CN219301044U

CN219301044U - Miniature refrigerating device

Info

Publication number: CN219301044U
Application number: CN202320877827.5U
Authority: CN
Inventors: 王庭磊
Original assignee: Zero One Thermal Control Technology Shenzhen Co ltd
Current assignee: Zero One Thermal Control Technology Shenzhen Co ltd
Priority date: 2023-04-19
Filing date: 2023-04-19
Publication date: 2023-07-04
Anticipated expiration: 2033-04-19

Abstract

The utility model discloses a miniature refrigerating device, comprising: the shell is internally provided with a superconducting flat heat pipe, a refrigerating sheet radiating chamber and a cooling heat exchange chamber are arranged in the shell corresponding to the superconducting flat heat pipe, a refrigerator component is arranged in the refrigerating sheet radiating chamber, the refrigerator component is arranged on one side of the superconducting flat heat pipe, the cooling heat exchange chamber is provided with a cooling heat exchanger component, and the cooling heat exchanger component is arranged on the other side of the superconducting flat heat pipe; the refrigerator component generates cold energy, the cold energy is transmitted to the cooling heat exchanger component through the superconducting flat heat pipe, and the cooling heat exchanger component is used for processing and outputting cold air.

Description

Miniature refrigerating device

Technical Field

The utility model relates to the technical field of refrigeration, in particular to a miniature refrigeration device.

Background

Refrigeration, also known as freezing, reduces or maintains the temperature of an object below the natural ambient temperature, two ways of achieving refrigeration are natural cooling, namely artificial cooling, natural cooling utilizes natural ice or deep-well water to cool the object, but the refrigeration capacity (i.e., the heat taken away from the object to be cooled) and the refrigeration temperature possibly achieved often cannot meet the production needs, and natural cooling is a heat transfer process. Artificial refrigeration is a unit operation that uses refrigeration equipment to add energy to transfer heat from a low-temperature object to a high-temperature object, which belongs to a thermodynamic process;

at present, when local refrigeration is carried out manually, a fan is generally adopted for refrigeration, and when the manual refrigeration mode is used in hot summer, the fan can not achieve the required refrigeration effect, so that the experience is not strong.

Disclosure of Invention

Aiming at the problems existing in the prior art, the utility model provides a miniature refrigerating device, which can be widely used on human body parts or electric appliances in order to solve the problem that the fan can not achieve the required refrigerating effect.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the miniature refrigerating device comprises a shell, wherein a superconducting flat heat pipe is arranged in the shell, a refrigerating sheet radiating chamber and a cooling heat exchange chamber are arranged in the shell corresponding to the superconducting flat heat pipe, a refrigerator component is arranged in the refrigerating sheet radiating chamber, the refrigerator component is arranged on one side of the superconducting flat heat pipe, a cooling heat exchange component is arranged on the cooling heat exchange chamber, and the cooling heat exchanger component is arranged on the other side of the superconducting flat heat pipe;

the refrigerator component generates cold energy, the cold energy is transmitted to the cooling heat exchanger component through the superconducting flat heat pipe, and the cooling heat exchanger component is used for processing and outputting cold air.

Optionally, the refrigerator assembly includes a cooling fin radiator, a cooling fan, and a semiconductor cooling fin, wherein the cooling fan is disposed on one side of the cooling fin radiator, and the semiconductor cooling fin is disposed on the other side of the cooling fin radiator.

Optionally, the cooling fin radiator is provided with a groove, and the cooling fan is arranged in the groove.

Optionally, the cooling heat exchanger assembly comprises a cooling heat exchanger and a heat exchange fan, and the heat exchange fan is arranged on one side of the cooling heat exchanger.

Optionally, the superconducting flat-plate heat pipe is composed of a closed flat-plate array pipe, working fluid and a toothed capillary structure.

Optionally, the superconducting flat heat pipe is a flat superconducting flat heat pipe or a U-shaped superconducting flat heat pipe.

Optionally, the number of the refrigerator components and the number of the cooling heat exchanger components are at least set to one.

Optionally, a heat insulation block is arranged between the cooling fin heat dissipation chamber and the cooling heat exchange chamber.

Optionally, the shell is provided with two heat dissipation air inlets and two heat dissipation air outlets corresponding to the heat exchange chamber of the refrigerating sheet;

the shell is provided with a cooling air inlet and a cooling air outlet corresponding to the cooling heat exchange chamber.

Optionally, the structure of the shell is a square frame type, a cylinder type or an elliptic cylinder type structure.

The technical scheme of the utility model has the following beneficial effects:

(1) The utility model generates cold energy through the refrigerator component, transmits the cold energy to the cooling heat exchanger component through the superconducting flat heat pipe, and outputs cold air through the cooling heat exchanger component, so that the processing mode can realize that the superconducting flat heat pipe can locally generate the cold energy in the transmission process, particularly under the condition that the shell is also made of materials such as aluminum alloy, carbon steel, SUS and the like, and finally outputs the cold energy through the cooling heat exchanger, thereby realizing the refrigeration effect in local application;

(2) The utility model relates to a refrigerator component cold plate radiator, a refrigerating fan and a semiconductor refrigerating plate, which are designed in such a way that under the condition that a power supply provides voltage for the semiconductor refrigerating plate, cold energy can be continuously generated, and under the cooperation of the refrigerating fan, the cold plate radiator, a cooling air inlet and a cooling air outlet, heat generated by the semiconductor refrigerating plate is output through the cooling air outlet, and the part of the semiconductor refrigerating plate, which generates heat, is absorbed by external cold air through the refrigerating fan to dissipate heat;

(3) The shell is arranged as the cooling fin heat dissipation chamber and the cooling heat exchange chamber, so that the cooling fin heat dissipation chamber and the cooling heat exchange chamber can be mutually interfered.

Drawings

FIG. 1 is an overall block diagram of the present utility model;

FIG. 2 is a schematic diagram showing the structure of a heat dissipation air outlet, a heat dissipation air inlet, a cooling air inlet and a cooling air outlet according to the present utility model;

FIG. 3 is a schematic view of a cylindrical or elliptical column structure of a housing according to the present utility model;

FIG. 4 is a schematic diagram of a refrigerator assembly according to the present utility model;

FIG. 5 is a schematic view of another view of the refrigerator assembly of the present utility model;

FIG. 6 is a schematic view of a cooling heat exchanger assembly of the present utility model;

FIG. 7 is a schematic diagram of the present utility model showing the number of refrigerator modules and the number of cooling heat exchanger modules in a single and superconducting flat heat pipe configuration;

FIG. 8 is a schematic diagram of a heat pipe structure with two chiller assemblies and one cooling heat exchanger assembly according to the present utility model;

FIG. 9 is a schematic diagram of another embodiment of the present utility model with two chiller assemblies and two cooling heat exchanger assemblies and superconducting flat heat pipes.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, a first feature is "on" or "to a second feature unless explicitly specified and defined otherwise

"under" may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Referring to fig. 1, the present utility model provides a micro refrigeration apparatus, comprising:

the miniature refrigerating device comprises a shell 1, wherein a superconducting flat heat pipe 5 is arranged in the shell 1, a refrigerating sheet radiating chamber 4 and a cooling heat exchange chamber 2 are arranged in the shell 1 corresponding to the superconducting flat heat pipe 5, a refrigerator component 51 is arranged in the refrigerating sheet radiating chamber 4, the refrigerator component 51 is arranged on one side of the superconducting flat heat pipe 5, a cooling heat exchange chamber 2 is provided with a cooling heat exchanger component 21, and the cooling heat exchanger component 21 is arranged on the other side of the superconducting flat heat pipe 5;

the refrigerator assembly 51 generates cold energy, and the cold energy is transmitted to the cooling heat exchanger assembly 21 through the superconducting flat heat pipe 5, and the cooling heat exchanger assembly 21 processes and outputs cold air.

As shown in fig. 4 and 5: in this embodiment, the refrigerator assembly 51 includes a cooling fin radiator 511, a cooling fan 512, and a semiconductor cooling fin 514, wherein the cooling fan 512 is disposed on one side of the cooling fin radiator 511, and the semiconductor cooling fin 514 is disposed on the other side of the cooling fin radiator 511; the cooling fin radiator 511 is provided with a groove, and the cooling fan 512 is arranged in the groove; the shell 1 is provided with a heat radiation air inlet 13, a heat radiation air inlet 14 and a heat radiation air outlet 12 corresponding to the cooling fin heat radiation chamber 4;

specifically, the upper surface and the lower surface of the semiconductor refrigeration piece 514 are both provided with a heat conducting gasket 513, the upper surface of the semiconductor refrigeration piece 514 is respectively fixed below the cold piece radiator through the heat conducting gasket 513, the lower surface of the semiconductor refrigeration piece 514 is connected with the superconductive flat plate heat pipe 5 through the heat conducting gasket 513, and the cold piece radiator 511 can be a radiating fin;

when the semiconductor refrigeration piece 514 is powered, the semiconductor refrigeration piece 514 works, the semiconductor refrigeration piece 514 close to the superconducting flat heat pipe 5 releases cold energy, the back side semiconductor refrigeration piece 514 releases heat, and in order to maintain the working efficiency of the semiconductor refrigeration piece 514, the heat generated by the semiconductor refrigeration piece 514 needs to be dissipated; cold air is sucked into the cooling air from the cooling air inlet 13 and the cooling air inlet 14 through the cooling fan 512 by cooling the cooling fin radiator 511, and is blown to the surface of the cooling fin contacted with the heating side of the semiconductor cooling fin 514, and after heat exchange with the cooling fin, hot air is brought out of the shell 1 through the cooling air outlet 12; this heat exchange process is completed in the cooling fin heat dissipation chamber 4;

as shown in fig. 6: in this embodiment, the cooling heat exchanger assembly 21 includes a cooling heat exchanger 21 and a heat exchange fan 212, and the heat exchange fan 212 is disposed at one side of the cooling heat exchanger 21; the shell 1 is provided with a cooling air inlet 15 and a cooling air outlet 11 corresponding to the cooling heat dissipation chamber 5

Specifically, when the cold generated by the semiconductor refrigerating sheet 514 is transferred to the cooling area through the superconducting flat heat pipe 5, the cold is transferred to the cooling heat exchanger 21 contacted with the superconducting flat heat pipe, and then the cold is taken out of the shell 1 from the cooling air outlet 12; on the other hand, when the hot air enters through the cooling air inlet 13 and flows through the surface of the cooling heat exchanger 21, the hot air exchanges cold with the hot air to be converted into cooled air, and the cooled air is taken out of the shell 1 through the cooling air outlet 12, and the cold air exchange process is completed in the cooling heat exchange chamber 2.

In this embodiment, the superconducting flat heat pipe 5 is composed of a closed flat array pipe, a working fluid and a toothed capillary structure;

wherein, one end of the flat array tube is sealed, the tube is pumped into vacuum of 1.0 x (less than or equal to 10 < -2 >) Pa, then is filled with a proper amount of low boiling point working liquid, and the other end is sealed to manufacture the superconducting flat heat tube 5;

the working solution in the sealed cavity of the superconducting flat heat pipe 5 is subjected to phase change evaporation to form a gaseous state under natural environment conditions, a certain steady saturated vapor pressure is formed, when the refrigerating sheet works, the semiconductor refrigerating sheet 514 transmits cold energy to the superconducting flat heat pipe 5, the saturated vapor pressure in the area is reduced by cooling, the phase change vapor in the high vapor pressure area flows to a low vapor pressure area, the overall saturated vapor pressure in the sealed shell 1 of the superconducting flat heat pipe 5 is reduced, a lower saturated vapor pressure steady state form is formed than before, the temperature of the superconducting flat heat pipe 5 is reduced, the cold energy generated by the semiconductor refrigerating sheet 514 is efficiently transmitted through the change of the saturated vapor pressure of the phase change working solution of the superconducting flat heat pipe 5, and the overall use temperature of the superconducting flat heat pipe 5 is reduced; as the semiconductor cooling fins 514 continue to operate, the temperature of the superconductor flat heat pipe continues to decrease.

As shown in fig. 7 to 9: in the present embodiment, the superconducting flat heat pipe is set as a flat superconducting flat heat pipe 5 or a U-shaped superconducting flat heat pipe 5; the number of the refrigerator modules 51 is set to one or two; the number of the cooling heat exchanger assemblies 21 is set to one or two;

when the number of the refrigerator components 51 is 1 or 2 and the number of the cooling heat exchanger components 21 is 1, the refrigerator components 51 are matched with the flat superconducting flat heat pipe 5 to be used, the refrigerator components 51 are arranged on or below one end of the flat superconducting flat heat pipe 5, and the cooling heat exchanger components 21 are arranged on or below the other end of the flat superconducting flat heat pipe 5;

when the number of the refrigerator assemblies 51 and the number of the cooling heat exchanger assemblies 21 are two, the U-shaped superconducting flat heat pipe is matched for use, the refrigerator assemblies 51 are arranged on the upper surface and the lower surface of one end of the flat superconducting flat heat pipe 5, and the cooling heat exchanger assemblies 21 are arranged on the upper surface and the lower surface of the other end of the flat superconducting flat heat pipe 5

As shown in fig. 1: in this embodiment, an insulating block is disposed between the cooling fin heat dissipation chamber and the cooling heat exchange chamber 2, and specifically, the insulating block is disposed so that the cooling fin heat dissipation chamber and the cooling heat exchange chamber 2 have no interference effect.

As shown in fig. 1 to 3: in this embodiment, the material of the housing 1 is (for example, PE, HDPE, PS, PP, PVC), aluminum alloy (6061, 6063, 5052, etc.), carbon steel, SUS, etc., and the structural shape thereof is mostly a square frame type, a cylinder type or an elliptic cylinder type.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. The miniature refrigerating device is characterized by comprising a shell, wherein a superconducting flat heat pipe is arranged in the shell, a refrigerating sheet radiating chamber and a cooling heat exchange chamber are arranged in the shell corresponding to the superconducting flat heat pipe, a refrigerator component is arranged in the refrigerating sheet radiating chamber, the refrigerator component is arranged on one side of the superconducting flat heat pipe, a cooling heat exchange chamber is provided with a cooling heat exchanger component, and the cooling heat exchanger component is arranged on the other side of the superconducting flat heat pipe;

2. The micro-refrigerator of claim 1, wherein the refrigerator assembly comprises a cooling fin radiator, a cooling fan, and a semiconductor cooling fin, the cooling fan is disposed on one side of the cooling fin radiator, and the semiconductor cooling fin is disposed on the other side of the cooling fin radiator.

3. A micro-refrigeration device according to claim 2, wherein the cooling fin radiator is provided with a recess, and the cooling fan is provided in the recess.

4. The micro refrigeration unit as set forth in claim 1 wherein said cooling heat exchanger assembly includes a cooling heat exchanger, a heat exchange fan, said heat exchange fan being disposed on one side of the cooling heat exchanger.

5. The micro refrigerating device according to claim 1, wherein the superconducting flat-plate heat pipe is composed of a closed flat-plate array pipe, a working fluid and a toothed capillary structure.

6. The micro refrigeration apparatus as set forth in claim 5, wherein said superconducting flat heat pipe is a flat superconducting flat heat pipe or a U-shaped superconducting flat heat pipe.

7. A micro refrigeration unit as set forth in claim 1 wherein said number of refrigerator modules and said number of cooling heat exchanger modules are at least one.

8. A micro refrigeration apparatus as set forth in claim 1 wherein a heat insulating block is provided between said cooling fin heat dissipation chamber and said cooling heat exchange chamber.

9. The micro-refrigeration device according to claim 1, wherein the shell is provided with two heat dissipation air inlets and two heat dissipation air outlets corresponding to the heat exchange chamber of the refrigeration sheet; the shell is provided with a cooling air inlet and a cooling air outlet corresponding to the cooling heat exchange chamber.

10. A micro-refrigeration device according to any one of claims 1 to 9, wherein the housing is configured as a square, cylinder or oval cylinder.