiator (5) through a connecting piece (6) to form an oscillating heat pipe for heat dissipation The evaporation end (7) of the device (5), the other end of the oscillating heat pipe radiator (5) is its condensation end (8), and the thermoelectric cooling device (2) is powered by a power supply (11), and the power supply (11) is connected to the thermoelectric An adjustable resistor (12) is connected between the refrigeration devices (2) for adjusting the cooling capacity of the system. 2. The thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device according to claim 1, characterized in that, the condensing end (8) of the oscillating heat pipe radiator (5) is equipped with a cooling fin (9). 3. The thermoelectric refrigeration oscillating heat pipe composite cooling temperature control device according to claim 1, characterized in that a fan (10) is installed in front of the condensation end (8) of the oscillating heat pipe. 4. The thermoelectric cooling oscillating heat pipe compound cooling temperature control device according to claim 1, characterized in that the thermoelectric cooling device (2) is a single-stage or multi-stage thermoelectric cooling series device.

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