CN111189255A - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN111189255A CN111189255A CN202010073384.5A CN202010073384A CN111189255A CN 111189255 A CN111189255 A CN 111189255A CN 202010073384 A CN202010073384 A CN 202010073384A CN 111189255 A CN111189255 A CN 111189255A
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- CN
- China
- Prior art keywords
- cold
- semiconductor
- water
- guide pipe
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a semiconductor refrigerator, which comprises a semiconductor refrigerating sheet, a cold guide pipe and a fan, wherein the semiconductor refrigerating sheet is arranged on the semiconductor refrigerating sheet; the semiconductor refrigeration sheet is used for generating cold energy at the cold end and transmitting the cold energy to the cold guide pipe; the cold guide pipe is used for emitting the cold energy to form cold air by the air around the cold guide pipe in a cold area; the fan is used for blowing the cold air to a preset area and refrigerating the preset area; the cold end of the semiconductor refrigeration piece is connected with the cold guide pipe, and the fan is arranged on one side of the cold guide pipe. The invention carries out refrigeration by matching the semiconductor refrigeration sheet, the cold guide pipe and the fan without adopting a compressor and a refrigerant, thereby realizing environment-friendly refrigeration.
Description
Technical Field
The invention relates to the technical field of thermoelectricity, in particular to a semiconductor refrigerator.
Background
Due to the daily productive activities of humans, the earth has gradually started to become warm, resulting in frequent extreme weather. Wherein high-temperature weather is often abused, so that the air conditioner becomes a necessary household appliance in summer. The traditional air conditioner compresses a refrigerant (generally Freon) by a compressor, liquefies the refrigerant by a condenser (a heat radiation process) and gasifies the refrigerant by an evaporator (a heat absorption process), and finally achieves a refrigeration effect.
However, the compressor generally consumes a large amount of energy, and once a refrigerant such as freon used in an air conditioner leaks, the refrigerant will damage the ozone layer, and the greenhouse effect will be aggravated. Therefore, the human beings urgently need an energy-saving, low-carbon and environment-friendly refrigeration device.
Disclosure of Invention
In view of the defects in the prior art, the invention aims to provide a semiconductor refrigerator.
The semiconductor refrigerator provided by the invention comprises a semiconductor refrigerating sheet, a cold guide pipe and a fan;
the semiconductor refrigeration sheet is used for generating cold energy at the cold end and transmitting the cold energy to the cold guide pipe;
the cold guide pipe is used for emitting the cold energy to form cold air by the air around the cold guide pipe in a cold area;
the fan is used for blowing the cold air to a preset area and refrigerating the preset area; the cold end of the semiconductor refrigeration piece is connected with the cold guide pipe, and the fan is arranged on one side of the cold guide pipe.
Preferably, the thermoelectric generator further comprises a heat conducting sheet, a semiconductor thermoelectric generating sheet and a cooling system;
one side end of the heat conducting sheet is attached to the hot end of the semiconductor refrigerating sheet, and the other side end of the heat conducting sheet is attached to the hot end of the semiconductor thermoelectric generation sheet;
the cold end of the semiconductor thermoelectric power generation piece is refrigerated through a cooling system, so that power generation temperature difference is formed between the cold end and the hot end of the semiconductor thermoelectric power generation piece, and direct current is generated.
Preferably, the cooling system comprises a water cooling pipe, a water pump and a water tank;
one end of the water-cooling pipe is communicated with the water outlet of the water tank, and the other end of the water-cooling pipe is communicated with the water inlet of the water pump; the water inlet of the water pump is communicated with the water inlet of the water tank;
the water cooling pipe, the water pump and the water tank form a water cooling circulation system;
the water-cooling pipe is attached to the cold end of the semiconductor thermoelectric generation piece.
Preferably, the device also comprises a voltage stabilizing module and the storage battery;
the voltage stabilizing module is used for stabilizing the direct current generated by the semiconductor thermoelectric generation chip;
the storage battery is used for storing the direct current.
Preferably, the water-cooling pipe is made of a copper pipe;
preferably, the semiconductor refrigeration piece is connected with a power supply and used for converting electric energy provided by the power supply into cold energy emitted at a cold end.
Compared with the prior art, the invention has the following beneficial effects:
the semiconductor refrigeration device refrigerates by matching the semiconductor refrigeration sheet, the cold guide pipe and the fan without adopting a compressor and a refrigerant, so that environment-friendly refrigeration is realized;
according to the semiconductor thermoelectric power generation device, the cold end of the semiconductor thermoelectric power generation piece is used for refrigerating, the hot end of the semiconductor thermoelectric power generation piece receives the temperature difference formed by the heat generated by the semiconductor refrigeration piece for power generation, and the waste heat generated by the semiconductor refrigeration piece can be recycled, so that the effect of waste heat utilization is achieved on the basis of environmental protection.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts. Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of an energy-saving semiconductor refrigerator capable of generating power according to an embodiment of the present invention.
In the figure:
1 is a semiconductor refrigerating sheet;
2 is a semiconductor thermoelectric generation sheet;
3 is a cold guide pipe;
4 is a fan;
5 is a heat conducting sheet;
6 is a water-cooling tube;
7 is a water pump;
and 8 is a water tank.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixation or for circuit connection.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Fig. 1 is a schematic structural diagram of a semiconductor refrigerator in an embodiment of the present invention, and as shown in fig. 1, the semiconductor refrigerator provided by the present invention can not only save energy but also generate electricity, and includes a semiconductor refrigeration sheet 1, a semiconductor thermoelectric generation sheet 2, a cold guide pipe 3, a fan 4, a heat conduction sheet 5, a water cooling pipe 6, a water pump 7, and a water tank 8;
the semiconductor refrigerating sheet 1 is used for generating cold at a cold end and transmitting the cold to the cold guide pipe 3;
the cold guide pipe 3 is used for emitting the cold energy and forming cold air by the air around the cold guide pipe 3 in a cold area;
the fan 4 is used for blowing the cold air to a preset area and refrigerating the preset area; the cold end of the semiconductor refrigeration sheet 1 is connected with the cold guide pipe 3, and the fan 4 is arranged on one side of the cold guide pipe 3.
In the embodiment of the invention, the cold guide pipe 3 is made of copper, iron, aluminum, alloy and other materials, and can be woven into a shape which is easy to release cold, such as a U shape, an S shape and the like. The semiconductor refrigerating sheet 1 is connected with a power supply and used for converting electric energy provided by the power supply into cold energy emitted at a cold end.
In the embodiment of the invention, the semiconductor refrigeration piece 1, the cold guide pipe 3 and the fan 4 are matched for refrigeration, and a compressor and a refrigerant are not needed, so that the environment-friendly refrigeration is realized.
One side end of the heat conducting sheet 5 is attached to the hot end of the semiconductor refrigerating sheet 1, and the other side end of the heat conducting sheet is attached to the hot end of the semiconductor thermoelectric generation sheet 2; the cold end of the semiconductor thermoelectric generation piece 2 is refrigerated through a cooling system, so that a power generation temperature difference is formed between the cold end and the hot end of the semiconductor thermoelectric generation piece 2, and further direct current is generated.
Namely, in the embodiment of the invention, the cold end of the semiconductor thermoelectric generation piece 2 is used for refrigerating, the hot end of the semiconductor thermoelectric generation piece receives the temperature difference formed by the heat generated by the semiconductor refrigeration piece 1 for generating electricity, and the waste heat generated by the semiconductor refrigeration piece 1 can be recycled, so that the effect of waste heat utilization is achieved on the basis of environmental protection
In an embodiment of the present invention, the cooling system includes a water cooling pipe 6, a water pump 7, and a water tank 8;
one end of the water-cooling pipe 6 is communicated with the water outlet of the water tank 8, and the other end of the water-cooling pipe is communicated with the water inlet of the water pump 7; the water inlet of the water pump 7 is communicated with the water inlet of the water tank 8;
the water cooling pipe 6, the water pump 7 and the water tank 8 form a water cooling circulation system;
and the water-cooling pipe 6 is attached to the cold end of the semiconductor thermoelectric generation sheet 2.
In the modification of the present invention, the cooling system may adopt other cooling methods. The water cooling pipe 6 is made of a copper pipe, and can also be made of materials such as aluminum, iron and alloy.
In the embodiment of the invention, the semiconductor refrigerator provided by the invention further comprises a voltage stabilizing module and the storage battery;
the voltage stabilizing module is used for stabilizing the direct current generated by the semiconductor thermoelectric generation chip 2;
the storage battery is used for storing the direct current.
That is, in the embodiment of the present invention, the direct current generated by the semiconductor thermoelectric generation chip 2 is stabilized and stored in the storage battery.
When the semiconductor refrigerator provided by the embodiment of the invention is used, the semiconductor refrigerating sheet 1 provides electric energy through the power supply arranged outside, refrigeration is carried out at the cold end of the semiconductor refrigerating sheet, and the hot end of the semiconductor refrigerating sheet gives out heat. The cold conducting pipe 3 is closely attached to the cold end of the semiconductor refrigerating sheet 1, so that the temperature is rapidly reduced, and surrounding air is cooled to form cold air. Then, the fan 4 blows out cold air at the cold end of the semiconductor refrigeration sheet 1 and the periphery of the cold guide pipe 3, thereby achieving the effect of cooling and refrigeration. The heat produced by the hot end of the semiconductor refrigeration sheet 1 is conducted to the hot end side of the semiconductor thermoelectric generation sheet 2 by the heat conducting sheet 5, and the cold end side of the semiconductor thermoelectric generation sheet 2 jointly forms a water cooling circulation system by the water cooling pipe 6, the low-power water pump 7 and the water tank 8, so that lower temperature is provided for the cold end side of the semiconductor thermoelectric generation sheet 2, and effective power generation temperature difference is formed on two sides of the semiconductor thermoelectric generation sheet 2. Direct current that semiconductor thermoelectric generation piece 2 produced is carried for the battery after through voltage stabilizing module conversion, and the battery can be used for the illumination of charging to reach the purpose of environmental protection and waste heat utilization.
In the embodiment of the invention, the semiconductor refrigeration piece, the cold guide pipe and the fan are matched for refrigeration, and a compressor and a refrigerant are not needed, so that environment-friendly refrigeration is realized; according to the semiconductor thermoelectric power generation device, the cold end of the semiconductor thermoelectric power generation piece is used for refrigerating, the hot end of the semiconductor thermoelectric power generation piece receives the temperature difference formed by the heat generated by the semiconductor refrigeration piece for power generation, and the waste heat generated by the semiconductor refrigeration piece can be recycled, so that the effect of waste heat utilization is achieved on the basis of environmental protection.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (6)
1. A semiconductor refrigerator is characterized by comprising a semiconductor refrigerating sheet, a cold guide pipe and a fan;
the semiconductor refrigeration sheet is used for generating cold energy at the cold end and transmitting the cold energy to the cold guide pipe;
the cold guide pipe is used for emitting the cold energy to form cold air by the air around the cold guide pipe in a cold area;
the fan is used for blowing the cold air to a preset area and refrigerating the preset area; the cold end of the semiconductor refrigeration piece is connected with the cold guide pipe, and the fan is arranged on one side of the cold guide pipe.
2. The semiconductor refrigerator according to claim 1, further comprising a heat conducting sheet, a semiconductor thermoelectric generation sheet, and a cooling system;
one side end of the heat conducting sheet is attached to the hot end of the semiconductor refrigerating sheet, and the other side end of the heat conducting sheet is attached to the hot end of the semiconductor thermoelectric generation sheet;
the cold end of the semiconductor thermoelectric power generation piece is refrigerated through a cooling system, so that power generation temperature difference is formed between the cold end and the hot end of the semiconductor thermoelectric power generation piece, and direct current is generated.
3. The semiconductor chiller according to claim 2, wherein the cooling system comprises a water-cooled tube, a water pump, and a water tank;
one end of the water-cooling pipe is communicated with the water outlet of the water tank, and the other end of the water-cooling pipe is communicated with the water inlet of the water pump; the water inlet of the water pump is communicated with the water inlet of the water tank;
the water cooling pipe, the water pump and the water tank form a water cooling circulation system;
the water-cooling pipe is attached to the cold end of the semiconductor thermoelectric generation piece.
4. The semiconductor refrigerator according to claim 2, further comprising a voltage stabilization module and the storage battery;
the voltage stabilizing module is used for stabilizing the direct current generated by the semiconductor thermoelectric generation chip;
the storage battery is used for storing the direct current.
5. The semiconductor cooler according to claim 3, wherein the water-cooling tube is made of a copper tube.
6. The semiconductor refrigerator of claim 1, wherein the semiconductor chilling plate is connected to a power source for converting electrical energy provided by the power source into chilling energy emitted at the cold end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010073384.5A CN111189255A (en) | 2020-01-20 | 2020-01-20 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010073384.5A CN111189255A (en) | 2020-01-20 | 2020-01-20 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111189255A true CN111189255A (en) | 2020-05-22 |
Family
ID=70708297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010073384.5A Pending CN111189255A (en) | 2020-01-20 | 2020-01-20 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111189255A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115247109A (en) * | 2021-04-27 | 2022-10-28 | 安庆市绿丰园生态农业发展有限公司 | Preparation method and processing equipment of waxberry fruit wine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010001924A1 (en) * | 1999-11-30 | 2001-05-31 | Masato Maehashi | Temperature control system |
| CN204633642U (en) * | 2015-05-26 | 2015-09-09 | 任毅枫 | A kind of semiconductor power generation device |
| CN204923551U (en) * | 2015-09-01 | 2015-12-30 | 蓝思科技（长沙）有限公司 | Semiconductor refrigeration machine |
| CN105299950A (en) * | 2015-11-12 | 2016-02-03 | 华南理工大学 | Solar semiconductor refrigerating system |
| CN106524631A (en) * | 2016-12-20 | 2017-03-22 | 浙江聚珖科技股份有限公司 | Combined semiconductor refrigeration refrigerator |
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
-
2020
- 2020-01-20 CN CN202010073384.5A patent/CN111189255A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010001924A1 (en) * | 1999-11-30 | 2001-05-31 | Masato Maehashi | Temperature control system |
| CN204633642U (en) * | 2015-05-26 | 2015-09-09 | 任毅枫 | A kind of semiconductor power generation device |
| CN204923551U (en) * | 2015-09-01 | 2015-12-30 | 蓝思科技（长沙）有限公司 | Semiconductor refrigeration machine |
| CN105299950A (en) * | 2015-11-12 | 2016-02-03 | 华南理工大学 | Solar semiconductor refrigerating system |
| CN106524631A (en) * | 2016-12-20 | 2017-03-22 | 浙江聚珖科技股份有限公司 | Combined semiconductor refrigeration refrigerator |
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115247109A (en) * | 2021-04-27 | 2022-10-28 | 安庆市绿丰园生态农业发展有限公司 | Preparation method and processing equipment of waxberry fruit wine |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200522 |
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| RJ01 | Rejection of invention patent application after publication |