CN204923551U - Semiconductor refrigeration machine - Google Patents
Semiconductor refrigeration machine Download PDFInfo
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- CN204923551U CN204923551U CN201520672861.4U CN201520672861U CN204923551U CN 204923551 U CN204923551 U CN 204923551U CN 201520672861 U CN201520672861 U CN 201520672861U CN 204923551 U CN204923551 U CN 204923551U
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Abstract
The utility model provides a semiconductor refrigeration machine, it includes temperature control device, heat dissipation layer, semiconductor refrigeration piece, electrically controlled device and refrigeration layer, the heat dissipation layer sets up respectively in the hot junction and the cold junction of semiconductor refrigeration piece with the layer of refrigerating, and temperature control device and electrically controlled device are used for detection and control interior and the heat transfer rate of semiconductor refrigeration machine to the external environment condition of semiconductor refrigeration machine, heat dissipation layer is connected at the fin in semiconductor refrigeration piece hot junction and is set up in the radiator fan in the fin outside including the several, the refrigeration layer including go out an oil pipe, advance oil pipe, cooling tube and several connect the cooling fin at semiconductor refrigeration piece cold junction, it is small that it adopts the semiconductor refrigeration technique to have, and the heat dissipation is fast, and refrigeration effect is good, noiselessness, no environmental pollution to overall structure is simple, and installation and convenient operation, manufacturing cost are showing and reduce, easily the penetration and promotion use, the cooling system complete network that it extensively was applicable to the rotatory precision machine tool main shafts of various high speeds uses.
Description
Technical field
The utility model relates to a kind of semiconductor refrigerator.
Background technology
When the thermocouple centering that one block of N-type semiconductor material and one block of P-type semiconductor material are coupled to have electric current by time, will produce transfer of heat between two ends, heat will transfer to the other end from one end, thus produces the temperature difference and form cold and hot end; Namely the semiconductor chilling plate of outsourcing contains above-mentioned N-type semiconductor material and P-type semiconductor material, during to described semiconductor chilling plate On current, and wherein one end formation hot junction, the other end forms cold junction; In addition, in order to the temperature making whole semiconductor chilling plate reach lower, the modes such as heat radiation can be taked to reduce the temperature in hot junction to make to shift in the timely externally environment of heat.
In glass industry is produced, the rotary main shaft of the equipment such as carving machine, refiner is because mean speed reaches about 30000 revs/min, so the temperature of main shaft is very high must carry out radiating treatment, if the bad main shaft of radiating effect can be easy to damage, and main shaft is the core component of the equipment such as whole carving machine, refiner, its price is also quite expensive; Radiating mode traditional is at present realized to cold oil refrigeration by the mode of a compressor refrigeration, and cold oil flows through main shaft inner U-tube road heat is taken away, and realizes to Spindle's heat emission; But this radiating mode exists a lot of shortcoming: as the cold-producing medium in compressor easily volatilizees the internal bearings quick abrasion of leakage, compressor, easily circuit for generating plate is on fire in a humid environment burns, and this just causes the maintenance cost of equipment high, and production efficiency is low; And the large needs of the volume of compressor take very large space.
Utility model content
For above-mentioned situation, the utility model object is to provide a kind of semiconductor refrigerator, it replaces the mode that compressor+cold-producing medium of the prior art carries out to cold oil freezing, but the semiconductor refrigerator utilizing the utility model to provide freezes to the cooling fluid flowed in main shaft (as cold oil); Its adopts semiconductor refrigerating technology, and to have volume little, rapid heat dissipation, good refrigeration effect, noiselessness, non-environmental-pollution, and overall structure is simple, installs and easy to operate, and manufacturing cost significantly reduces, and is easy to promote the popularization use.
For realizing above-mentioned task, a kind of semiconductor refrigerator, it comprises attemperating unit, heat dissipating layer, semiconductor chilling plate, electric control gear and refrigerating layer; Described heat dissipating layer and refrigerating layer are arranged at hot junction and the cold junction of semiconductor chilling plate respectively, and described attemperating unit and electric control gear are used in semiconductor refrigerator described in detection and control and the heat transfer rate of semiconductor refrigerator externally environment; Described heat dissipating layer comprises several fin being connected to semiconductor chilling plate hot junction and the radiator fan be arranged at outside fin, and described refrigerating layer comprises flowline, oil inlet pipe, refrigerator pipes and several cooling fin being connected to semiconductor chilling plate cold junction; The high temperature coolant entered in described semiconductor refrigerator from oil inlet pipe flow refrigerator pipes and with cooling fin generation heat exchange, and flow out cryogenic liquid from flowline; Described semiconductor chilling plate On current makes heat continue to flow to its hot junction from the cold junction of semiconductor chilling plate, the heat coming from high temperature coolant flows to the cold junction of semiconductor chilling plate from cooling fin through refrigerator pipes, flow to described fin through the hot junction of semiconductor chilling plate again, and by described radiator fan, heat is distributed in external environment condition; Described cooling fluid is cold oil or cooling water.
For realizing the utility model structure, effect optimization, its further step: described several fin is parallel evenly distributed and be all vertically connected at the hot junction of semiconductor chilling plate, described several cooling fin is parallel evenly distributed and be all vertically connected at the cold junction of semiconductor chilling plate.
Described refrigerator pipes is arranged between every two pieces of adjacent cooling fins.
Hot junction and the cold junction of described semiconductor chilling plate all scribble heat-conducting silicone grease.
Appearance and size length × wide × the height of described semiconductor chilling plate is 400mm × 400mm × 4mm.
Described semiconductor chilling plate is connected in the DC circuit of 24V.
Described refrigerator pipes adopts copper alloy or aluminium alloy to be made.
On the thickness direction of described semiconductor chilling plate, the distance of described attemperating unit and electric control gear and described semiconductor chilling plate is 0 ~ 150mm.
Described attemperating unit comprises and is provided with temperature display and networking monitoring module, and realizes the remote monitoring to temperature through networking monitoring module.
The outer surface of described cooling fin is provided with heat-preservation cotton for isolating the contact of cooling fin and external environment condition.
The utility model provides a kind of semiconductor refrigerator, and it comprises attemperating unit, heat dissipating layer, semiconductor chilling plate, electric control gear and refrigerating layer; Described heat dissipating layer and refrigerating layer are arranged at hot junction and the cold junction of semiconductor chilling plate respectively, and described attemperating unit and electric control gear are used in semiconductor refrigerator described in detection and control and the heat transfer rate of semiconductor refrigerator externally environment; Described heat dissipating layer comprises several fin being connected to semiconductor chilling plate hot junction and the radiator fan be arranged at outside fin, and described refrigerating layer comprises flowline, oil inlet pipe, refrigerator pipes and several cooling fin being connected to semiconductor chilling plate cold junction; The high temperature coolant entered in described semiconductor refrigerator from oil inlet pipe flow refrigerator pipes and with cooling fin generation heat exchange, and flow out cryogenic liquid from flowline; Described semiconductor chilling plate On current makes heat continue to flow to its hot junction from the cold junction of semiconductor chilling plate, the heat coming from high temperature coolant flows to the cold junction of semiconductor chilling plate from cooling fin through refrigerator pipes, flow to described fin through the hot junction of semiconductor chilling plate again, and by described radiator fan, heat is distributed in external environment condition; Described cooling fluid is the technical scheme of cold oil or cooling water; It is little that it adopts semiconductor refrigerating technology to have volume, rapid heat dissipation, good refrigeration effect, noiselessness, non-environmental-pollution; And overall structure is simple, to install and easy to operate, manufacturing cost significantly reduces, and is easy to promote the popularization use.
The beneficial effect that the utility model is produced compared to existing technology:
I, the utility model adopts semiconductor refrigerating technology, compares the volume-diminished 5 times of traditional compressor, takes up room little, and installation and maintenance is convenient, easy and simple to handle;
II, the utility model adopts the wearing and tearing of semiconductor refrigerating technology mechanical, noiselessness, without cold-producing medium, reduces the maintenance cost of equipment, and be conducive to protection of the environment;
III, the utility model adopts attemperating unit to be provided with temperature display and networking monitoring module, and can realize the remote monitoring to temperature through networking monitoring module, is conducive to realizing intelligent and automated production, improves production efficiency;
IV, the utility model adopts several fin and cooling fin all respectively in parallel evenly distributed and vertically fit in hot junction and the cold junction of semiconductor chilling plate, this structure rapid heat dissipation and good refrigeration effect, effectively can save the energy loss of 45%;
V, the utility model adopts semiconductor refrigerating technology to have volume little, rapid heat dissipation, good refrigeration effect, noiselessness, non-environmental-pollution; And overall structure is simple, take up room little, to install and easy to operate, manufacturing cost significantly reduces, and improves production efficiency, wide market, is convenient to promote the use of.
The cooling system that the utility model is widely used in various High Rotation Speed precision machine tool main shaft supports the use.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Accompanying drawing explanation
The accompanying drawing forming the application's part is used to provide further understanding of the present utility model, and schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.
Fig. 1 is overall structure schematic diagram of the present utility model.
In figure: 1-attemperating unit, 2-heat dissipating layer, 21-fin, 22-radiator fan, 3-semiconductor chilling plate, 4-electric control gear, 5-refrigerating layer, 51-flowline, 52-oil inlet pipe, 53-refrigerator pipes, 54-cooling fin.
Detailed description of the invention
With reference to accompanying drawing, the utility model is achieved in that a kind of semiconductor refrigerator, and it comprises attemperating unit 1, heat dissipating layer 2, semiconductor chilling plate 3, electric control gear 4 and refrigerating layer 5; Described heat dissipating layer 2 and refrigerating layer 5 are arranged at hot junction and the cold junction of semiconductor chilling plate 3 respectively, and described attemperating unit 1 and electric control gear 4 are in semiconductor refrigerator described in detection and control and the heat transfer rate of semiconductor refrigerator externally environment; Described heat dissipating layer 2 comprises several fin 21 being connected to semiconductor chilling plate 3 hot junction and the radiator fan 22 be arranged at outside fin 21, and described refrigerating layer 5 comprises flowline 51, oil inlet pipe 52, refrigerator pipes 53 and several cooling fin 54 being connected to semiconductor chilling plate 3 cold junction; The high temperature coolant entered in described semiconductor refrigerator from oil inlet pipe 52 flows and with cooling fin 54, heat exchange occurs refrigerator pipes 53, and flows out cryogenic liquid from flowline 51; Described semiconductor chilling plate 3 On current makes heat continue to flow to its hot junction from the cold junction of semiconductor chilling plate 3, the heat coming from high temperature coolant flows to the cold junction of semiconductor chilling plate 3 from cooling fin 54 through refrigerator pipes 53, flow to described fin 21 through the hot junction of semiconductor chilling plate 3 again, and by described radiator fan 22, heat is distributed in external environment condition; Described cooling fluid is cold oil or cooling water.
As shown in Figure 1, several fin of the present utility model 21 is in parallel evenly distributed and be all vertically connected at the hot junction of semiconductor chilling plate 3, described several cooling fin 54 is in parallel evenly distributed and be all vertically connected at the cold junction of semiconductor chilling plate 3, and the outer surface of this cooling fin 54 is provided with heat-preservation cotton for isolating the contact of cooling fin 54 and external environment condition; This structure rapid heat dissipation and good refrigeration effect, find in actual production, adopts semiconductor refrigerator only to need the power of 700W can reach the same refrigeration of the power of traditional compressor 1260W, effectively saved the energy loss of 45%; Described refrigerator pipes 53 is arranged between every two pieces of adjacent cooling fins 54, and this refrigerator pipes 53 preferably adopts copper alloy or aluminium alloy to be made, can effective guarantee refrigeration; Hot junction and the cold junction of described semiconductor chilling plate 3 all scribble heat-conducting silicone grease, and the appearance and size length × wide × height of this semiconductor chilling plate 3 is 400mm × 400mm × 4mm, and this semiconductor chilling plate 3 is connected in the DC circuit of 24V; On the thickness direction of described semiconductor chilling plate 3, described attemperating unit 1 and electric control gear 4 are 0 ~ 150mm with the distance of described semiconductor chilling plate 3, described attemperating unit 1 comprises and is provided with temperature display and networking monitoring module, and realizes the remote monitoring to temperature through networking monitoring module.
By reference to the accompanying drawings, workflow of the present utility model: the high temperature oil in fuel tank flows into refrigerator pipes 53 through oil inlet pipe 52, heat exchange is there is through the high temperature oil of refrigerator pipes 53 and cooling fin 54, the U-tube road on High Rotation Speed lathe in main shaft is entered through flowline 51 after high temperature oil cooling, main shaft is cooled, finally flow back to fuel tank, iterative cycles like this cools the main shaft in High Rotation Speed.
In the utility model, described electric control gear 4 is mainly used in the power (electric current and/or voltage) controlling to be applied on described semiconductor chilling plate 3, thus controls the transfer of heat speed being transferred to hot junction on semiconductor chilling plate 3 by cold junction; Described attemperating unit 1 is mainly used in the temperature measuring cooling fluid in ambient temperature and semiconductor refrigerator, and regulate and control the suitable rate of heat transfer with semiconductor refrigerator externally environment in semiconductor refrigerator together with electric control gear 4 according to the needs of coolant temperature in main shaft; In a kind of concrete embodiment, described attemperating unit 1 and electric control gear 4 are incorporated in same distribution box, described attemperating unit 1 and electric control gear 4 are preferably arranged on the position, high-temperature region in low-temperature space away from cold junction and hot junction, with make attemperating unit 1 and electric control gear 4 stable.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations; All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (10)
1. a semiconductor refrigerator, is characterized in that comprising attemperating unit (1), heat dissipating layer (2), semiconductor chilling plate (3), electric control gear (4) and refrigerating layer (5); Described heat dissipating layer (2) and refrigerating layer (5) are arranged at hot junction and the cold junction of semiconductor chilling plate (3) respectively, and described attemperating unit (1) and electric control gear (4) are in semiconductor refrigerator described in detection and control and the heat transfer rate of semiconductor refrigerator externally environment; Described heat dissipating layer (2) comprises several fin (21) being connected to semiconductor chilling plate (3) hot junction and the radiator fan (22) be arranged at outside fin (21), and described refrigerating layer (5) comprises flowline (51), oil inlet pipe (52), refrigerator pipes (53) and several cooling fin (54) being connected to semiconductor chilling plate (3) cold junction; The high temperature coolant entered in described semiconductor refrigerator from oil inlet pipe (52) flows and with cooling fin (54), heat exchange occurs refrigerator pipes (53), and flows out cryogenic liquid from flowline (51); Described semiconductor chilling plate (3) On current makes heat continue to flow to its hot junction from the cold junction of semiconductor chilling plate (3), the heat coming from high temperature coolant flows to the cold junction of semiconductor chilling plate (3) from cooling fin (54) through refrigerator pipes (53), flow to described fin (21) through the hot junction of semiconductor chilling plate (3) again, and by described radiator fan (22), heat is distributed in external environment condition; Described cooling fluid is cold oil or cooling water.
2. a kind of semiconductor refrigerator according to claim 1, it is characterized in that described several fin (21) is in parallel evenly distributed and be all vertically connected at the hot junction of semiconductor chilling plate (3), described several cooling fin (54) is in parallel evenly distributed and be all vertically connected at the cold junction of semiconductor chilling plate (3).
3. a kind of semiconductor refrigerator according to claim 1, is characterized in that described refrigerator pipes (53) is arranged between every two pieces of adjacent cooling fins (54).
4. a kind of semiconductor refrigerator according to claim 1, is characterized in that the hot junction of described semiconductor chilling plate (3) and cold junction all scribble heat-conducting silicone grease.
5. a kind of semiconductor refrigerator according to claim 1, is characterized in that the appearance and size length × wide × height of described semiconductor chilling plate (3) is 400mm × 400mm × 4mm.
6. a kind of semiconductor refrigerator according to claim 5, is characterized in that described semiconductor chilling plate (3) is connected in the DC circuit of 24V.
7. a kind of semiconductor refrigerator according to claim 1, is characterized in that described refrigerator pipes (53) adopts copper alloy or aluminium alloy to be made.
8. a kind of semiconductor refrigerator according to claim 1, it is characterized in that on the thickness direction of described semiconductor chilling plate (3), described attemperating unit (1) and electric control gear (4) are 0 ~ 150mm with the distance of described semiconductor chilling plate (3).
9. a kind of semiconductor refrigerator according to claim 1, is characterized in that described attemperating unit (1) comprises and is provided with temperature display and networking monitoring module, and realizes the remote monitoring to temperature through networking monitoring module.
10. a kind of semiconductor refrigerator according to claim 1, is characterized in that the outer surface of described cooling fin (54) is provided with heat-preservation cotton for isolating the contact of cooling fin (54) and external environment condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520672861.4U CN204923551U (en) | 2015-09-01 | 2015-09-01 | Semiconductor refrigeration machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520672861.4U CN204923551U (en) | 2015-09-01 | 2015-09-01 | Semiconductor refrigeration machine |
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| Publication Number | Publication Date |
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| CN204923551U true CN204923551U (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520672861.4U Active CN204923551U (en) | 2015-09-01 | 2015-09-01 | Semiconductor refrigeration machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109157088A (en) * | 2018-08-17 | 2019-01-08 | 李嘉程 | Semiconductor refrigerating cup lid |
| CN111189255A (en) * | 2020-01-20 | 2020-05-22 | 上海应用技术大学 | Semiconductor refrigerator |
| CN112234485A (en) * | 2020-10-30 | 2021-01-15 | 江西铜业鑫瑞科技有限公司 | Semiconductor refrigeration cooling system based on circulation heat dissipation |
| CN113594344A (en) * | 2021-07-30 | 2021-11-02 | 浙江珵美科技有限公司 | Refrigeration chip heat dissipation device and use method |
-
2015
- 2015-09-01 CN CN201520672861.4U patent/CN204923551U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109157088A (en) * | 2018-08-17 | 2019-01-08 | 李嘉程 | Semiconductor refrigerating cup lid |
| CN111189255A (en) * | 2020-01-20 | 2020-05-22 | 上海应用技术大学 | Semiconductor refrigerator |
| CN112234485A (en) * | 2020-10-30 | 2021-01-15 | 江西铜业鑫瑞科技有限公司 | Semiconductor refrigeration cooling system based on circulation heat dissipation |
| CN113594344A (en) * | 2021-07-30 | 2021-11-02 | 浙江珵美科技有限公司 | Refrigeration chip heat dissipation device and use method |
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