CN210129217U

CN210129217U - Refrigerating system capable of monitoring power consumption immediately

Info

Publication number: CN210129217U
Application number: CN201921577368.9U
Authority: CN
Inventors: 林冠宇
Original assignee: Suzhou Wave Intelligent Technology Co Ltd
Current assignee: Suzhou Wave Intelligent Technology Co Ltd
Priority date: 2019-09-20
Filing date: 2019-09-20
Publication date: 2020-03-06
Anticipated expiration: 2029-09-20

Abstract

The utility model provides a but refrigerating system of instant monitoring consumption, the utility model discloses the consumption that will refrigerate chip module group overlapping voltage regulator is listened, current sensing module and BMC on external server are come through passageways such as I2C or GPIO, current variation and consumption size through acquireing CPU or GPU high fever chip in real time, and adjust and control the intensity of refrigeration chip module according to the current variation, make the system's heat dissipation more timely, in addition can independently do work to single chip and consume the control, give the heat dissipation intensity of different refrigeration chip modules to different consumptions, except promoting its whole radiating efficiency, also save required radiating consumption simultaneously.

Description

Refrigerating system capable of monitoring power consumption immediately

Technical Field

The utility model relates to a refrigeration chip technical field, especially a refrigerating system of can real time monitoring consumption.

Background

Most of the heat dissipation technologies of the existing servers, including the common heat dissipation fins, fans, liquid cooling systems, etc., use the heat conduction characteristics of the materials themselves or the latent heat absorbed by the phase change of the working fluid to carry away the heat of the electronic components, and basically conduct the heat from high temperature to low temperature, which is generally called passive heat dissipation. The heat sink is a material fixed on the surface of the electronic component and used for conducting heat generated by the electronic component to the surroundings. The heat sink generally comprises a base plate directly contacting the electronic component to quickly transfer and dissipate heat to avoid thermal transition concentration, and a plurality of fins to increase the heat dissipation area of the heat sink for further transferring heat dissipated by the base plate.

In addition, another heat dissipation technology is active cooling, which actively transfers heat energy to achieve the function of continuously transferring heat energy from the low temperature end to the high temperature end. A generally known compressor system is one of the active refrigeration devices.

Traditionally, a heat dissipation system of a server relies on a heat sink and a fan to conduct out heat energy on a chip, but the heat dissipation system is often limited by the design of the heat dissipation system on the system, the design on a mechanism is relatively influenced, and the quality of signal routing is more seriously influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a but refrigerating system of real time monitoring consumption aims at solving and relies on fin and fan to dispel the heat the not good problem of radiating effect who leads to among the prior art, realizes adjusting the heat radiation intensity of refrigeration chip in real time according to the consumption value of listening, improves the radiating efficiency.

In order to achieve the above technical purpose, the utility model provides a but refrigerating system of real-time supervision consumption, refrigerating system includes:

the current sensing module and the refrigeration chip module are arranged on the shell;

the current sensing module is arranged in a voltage regulator, and the voltage regulator is respectively connected with the CPU and the BMC and is used for acquiring current and voltage and transmitting the current and voltage values to the BMC;

the BMC is connected with the refrigeration chip module and used for calculating a power consumption value according to the current value and the voltage value and adjusting the current of the refrigeration chip module;

the refrigeration chip module dissipates heat for the CPU or GPU high-heat chip.

Preferably, the BMC is connected with the refrigeration chip module through I2C or GPIO.

Preferably, the voltage regulator is connected with the BMC through I2C.

Preferably, the current sensing module is a current sensor or a resistor.

Preferably, the refrigeration chip is a semiconductor element which is subjected to temperature control through direct current, and the larger the current is, the larger the temperature difference between two surfaces of the chip is.

Preferably, the current of the refrigeration chip flows from the P-type element to the N-type element, and at the P-type element at the hot end, the electrons are captured by the holes and heat is released; at the cold end, the P-type element needs to obtain energy for absorbing heat because electrons are separated from the capture of the electric holes, and the N-type element needs to obtain energy for absorbing heat because electrons break through the blockade of the electrons.

The effects provided in the contents of the present invention are only the effects of the embodiments, not all the effects of the present invention, and one of the above technical solutions has the following advantages or advantageous effects:

compared with the prior art, the utility model discloses the consumption that will refrigerate chip module group overlapping voltage regulator is listened, current sensing module and BMC on external server are come through passageways such as I2C or GPIO, current variation and consumption size through acquireing CPU or GPU high fever chip in real time, and adjust and control the intensity of refrigeration chip module according to current variation, make the system heat dissipation more timely, in addition can independently do the work and consume the control to single chip, give the heat dissipation intensity of different refrigeration chip modules to different consumptions, except promoting its whole radiating efficiency, also save required radiating consumption simultaneously.

Drawings

Fig. 1 is a block diagram of a refrigeration system capable of monitoring power consumption in real time according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a refrigeration chip provided in an embodiment of the present invention.

Detailed Description

In order to clearly illustrate the technical features of the present invention, the present invention is explained in detail by the following embodiments in combination with the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted so as to not unnecessarily limit the invention.

The following describes the refrigeration system capable of monitoring power consumption in real time in detail with reference to the accompanying drawings.

As shown in fig. 1, the utility model discloses a but refrigerating system of instant monitoring consumption, refrigerating system includes:

the current sensing module is arranged in a voltage regulator, and the voltage regulator is respectively connected with the CPU and the BMC and is used for acquiring current and voltage and transmitting the calculated power consumption value to the BMC;

the BMC is connected with the refrigeration chip module and used for adjusting the current of the refrigeration chip module according to the power consumption value;

The utility model discloses a refrigeration chip belong to active refrigeration, though the energy efficiency is not as good as compressor system than COP value yet, nevertheless on the server application, require in the application demand fields such as little volume, low noise, lightweight and accurate accuse temperature, have unique advantage.

As shown in fig. 2, the refrigeration chip of the present invention is a semiconductor device that can be freely cooled, heated and temperature-controlled by direct current, the temperature difference between the two sides of the wafer is affected by the current, the larger the current is, the larger the temperature difference is, the current flows from the P-type device to the N-type device, at the P-type device at the hot end, the electrons are caught by the holes, so the heat is released to heat, at the N-type device at the hot end, the electrons are repelled, so the heat is released to heat; at the cold end, the P-type element needs to obtain energy for absorbing heat because electrons are separated from the capture of the electric holes, and the N-type element needs to obtain energy for absorbing heat because electrons break through the blocking of the electrons, thereby becoming the cold end.

The utility model discloses in, add the refrigeration chip module with above-mentioned refrigeration chip to replace traditional server to rely on fin and fan to come the mode that the heat energy on the chip was derived, borrow by the size and the direction of control direct current electric quantity of passing through, can decide the size and the relative position of inhaling/heat release volume.

A current sensing module is arranged in the design of a voltage regulator of a high-heat chip such as a CPU (Central processing Unit) or a GPU (graphics processing Unit), the current sensing module is a current sensor or a precision resistor, a detection current differential signal is led out from two ends of the current sensing module and transmitted to a BMC (baseboard management controller) through I2C, the current and voltage values on the current sensing module are monitored through the BMC, the power consumption value of load equipment can be calculated, the BMC is connected to a refrigeration chip module through I2C or GPIO (general purpose input/output), the refrigeration chip module is adjusted through the BMC, the current change and the power consumption of the CPU or the GPU high-heat chip are obtained in real time, and the intensity of the refrigeration chip module is.

In addition, the design can independently control the heat dissipation of the single chip, and because different chips have different power consumptions at the same time, the power consumption of the single chip is independently monitored, the heat dissipation of the refrigeration chip module is timely carried out aiming at the respective chip, the temperature monitoring can be timely and more efficient, and the unnecessary power consumption is also reduced.

The utility model discloses with refrigeration chip module group power consumption of lapping voltage regulator listen, current sensing module and BMC on external server are come through passageways such as I2C or GPIO, current variation and consumption size through acquireing CPU or GPU high fever chip in real time, and adjust and control the intensity of refrigeration chip module according to current variation, make the system heat dissipation more timely, in addition can independently do work power consumption control to single chip, give the heat dissipation intensity of different refrigeration chip modules to different consumptions, except promoting its whole radiating efficiency, also save required radiating consumption simultaneously.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A refrigeration system capable of monitoring power consumption on-the-fly, the refrigeration system comprising:

2. The cooling system as claimed in claim 1, wherein the BMC is connected to the cooling chip module through I2C or GPIO.

3. The refrigeration system of claim 1, wherein the voltage regulator is connected to the BMC via I2C.

4. The refrigeration system as recited in claim 1 wherein said current sensing module is a current sensor or a resistor.

5. The refrigeration system as claimed in claim 1, wherein the refrigeration chip is a semiconductor device with temperature control by direct current, and the larger the current is, the larger the temperature difference between two sides of the chip is.

6. The refrigeration system according to claim 5, wherein the current of the refrigeration chip flows from the P-type element to the N-type element, and at the P-type element at the hot end, the electrons are captured by the holes and heat up, and at the N-type element at the hot end, the electrons are repelled by the electrons and heat up; at the cold end, the P-type element needs to obtain energy for absorbing heat because electrons are separated from the capture of the electric holes, and the N-type element needs to obtain energy for absorbing heat because electrons break through the blockade of the electrons.