CN204345964U - Multilevel semiconductor cooling assembly and semiconductor refrigerating equipment - Google Patents
Multilevel semiconductor cooling assembly and semiconductor refrigerating equipment Download PDFInfo
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- CN204345964U CN204345964U CN201420746798.XU CN201420746798U CN204345964U CN 204345964 U CN204345964 U CN 204345964U CN 201420746798 U CN201420746798 U CN 201420746798U CN 204345964 U CN204345964 U CN 204345964U
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- heat dissipating
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- metallic heat
- dissipating part
- chilling plate
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Abstract
The utility model provides a kind of multilevel semiconductor cooling assembly and semiconductor refrigerating equipment.Multilevel semiconductor cooling assembly, comprises multiple semiconductor chilling plate, also comprises multiple metallic heat dissipating part, and described metallic heat dissipating part inside is formed with cavity, is filled with volatile liquid in described cavity; Be provided with described semiconductor chilling plate between adjacent two described metallic heat dissipating parts, described semiconductor chilling plate is attached to the surface of described metallic heat dissipating part.By adopting metallic heat dissipating part, the cold junction of semiconductor chilling plate and hot junction are dispelled the heat, owing to being filled with volatile liquid in the cavity of metallic heat dissipating part, volatile liquid becomes gaseous state and becomes liquid state after catching a cold after being heated, the volatile liquid realized in metallic heat dissipating part realizes self-loopa flowing, effective raising radiating efficiency and ability, and without the need to additionally increasing fan, realize the refrigeration performance that improve multilevel semiconductor cooling assembly, optimize the muting function of semiconductor refrigerating assembly.
Description
Technical field
The utility model relates to refrigerating plant, particularly relates to a kind of multilevel semiconductor cooling assembly and semiconductor refrigerating equipment.
Background technology
At present, refrigeration plant (such as refrigerator, refrigerator, wine cabinet) is electrical equipment conventional in people's daily life, usually have refrigeration system in refrigeration plant, generally refrigeration system is made up of compressor, condenser and evaporimeter, can realize the refrigeration compared with low temperature.But, along with the development of semiconductor refrigerating technology, the refrigeration plant adopting semiconductor chilling plate to carry out freezing also is widely used, but, because the refrigerating capacity of monolithic semiconductor cooling piece is limited, in order to improve refrigerating capacity, usually adopting more semiconductor cooling piece to be stacked and forming semiconductor refrigerating assembly, to improve refrigeration performance; Due to semiconductor chilling plate impact by ambient temperature when freezing, the hot-side heat dissipation of outermost semiconductor chilling plate is limited in one's ability, the refrigerating capacity of each semiconductor chilling plate cannot be utilized fully, and the hot junction being positioned at outermost semiconductor chilling plate needs the extra fan that increases to carry out forced heat radiation, to avoid burning out semiconductor chilling plate, cause that the refrigerating capacity of semiconductor refrigerating assembly in prior art is poor and muting function is poor.
Summary of the invention
Technical problem to be solved in the utility model is: provide a kind of multilevel semiconductor cooling assembly and semiconductor refrigerating equipment, solve the poor and defect that muting function is poor of the refrigerating capacity of semiconductor refrigerating assembly in prior art, realize the refrigeration performance improving multilevel semiconductor cooling assembly, optimize the muting function of semiconductor refrigerating assembly.
The technical scheme that the utility model provides is, a kind of multilevel semiconductor cooling assembly, comprises multiple semiconductor chilling plate, also comprises multiple metallic heat dissipating part, and described metallic heat dissipating part inside is formed with cavity, is filled with volatile liquid in described cavity; Be provided with described semiconductor chilling plate between adjacent two described metallic heat dissipating parts, described semiconductor chilling plate is attached to the surface of described metallic heat dissipating part.
Further, described semiconductor chilling plate is positioned at one end of described metallic heat dissipating part.
Further, the surface area of described metallic heat dissipating part is greater than the surface area of described semiconductor chilling plate.
Further, described volatile liquid is liquid carbon dioxide, liquid ammonia, methyl alcohol or ethanol.
Further, the thickness of described metallic heat dissipating part is 5cm ~ 9cm.
The utility model also provides a kind of semiconductor refrigerating equipment, comprises casing, is provided with inner bag in described casing, also comprises above-mentioned multilevel semiconductor cooling assembly; Be positioned in described multilevel semiconductor cooling assembly outside and the metallic heat dissipating part be connected with the cold junction of semiconductor chilling plate is cold scattering body, described cold scattering body is arranged on described inner bag.
Further, described inner bag is provided with opening, described cold scattering body is arranged in described opening; Or described inner bag is metal courage body, described cold scattering is shown consideration for and is leaned against on described inner bag.
Further, be positioned in described multilevel semiconductor cooling assembly outside and the metallic heat dissipating part be connected with the hot junction of semiconductor chilling plate is radiator, the collet of tubular is formed in described casing, described multilevel semiconductor cooling assembly is arranged in described collet, and the outer surface of described radiator is exposed at outside described collet.
The multilevel semiconductor cooling assembly that the utility model provides and semiconductor refrigerating equipment, by adopting metallic heat dissipating part, the cold junction of semiconductor chilling plate and hot junction are dispelled the heat, owing to being filled with volatile liquid in the cavity of metallic heat dissipating part, volatile liquid becomes gaseous state and becomes liquid state after catching a cold after being heated, after semiconductor chilling plate energising, between adjacent two semiconductor chilling plates in metallic heat dissipating part, volatile liquid is being subject to thermal evaporation rising near the hot junction place of semiconductor chilling plate, and liquefaction of catching a cold near the cold junction place of semiconductor chilling plate declines, the volatile liquid realized in metallic heat dissipating part realizes self-loopa flowing, and further heat radiation will be realized by metallic heat dissipating part in volatile liquid self-loopa flow process, effective raising radiating efficiency and ability, and without the need to additionally increasing fan, realize the refrigeration performance that improve multilevel semiconductor cooling assembly, optimize the muting function of semiconductor refrigerating assembly.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model multilevel semiconductor cooling assembly embodiment one;
Fig. 2 is the structural representation of the utility model multilevel semiconductor cooling assembly embodiment two;
Fig. 3 is the structural representation of the utility model semiconductor refrigerating equipment embodiment.
Detailed description of the invention
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, multilevel semiconductor cooling assembly described in the present embodiment, comprise multiple semiconductor chilling plate 1, also comprise multiple metallic heat dissipating part 2, cavity is formed in described metallic heat dissipating part 2, be filled with volatile liquid in described cavity, wherein volatile liquid is liquid carbon dioxide, liquid ammonia, methyl alcohol or ethanol etc.Be provided with described semiconductor chilling plate 1 between adjacent two described metallic heat dissipating parts 2, described semiconductor chilling plate 1 is attached to the surface of described metallic heat dissipating part 2.
Semiconductor chilling plate 1 is positioned at one end of described metallic heat dissipating part 2, rises, preferably semiconductor chilling plate 1 is arranged on the top of metallic heat dissipating part 2 because volatile liquid forms gas after being heated, can cold scattering fast.Certainly, the quantity of semiconductor chilling plate 1 can be multiple, is arranged on the diverse location of metallic heat dissipating part 2.In order to improve the heat-sinking capability of metallic heat dissipating part 2, the surface area of metallic heat dissipating part 2 is greater than the surface area of described semiconductor chilling plate 1.The thickness of metallic heat dissipating part 2 should at 5cm ~ 9cm, to guarantee that the inner volatile liquid of metallic heat dissipating part 2 can dispel the heat in self-loopa flowing.
Two semiconductor chilling plates are adopted to be described for the multilevel semiconductor cooling assembly described in the present embodiment below:
As shown in Figure 2, multilevel semiconductor cooling assembly described in the present embodiment adopts two semiconductor chilling plates, i.e. first order semiconductor chilling plate 11, second level semiconductor chilling plate 12, simultaneously, multilevel semiconductor cooling assembly described in the present embodiment has three metallic heat dissipating parts, i.e. outer layer metal radiator 21, first order metallic heat dissipating part 22 and second level metallic heat dissipating part 23, is filled with volatile liquid in the internal cavities of outer layer metal radiator 21, first order metallic heat dissipating part 22 and second level metallic heat dissipating part 23; First order semiconductor chilling plate 11 is between outer layer metal radiator 21 and first order metallic heat dissipating part 22, and second level semiconductor chilling plate 12 is between first order metallic heat dissipating part 22 and second level metallic heat dissipating part 23.
When two-stage semiconductor cooler sheet refrigerating plant needs to freeze, first, to being positioned at the additional setting DC voltage of first order semiconductor chilling plate 11, absorb heat in the hot junction that the medial surface 211 of outer layer metal radiator 21 abuts in first order semiconductor chilling plate 11, one side 221 of first order metallic heat dissipating part 22 reclines the cold junction of first order semiconductor chilling plate 11, gas in one side 221 internal cavity of first order metallic heat dissipating part 22, liquid mixture is caught a cold sinking, and gas in the internal cavity of a side 222 of the first order metallic heat dissipating part 22 contacted away from first order semiconductor chilling plate 11, liquid mixture floats because relative temperature is higher, now, be positioned at the gas of first order metallic heat dissipating part 22, liquid mixture is formed and circulates up and down under pressure differential effect, make the gas being positioned at first order metallic heat dissipating part 22, the temperature of liquid mixture reduces fast.
Be positioned at the hot junction of first order semiconductor chilling plate 11, the gas made due to temperature rising in internal cavity of the side 211 of the outer layer metal radiator 21 near first order semiconductor chilling plate 11 place, liquid mixture heat floats, and away from the gas in the internal cavity of the side 212 of the outer layer metal radiator 21 at first order semiconductor chilling plate 11 place, liquid mixture is due to the relatively low gas of temperature, liquid mixture sinks, now, gas in outer layer metal radiator 21, liquid mixture circulates up and down at the descending one-tenth of pressure differential effect, thus make the heat of the release end of heat of first order semiconductor chilling plate 11 be discharged into rapidly gas in whole outer layer metal radiator 21, in liquid mixture, heat is avoided to assemble at the release end of heat of first order semiconductor refrigerating 11 and burn out first order semiconductor refrigerating 11.Gas in outer layer metal radiator 21, the heat in liquid mixture are discharged in external environment condition eventually through outer layer metal radiator 21 outer wall.
Secondly, to the additional setting DC voltage of second level semiconductor chilling plate 12, absorb heat in the hot junction that one side 222 of first order metallic heat dissipating part 22 abuts in second level semiconductor chilling plate 12, the side 231 of the second level metallic heat dissipating part 23 contacted with second level semiconductor chilling plate 12 to decline the gas made in its internal cavity due to the temperature of this side, liquid mixture sinks, and make gas in internal cavity away from a side 232 of the second level metallic heat dissipating part 23 of second level semiconductor chilling plate 12 because temperature is relatively high, liquid mixture floats, gas now in second level metallic heat dissipating part 23, liquid mixture is formed and circulates up and down under pressure differential effect, make the gas being positioned at second level metallic heat dissipating part 23, the temperature of liquid mixture reduces fast.
In the hot junction of second level semiconductor chilling plate 12, one side 222 of the first order metallic heat dissipating part 22 contacted with second level semiconductor chilling plate 12 raises the gas made in internal cavity due to temperature, liquid mixture heat floats, and reduce the gas making in its internal cavity away from a side 221 of the first order metallic heat dissipating part 22 at second level semiconductor chilling plate 12 place due to temperature, liquid mixture sinks, now can accelerate the gas in first order metallic heat dissipating part 22, the liquid mixture circulation up and down that becomes of row, thus make the heat of the cold junction of second level semiconductor chilling plate 12 be discharged into rapidly gas in whole first order metallic heat dissipating part 22, in liquid mixture, heat is avoided to assemble at second level semiconductor chilling plate 12 release end of heat and burn out second level semiconductor chilling plate 12.
By that analogy, third level semiconductor chilling plate and third level metallic heat dissipating part and fourth stage semiconductor chilling plate and fourth stage metallic heat dissipating part etc. can be increased as required, form multilevel semiconductor cooling piece, its principle with describe in the embodiment of above-mentioned Level Two semiconductor cooling piece consistent.
The utility model additionally provides a kind of semiconductor refrigerating equipment, by adopting metallic heat dissipating part, the cold junction of semiconductor chilling plate and hot junction are dispelled the heat, owing to being filled with volatile liquid in the cavity of metallic heat dissipating part, volatile liquid becomes gaseous state and becomes liquid state after catching a cold after being heated, after semiconductor chilling plate energising, between adjacent two semiconductor chilling plates in metallic heat dissipating part, volatile liquid is being subject to thermal evaporation rising near the hot junction place of semiconductor chilling plate, and liquefaction of catching a cold near the cold junction place of semiconductor chilling plate declines, the volatile liquid realized in metallic heat dissipating part realizes self-loopa flowing, and further heat radiation will be realized by metallic heat dissipating part in volatile liquid self-loopa flow process, effective raising radiating efficiency and ability, and without the need to additionally increasing fan, realize the refrigeration performance that improve multilevel semiconductor cooling assembly, optimize the muting function of semiconductor refrigerating assembly.
As shown in Figure 3, the utility model also provides a kind of semiconductor refrigerating equipment, comprises casing 100, is provided with inner bag 101 in described casing 100, also comprises above-mentioned multilevel semiconductor cooling assembly 200; Be positioned in described multilevel semiconductor cooling assembly 200 outside and the metallic heat dissipating part be connected with the cold junction of semiconductor chilling plate 1 is cold scattering body 201, described cold scattering body 201 is arranged on described inner bag 101.
Specifically, multilevel semiconductor cooling assembly 200 in the present embodiment semiconductor refrigerating equipment can adopt the multilevel semiconductor cooling assembly in the utility model multilevel semiconductor cooling assembly embodiment, its concrete structure see the record of the utility model multilevel semiconductor cooling assembly embodiment and accompanying drawing 1, can not repeat them here.
Wherein, be delivered in inner bag 101 by cold efficiently for the ease of cold scattering body 201, inner bag 101 is provided with opening (not shown), described cold scattering body 201 is arranged in described opening; Or described inner bag 101 is metal courage body, and described cold scattering body 201 abuts on described inner bag.In addition, be positioned in multilevel semiconductor cooling assembly 200 outside and the metallic heat dissipating part be connected with the hot junction of semiconductor chilling plate is radiator 202, the collet 102 of tubular is formed in described casing 100, described multilevel semiconductor cooling assembly 200 is arranged in described collet 102, and the outer surface of described radiator 202 is exposed at outside described collet 102.Concrete, the outside being exposed at collet 102 outside the radiator 202 of multilevel semiconductor cooling assembly 200 can guarantee that radiator 202 effectively distributes heat to outside, and the cold that collet 102 can reduce cold scattering body 201 is revealed.
Semiconductor refrigerating equipment described in the present embodiment, the course of work is as follows:
Step 1, judge that semiconductor refrigerating equipment is the need of freezing; If not, then step 2 is performed; If so, then step 3 is performed;
Step 2, the power-off of more semiconductor cooling piece;
Step 3, more semiconductor cooling piece are energized.
Further, described step 2 is specially: the power-off simultaneously of more semiconductor cooling piece, or, direction semiconductor-on-insulator cooling piece interval power-off successively from outside to inside; Described step 3 is specially: more semiconductor cooling piece is energized simultaneously, or, direction semiconductor-on-insulator cooling piece interval energising successively from outside to inside.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (8)
1. a multilevel semiconductor cooling assembly, comprises multiple semiconductor chilling plate, it is characterized in that, also comprises multiple metallic heat dissipating part, and described metallic heat dissipating part inside is formed with cavity, is filled with volatile liquid in described cavity; Be provided with described semiconductor chilling plate between adjacent two described metallic heat dissipating parts, described semiconductor chilling plate is attached to the surface of described metallic heat dissipating part.
2. multilevel semiconductor cooling assembly according to claim 1, is characterized in that, described semiconductor chilling plate is positioned at one end of described metallic heat dissipating part.
3. multilevel semiconductor cooling assembly according to claim 1, is characterized in that, the surface area of described metallic heat dissipating part is greater than the surface area of described semiconductor chilling plate.
4. multilevel semiconductor cooling assembly according to claim 1, is characterized in that, described volatile liquid is liquid carbon dioxide, liquid ammonia, methyl alcohol or ethanol.
5. multilevel semiconductor cooling assembly according to claim 2, is characterized in that, the thickness of described metallic heat dissipating part is 5cm ~ 9cm.
6. a semiconductor refrigerating equipment, comprises casing, is provided with inner bag, it is characterized in that in described casing, also comprise as arbitrary in claim 1-5 as described in multilevel semiconductor cooling assembly; Be positioned in described multilevel semiconductor cooling assembly outside and the metallic heat dissipating part be connected with the cold junction of semiconductor chilling plate is cold scattering body, described cold scattering body is arranged on described inner bag.
7. semiconductor refrigerating equipment according to claim 6, is characterized in that, described inner bag is provided with opening, and described cold scattering body is arranged in described opening; Or described inner bag is metal courage body, described cold scattering is shown consideration for and is leaned against on described inner bag.
8. the semiconductor refrigerating equipment according to claim 6 or 7, it is characterized in that, be positioned in described multilevel semiconductor cooling assembly outside and the metallic heat dissipating part be connected with the hot junction of semiconductor chilling plate is radiator, the collet of tubular is formed in described casing, described multilevel semiconductor cooling assembly is arranged in described collet, and the outer surface of described radiator is exposed at outside described collet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420746798.XU CN204345964U (en) | 2014-12-03 | 2014-12-03 | Multilevel semiconductor cooling assembly and semiconductor refrigerating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420746798.XU CN204345964U (en) | 2014-12-03 | 2014-12-03 | Multilevel semiconductor cooling assembly and semiconductor refrigerating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204345964U true CN204345964U (en) | 2015-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420746798.XU Withdrawn - After Issue CN204345964U (en) | 2014-12-03 | 2014-12-03 | Multilevel semiconductor cooling assembly and semiconductor refrigerating equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN204345964U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105650936A (en) * | 2014-12-03 | 2016-06-08 | 青岛海尔科技有限公司 | Multistage semiconductor refrigerating assembly and semiconductor refrigerating device |
-
2014
- 2014-12-03 CN CN201420746798.XU patent/CN204345964U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105650936A (en) * | 2014-12-03 | 2016-06-08 | 青岛海尔科技有限公司 | Multistage semiconductor refrigerating assembly and semiconductor refrigerating device |
| CN105650936B (en) * | 2014-12-03 | 2018-04-17 | 青岛海尔科技有限公司 | Multilevel semiconductor cooling assembly and semiconductor refrigerating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150520 Effective date of abandoning: 20180417 |