CN204966961U - High -efficient compact laser instrument heat abstractor - Google Patents
High -efficient compact laser instrument heat abstractor Download PDFInfo
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- CN204966961U CN204966961U CN201520779141.8U CN201520779141U CN204966961U CN 204966961 U CN204966961 U CN 204966961U CN 201520779141 U CN201520779141 U CN 201520779141U CN 204966961 U CN204966961 U CN 204966961U
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Abstract
The utility model discloses a high -efficient compact laser instrument heat abstractor, include: the refrigerant compressor arrangement, condenser, throttling arrangement and the evaporimeter that form an airtight return circuit is connected gradually through the pipeline, refrigerant compressor arrangement for enter after sucking the refrigerant and compressing into the refrigerant high pressure and high temperature's steam the condenser, the condenser for the steam that makes high pressure and high temperature is exothermic to coolant, and the condensation becomes high -pressure cryogenic liquids, throttling arrangement for change the microthermal liquid refrigerant of high pressure into low pressure cryogenic liquids, evaporimeter, the microthermal liquid refrigerant of low pressure absorb in the evaporimeter by behind the heat of cooling object, gasify into the microthermal steam of low pressure, are sucked by refrigerant compressor arrangement again, be provided with a plurality of laser element on the evaporimeter. The utilization of this device is evaporated endothermal principle and is dispelled the heat to laser element, and the radiating efficiency is high.
Description
Technical field
The utility model relates to a kind of heat abstractor.More specifically, a kind of heat radiating device for laser of high-efficiency compact is related to.
Background technology
The heat abstractor of laser has a great impact for raising energy of lasers conversion efficiency, in Laser Devices operation process, if the heat produced when can get rid of work in time, just can obtain efficient RF electro-optical efficiency, improve laser and stabilized lasers power output.Present stage, in some large-power semiconductor laser modules, usually need using cooling water as refrigerant cooling laser device, and water cooling plant volume is large, transport inconvenience, be unfavorable for the miniaturization of laser module, limit the application of the laser module of relatively high power, such as, be applied in laser television.In the semiconductor laser module of some middle low powers, normal heat pipe conjunction with semiconductors refrigerator (TEC) that adopts freezes, but TEC refrigerating efficiency is low, and the hot junction of TEC also needs good heat radiation, otherwise refrigerating efficiency can reduce further.
Therefore, need to provide the high device of a kind of radiating efficiency of miniaturization to cool laser.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of heat radiating device for laser of high-efficiency compact, this heat abstractor low-profile and radiating efficiency is high.
For solving the problems of the technologies described above, the utility model adopts following technical proposals:
A heat radiating device for laser for high-efficiency compact, comprising: be in turn connected to form the refrigerant compressing device of a closed loop, condenser, throttling arrangement and evaporator by pipeline;
Described refrigerant compressing device, for sucking refrigerant and entering described condenser after refrigerant being compressed into the steam of high pressure-temperature;
Described condenser, for making the steam of high pressure-temperature to coolant heat release, is condensed into high pressure low temperature liquid;
Described throttling arrangement, for changing into low pressure, low temperature liquid by the liquid coolant of high pressure low temperature;
Described evaporator, the liquid coolant of low-pressure low-temperature is gasificated into the steam of low-pressure low-temperature, then is sucked by refrigerant compressing device absorb the heat of the object that is cooled in evaporator after;
Described evaporator is provided with some laser elements.
Preferably, described evaporator is plate-like structure, and its inside offers passage, and described laser element is arranged on the evaporator surface corresponding with described passage.
Preferably, the shape of described passage is U-shaped, and its inside also offers the microchannel for increasing refrigerant and evaporator contact area.
Preferably, described evaporator comprises the cold drawing of plate-like structure and the pipeline embedded in described cold drawing.
Preferably, the shape of described pipeline is U-shaped.
Preferably, this heat abstractor also comprises one and is arranged on temperature-measuring part on described evaporator or condenser, and described refrigerant compressing device regulates compression speed according to this temperature-measuring part.
Preferably, heat conduction elargol or heat-conducting silicone grease is filled with between the surface of described evaporator and laser element.
Preferably, described refrigerant compressing device is by compressor.
Preferably, described throttling arrangement is capillary.
Preferably, the material of described evaporator is aluminium alloy.
The beneficial effects of the utility model are as follows:
The utility model utilizes the principle of evaporation endothermic to dispel the heat to laser element, and radiating efficiency is high, and refrigerant compressing device also Miniaturizable, thus make this heat abstractor integral miniaturization.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
Fig. 1 illustrates schematic diagram of the present utility model.
Fig. 2 illustrates structural representation of the present utility model.
Embodiment
In order to be illustrated more clearly in the utility model, below in conjunction with preferred embodiments and drawings, the utility model is described further.Parts similar in accompanying drawing represent with identical Reference numeral.It will be appreciated by those skilled in the art that specifically described content is illustrative and nonrestrictive below, protection range of the present utility model should do not limited with this.
Schematic diagram of the present utility model as shown in Figure 1, a kind of heat radiating device for laser of high-efficiency compact comprises and is in turn connected to form a closed loop by pipeline: refrigerant compressing device 1, condenser 2, throttling arrangement 3 and evaporator 4, refrigerant compressing device 1 sucks refrigerant and enters condenser 2 after refrigerant being compressed into the steam of high pressure-temperature, the refrigerant steam of HTHP is condensed into high pressure low temperature liquid in condenser 2, the liquid refrigerants of high pressure low temperature is by changing into the liquid of low-pressure low-temperature after throttling arrangement 3, the liquid refrigerants of low-pressure low-temperature is gasificated into the steam of low-temp low-pressure absorb the heat of the object that is cooled in evaporator 4 after, again sucked by refrigerant compressing device 1, thus complete and once circulate.
In the present embodiment as shown in Figure 2, refrigerant compressing device 1 is light duty compressor, condenser 2 is the radiator with fan, throttling arrangement 3 is capillary, the cold drawing 41 that evaporator 4 comprises plate-like structure and the U-shaped copper pipe 42 embedded in cold drawing 41, position corresponding with U-shaped copper pipe 42 on the surface of cold drawing 41 is provided with several laser elements 5, is filled with heat conduction elargol between laser element 5 and cold drawing 41.Refrigerant is after refrigerant compressing device 1 compresses, the gas coolant of high pressure-temperature is discharged by the outlet of refrigerant compressing device 1, the entrance of condenser 2 is connected to by pipeline, fully dispel the heat through condenser 2, refrigerant is cooled to the gas of cryogenic high pressure, throttling arrangement 3 porch is connected to by pipeline, refrigerant produces pressure drop at the entrance and exit place of throttling arrangement 3, refrigerant is by liquefaction after throttling arrangement 3, the entrance of U-shaped copper pipe 42 is connected to through pipeline, refrigerant is evaporation endothermic in U-shaped copper pipe 42, the heat that the semiconductor laser element 5 be attached on cold drawing 41 distributes is taken away, refrigerant enters the entrance of compressor through the outlet of U-shaped copper pipe 42, complete and once circulate.On cold drawing 41, be also provided with temperature-measuring part in this device, the numerical value that refrigerant compressing device 1 can record according to temperature-measuring part regulates compression speed, ensures the normal working temperature of laser element 5.For ensureing heat conduction velocity, cold drawing 41 adopts aluminum alloy materials to make.It should be noted that U-shaped copper pipe 42 may also be snakelike shape.
In another implementation column, evaporator 3 only comprises cold drawing 41, cold drawing 41 inside offers U-shaped passage, the import of U-shaped passage is connected with the outlet of throttling arrangement 3, the outlet of U-shaped passage is connected with the import of refrigerant compressing device 1, in order to increase the contact area of refrigerant and cold drawing 41, U-shaped channel interior is also provided with microchannel.All the other structures are identical with the first embodiment.
Obviously; above-described embodiment of the present utility model is only for the utility model example is clearly described; and be not the restriction to execution mode of the present utility model; for those of ordinary skill in the field; can also make other changes in different forms on the basis of the above description; here cannot give exhaustive to all execution modes, every belong to the technical solution of the utility model the apparent change of extending out or variation be still in the row of protection range of the present utility model.
Claims (10)
1. a heat radiating device for laser for high-efficiency compact, comprising: be in turn connected to form the refrigerant compressing device of a closed loop, condenser, throttling arrangement and evaporator by pipeline;
Described refrigerant compressing device, for sucking refrigerant and entering described condenser after refrigerant being compressed into the steam of high pressure-temperature;
Described condenser, for making the steam of high pressure-temperature to coolant heat release, is condensed into high pressure low temperature liquid;
Described throttling arrangement, for changing into low pressure, low temperature liquid by the liquid coolant of high pressure low temperature;
Described evaporator, the liquid coolant of low-pressure low-temperature is gasificated into the steam of low-pressure low-temperature, then is sucked by refrigerant compressing device absorb the heat of the object that is cooled in evaporator after;
It is characterized in that: described evaporator is provided with some laser elements.
2. heat radiating device for laser according to claim 1, is characterized in that: described evaporator is plate-like structure, and its inside offers passage, and described laser element is arranged on the evaporator surface corresponding with described passage.
3. heat radiating device for laser according to claim 2, is characterized in that: the shape of described passage is U-shaped, and its inside also offers the microchannel for increasing refrigerant and evaporator contact area.
4. heat radiating device for laser according to claim 1, is characterized in that: the cold drawing that described evaporator comprises plate-like structure and the pipeline embedded in described cold drawing.
5. heat radiating device for laser according to claim 4, is characterized in that: the shape of described pipeline is U-shaped.
6. heat radiating device for laser according to claim 1, is characterized in that: this heat abstractor also comprises one and is arranged on temperature-measuring part on described evaporator or condenser, and described refrigerant compressing device regulates compression speed according to this temperature-measuring part.
7. heat radiating device for laser according to claim 1, is characterized in that: be filled with heat conduction elargol or heat-conducting silicone grease between the surface of described evaporator and laser element.
8. heat radiating device for laser according to claim 1, is characterized in that: described refrigerant compressing device is by compressor.
9. heat radiating device for laser according to claim 1, is characterized in that: described throttling arrangement is capillary.
10. heat radiating device for laser according to claim 1, is characterized in that: the material of described evaporator is aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520779141.8U CN204966961U (en) | 2015-10-09 | 2015-10-09 | High -efficient compact laser instrument heat abstractor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520779141.8U CN204966961U (en) | 2015-10-09 | 2015-10-09 | High -efficient compact laser instrument heat abstractor |
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| CN204966961U true CN204966961U (en) | 2016-01-13 |
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| CN201520779141.8U Active CN204966961U (en) | 2015-10-09 | 2015-10-09 | High -efficient compact laser instrument heat abstractor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104360A (en) * | 2017-07-13 | 2017-08-29 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
| CN111366830A (en) * | 2020-03-17 | 2020-07-03 | 苏州长光华芯光电技术有限公司 | Semiconductor laser low temperature testing arrangement |
| CN112954969A (en) * | 2021-02-03 | 2021-06-11 | 上海玖热智能科技有限公司 | Compact power device heat dissipation system and working method |
| CN115579714A (en) * | 2022-11-17 | 2023-01-06 | 济南邦德激光股份有限公司 | Laser device heat abstractor and laser device |
-
2015
- 2015-10-09 CN CN201520779141.8U patent/CN204966961U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104360A (en) * | 2017-07-13 | 2017-08-29 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
| CN107104360B (en) * | 2017-07-13 | 2019-06-07 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
| CN111366830A (en) * | 2020-03-17 | 2020-07-03 | 苏州长光华芯光电技术有限公司 | Semiconductor laser low temperature testing arrangement |
| CN112954969A (en) * | 2021-02-03 | 2021-06-11 | 上海玖热智能科技有限公司 | Compact power device heat dissipation system and working method |
| CN115579714A (en) * | 2022-11-17 | 2023-01-06 | 济南邦德激光股份有限公司 | Laser device heat abstractor and laser device |
| CN115579714B (en) * | 2022-11-17 | 2023-03-10 | 济南邦德激光股份有限公司 | Laser device heat abstractor and laser device |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 310018 Zhejiang City, Hangzhou Province Economic and Technological Development Zone, No. 600 Poplar Street, No. 21, room 2, building 107, room Patentee after: HANGZHOU ZHONGKE AURORA TECHNOLOGY Co.,Ltd. Address before: 310018 Zhejiang City, Hangzhou Province Economic and Technological Development Zone, No. 600 Poplar Street, No. 21, room 2, building 107, room Patentee before: Hangzhou Hongshi Technology Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An efficient and compact laser cooling device Effective date of registration: 20220930 Granted publication date: 20160113 Pledgee: Bank of Hangzhou Limited by Share Ltd. science and Technology Branch Pledgor: HANGZHOU ZHONGKE AURORA TECHNOLOGY Co.,Ltd. Registration number: Y2022980017385 |