CN109157088A - Semiconductor refrigerating cup lid - Google Patents
Semiconductor refrigerating cup lid Download PDFInfo
- Publication number
- CN109157088A CN109157088A CN201810945238.XA CN201810945238A CN109157088A CN 109157088 A CN109157088 A CN 109157088A CN 201810945238 A CN201810945238 A CN 201810945238A CN 109157088 A CN109157088 A CN 109157088A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- refrigerating
- cup lid
- plate
- chilling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D1/00—Devices using naturally cold air or cold water
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to a kind of cup lids, more particularly to a kind of semiconductor refrigerating cup lid.Semiconductor refrigerating cup lid includes top cover and lid, is provided with demarcation plate on the downside of the lid portion inside, and fixed plate and control chip are provided on the demarcation plate；Heat dissipating layer, semiconductor chilling plate and refrigerating layer are provided in the fixed plate；The hot end of the semiconductor chilling plate is connect with the heat dissipating layer, and cold end is connect with the refrigerating layer；The refrigerating layer runs through the demarcation plate；The heat dissipating layer includes cooling fin and radiator fan；The radiator fan is set to the top of cooling fin；The semiconductor chilling plate, radiator fan are connect with the control chip；The power interface connecting with control chip is provided on the lid.The present invention does not need any refrigerant, environmentally protective；Can be with continuous work, the service life is long, and install convenient；Its compact, refrigerating speed is fast, high-efficient.
Description
Technical field
The present invention relates to a kind of cup lids, more particularly to a kind of semiconductor refrigerating cup lid.
Background technique
Cup is closely related with daily life, with the continuous improvement of living standards, has reasonable function and sets
Meter is rich in beautiful product increasingly by everybody welcome.In life, vacuum cup is very common, although vacuum cup can also be protected
It is cold, but the time of cold insulation is very short and vacuum cup is mostly aluminum kettle, and collision is easy to paint or generates groove.There are also one on the market
A little refrigeration cups need that entire cup is put into refrigerator freezing in advance, of long duration, and the drink in cup is cooled unevenly, refrigeration effect
Fruit is bad.It is impossible to meet the demands that people drink ice water daily especially summer.
Summary of the invention
In consideration of it, it is an object of the invention to be to overcome the deficiencies of the prior art and provide one kind can be quickly obtained it is cold
Freeze the semiconductor refrigerating cup lid of water.
The technical solution adopted by the present invention to solve the technical problems is: semiconductor refrigerating cup lid includes top cover and lid,
It is provided with demarcation plate on the downside of the lid portion inside, fixed plate and control chip are provided on the demarcation plate；Consolidate in described
Heat dissipating layer, semiconductor chilling plate and refrigerating layer are provided on fixed board；The hot end of the semiconductor chilling plate and the heat dissipation
Layer connection, cold end are connect with the refrigerating layer；The refrigerating layer runs through the demarcation plate；The heat dissipating layer includes dissipating
Backing and radiator fan；The radiator fan is set to the top of cooling fin；The semiconductor chilling plate, radiator fan are equal
It is connect with the control chip；The power interface connecting with control chip is provided on the lid.
Further, for the present invention is better achieved, following setting structures are especially used: the semiconductor chilling plate
It is 400mm × 400mm × 4mm having a size of length × width × height.
Further, for the present invention is better achieved, following setting structures are especially used: the semiconductor chilling plate
Operating voltage is 12VDC.
Further, for the present invention is better achieved, following setting structures are especially used: the semiconductor chilling plate
Hot end and cold end are coated with heat-conducting silicone grease.
Further, for the present invention is better achieved, following setting structures are especially used: the cooling fin for muti-piece,
It is arranged in parallel, and perpendicular to the hot end of semiconductor chilling plate；The refrigerating layer is evenly distributed in parallel, and perpendicular to partly leading
The cold end of body cooling piece.
Further, for the present invention is better achieved, following setting structures: the cooling fin and refrigerating layer are especially used
It is made using copper alloy or aluminium alloy.
Further, for the present invention is better achieved, following setting structures: the cap base and lid are especially used
Top is provided with sheet metal.
Further, for the present invention is better achieved, following setting structures is especially used: being provided in the fixed plate
Fixinig plate.
Further, for the present invention is better achieved, especially use following setting structures: the radiator fan is direct current
Fan.
Further, for the present invention is better achieved, following setting structures: the bottom end setting of the lid are especially used
There is screw thread, and internal engagement has sealing ring.
The beneficial effects of the present invention are: semiconductor chilling plate application " Peltier " effect of the invention is in semiconductor chilling plate
When passing through direct current, heat will be transferred to the other end from one end, so that generating the temperature difference forms hot and cold side, refrigerating layer is set to
Semiconductor chilling plate cold end is simultaneously contacted with liquid, and semiconductor chilling plate holds heat absorption, liquid cooling herein；Cooling fin is set to half
Conductor cooling piece hot end, semiconductor chilling plate holds heat release herein, while cooperating radiator fan, and accelerated heat distributes.The present invention
Any refrigerant is not needed, it is environmentally protective；Can be with continuous work, the service life is long, and install convenient；Its compact, refrigerating speed
Fastly, high-efficient.In the heat-conducting silicone grease that the hot end of semiconductor chilling plate and cold end apply, there is high thermal conductivity, splendid thermal conductivity,
Wider to use temperature, good stability plays heat transfer and the functions such as moisture-proof, dust-proof, anticorrosion, shockproof.Heat dissipation
Piece is made using copper alloy or aluminium alloy, with good thermal conductivity, can be ensured refrigeration refrigeration effect, be reduced simultaneously
Cost.Sheet metal is provided at the top of cap base and lid, when top cover screws clockwise, bottom metal piece and lid top
The contact of portion's sheet metal, circuit conducting, semiconductor chilling plate and radiator fan are started to work, and switch is played the role of.The bottom of lid
End is provided with screw thread, and internal engagement has sealing ring, can be used cooperatively different cups, the sealing ring of cooperation using standard thread
It reveal drink will not, carried convenient for outgoing.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is the required attached drawing used in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of semiconductor refrigerating cup lid of the invention；
Fig. 2 is the schematic diagram of internal structure of semiconductor refrigerating cup lid of the invention；
Fig. 3 is the structural schematic diagram of the power interface of semiconductor refrigerating cup lid of the invention；
In figure, 1-cup lid；2-lids；3-fixed plates；4-semiconductor chilling plates；5-refrigerating layers；6-control chips；
7-cooling fins；8-radiator fans；9-power supplys；10-fixinig plates；11-sealing rings；12-demarcation plates.
Specific embodiment
To make the purpose of the present invention, technical solution and advantage are clearer, will carry out below to technical solution of the present invention
Detailed description.Obviously, described embodiment is only invention a part of the embodiment, rather than comprehensive embodiment.It is based on
The embodiment of the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the range that the present invention is protected.
Embodiment 1:
As shown in Figure 1 to Figure 3, semiconductor refrigerating cup lid of the invention, including top cover 1 and lid 2, in the lid 2
Subordinate side is provided with demarcation plate 12, and fixed plate 3 and control chip 6 are provided on the demarcation plate 12；In the fixed plate 3
It is provided with heat dissipating layer, semiconductor chilling plate 4 and refrigerating layer 5；The hot end of the semiconductor chilling plate 4 and the heat dissipating layer,
Cold end is connect with the refrigerating layer 5；The refrigerating layer 5 runs through the demarcation plate 12；The heat dissipating layer includes heat dissipation
Piece 7 and radiator fan 8；The radiator fan 8 is set to the top of cooling fin 8；The semiconductor chilling plate 4, radiation air
Fan 8 is connect with the control chip 6；The power interface 9 connecting with control chip 6 is provided on the lid 2.This hair
Bright semiconductor refrigerating cup lid, using " Peltier " effect when semiconductor chilling plate 4 passes through direct current, heat will be from one end
It is transferred to the other end, so that generating the temperature difference forms hot and cold side, refrigerating layer 5 is set to 4 cold end of semiconductor chilling plate and and liquid
Contact, semiconductor chilling plate 4 hold heat absorption, liquid cooling herein；Cooling fin 7 is set to 4 hot end of semiconductor chilling plate, semiconductor
Cooling piece 4 holds heat release herein, while cooperating radiator fan 8, and accelerated heat distributes.The present invention does not need any refrigerant, green
Colour circle is protected；Can be with continuous work, the service life is long, and install convenient；Its compact, refrigerating speed is fast, high-efficient.
Embodiment 2:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
It is that length × width × height is 400mm × 400mm × 4mm with following setting structures: the size of the semiconductor chilling plate 4.
Embodiment 3:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
It is 12VDC with following setting structures: the operating voltage of the semiconductor chilling plate 4.In this voltage lower semiconductor cooling piece 4
Refrigerating capacity and the temperature difference in cold end hot end adaptation are best.
Embodiment 4:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
Heat-conducting silicone grease is coated with following setting structures: the hot end of the semiconductor chilling plate 4 and cold end.Heat-conducting silicone grease is led with height
Heating rate, splendid thermal conductivity is wider to use temperature, and good stability plays heat transfer and moisture-proof, dust-proof, anti-corrosion
The functions such as erosion, shockproof.
Embodiment 5:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
With following setting structures: the cooling fin 7 is muti-piece, arranged in parallel, and perpendicular to the hot end of semiconductor chilling plate 4；
The refrigerating layer 5 is parallel evenly distributed, and perpendicular to the cold end of semiconductor chilling plate 4.
Embodiment 6:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
With following setting structures: 7 refrigerating layer 5 of cooling fin is made using copper alloy or aluminium alloy, is led with good
It is hot, can ensure refrigeration refrigeration effect, while reducing cost.
Embodiment 7:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
With following setting structures: being provided with sheet metal at the top of 1 bottom of top cover and lid 2.When top cover 1 screws clockwise,
Bottom metal piece is contacted with 2 top metal piece of lid, and circuit conducting, semiconductor chilling plate 4 and radiator fan 8 are started to work, and is risen
To the effect of switch.
Embodiment 8:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
With following setting structures: being provided with fixinig plate 10 in the fixed plate 3.Fixinig plate 10 is in bridge type, is set under fixed plate 3
Side, for the fixation between fixed plate 3 and cooling fin 7.
Embodiment 9:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
It is DC fan with following setting structures: the radiator fan 8.
Embodiment 10:
Preferably, being advanced optimized on the basis of the above embodiments in order to which the present invention is better achieved, especially adopt
With following setting structures: the bottom end of the lid 2 is provided with screw thread, and internal engagement has sealing ring 11.Using standard thread
It can be used cooperatively different cups, the sealing ring 11 of cooperation reveal drink will not, carry convenient for outgoing.
Upper described, only a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, and it is any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope of appended claims.
Claims (10)
1. semiconductor refrigerating cup lid, it is characterised in that: including top cover (1) and lid (2), the lid (2) inner lower is set
Demarcation plate (12) are equipped with, fixed plate (3) and control chip (6) are provided on the demarcation plate (12)；In the fixed plate (3)
On be provided with heat dissipating layer, semiconductor chilling plate (4) and refrigerating layer (5)；The hot end of the semiconductor chilling plate (4) and described
Heat dissipating layer connection, cold end are connect with the refrigerating layer (5)；The refrigerating layer (5) runs through the demarcation plate (12)；It is described
Heat dissipating layer include cooling fin (7) and radiator fan (8)；The radiator fan (8) is set to the top of cooling fin (8)；Institute
Semiconductor chilling plate (4), the radiator fan (8) stated are connect with the control chip (6)；It is arranged on the lid (2)
There is the power interface (9) connecting with control chip (6).
2. semiconductor refrigerating cup lid according to claim 1, it is characterised in that: the ruler of the semiconductor chilling plate (4)
Very little be length × width × height is 400mm × 400mm × 4mm.
3. semiconductor refrigerating cup lid according to claim 2, it is characterised in that: the work of the semiconductor chilling plate (4)
Making voltage is 12VDC.
4. semiconductor refrigerating cup lid according to claim 2, it is characterised in that: the heat of the semiconductor chilling plate (4)
End and cold end are coated with heat-conducting silicone grease.
5. semiconductor refrigerating cup lid according to claim 1, it is characterised in that: the cooling fin (7) is muti-piece, mutually
It is arranged in parallel, and perpendicular to the hot end of semiconductor chilling plate (4)；The refrigerating layer (5) is parallel evenly distributed, and perpendicular to half
The cold end of conductor cooling piece (4).
6. semiconductor refrigerating cup lid according to claim 5, it is characterised in that: the cooling fin (7) and refrigerating layer (5)
It is made using copper alloy or aluminium alloy.
7. semiconductor refrigerating cup lid according to claim 1, it is characterised in that: top cover (1) bottom and lid (2)
Top is provided with sheet metal.
8. semiconductor refrigerating cup lid according to claim 1, it is characterised in that: be provided in the fixed plate (3) solid
Stator (10).
9. semiconductor refrigerating cup lid according to claim 1, it is characterised in that: the radiator fan (8) is direct current wind
Fan.
10. semiconductor refrigerating cup lid according to claim 1, it is characterised in that: the bottom end of the lid (2) is provided with
Screw thread, and internal engagement has sealing ring (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810945238.XA CN109157088A (en) | 2018-08-17 | 2018-08-17 | Semiconductor refrigerating cup lid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810945238.XA CN109157088A (en) | 2018-08-17 | 2018-08-17 | Semiconductor refrigerating cup lid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109157088A true CN109157088A (en) | 2019-01-08 |
Family
ID=64895958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810945238.XA Pending CN109157088A (en) | 2018-08-17 | 2018-08-17 | Semiconductor refrigerating cup lid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109157088A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203273317U (en) * | 2013-05-31 | 2013-11-06 | 徐境一 | Simple flashlight |
| CN203709731U (en) * | 2014-01-21 | 2014-07-16 | 深圳市中航三鑫光伏工程有限公司 | Refrigerating and heating cup |
| CN204923551U (en) * | 2015-09-01 | 2015-12-30 | 蓝思科技（长沙）有限公司 | Semiconductor refrigeration machine |
| CN204931174U (en) * | 2015-09-23 | 2016-01-06 | 东北石油大学 | Self-service refrigeration cup |
| CN108392046A (en) * | 2018-04-18 | 2018-08-14 | 张华建 | A kind of cup lid with refrigeration |
-
2018
- 2018-08-17 CN CN201810945238.XA patent/CN109157088A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203273317U (en) * | 2013-05-31 | 2013-11-06 | 徐境一 | Simple flashlight |
| CN203709731U (en) * | 2014-01-21 | 2014-07-16 | 深圳市中航三鑫光伏工程有限公司 | Refrigerating and heating cup |
| CN204923551U (en) * | 2015-09-01 | 2015-12-30 | 蓝思科技（长沙）有限公司 | Semiconductor refrigeration machine |
| CN204931174U (en) * | 2015-09-23 | 2016-01-06 | 东北石油大学 | Self-service refrigeration cup |
| CN108392046A (en) * | 2018-04-18 | 2018-08-14 | 张华建 | A kind of cup lid with refrigeration |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190108 |
|
| RJ01 | Rejection of invention patent application after publication |