CN210866764U

CN210866764U - Laser and refrigerating device thereof

Info

Publication number: CN210866764U
Application number: CN201922478265.3U
Authority: CN
Inventors: 尹志军; 张虞; 吴冰; 许志城
Original assignee: Nanjing Nanzhi Institute Of Advanced Optoelectronic Integration
Current assignee: Nanjing Nanzhi Institute Of Advanced Optoelectronic Integration
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-06-26
Anticipated expiration: 2029-12-31

Abstract

The application provides a laser refrigerating device which is used for refrigerating and radiating a laser; the laser refrigerating device comprises a semiconductor refrigerator, a radiator and a liquid circulation heat conducting part; the semiconductor refrigerator comprises a refrigerating surface and a heating surface, and the refrigerating surface is in heat conduction contact with the liquid circulation heat conduction component; the heating surface is in thermally conductive contact with the heat sink. The compressor has compact structure and small volume, thereby solving the problems of large volume, heavy weight, complex mechanical mechanism, incapability of being portable and the like of the traditional equipment for refrigerating by using the compressor. In addition, this application still provides a laser instrument.

Description

Laser and refrigerating device thereof

Technical Field

The application relates to the technical field of lasers, in particular to a laser and a refrigerating device thereof.

Background

A TEC semiconductor Cooler (Thermo Electric Cooler) is made using the peltier effect of a semiconductor material. The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one surface absorbs heat and the other surface releases heat. The surface for absorbing heat forms a heating surface, and the surface for releasing heat forms a refrigerating surface. The heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials of TEC, and the bismuth telluride elements are electrically connected in series and generate heat in parallel. The TEC comprises a number of P-type and N-type pairs (sets) connected together by electrodes and sandwiched between two ceramic electrodes; when current flows through the TEC, the heat generated by the current is transferred from one side of the TEC to the other, creating a "hot" side and a "cold" side on the TEC, which is the principle of heating and cooling of the TEC. Compared with the traditional compressor refrigeration, the TEC refrigeration has the advantages of no vibration, no noise, no mechanical motion, high refrigeration speed, convenience in power control and the like.

The traditional water chiller is usually large in size, a compressor is used for refrigerating, F22 or R134a refrigerant is used, the mechanical structure is complex and cannot be miniaturized, and water cooling heat dissipation cannot be utilized for portable equipment such as small handheld equipment.

SUMMERY OF THE UTILITY MODEL

The application provides a laser refrigerating device, its compact structure, small to can solve the tradition and utilize the refrigerated equipment of compressor bulky, weight big, mechanical mechanism complicacy, unable portable scheduling problem. In addition, this application still provides a laser instrument.

In order to solve the above technical problems, a first aspect of the present application provides a laser refrigeration device for refrigerating and dissipating heat of a laser; the laser refrigerating device comprises a semiconductor refrigerator, a radiator and a liquid circulation heat conducting part; the semiconductor refrigerator comprises a refrigerating surface and a heating surface, and the refrigerating surface is in heat conduction contact with the liquid circulation heat conduction component; the heating surface is in thermally conductive contact with the heat sink.

Optionally, the radiator is of a box structure with a hollow interior.

Optionally, the box structure includes a left side and a right side, the semiconductor refrigerators include a plurality of semiconductor refrigerators, and each semiconductor refrigerator is attached to the left side or the right side with a heating surface thereof.

Optionally, the box structure includes leading flank and trailing flank, the leading flank with the trailing flank has all seted up the ventilation groove.

Optionally, the laser cooling device further includes a heat dissipation fan, and the heat dissipation fan is mounted on at least one of the front side surface and the rear side surface and is opposite to the ventilation slot.

Optionally, the liquid circulation heat conduction component is a square structure, and the inner side surface of the square structure is attached to the refrigerating surface.

Optionally, the liquid circulation heat conducting component includes a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are disposed on the front side surface of the tetragonal structure.

Optionally, the laser refrigeration device comprises a mounting part, and the liquid circulation heat conduction part is connected to the heat sink through the mounting part.

Optionally, the mounting part is a buckle, the buckle includes a buckle groove, and the liquid circulation heat-conducting part is disposed in the buckle groove.

The second aspect of the present application further provides a laser, including a refrigeration circuit; the laser comprises the laser refrigerating device, one end of the refrigerating circuit is communicated with the liquid inlet of the liquid circulation heat-conducting component, and the other end of the refrigerating circuit is communicated with the liquid outlet of the liquid circulation heat-conducting component.

In the application, the laser refrigerating device comprises a semiconductor refrigerator, a radiator and a liquid circulation heat conducting part; the semiconductor refrigerator comprises a refrigerating surface and a heating surface, and the refrigerating surface is in heat conduction contact with the liquid circulation heat conduction component; the heating surface is in thermally conductive contact with the heat sink.

In the structure design, the liquid circulation heat conducting component is communicated with a refrigerating circuit of the laser. The heat generated by the laser during working is brought to the circulating heat conducting component through the refrigerating loop, and the circulating heat conducting component is in contact with the refrigerating surface, so that the liquid in the refrigerating loop can be cooled and refrigerated. Meanwhile, the heat absorbed on the heating surface is dissipated through the radiator. The structure design only needs the semiconductor refrigerator, the liquid circulation heat conducting component and the radiator, has few parts, small volume and compact structure, and can effectively solve the problems of large volume, heavy weight, complex mechanical mechanism, incapability of being portable and the like of the traditional equipment for refrigerating by utilizing the compressor.

Drawings

FIG. 1 is a schematic diagram of a laser cooling device shown in an exemplary embodiment of the present application;

FIG. 2 is an exploded view of the assembly of the laser refrigeration unit of FIG. 1;

fig. 3 is a schematic structural diagram of a radiator of the laser refrigerating device in fig. 1.

Wherein, the corresponding relationship between the component names and the reference numbers in fig. 1 to fig. 3 is:

a semiconductor refrigerator 1; a refrigerated surface 101; heating the noodles; 102, and (b);

a radiator 2; a ventilation slot 201;

a liquid circulation heat-conductive member 3; a liquid inlet 301; a liquid outlet 302;

a heat radiation fan 4;

a buckle 5; a catching groove 501.

Detailed Description

Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following examples do not represent all embodiments consistent with the present application. But merely as exemplifications of systems and methods consistent with certain aspects of the application, as recited in the claims.

Referring to fig. 1, 2 and 3, fig. 1 is a schematic structural diagram of a laser cooling device shown in an exemplary embodiment of the present application; FIG. 2 is an exploded view of the assembly of the laser refrigeration unit of FIG. 1; fig. 3 is a schematic structural diagram of a radiator of the laser refrigerating device in fig. 1.

In one embodiment of the present application, as shown in fig. 1 and 2, the laser cooling device includes a semiconductor cooler 1, a heat sink 2, a liquid circulation heat-conducting part 3; the semiconductor refrigerator 1 comprises a refrigerating surface 101 and a heating surface 102, wherein the refrigerating surface 101 is in heat conduction contact with the liquid circulation heat conduction component 3; the heating surface 102 is in heat-conducting contact with the heat sink 2.

In this design, the liquid circulation heat-conducting component 3 is communicated with the refrigerating circuit of the laser. The heat generated by the laser during operation is carried through the refrigeration circuit to the circulating heat conducting member, which, due to its contact with the refrigeration surface 101, dissipates and refrigerates the liquid in the refrigeration circuit. At the same time, the heat absorbed by the heating surface 102 is dissipated through the radiator 2. The structural design only needs the semiconductor refrigerator 1, the liquid circulation heat conducting component 3 and the radiator 2, has few parts, small volume and compact structure, and therefore, the problems that the traditional equipment for refrigerating by using the compressor is large in volume, heavy in weight, complex in mechanical mechanism, incapable of being carried and the like can be effectively solved.

In the above embodiment, we can further design the structure of the heat sink 2. For example, as shown in fig. 2 and 3, the radiator 2 has a hollow box structure. In this case structure, the case structure includes a left side surface and a right side surface, the semiconductor refrigerators 1 include a plurality of them, and each semiconductor refrigerator 1 is attached with its heating surface 102 on the left side surface or the right side surface.

In the above structural design, the heat sink 2 is a box structure with a hollow interior, so that more semiconductor refrigerators 1 can be arranged, and the heat container of the semiconductor refrigerators 1 is easily conducted and dissipated by the side wall of the heat sink 2.

In the above structural design, in order to further improve the heat dissipation effect, the box structure includes leading flank and trailing flank, and ventilation groove 201 has all been seted up to leading flank and trailing flank. Meanwhile, a heat radiation fan 4 may be further provided. For example, as shown in fig. 1 and 2, the laser cooling device further includes a heat dissipation fan 4, and the heat dissipation fan 4 is mounted on at least one of the front side and the rear side, and is opposite to the ventilation groove 201.

In the above structure, due to the arrangement of the ventilation slot 201 and the heat dissipation fan 4, the heat on the side wall of the heat sink 2 can be quickly taken away by the wind, so that a better heat dissipation effect can be obtained.

It should be noted that, as shown in fig. 2 and 3, the left side surface is shown in the drawings, and the right side surface is an inward facing side surface opposite to the left side surface, which is not shown in the drawings. In addition, the front side is shown and the rear side is the side facing directly inward from the front side and is not shown in the figures.

In the above embodiment, we can further design the liquid circulation heat-conducting component 3. For example, as shown in fig. 2, the liquid circulation heat conduction member 3 has a tetragonal structure, and the inner side of the tetragonal structure is attached to the cooling surface 101. The tetragonal structure may be a rectangular structure or a square structure, which is not limited in this application.

Further, as shown in fig. 2, the liquid circulation heat conduction member 3 includes a liquid inlet 301 and a liquid outlet 302, and the liquid inlet 301 and the liquid outlet 302 are provided on the front side surface of the tetragonal structure. In this design, the cooling liquid enters through the liquid inlet 301, exchanges heat with the cooling surface 101, lowers the temperature, and then flows out through the liquid outlet 302. Thus, heat exchange can be conveniently performed.

In the above embodiment, we can further design the installation structure between the liquid circulation heat conduction part 3 and the heat sink 2. For example, the laser cooling device includes a mounting part, and the liquid circulation heat-conducting part 3 is connected to the heat sink 2 through the mounting part. Further, as shown in fig. 1 and 2, the mounting part is a buckle 5, the buckle 5 includes a buckle groove 501, and the liquid circulation heat conduction part 3 is disposed in the buckle groove 501. The design of the buckle 5 enables the connection between the liquid circulation heat-conducting component 3 and the radiator 2 to be simple and efficient.

In this application, the refrigeration liquid can get into a storage water tank after 1 refrigeration of semiconductor cooler, pumps through the water pump again, because the specific heat capacity of water is great, so liquid circulation heat-conducting component 3 can design into a little water course that is soft, increases the area of contact of water and radiating wall, increases hot water cooling's effect.

In addition, the refrigeration power of the semiconductor refrigerator 1 is easily controlled by the current, the temperature control device is used for easily realizing accurate temperature control, mechanical vibration does not exist in the refrigeration process of the TEC, a mechanical structure with a complex compressor does not exist, the whole device is simple, high in efficiency, low in manufacturing cost, easy to carry, small in size and capable of working after being plugged in a power supply for setting the temperature.

In addition, the application also provides a laser, which comprises a refrigeration loop; wherein the laser comprises a laser refrigeration device as claimed in any one of the above embodiments, and one end of the refrigeration circuit is communicated with the liquid inlet 301 of the liquid circulation heat conduction part 3, and the other end is communicated with the liquid outlet 302 of the liquid circulation heat conduction part 3.

The embodiments provided in the present application are only a few examples of the general concept of the present application, and do not limit the scope of the present application. Any other embodiments extended according to the scheme of the present application without inventive efforts will be within the scope of protection of the present application for a person skilled in the art.

Claims

1. A laser refrigerating device is used for refrigerating and radiating a laser; the laser refrigerating device is characterized by comprising a semiconductor refrigerator, a radiator and a liquid circulation heat conducting part; the semiconductor refrigerator comprises a refrigerating surface and a heating surface, and the refrigerating surface is in heat conduction contact with the liquid circulation heat conduction component; the heating surface is in thermally conductive contact with the heat sink.

2. The laser cooling device as claimed in claim 1, wherein the heat sink is of a box structure with a hollow interior.

3. The laser cooling device as claimed in claim 2, wherein the cabinet structure includes a left side and a right side, the semiconductor cooler includes a plurality of semiconductor coolers, and each of the semiconductor coolers is attached with its heating surface to the left side or the right side.

4. The laser cooling device as claimed in claim 2, wherein the box structure comprises a front side and a rear side, and wherein the front side and the rear side are both provided with ventilation slots.

5. The laser cooling device as claimed in claim 4, further comprising a heat dissipating fan mounted on at least one of the front and rear sides opposite the ventilation slot.

6. The laser cooling device as claimed in any one of claims 1 to 5, wherein the liquid circulation heat conduction member is a tetragonal structure, and the tetragonal structure is attached to the cooling surface by its inner side surface.

7. The laser cooling device as claimed in claim 6, wherein said liquid circulation heat conducting member comprises a liquid inlet and a liquid outlet, said liquid inlet and said liquid outlet being provided on a front side of said tetragonal structure.

8. The laser cooling device as claimed in any one of claims 1 to 5, wherein the laser cooling device comprises a mounting member through which the liquid circulation heat conducting member is connected to the heat sink.

9. The laser cooler of claim 8 wherein said mounting member is a snap, said snap including a snap groove, said hydronic heat transfer member being disposed in said snap groove.

10. A laser comprising a refrigeration circuit; wherein the laser comprises a laser cooling device as set forth in any one of claims 1 to 9, one end of the cooling circuit is communicated with the liquid inlet of the liquid circulation heat conduction part, and the other end is communicated with the liquid outlet of the liquid circulation heat conduction part.