CN111772445A - Semiconductor constant temperature cup cover based on thermoelectric generation - Google Patents
Semiconductor constant temperature cup cover based on thermoelectric generation Download PDFInfo
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- CN111772445A CN111772445A CN202010736794.3A CN202010736794A CN111772445A CN 111772445 A CN111772445 A CN 111772445A CN 202010736794 A CN202010736794 A CN 202010736794A CN 111772445 A CN111772445 A CN 111772445A
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- semiconductor
- thermoelectric generation
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2205—Drinking glasses or vessels
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2288—Drinking vessels or saucers used for table service with means for keeping liquid cool or hot
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/32—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a semiconductor constant-temperature cup cover based on thermoelectric generation, which comprises a cover body and a cap arranged at the top of the cover body, wherein a constant-temperature unit is arranged in the cover body, and comprises an aluminum liner, a partition plate arranged between the aluminum liner and the inner wall of the cover body, a cold/heat conduction block arranged on the aluminum liner, a thermoelectric generation system, a semiconductor constant-temperature system and a heat dissipation system, wherein the thermoelectric generation system is arranged on the cold/heat conduction block and the partition plate, the semiconductor constant-temperature system is arranged on the cold/heat conduction block, and the heat dissipation system is arranged on the semiconductor constant-temperature system. Compared with the prior art, the thermoelectric power generation technology and the semiconductor refrigeration technology are combined, thermoelectric power generation is effectively utilized, the thermoelectric power generation is stored in the lithium battery after rectification and voltage stabilization of the controller, the lithium battery is used as a power supply to provide working voltage for the semiconductor refrigeration sheet, constant-temperature water is obtained, any refrigerant is not needed, the power supply is saved, and the energy-saving and environment-friendly effects are achieved.
Description
Technical Field
The invention belongs to the technical field of water cups and relates to a semiconductor constant-temperature cup cover based on thermoelectric power generation.
Background
The water cup is closely related to the daily life of people, and along with the continuous improvement of the living standard, the water cup with reasonable functions is more and more popular among people. In life, the thermos cup is very common, though the thermos cup can play the heat preservation effect in a period of time, but can not drink the water of suitable temperature very fast when needs to the thermos cup is generally very expensive, and the time spent heat preservation effect of having a specified duration can descend. At present, some constant-temperature water cups, such as 55-degree cups and the like, are also available in the market, are popular with people, but are expensive, heavy in size and thick in wall, and can only contain a small amount of water every time, so that the requirements of people cannot be met.
The invention discloses a Chinese patent with a publication number of CN108814198A (vacuum cup), which solves the problem that the vacuum cup in the prior art can not rapidly cool water, a heat conducting part is arranged in a vacuum cavity of the vacuum cup, the heat conducting part is connected with or separated from the vacuum cavity, when the vacuum cup needs to keep warm, the heat conducting part in the vacuum cavity of the vacuum cup is set to be separated from the cup wall, the heat transfer in the cup body is isolated, so as to realize the heat preservation effect of the vacuum cup, when the liquid in the cup is urgently drunk, the heat conducting part in the vacuum cavity of the vacuum cup is connected with the cup wall, the heat of the liquid in the cup body is rapidly transferred to the outside of the cup through the heat conducting part, and. But the cup has small volume for containing water, thick wall and heavy weight.
The Chinese patent invention with publication number CN110786697A (heat preservation cup cover and cup) solves the problems of poor heat preservation effect and difficult installation with the cup provided with the cup cover in the prior art, and the inner cover and the outer cover of the cup cover are connected by the hardware snap ring with the barb structure, so that the inner cover and the outer cover are firmly connected, are not easy to loosen and fall off, but only can preserve heat and can not refrigerate.
Disclosure of Invention
The invention aims to provide a semiconductor constant-temperature cup cover based on thermoelectric generation.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a semiconductor constant temperature bowl cover based on thermoelectric generation, this constant temperature bowl cover include the lid and set up the block at the lid top, the lid in be equipped with constant temperature unit, this constant temperature unit includes aluminium inner bag, sets up baffle between the inner wall of aluminium inner bag and lid, set up lead cold/hot piece, thermoelectric generation system, semiconductor constant temperature system and cooling system on the aluminium inner bag, thermoelectric generation system set up and leading on cold/hot piece and baffle, semiconductor constant temperature system set up and leading on cold/hot piece, cooling system set up on semiconductor constant temperature system.
Furthermore, the baffle is lapped on the aluminum inner container, the baffle and the aluminum inner container separate the inner part of the cover body into an upper cavity and a lower cavity, and the cold/heat conduction block, the temperature difference power generation system, the semiconductor constant temperature system and the heat dissipation system are all positioned in the upper cavity.
Further, the diameter of the cold/heat conduction block is gradually reduced from bottom to top.
Further, thermoelectric generation system include thermoelectric generation component, controller and lithium cell, thermoelectric generation component set up on leading cold/hot piece, controller and lithium cell all set up on the baffle, and the controller respectively with thermoelectric generation component, lithium cell electricity be connected.
Furthermore, the semiconductor constant temperature system comprises a first semiconductor refrigeration piece and a second semiconductor refrigeration piece which are respectively arranged on the cold/heat conduction block, and the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are respectively and electrically connected with the controller.
Furthermore, a temperature sensor is also arranged on the cold/heat conduction block, and the controller is electrically connected with the temperature sensor.
Furthermore, the heat dissipation system comprises a vacuum cavity soaking plate arranged on the first semiconductor refrigeration piece and the second semiconductor refrigeration piece, fins arranged on the vacuum cavity soaking plate and a fan arranged above the fins, and the controller is electrically connected with the fan.
Furthermore, the cover body and the cover cap are detachably connected.
Furthermore, the top of the cover body and the bottom of the cover cap are both provided with metal sheets.
Furthermore, the inner side of the bottom of the cover body is provided with threads and a sealing ring.
The invention provides a semiconductor constant-temperature cup cover based on thermoelectric generation.A controller is connected with a first semiconductor refrigerating sheet, a second semiconductor refrigerating sheet, a thermoelectric generation element, a lithium battery, a fan and a (MEMS) temperature sensor through a lead. When the temperature difference exists at the cold end and the hot end of the temperature difference power generation element, current is generated, and the controller is stored in the lithium battery after rectification and voltage stabilization so as to provide working voltage for the semiconductor refrigeration piece and the fan. The upper part of the semiconductor refrigerating sheet is a heat dissipation (cold) layer, and the lower part of the semiconductor refrigerating sheet is a refrigerating (hot) layer; when the water temperature in the cup is higher than (lower than) a threshold value set by the MEMS temperature sensor, the controller outputs a signal, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet switch the positive electrode and the negative electrode at the same time, and the water is cooled (heated) through the cold/heat conducting block and the aluminum liner, so that the constant temperature of the water in the cup is realized; the vapor chamber has the function of temperature equalization, accelerates heat (cold) conduction, and further dissipates heat (cold) through the fins and the fan.
Specifically, in each part of the thermostatic cup cover of the invention:
the thermoelectric generation component is installed in the middle of two semiconductor refrigeration pieces, and the thermoelectric generation component hugs closely the heat source, and when cold and hot both ends had the difference in temperature to exist, the direct current that the thermoelectric generation component produced carries out rectification, steady voltage back storage in the lithium cell through the controller, provides operating voltage for semiconductor refrigeration piece and fan. The thermoelectric power generation element can be selected as a thermoelectric couple, when temperature difference is generated at the cold end and the hot end, the heat movement of a cavity at the hot end of the P-type semiconductor material is higher than that at the cold end, and the cavity is diffused from the high-temperature end to the low-temperature end to form potential difference; the thermal motion of the electrons at the hot end of the N-type semiconductor material is higher than that at the cold end, and then the electrons diffuse from the high-temperature end to the low-temperature end to form a potential difference. In the formed loop, when a temperature difference exists between the two ends of the composite semiconductor material, an electromotive force is generated to form a current.
The controller is installed on the inside right side of lid, and inside is equipped with rectifier circuit, electric capacity, steady voltage charging circuit etc. connects first semiconductor refrigeration piece, second semiconductor refrigeration piece, thermoelectric generation component, lithium cell, fan and MEMS temperature sensor through the wire.
The lithium cell is installed in the inside left side of lid, and the electric energy that mainly functions sent for storage thermoelectric generation component provides operating voltage for semiconductor refrigeration piece and fan. The unit of the lithium battery is milliampere (mAh), and when the capacity of the lithium battery is 1000mA and the output current is 1mA, the current can be output for 1000 h. The lithium battery preferably has a capacity of 100 AH.
One surface of the first semiconductor refrigerating sheet and one surface of the second semiconductor refrigerating sheet are cold surfaces with temperature reduction and heat absorption; the other side is a hot side with temperature rising and heat release, when the water temperature in the cup is higher than (lower than) a threshold value set by the MEMS temperature sensor, the controller outputs signals, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet switch the positive electrode and the negative electrode at the same time, and the temperature of the water in the cup is lowered (raised) through the cold/hot guide block and the metal aluminum inner container, so that the constant temperature of the water in the cup is realized. Preferably, the semiconductor cooling plate has a size of 400mm × 400mm × 4mm (length × width × height) and an operating voltage of 12 VDC.
The semiconductor refrigeration piece is also called as a thermoelectric semiconductor refrigeration assembly, because the refrigeration piece is divided into two sides, one side absorbs heat and is called as a hot side, the other side dissipates heat and is called as a cold side, and the refrigeration piece only plays a heat conduction role and is a heat transfer tool. The semiconductor refrigerating sheet can be applied to occasions with limited space, high reliability requirement and no refrigerant pollution.
The MEMS temperature sensor is arranged between the two semiconductor refrigerating pieces and mainly plays a role in temperature control, and the threshold value of the sensor is 55 ℃.
Compared with the prior art, the invention increases the attaching area of the cold/heat guide block and the metal aluminum inner container, thereby improving the heat exchange efficiency of the cold/heat guide block and the metal aluminum inner container.
The metal aluminum inner container is arranged below the cold/heat conduction block and is mainly used for heating (refrigerating) water.
In particular, the binding surface between the semiconductor refrigeration piece and the cold/heat conduction block is coated with heat conduction silicone grease, so that the heat conduction silicone grease has high heat conduction (cold) rate, excellent heat conductivity, wider use temperature and good stability, and has the functions of heat transfer medium, moisture resistance, dust resistance, corrosion resistance, shock resistance and the like.
The vapor chamber is also called a Vapor Chamber (VC) and is arranged above the semiconductor refrigeration piece, mainly used for transferring heat and has temperature uniformity. After absorbing the heat of the chip, the liquid at the bottom of the vacuum cavity is evaporated and diffused into the vacuum cavity, the heat is conducted to the other end, and then the liquid is condensed to return to the bottom and is conducted by phase change.
The fins are arranged above the vapor chamber and mainly used for conducting heat; the fin is made of copper alloy or aluminum alloy, has good heat conductivity, can ensure the refrigerating and heating effects, and reduces the cost.
The fan is arranged above the fins and mainly used for accelerating the heat (cold) emission.
In particular, the binding surface between the semiconductor refrigeration piece and the vapor chamber is coated with heat-conducting silicone grease, which has high heat (cold) conduction rate, excellent heat conductivity, wider use temperature, good stability, heat transfer medium function, and moisture-proof, dust-proof, corrosion-proof, shock-proof functions, etc.
The block is installed in the top, all is provided with the sheetmetal in block bottom and lid top, and when the block was screwed clockwise, its bottom sheetmetal and lid top sheetmetal contact, and the return circuit switches on, and semiconductor refrigeration piece and radiator fan begin work, play the effect of switch.
The sealing washer is installed inside the lid bottom, and the bottom of lid is provided with the screw thread, and the fit in inside has the sealing washer, adopts standard screw thread can cooperate and use different cups, and the complex sealing washer makes the drink can not reveal, portable going out.
Compared with the prior art, the invention has the following characteristics:
1) the temperature difference power generation technology is combined with the semiconductor refrigeration technology, the temperature difference power generation is effectively utilized, the power is stored in the lithium battery after being rectified and stabilized by the controller, the power is used as a power supply to provide working voltage for the semiconductor refrigeration sheet, constant-temperature water is obtained, any refrigerant is not needed, the power supply is saved, and the energy-saving and environment-friendly effects are achieved;
2) the invention reduces the times of switching the anode and the cathode of the semiconductor refrigerating sheet, increases the time interval and prolongs the service life of the semiconductor refrigerating sheet;
3) the bottom end of the cover body is provided with the threads, the sealing ring is matched in the cover body, different cups can be matched by adopting the standard threads, and the matched sealing ring prevents the beverage from leaking and is convenient to carry when going out;
4) the invention does not need any refrigerant, and is green and environment-friendly. The volume is small, the refrigerating (heating) speed is high, and the efficiency is high;
5) the lithium battery in the invention can be disassembled, and when the electric quantity generated by temperature difference is not enough to provide working voltage for the semiconductor refrigeration sheet and the fan, the battery can be replaced, thus being convenient and practical.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of a thermostatic unit according to the present invention;
FIG. 3 is a schematic structural view of a seal ring according to the present invention;
the notation in the figure is:
the device comprises a cover cap 1, a cover body 2, a cover body 201, an upper cavity body 202, a lower cavity body, a first semiconductor refrigerating sheet 3, a second semiconductor refrigerating sheet 4, a thermoelectric generation element 5, a cold/heat conduction block 6, a vapor chamber 7, a fin 8, a fan 9, an aluminum inner container 10, a controller 11, a lithium battery 12, a partition plate 13, a sealing ring 14 and a temperature sensor 15.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
Example (b):
as shown in figure 1, the semiconductor constant temperature cup cover based on thermoelectric generation comprises a cover body 2 and a cover cap 1 arranged at the top of the cover body 2, wherein a constant temperature unit is arranged in the cover body 2. As shown in fig. 2, the constant temperature unit includes an aluminum inner container 10, a partition plate 13 disposed between the aluminum inner container 10 and an inner wall of the cover body 2, a cold/heat conduction block 6 disposed on the aluminum inner container 10, a thermoelectric generation system, a semiconductor constant temperature system, and a heat dissipation system, the thermoelectric generation system is disposed on the cold/heat conduction block 6 and the partition plate 13, the semiconductor constant temperature system is disposed on the cold/heat conduction block 6, and the heat dissipation system is disposed on the semiconductor constant temperature system.
The partition plate 13 is overlapped on the aluminum inner container 10, the partition plate 13 and the aluminum inner container 10 divide the inside of the cover body 2 into an upper cavity 201 and a lower cavity 202, and the cold/heat conduction block 6, the thermoelectric generation system, the semiconductor constant temperature system and the heat dissipation system are all located in the upper cavity 201.
The diameter of the cold/hot guide block 6 is gradually reduced from bottom to top.
The thermoelectric generation system comprises a thermoelectric generation element 5, a controller 11 and a lithium battery 12, wherein the thermoelectric generation element 5 is arranged on the cold/heat conduction block 6, the controller 11 and the lithium battery 12 are both arranged on a partition board 13, and the controller 11 is respectively electrically connected with the thermoelectric generation element 5 and the lithium battery 12.
The semiconductor constant temperature system comprises a first semiconductor refrigerating sheet 3 and a second semiconductor refrigerating sheet 4 which are respectively arranged on the cold/heat conducting block 6, and the first semiconductor refrigerating sheet 3 and the second semiconductor refrigerating sheet 4 are respectively and electrically connected with the controller 11. The cold/heat conduction block 6 is also provided with a temperature sensor 15, and the controller 11 is electrically connected with the temperature sensor 15.
The heat dissipation system comprises a vacuum cavity soaking plate 7 arranged on the first semiconductor refrigerating sheet 3 and the second semiconductor refrigerating sheet 4, fins 8 arranged on the vacuum cavity soaking plate 7 and a fan 9 arranged above the fins 8, and the controller 11 is electrically connected with the fan 9.
The cover body 2 is detachably connected with the cover cap 1. The top of the cover body 2 and the bottom of the cover cap 1 are both provided with metal sheets.
As shown in fig. 3, a screw and a packing 14 are provided on the inner side of the bottom of the lid body 2.
The constant-temperature cup cover is used for heating and refrigerating water, and when the water in the cup is not enough to contact the aluminum inner container 10 of the cup cover (a small amount of water), the cup cover is inverted, so that the use is convenient and quick. The cup cover can be customized according to the cup mouth of a certain type, the size can be flexibly changed, and the use of the cup cover is not limited to a cup.
The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.
Claims (10)
1. The utility model provides a semiconductor constant temperature bowl cover based on thermoelectric generation, its characterized in that, this constant temperature bowl cover include lid (2) and set up at lid (1) at lid (2) top, lid (2) in be equipped with constant temperature unit, this constant temperature unit includes aluminium inner bag (10), set up baffle (13) between the inner wall of aluminium inner bag (10) and lid (2), lead cold/hot piece (6), thermoelectric generation system, semiconductor constant temperature system and cooling system set up on aluminium inner bag (10), thermoelectric generation system set up on leading cold/hot piece (6) and baffle (13), semiconductor constant temperature system set up on leading cold/hot piece (6), cooling system set up on semiconductor constant temperature system.
2. The semiconductor constant-temperature cup cover based on thermoelectric generation as claimed in claim 1, wherein the partition plate (13) is lapped on the aluminum liner (10), the partition plate (13) and the aluminum liner (10) separate the interior of the cup body (2) into an upper cavity (201) and a lower cavity (202), and the cold/heat conduction block (6), the thermoelectric generation system, the semiconductor constant-temperature system and the heat dissipation system are all located in the upper cavity (201).
3. The semiconductor constant temperature cup cover based on thermoelectric generation as claimed in claim 1, wherein the diameter of the cold/heat conduction block (6) is gradually reduced from bottom to top.
4. The semiconductor constant temperature cup cover based on thermoelectric generation as claimed in claim 1, wherein the thermoelectric generation system comprises a thermoelectric generation element (5), a controller (11) and a lithium battery (12), the thermoelectric generation element (5) is arranged on the cold/heat conduction block (6), the controller (11) and the lithium battery (12) are both arranged on the partition board (13), and the controller (11) is electrically connected with the thermoelectric generation element (5) and the lithium battery (12) respectively.
5. The semiconductor constant-temperature cup cover based on thermoelectric generation is characterized in that the semiconductor constant-temperature system comprises a first semiconductor refrigerating sheet (3) and a second semiconductor refrigerating sheet (4) which are respectively arranged on a cold/heat conduction block (6), and the first semiconductor refrigerating sheet (3) and the second semiconductor refrigerating sheet (4) are respectively and electrically connected with a controller (11).
6. The semiconductor constant-temperature cup cover based on thermoelectric generation as claimed in claim 5, wherein a temperature sensor (15) is further arranged on the cold/heat conduction block (6), and the controller (11) is electrically connected with the temperature sensor (15).
7. The semiconductor constant-temperature cup cover based on thermoelectric generation is characterized in that the heat dissipation system comprises vacuum cavity vapor chambers (7) arranged on the first semiconductor refrigeration piece (3) and the second semiconductor refrigeration piece (4), fins (8) arranged on the vacuum cavity vapor chambers (7) and fans (9) arranged above the fins (8), and the controller (11) is electrically connected with the fans (9).
8. The semiconductor constant-temperature cup cover based on thermoelectric generation as claimed in claim 1, wherein the cover body (2) and the cap (1) are detachably connected.
9. The semiconductor constant-temperature cup cover based on thermoelectric generation as claimed in claim 8, wherein the top of the cover body (2) and the bottom of the cap (1) are both provided with metal sheets.
10. The semiconductor constant-temperature cup cover based on thermoelectric generation as claimed in claim 1, wherein the inner side of the bottom of the cover body (2) is provided with threads and a sealing ring (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010736794.3A CN111772445A (en) | 2020-07-28 | 2020-07-28 | Semiconductor constant temperature cup cover based on thermoelectric generation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010736794.3A CN111772445A (en) | 2020-07-28 | 2020-07-28 | Semiconductor constant temperature cup cover based on thermoelectric generation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111772445A true CN111772445A (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010736794.3A Pending CN111772445A (en) | 2020-07-28 | 2020-07-28 | Semiconductor constant temperature cup cover based on thermoelectric generation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111772445A (en) |
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2020
- 2020-07-28 CN CN202010736794.3A patent/CN111772445A/en active Pending
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