CN206962242U

CN206962242U - A kind of semiconductor laser radiator structure

Info

Publication number: CN206962242U
Application number: CN201720788656.3U
Authority: CN
Inventors: 程根
Original assignee: Shenyang Zhuo Zhuo Laser Medical Instruments Co Ltd
Current assignee: Shenyang Zhuo Zhuo Laser Medical Instruments Co Ltd
Priority date: 2017-07-03
Filing date: 2017-07-03
Publication date: 2018-02-02
Anticipated expiration: 2027-07-03

Abstract

It the utility model is related to field of semiconductor lasers, specifically a kind of semiconductor laser radiator structure, including laser module, TEC, metab, heat pipe, radiating fin and fan, wherein described laser module is arranged at the cold end of TEC, the hot junction of the TEC contacts with the metab, multiple heat pipes are provided with the metab, radiating fin is set with the heat pipe, fan is provided with the radiating fin side.The utility model merges a variety of radiating modes, greatly improves radiating efficiency.

Description

A kind of semiconductor laser radiator structure

Technical field

Field of semiconductor lasers is the utility model is related to, specifically a kind of semiconductor laser radiator structure.

Background technology

The temperature of the life-span of semiconductor laser module and power and laser module is closely related, when temperature is raised, laser The life-span of device can exponentially decline；Meanwhile after temperature rises, the emergent power of laser module can be also decreased obviously, and be ultimately resulted in Power it is unstable.So how to solve the radiating of semiconductor laser, have great importance for the performance for improving laser.

At present, the main heat sink form of laser module has air-cooled and two kinds of water cooling.It is air-cooled be by laser module directly with Fin contacts, and then carries out air blast cooling to fin using fan.The refrigeration of this kind of mode is poor, and laser temperature Can not be constant under a certain design temperature, it is only applicable to less demanding and lower-powered laser application.For stabilized lasers temperature Degree, some schemes can be put into thermoelectric module, the cold end and laser module of thermoelectric module between laser module and fin Contact, hot junction contact with fin, thus the heat of laser module can be delivered into hot junction from cold end, maintain temperature stabilization to exist Design temperature, the design temperature even can be less than environment temperature.But due to common heat sink conducts heat and heat dispersion compared with Difference, cause fin must be made into big, air quantity of fan will also be made big, can be only achieved the radiating effect of needs.Also A kind of water-cooling project, i.e., using micro-channel heat sink liquid SAPMAC method mode, by controlling circulating water flow in heat sink pipeline to reach temperature The purpose of control.But the shortcomings that this refrigerating method is that volume is big, temperature control precision is not high, later maintenance is inconvenient.

Utility model content

The purpose of this utility model is to provide a kind of semiconductor laser radiator structure, merges a variety of radiating modes, greatly It is big to improve radiating efficiency.

The purpose of this utility model is achieved through the following technical solutions：

A kind of semiconductor laser radiator structure, including laser module, TEC, metab, heat pipe, radiating fin Piece and fan, wherein the laser module is arranged at the cold end of TEC, the hot junction of the TEC and the gold Belong to base contacts, multiple heat pipes are provided with the metab, radiating fin are set with the heat pipe, in the radiating Fin side is provided with fan.

The heat pipe is L-shaped, wherein the horizontal side of the heat pipe is embedded on the downside of the hot junction of the TEC, in institute State and be set with radiating fin on the vertical side of heat pipe.

Circular groove landfill heat pipe is dug in the contact position of the metab and TEC, and the heat pipe is adopted with metab Use soldering connection.

The heat pipe upper surface contacts provided with a contact plane with the hot junction of TEC.

The assembling form of the heat pipe and radiating fin is pyramidal structure, and radiating fin is horizontally installed to the perpendicular of the heat pipe Front, the heat pipe afterbody condensation end are higher than evaporation ends.

The blowing direction of the fan is parallel with radiating fin.

Metal heat sink is provided between the TEC cold end and laser module.

The advantages of the utility model is with good effect：

1st, a variety of radiating modes such as the utility model synthesis TEC, metab, heat pipe, radiating fin, fan, Preferable radiating effect in smaller size smaller can be realized, greatly improves radiating efficiency.

2nd, the utility model mounting structure is reliable and stable, substantially without later maintenance.

Brief description of the drawings

Fig. 1 is structural representation of the present utility model.

Wherein, 1 is laser module, and 2 be TEC, and 3 be fixed screw, and 4 be metab, and 5 be heat pipe, and 6 be scattered Hot fin, 7 be fan.

Embodiment

The utility model is described in further detail below in conjunction with the accompanying drawings.

As shown in figure 1, the utility model includes laser module 1, TEC 2, metab 4, heat pipe 5, radiating fin Piece 6 and fan 7, wherein the laser module 1 is arranged at the cold end of TEC 2, the hot junction of the TEC 2 and institute State metab 4 to contact, be provided with multiple heat pipes 5 on the metab 4, in the present embodiment, the heat pipe 5 is L-shaped, and institute The horizontal side for stating heat pipe 5 is embedded in the metab 4 and is arranged on the downside of the hot junction of the TEC 2, the heat The vertical side of pipe 5 is vertically arranged, and radiating fin 6 is set with the vertical side of the heat pipe 5, remote in the radiating fin 6 The side of laser module 1 is provided with fan 7.The laser module 1 and TEC 2 are techniques well known.

In the present embodiment, dig circular groove in the contact position of metab 4 and TEC 2 and fill heat pipe 5, and heat pipe 5 Soldering connection need to be used with metab 4, so both may insure the safe fixation of heat pipe 5, again can be by the heat of metab 4 Amount passes to heat pipe 5 well.The part that heat pipe 5 protrudes plane on metab 4 must be flattened using press and use milling cutter Mill out a contact plane with high surfaces roughness, it is ensured that TEC preferably thermally contacts with metab.

In the present embodiment, the assembling form of the heat pipe 5 and radiating fin 6 is pyramidal structure, i.e. the afterbody of heat pipe 5 (condensation End) it should be higher than that at thermal source (evaporation ends), it so can ensure that the internal working fluid of heat pipe 5 in gravity and the collective effect of capillarity Under can smoothly be back to evaporation ends from condensation end.Radiating fin 6 is carried out using fan 7 air-cooled simultaneously, blowing direction is parallel In the direction of radiating fin 6.

In the present embodiment, the TEC 2 is arranged on the metab 4 by fixed screw 3.In addition in heat Metal heat sink can be installed between the electric cold end of refrigerator 2 and laser module 1, heat sink, the metal heat sink can not also be installed For one piece of metallic plate.

Operation principle of the present utility model is：

The utility model realize cooling procedure be：After TEC 2 is powered, its cold end refrigeration, for cooling down laser Module 1, the heat of the output of laser module 1 and TEC 2 heat of itself have been delivered to the heat of TEC 2 jointly End, a part of heat are taken away by heat pipe 5 and have been delivered to radiating fin 6, and then the wind-force caused by fan 7 is taken away；A part of quilt Metab 4 absorbs and lost.

Claims

A kind of 1. semiconductor laser radiator structure, it is characterised in that：Including laser module (1), TEC (2), metal Base (4), heat pipe (5), radiating fin (6) and fan (7), wherein the laser module (1) is arranged at TEC (2) Cold end, the hot junction of the TEC (2) contact with the metab (4), are provided with the metab (4) multiple Heat pipe (5), radiating fin (6) is set with the heat pipe (5), fan (7) is provided with the radiating fin (6) side.
2. semiconductor laser radiator structure according to claim 1, it is characterised in that：The heat pipe (5) is L-shaped, its Described in the horizontal side of heat pipe (5) be embedded on the downside of the hot junction of the TEC (2), in the vertical side of the heat pipe (5) On be set with radiating fin (6).
3. semiconductor laser radiator structure according to claim 2, it is characterised in that：The metab (4) and heat Circular groove landfill heat pipe (5) is dug in the contact position of electric refrigerator (2), and the heat pipe (5) uses soldering connection with metab (4).
4. semiconductor laser radiator structure according to claim 3, it is characterised in that：Heat pipe (5) upper surface is set There are a contact plane and the hot junction of TEC (2) to contact.
5. semiconductor laser radiator structure according to claim 2, it is characterised in that：The heat pipe (5) and radiating fin The assembling form of piece (6) is pyramidal structure, and radiating fin (6) is horizontally installed to the vertical side of the heat pipe (5), the heat pipe (5) afterbody condensation end is higher than evaporation ends.
6. semiconductor laser radiator structure according to claim 5, it is characterised in that：The blowing side of the fan (7) To parallel with radiating fin (6).
7. semiconductor laser radiator structure according to claim 1, it is characterised in that：The TEC (2) is cold Metal heat sink is provided between end and laser module (1).