US20080041066A1 - Air cooling/heating device - Google Patents
Air cooling/heating device Download PDFInfo
- Publication number
- US20080041066A1 US20080041066A1 US11/507,217 US50721706A US2008041066A1 US 20080041066 A1 US20080041066 A1 US 20080041066A1 US 50721706 A US50721706 A US 50721706A US 2008041066 A1 US2008041066 A1 US 2008041066A1
- Authority
- US
- United States
- Prior art keywords
- unit
- compartment
- heating device
- air cooling
- thermal energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2111—Temperatures of a heat storage receiver
Definitions
- the invention relates to an air cooling/heating device.
- Air heaters for generating hot air currents, and air coolers for generating cool air currents are known in the art.
- the output power of the air heaters/coolers affects the size and power consumption of the same. That is, air heaters/coolers with large power outputs are generally bulky, consume large amounts of electricity, and are expensive. It is thus desirable to provide an air cooling/heating device that can provide a large power output while having a compact size and consuming a smaller amount of electricity to reduce manufacturing and operating costs.
- the object of the present invention is to provide a simple and cost-effective air cooling/heating device.
- an air cooling/heating device that includes a housing unit, a thermal energy storing unit, an energy exchange unit, a pump, a thermoelectric semiconductor device, and a turbulence unit.
- the housing unit includes a housing body, and a partition plate disposed in and connected to the housing body such that the partition plate divides an interior of the housing body into first and second compartments.
- the housing body is formed with a first opening and a first mounting hole in spatial communication with the first compartment.
- the housing body is further formed with a second opening unit and a second mounting hole in spatial communication with the second compartment.
- the thermal energy storing unit is mounted to the partition plate of the housing unit, is disposed in the first compartment, and is adapted to contain antifreeze liquid.
- the energy exchange unit is disposed in the first compartment, and includes a pipe that is connected to the thermal energy storing unit to form a closed loop therewith.
- the pump is connected in series to the pipe of the energy exchange unit, and is operable to deliver the antifreeze liquid contained in the thermal energy storing unit to the energy exchange unit and to return the antifreeze liquid in the energy exchange unit back to the thermal energy storing unit.
- thermoelectric semiconductor device is disposed in the second compartment, and is in thermal contact with the thermal energy storing unit.
- the turbulence unit includes first and second fans mounted in the first and second mounting holes in the housing body, respectively.
- FIG. 1 is an assembled schematic partly sectional view of the preferred embodiment of an air cooling/heating device according to the present invention.
- FIG. 2 is an electric circuit diagram of a power supply unit according to the preferred embodiment.
- the preferred embodiment of an air cooling/heating device includes a housing unit 1 , a thermal energy storing unit 3 , an energy exchange unit 4 , a pump 5 , a thermoelectric semiconductor device 6 , a heat guide 7 , a turbulence unit 8 , and a power supply unit 2 .
- the housing unit 1 includes a housing body 11 , and a partition plate 14 disposed in and connected to the housing body 11 such that the partition plate 14 divides an interior of the housing body 11 into first and second compartments 12 , 13 .
- the housing body 11 is formed with a first opening 111 and a first mounting hole 112 in spatial communication with the first compartment 12 .
- the housing body 11 is further formed with a second opening unit 113 and a second mounting hole 114 in spatial communication with the second compartment 13 .
- the second opening unit 113 includes second and third openings 1131 , 1132 .
- the second mounting hole 114 is disposed between the second and third openings 1131 , 1132 .
- the housing unit 1 further includes several air filters 18 that are disposed to cover the first, second and third openings 111 , 1131 , 1132 , respectively.
- the thermal energy storing unit 3 is mounted to the partition plate 14 of the housing unit 1 , is disposed in the first compartment 12 , and is adapted to contain antifreeze liquid.
- the thermal energy storing unit 3 is embedded in the partition plate 14 of the housing unit 1 , and the antifreeze liquid is water mixed with ethylene glycol.
- the energy exchange unit 4 is disposed in the first compartment 12 , and includes a meandering pipe 41 that is connected to the thermal energy storing unit 3 to form a closed loop therewith.
- the pump 5 is connected in series to the pipe 41 of the energy exchange unit 4 , and is operable to deliver the antifreeze liquid contained in the thermal energy storing unit 3 to the energy exchange unit 4 and to return the antifreeze liquid in the energy exchange unit 4 back to the thermal energy storing unit 3 .
- thermoelectric semiconductor device 6 is disposed in the second compartment 13 , and has a first side 61 in thermal contact with the thermal energy storing unit 3 .
- the second mounting hole 114 is registered with the thermoelectric semiconductor device 6 .
- the heat guide 7 is disposed in the second compartment 13 , and is fixed to a second side 62 of the thermoelectric semiconductor device 6 that is opposite to the first side 61 .
- the heat guide 7 is a comb-shaped heat sink.
- the turbulence unit 8 includes first and second fans 81 , 82 mounted in the first and second mounting holes 112 , 114 in the housing body 11 , respectively.
- the first fan 81 is operable to draw air out of the first compartment 12
- the second fan 82 is operable to draw air into the second compartment 13 .
- the power supply unit 2 is mounted in the housing unit 1 , and is connected electrically to the pump 5 .
- the power supply unit 2 includes a high-voltage low-current circuit, and is responsible for supplying electric power to the various components of the device.
- a temperature monitoring unit 9 is attached to the thermal energy storing unit 3 , is connected electrically to the power supply unit 2 , and is used to monitor temperature of the antifreeze liquid in the thermal energy storing unit 3 .
- the thermoelectric semiconductor device 6 is operable to absorb heat at one of the first and second sides 61 , 62 , and to dissipate heat at the other one of the first and second sides 61 , 62 .
- the first side 61 absorbs thermal energy
- the second side 62 dissipates thermal energy.
- the second side 62 absorbs thermal energy
- the first side 61 dissipates thermal energy.
- thermoelectric semiconductor device 6 With electrical power supplied by the power supply unit 2 , the thermoelectric semiconductor device 6 is capable of producing a stable heat source at the first side 61 thereof such that the thermal energy storing unit 3 is maintained at a heated state.
- the pump 5 delivers the heated antifreeze liquid between the thermal energy storing unit 3 and the energy exchange unit 4 via the pipe 41 such that temperature of air in the first compartment 12 is increased by the heated antifreeze liquid.
- the heated air is drawn out of the first compartment 12 by the first fan 81 of the turbulence unit 8 .
- the air cooling/heating device As the first fan 81 draws the heated air out of the first compartment 12 , air from outside of the air cooling/heating device is drawn into the first compartment 12 through the first opening 111 as a result of air circulation.
- the second side 62 of the thermoelectric semiconductor device 6 absorbs thermal energy via the heat guide 7 such that temperature of air in the second compartment 13 is decreased.
- the second fan 82 of the turbulence unit 8 draws air from outside of the air cooling/heating device into the second compartment 13 , the cooled air is drawn out of the second compartment 13 via the second and third openings 1131 , 1132 as a result of air circulation. With air circulating as described, the air cooling/heating device is effectively operating as an air heater.
- the air cooling/heating device can effectively operate as an air cooler.
- the air cooling/heating device can provide a large power output while having a compact size and consuming a smaller amount of electricity to reduce manufacturing and operating costs.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An air cooling/heating device includes: a housing unit having first and second compartments, formed with a first opening and a first mounting hole in spatial communication with the first compartment, and further formed with a second opening unit and a second mounting hole in spatial communication with the second compartment; a thermal energy storing unit and a pipe disposed in the first compartment, and adapted to contain antifreeze liquid; a pump connected in series to the pipe, and operable to deliver the antifreeze liquid between the thermal energy storing unit and the pipe; a thermoelectric semiconductor device disposed in the second compartment, and in thermal contact with the thermal energy storing unit; and a turbulence unit including first and second fans that are mounted in the first and second mounting holes in the housing body, respectively.
Description
- 1. Field of the Invention
- The invention relates to an air cooling/heating device.
- 2. Description of the Related Art
- Air heaters for generating hot air currents, and air coolers for generating cool air currents are known in the art. In the prior art, the output power of the air heaters/coolers affects the size and power consumption of the same. That is, air heaters/coolers with large power outputs are generally bulky, consume large amounts of electricity, and are expensive. It is thus desirable to provide an air cooling/heating device that can provide a large power output while having a compact size and consuming a smaller amount of electricity to reduce manufacturing and operating costs.
- Therefore, the object of the present invention is to provide a simple and cost-effective air cooling/heating device.
- According to the present invention, there is provided an air cooling/heating device that includes a housing unit, a thermal energy storing unit, an energy exchange unit, a pump, a thermoelectric semiconductor device, and a turbulence unit.
- The housing unit includes a housing body, and a partition plate disposed in and connected to the housing body such that the partition plate divides an interior of the housing body into first and second compartments. The housing body is formed with a first opening and a first mounting hole in spatial communication with the first compartment. The housing body is further formed with a second opening unit and a second mounting hole in spatial communication with the second compartment.
- The thermal energy storing unit is mounted to the partition plate of the housing unit, is disposed in the first compartment, and is adapted to contain antifreeze liquid.
- The energy exchange unit is disposed in the first compartment, and includes a pipe that is connected to the thermal energy storing unit to form a closed loop therewith.
- The pump is connected in series to the pipe of the energy exchange unit, and is operable to deliver the antifreeze liquid contained in the thermal energy storing unit to the energy exchange unit and to return the antifreeze liquid in the energy exchange unit back to the thermal energy storing unit.
- The thermoelectric semiconductor device is disposed in the second compartment, and is in thermal contact with the thermal energy storing unit.
- The turbulence unit includes first and second fans mounted in the first and second mounting holes in the housing body, respectively.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
-
FIG. 1 is an assembled schematic partly sectional view of the preferred embodiment of an air cooling/heating device according to the present invention; and -
FIG. 2 is an electric circuit diagram of a power supply unit according to the preferred embodiment. - As shown in
FIG. 1 , the preferred embodiment of an air cooling/heating device according to the present invention includes ahousing unit 1, a thermalenergy storing unit 3, anenergy exchange unit 4, apump 5, a thermoelectric semiconductor device 6, a heat guide 7, aturbulence unit 8, and apower supply unit 2. - The
housing unit 1 includes ahousing body 11, and apartition plate 14 disposed in and connected to thehousing body 11 such that thepartition plate 14 divides an interior of thehousing body 11 into first andsecond compartments housing body 11 is formed with afirst opening 111 and afirst mounting hole 112 in spatial communication with thefirst compartment 12. Thehousing body 11 is further formed with asecond opening unit 113 and asecond mounting hole 114 in spatial communication with thesecond compartment 13. In this embodiment, thesecond opening unit 113 includes second andthird openings second mounting hole 114 is disposed between the second andthird openings housing unit 1 further includesseveral air filters 18 that are disposed to cover the first, second andthird openings - The thermal
energy storing unit 3 is mounted to thepartition plate 14 of thehousing unit 1, is disposed in thefirst compartment 12, and is adapted to contain antifreeze liquid. In this embodiment, the thermalenergy storing unit 3 is embedded in thepartition plate 14 of thehousing unit 1, and the antifreeze liquid is water mixed with ethylene glycol. - The
energy exchange unit 4 is disposed in thefirst compartment 12, and includes ameandering pipe 41 that is connected to the thermalenergy storing unit 3 to form a closed loop therewith. - The
pump 5 is connected in series to thepipe 41 of theenergy exchange unit 4, and is operable to deliver the antifreeze liquid contained in the thermalenergy storing unit 3 to theenergy exchange unit 4 and to return the antifreeze liquid in theenergy exchange unit 4 back to the thermalenergy storing unit 3. - The thermoelectric semiconductor device 6 is disposed in the
second compartment 13, and has afirst side 61 in thermal contact with the thermalenergy storing unit 3. In this embodiment, thesecond mounting hole 114 is registered with the thermoelectric semiconductor device 6. - The heat guide 7 is disposed in the
second compartment 13, and is fixed to asecond side 62 of the thermoelectric semiconductor device 6 that is opposite to thefirst side 61. In this embodiment, the heat guide 7 is a comb-shaped heat sink. - The
turbulence unit 8 includes first andsecond fans second mounting holes housing body 11, respectively. Thefirst fan 81 is operable to draw air out of thefirst compartment 12, and thesecond fan 82 is operable to draw air into thesecond compartment 13. - The
power supply unit 2 is mounted in thehousing unit 1, and is connected electrically to thepump 5. With further reference toFIG. 2 , thepower supply unit 2 includes a high-voltage low-current circuit, and is responsible for supplying electric power to the various components of the device. - Preferably, a
temperature monitoring unit 9 is attached to the thermalenergy storing unit 3, is connected electrically to thepower supply unit 2, and is used to monitor temperature of the antifreeze liquid in the thermalenergy storing unit 3. - The thermoelectric semiconductor device 6 is operable to absorb heat at one of the first and
second sides second sides first side 61 absorbs thermal energy, and thesecond side 62 dissipates thermal energy. On the other hand, when the air cooling/heating device is operated in a second mode, thesecond side 62 absorbs thermal energy, and thefirst side 61 dissipates thermal energy. - Take the air cooling/heating device working in the heating mode as an example for the following description on operating principles of the air cooling/heating device. With electrical power supplied by the
power supply unit 2, the thermoelectric semiconductor device 6 is capable of producing a stable heat source at thefirst side 61 thereof such that the thermalenergy storing unit 3 is maintained at a heated state. Thepump 5 delivers the heated antifreeze liquid between the thermalenergy storing unit 3 and theenergy exchange unit 4 via thepipe 41 such that temperature of air in thefirst compartment 12 is increased by the heated antifreeze liquid. The heated air is drawn out of thefirst compartment 12 by thefirst fan 81 of theturbulence unit 8. As thefirst fan 81 draws the heated air out of thefirst compartment 12, air from outside of the air cooling/heating device is drawn into thefirst compartment 12 through thefirst opening 111 as a result of air circulation. On the other hand, thesecond side 62 of the thermoelectric semiconductor device 6 absorbs thermal energy via the heat guide 7 such that temperature of air in thesecond compartment 13 is decreased. As thesecond fan 82 of theturbulence unit 8 draws air from outside of the air cooling/heating device into thesecond compartment 13, the cooled air is drawn out of thesecond compartment 13 via the second andthird openings - On the contrary, by reversing the electrical polarity of the thermoelectric semiconductor device 6 such that the
first side 61 produces a cold source and thesecond side 62 dissipates thermal energy, the air cooling/heating device can effectively operate as an air cooler. - In view of the thermoelectric semiconductor device 6, the air cooling/heating device according to the present invention can provide a large power output while having a compact size and consuming a smaller amount of electricity to reduce manufacturing and operating costs.
- While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation and equivalent arrangements.
Claims (9)
1. An air cooling/heating device comprising:
a housing unit including a housing body, and a partition plate disposed in and connected to said housing body such that said partition plate divides an interior of said housing body into first and second compartments, said housing body being formed with a first opening and a first mounting hole in spatial communication with said first compartment, said housing body being further formed with a second opening unit and a second mounting hole in spatial communication with said second compartment;
a thermal energy storing unit mounted to said partition plate of said housing unit, disposed in said first compartment, and adapted to contain antifreeze liquid;
an energy exchange unit disposed in said first compartment, and including a pipe that is connected to said thermal energy storing unit to form a closed loop therewith;
a pump connected in series to said pipe of said energy exchange unit, and operable to deliver the antifreeze liquid contained in said thermal energy storing unit to said energy exchange unit and to return the antifreeze liquid in said energy exchange unit back to said thermal energy storing unit;
a thermoelectric semiconductor device disposed in said second compartment, and having a first side in thermal contact with said thermal energy storing unit; and
a turbulence unit including first and second fans mounted in said first and second mounting holes in said housing body, respectively.
2. The air cooling/heating device as claimed in claim 1 , further comprising a power supply unit mounted in said housing unit and connected electrically to said pump.
3. The air cooling/heating device as claimed in claim 1 , further comprising a heat guide disposed in said second compartment, and fixed to a second side of said thermoelectric semiconductor device.
4. The air cooling/heating device as claimed in claim 3 , wherein said heat guide is a comb-shaped heat sink.
5. The air cooling/heating device as claimed in claim 1 , wherein said second mounting hole is registered with said thermoelectric semiconductor device.
6. The air cooling/heating device as claimed in claim 5 , wherein said second opening unit includes second and third openings, and said second mounting hole is disposed between said second and third openings.
7. The air cooling/heating device as claimed in claim 1 , wherein said first fan is operable to draw air out of said first compartment, and said second fan is operable to draw air into said second compartment.
8. The air cooling/heating device as claimed in claim 3 , wherein said thermoelectric semiconductor device is operable to absorb heat at one of said first and second sides, and to dissipate heat at the other one of said first and second sides.
9. The air cooling/heating device as claimed in claim 1 , wherein said thermal energy storing unit is embedded in said partition plate of said housing unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/507,217 US20080041066A1 (en) | 2006-08-21 | 2006-08-21 | Air cooling/heating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/507,217 US20080041066A1 (en) | 2006-08-21 | 2006-08-21 | Air cooling/heating device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080041066A1 true US20080041066A1 (en) | 2008-02-21 |
Family
ID=39100046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/507,217 Abandoned US20080041066A1 (en) | 2006-08-21 | 2006-08-21 | Air cooling/heating device |
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US (1) | US20080041066A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009018741A1 (en) * | 2007-08-03 | 2009-02-12 | Zhiping Wang | A kind of thermoelectric semiconductor air conditioning for refrigerating and heating |
WO2010091531A1 (en) * | 2009-02-10 | 2010-08-19 | 陈健能 | Semiconductor mist-type air-conditioning equipment |
CN102616112A (en) * | 2012-03-31 | 2012-08-01 | 湖南贝特莱尔光电科技有限公司 | Solar vehicle-mounted cooling device |
US9115918B2 (en) | 2012-12-03 | 2015-08-25 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
US9151524B2 (en) | 2012-12-03 | 2015-10-06 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
US9182157B2 (en) | 2012-12-03 | 2015-11-10 | Whirlpool Corporation | On-door ice maker cooling |
US20160226111A1 (en) * | 2015-01-30 | 2016-08-04 | Prodigy Aircraft LLC | Thermal management systems and battery packs including the same |
CN104197452B (en) * | 2014-09-19 | 2017-01-04 | 江苏蓝鑫电子科技有限公司 | A kind of air conditioning system with air-cleaning function |
US9593870B2 (en) | 2012-12-03 | 2017-03-14 | Whirlpool Corporation | Refrigerator with thermoelectric device for ice making |
CN107676892A (en) * | 2016-08-02 | 2018-02-09 | 青岛海尔智能技术研发有限公司 | A kind of air conditioner and control method |
US20220399910A1 (en) * | 2021-06-09 | 2022-12-15 | Siyata Mobile Inc. | Mobile conversion apparatus for docking cellular data devices |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4463569A (en) * | 1982-09-27 | 1984-08-07 | Mclarty Gerald E | Solid-state heating and cooling apparatus |
US5097829A (en) * | 1990-03-19 | 1992-03-24 | Tony Quisenberry | Temperature controlled cooling system |
US5544487A (en) * | 1991-01-15 | 1996-08-13 | Hydrocool Pty Ltd | Thermoelectric heat pump w/hot & cold liquid heat exchange circutis |
-
2006
- 2006-08-21 US US11/507,217 patent/US20080041066A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4463569A (en) * | 1982-09-27 | 1984-08-07 | Mclarty Gerald E | Solid-state heating and cooling apparatus |
US5097829A (en) * | 1990-03-19 | 1992-03-24 | Tony Quisenberry | Temperature controlled cooling system |
US5544487A (en) * | 1991-01-15 | 1996-08-13 | Hydrocool Pty Ltd | Thermoelectric heat pump w/hot & cold liquid heat exchange circutis |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009018741A1 (en) * | 2007-08-03 | 2009-02-12 | Zhiping Wang | A kind of thermoelectric semiconductor air conditioning for refrigerating and heating |
WO2010091531A1 (en) * | 2009-02-10 | 2010-08-19 | 陈健能 | Semiconductor mist-type air-conditioning equipment |
CN102301192A (en) * | 2009-02-10 | 2011-12-28 | 陈健能 | Semiconductor Mist-type Air-conditioning Equipment |
CN102616112A (en) * | 2012-03-31 | 2012-08-01 | 湖南贝特莱尔光电科技有限公司 | Solar vehicle-mounted cooling device |
US10018384B2 (en) | 2012-12-03 | 2018-07-10 | Whirlpool Corporation | On-door ice maker cooling |
US9151524B2 (en) | 2012-12-03 | 2015-10-06 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
US9182157B2 (en) | 2012-12-03 | 2015-11-10 | Whirlpool Corporation | On-door ice maker cooling |
US9593870B2 (en) | 2012-12-03 | 2017-03-14 | Whirlpool Corporation | Refrigerator with thermoelectric device for ice making |
US9791186B2 (en) | 2012-12-03 | 2017-10-17 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
US9115918B2 (en) | 2012-12-03 | 2015-08-25 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
US10352596B2 (en) | 2012-12-03 | 2019-07-16 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
CN104197452B (en) * | 2014-09-19 | 2017-01-04 | 江苏蓝鑫电子科技有限公司 | A kind of air conditioning system with air-cleaning function |
US20160226111A1 (en) * | 2015-01-30 | 2016-08-04 | Prodigy Aircraft LLC | Thermal management systems and battery packs including the same |
CN107676892A (en) * | 2016-08-02 | 2018-02-09 | 青岛海尔智能技术研发有限公司 | A kind of air conditioner and control method |
CN107676892B (en) * | 2016-08-02 | 2020-10-02 | 青岛海尔智能技术研发有限公司 | Air conditioner and control method |
US20220399910A1 (en) * | 2021-06-09 | 2022-12-15 | Siyata Mobile Inc. | Mobile conversion apparatus for docking cellular data devices |
US11949442B2 (en) * | 2021-06-09 | 2024-04-02 | Siyata Mobile Inc. | Mobile conversion apparatus for docking cellular data devices |
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Legal Events
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |