CN210611769U - Electric heating refrigeration cup cover - Google Patents
Electric heating refrigeration cup cover Download PDFInfo
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- CN210611769U CN210611769U CN201921772457.9U CN201921772457U CN210611769U CN 210611769 U CN210611769 U CN 210611769U CN 201921772457 U CN201921772457 U CN 201921772457U CN 210611769 U CN210611769 U CN 210611769U
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- electric heating
- cup cover
- heat dissipation
- cup
- heating refrigeration
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Abstract
The utility model provides an electric heating refrigeration cup cover, which comprises a cup cover body, wherein the upper section part of the cup cover body is provided with an electric heating refrigeration semiconductor chip, a heat dissipation device, a control circuit board and a control button, and the electric heating refrigeration semiconductor chip and the heat dissipation device are electrically connected with the control circuit board; the lower section part of the cup cover body is provided with internal threads matched with a water cup and a temperature conduction tube, the top end of the temperature conduction tube is provided with a chip mounting seat, and the upper end of the temperature conduction tube protrudes into and is fixed on the upper section part of the cup cover body and used for mounting an electrothermal refrigeration semiconductor chip. The temperature change is directly generated on the temperature conduction tube by utilizing the semiconductor thermo-electric effect of the electric heating refrigeration semiconductor chip. When the electric heating refrigeration cup is used, the electric heating refrigeration cup cover is connected with the water cup, the temperature conduction pipe is inserted into the middle of the water cup, and the temperature of water in the water cup is changed through the temperature change of the temperature conduction pipe. The utility model discloses convenient and practical solves the heating and the refrigeration problem of people's trip drinking cup of carrying.
Description
Technical Field
The utility model relates to a general bowl cover that is used for various personal cups or thermos cups, especially indicate an electric heat refrigeration bowl cover.
Background
The vacuum cup is a container made of ceramic or stainless steel and vacuum layer, the top of the container is covered tightly, the vacuum heat insulating layer can delay the heat dissipation of the liquid such as water in the container, so as to achieve the purpose of heat preservation.
However, the conventional thermos cups in the prior art have the following disadvantages:
firstly, the function of current thermos cup only limits to the heat preservation to hot water, and the heat preservation time receives the good or bad decision of the heat preservation effect of thermos cup, and for a long time, water still can slowly become cold, loses the heat preservation effect.
Secondly, in hot summer, cold water is an indispensable way for people to eliminate intense heat, but the cold insulation effect of the common vacuum cup is not good, and even some vacuum cups do not have the function of cold insulation. To drink cold water, a refrigerating device for refrigerating water, such as a mini refrigerator, a cold and hot water dispenser, etc., needs to be carried, and the devices are very bulky, so that the carrying is very inconvenient.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electric heating refrigeration bowl cover to the problem of prior art.
In order to solve the technical problem, the utility model discloses a following technical scheme:
an electric heating refrigeration cup cover comprises a cup cover body, wherein a separating convex ring for separating the cup cover body into an upper section part and a lower section part is arranged in an inner cavity of the cup cover body, an electric heating refrigeration semiconductor chip, a heat dissipation device, a control circuit board and a control key are arranged on the upper section part of the cup cover body, and the electric heating refrigeration semiconductor chip and the heat dissipation device are electrically connected with the control circuit board; the lower segment part of the cup cover body is provided with internal threads matched with a water cup and a temperature conduction tube, the top end of the temperature conduction tube is provided with a chip mounting seat, and the upper end of the temperature conduction tube protrudes into and is fixed on the upper segment part of the cup cover body and used for mounting an electrothermal refrigeration semiconductor chip.
The heat dissipation device comprises a heat dissipation fin module, a heat dissipation fan and a fan fixing frame which are vertically arranged, wherein the heat dissipation fan is fixedly arranged above the fan fixing frame, a containing cavity matched with the heat dissipation fin module is arranged in the middle of the fan fixing frame, the whole heat dissipation fin module is sleeved into the containing cavity, and when the fan fixing frame is fixedly connected with the separation convex ring, the bottom surface of the heat dissipation fin module is in contact with the electrothermal refrigeration semiconductor chip.
Furthermore, square holes for ventilation are formed in the periphery of the fan fixing frame, and a plurality of strip-shaped through holes are formed in the periphery of the upper section of the cup cover body and correspond to the positions of the radiating fin modules and the radiating fan.
The circuit isolation board is arranged above the heat dissipation device, a plurality of positioning mounting columns are convexly arranged on the upper end face of the circuit isolation board, and the control circuit board is mounted on the positioning mounting columns; the circuit isolation board is characterized in that the four corners of the partition convex ring are provided with positioning connecting columns, positioning mounting holes are formed in the periphery of the circuit isolation board corresponding to the positioning connecting columns, and the circuit isolation board and the partition convex ring are fixedly connected by penetrating the positioning mounting holes through screws and being fixedly connected with the positioning connecting columns.
Preferably, a rechargeable battery for storing electricity is arranged above the circuit isolation plate, and the rechargeable battery is electrically connected with the control circuit board and used for supplying power to the electric heating refrigeration semiconductor chip and the heat dissipation device.
Furthermore, an encapsulation cover is arranged above the control circuit board, the encapsulation cover is fixedly connected with the circuit isolation board, and an installation space of the control circuit board and the rechargeable battery is formed between the encapsulation cover and the circuit isolation board; one side of encapsulation lid is provided with the button mounting groove, and in the back tip card of control button was gone into and is fixed in the button mounting groove, the preceding tip of control button was around the parallel and level with the outer of bowl cover body.
Still further, the upper end surface of the packaging cover is detachably provided with a top decorative sheet.
The temperature conduction pipe is a metal aluminum pipe, a copper pipe or a high-heat-conductivity ceramic pipe, the shape of the temperature conduction pipe can be set to be circular, square or triangular, and through holes can be arranged on the pipe wall of the temperature conduction pipe in an array or irregular arrangement mode.
The utility model has the advantages that:
the utility model provides a pair of electric heat refrigeration bowl cover through set up electric heat refrigeration semiconductor chip, heat abstractor, control circuit board, control button and temperature conduction pipe on the bowl cover body, utilizes electric heat refrigeration semiconductor chip's semiconductor hot-electric effect, directly produces the temperature variation on the temperature conduction pipe. When the electric heating refrigeration cup is used, the electric heating refrigeration cup cover is connected with the water cup, the temperature conduction pipe is inserted into the middle of the water cup, and the temperature of water in the water cup is changed through the temperature change of the temperature conduction pipe. The utility model has the advantages of simple structure, convenient and practical solves the heating and the refrigeration problem of the drinking cup that people's trip carried.
Drawings
Fig. 1 is a perspective view of an electric heating refrigeration cup cover of the utility model.
Fig. 2 is a structural diagram of the electric heating refrigeration cup cover of the utility model when the cup cover body is hidden.
Fig. 3 is a schematic structural view of the electric heating refrigeration semiconductor chip and the heat dissipation fin module when being mounted on the top of the temperature conduction tube.
Fig. 4 is a schematic structural view of the cup lid body.
Fig. 5 is a schematic structural view of a fan fixing frame.
Fig. 6 is an exploded view of the electric heating refrigeration cup cover of the present invention.
The reference numerals in fig. 1 to 6 include:
1-cup cover body 2-separation convex ring 3-electric heating refrigeration semiconductor chip
4-temperature conduction pipe 5-radiating fin module 6-radiating fan
7-fan fixing frame 8-accommodating cavity 9-square hole
10-strip through hole 11-circuit isolation board 12-positioning mounting column
13-positioning connecting column 14-packaging cover 15-control key
16-top decorative sheet.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.
The utility model provides an electric heat refrigeration bowl cover that improves, including bowl cover body 1, the inner chamber of bowl cover body 1 is equipped with and separates into upper segment part and hypomere part's separation bulge loop 2 with it, and the upper segment part of bowl cover body 1 is provided with electric heat refrigeration semiconductor chip 3, heat abstractor, control circuit board (this control circuit board is the circuit board that can play the control effect, belongs to the conventional technology and does not mention here again) and control button 15, electric heat refrigeration semiconductor chip 3, heat abstractor all are connected with the control circuit board electricity, control its closing and start-up through pressing this control button 15; the lower segment part of bowl cover body 1 is provided with internal thread and temperature conduction pipe 4 with drinking cup complex, and the top of temperature conduction pipe 4 is provided with the chip mount pad, the upper end of temperature conduction pipe 4 is protruding to be fixed in the upper segment part of bowl cover body 1 for install electric heat refrigeration semiconductor chip 3. The utility model discloses utilize the semiconductor thermal-electric effect of electric heat refrigeration semiconductor chip 3, directly produce the temperature variation on temperature conduction pipe 4. When the electric heating refrigeration cup is used, the electric heating refrigeration cup cover is connected with the water cup through threads, the temperature conduction tube 4 is inserted into the middle of the water cup, and the water temperature in the water cup is changed through the temperature change of the temperature conduction tube 4. The utility model has the advantages of simple structure, convenient and practical solves the heating and the refrigeration problem of the drinking cup that people's trip carried.
The utility model discloses in, heat abstractor is including being the heat radiation fin module 5, radiator fan 6 and the fan mount 7 of arranging from top to bottom, and radiator fan 6 uses screw fixed mounting in the top of fan mount 7, the centre of fan mount 7 is provided with the holding cavity 8 with 5 looks adaptations of heat radiation fin module, and in heat radiation fin module 5's whole emboliaed holding cavity 8, four angles at the inboard top of fan mount 7 were provided with the portion of compressing tightly that is used for compressing tightly heat radiation fin module 5, works as fan mount 7 and separates 2 fixed connection of bulge loop, and the portion of compressing tightly of fan mount 7 and the contact of 5 upper end four corners of heat radiation fin module, the bottom surface and the 3 contacts of electric heat refrigeration semiconductor chip of heat radiation fin module 5.
Furthermore, square holes 9 for ventilation are formed around the fan fixing frame 7, and a plurality of strip-shaped through holes 10 are formed in the positions, corresponding to the heat dissipation fin modules 5 and the heat dissipation fan 6, of the periphery of the upper section of the cup cover body 1. When the cup cover is used, the radiating fin module 5 corresponds to the strip-shaped through hole 10 of the cup cover body 1 and serves as an air inlet, the radiating fan 6 corresponds to the strip-shaped through hole 10 of the cup cover body 1 and serves as an air outlet, and when the radiating fan 6 is started, airflow is formed around the upper side and the lower side of the radiating device, so that the radiating effect is achieved.
The utility model discloses in, heat abstractor's top is provided with circuit division board 11, and circuit division board 11 is used for separating heat dissipation area and circuit. A plurality of positioning mounting columns 12 are convexly arranged on the upper end surface of the circuit isolation plate 11, and the control circuit board is mounted on the positioning mounting columns 12; the four corners of the partition convex ring 2 are provided with positioning connecting columns 13, the periphery of the circuit isolation plate 11 is provided with positioning mounting holes corresponding to the positioning connecting columns 13, and the circuit isolation plate 11 and the partition convex ring 2 are fixedly connected by using screws to penetrate through the positioning mounting holes and the positioning connecting columns 13, so that the circuit isolation plate 11 plays a role in bearing and fixedly mounting a control circuit board.
Preferably, a rechargeable battery (not shown) for storing electricity is arranged above the circuit isolation plate 11, and the rechargeable battery is electrically connected with the control circuit board and used for supplying power to the electric heating refrigeration semiconductor chip 3 and the heat dissipation device. The control circuit board is provided with a USB interface for charging, when the electric quantity of the rechargeable battery is used up, the rechargeable battery can be charged repeatedly by connecting the charger with the USB interface, and the use and the operation are simple and convenient.
Further, an encapsulation cover 14 is arranged above the control circuit board, the encapsulation cover 14 is fixedly connected with the circuit isolation board 11, and an installation space of the control circuit board and the rechargeable battery is formed between the encapsulation cover 14 and the circuit isolation board 11; one side of encapsulation lid 14 is provided with the button mounting groove, and in the back tip card of control button 15 was fixed in the button mounting groove, the preceding tip of control button 15 was with the outer periphery parallel and level of bowl cover body 1. Still further, the top decorative sheet 16 is detachably mounted on the upper end surface of the packaging cover 14, so that the overall appearance is neat and elegant.
The utility model discloses in, temperature conduction pipe 4 is metal aluminum pipe, copper pipe or high heat conduction ceramic pipe, circular, square or triangle-shaped can be set to the shape of temperature conduction pipe 4, but array arrangement or irregular arrangement set up the through-hole on the pipe wall of temperature conduction pipe 4.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention is disclosed in the preferred embodiment, it is not limited to the above description, and any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the technical solutions of the present invention are within the scope of the present invention.
Claims (8)
1. The utility model provides an electric heat refrigeration bowl cover, is equipped with the partition bulge loop that separates into upper segment part and hypomere part with it including the bowl cover body, the inner chamber of bowl cover body, its characterized in that: the upper section part of the cup cover body is provided with an electric heating refrigeration semiconductor chip, a heat dissipation device, a control circuit board and a control key, and the electric heating refrigeration semiconductor chip and the heat dissipation device are electrically connected with the control circuit board; the lower segment part of the cup cover body is provided with internal threads matched with a water cup and a temperature conduction tube, the top end of the temperature conduction tube is provided with a chip mounting seat, and the upper end of the temperature conduction tube protrudes into and is fixed on the upper segment part of the cup cover body and used for mounting an electrothermal refrigeration semiconductor chip.
2. An electric heating refrigeration cup cover according to claim 1, characterized in that: the heat dissipation device comprises a heat dissipation fin module, a heat dissipation fan and a fan fixing frame which are vertically arranged, wherein the heat dissipation fan is fixedly arranged above the fan fixing frame, a containing cavity matched with the heat dissipation fin module is arranged in the middle of the fan fixing frame, the whole heat dissipation fin module is sleeved into the containing cavity, and when the fan fixing frame is fixedly connected with the separating convex ring, the bottom surface of the heat dissipation fin module is in contact with the electrothermal refrigeration semiconductor chip.
3. An electric heating refrigeration cup cover according to claim 2, characterized in that: the cup cover comprises a cup cover body and is characterized in that square holes for ventilation are formed in the periphery of the fan fixing frame, and a plurality of strip-shaped through holes are formed in the periphery of the upper section of the cup cover body and correspond to the positions of the heat dissipation fin modules and the heat dissipation fan.
4. An electric heating refrigeration cup cover according to claim 1, characterized in that: a circuit isolation plate is arranged above the heat dissipation device, a plurality of positioning mounting columns are convexly arranged on the upper end surface of the circuit isolation plate, and the control circuit board is mounted on the positioning mounting columns; the circuit isolation board is characterized in that the four corners of the partition convex ring are provided with positioning connecting columns, positioning mounting holes are formed in the periphery of the circuit isolation board corresponding to the positioning connecting columns, and the circuit isolation board and the partition convex ring are fixedly connected by penetrating the positioning mounting holes through screws and being fixedly connected with the positioning connecting columns.
5. An electric heating refrigeration cup cover according to claim 4, characterized in that: and a rechargeable battery for storing electricity is arranged above the circuit isolation plate, and the rechargeable battery is electrically connected with the control circuit board and is used for supplying power to the electric heating refrigeration semiconductor chip and the heat dissipation device.
6. An electric heating refrigeration cup cover according to claim 5, characterized in that: an encapsulation cover is arranged above the control circuit board and fixedly connected with the circuit isolation plate, and an installation space of the control circuit board and the rechargeable battery is formed between the encapsulation cover and the circuit isolation plate; one side of encapsulation lid is provided with the button mounting groove, and in the back tip card of control button was gone into and is fixed in the button mounting groove, the preceding tip of control button was around the parallel and level with the outer of bowl cover body.
7. An electric heating refrigeration cup cover according to claim 6, characterized in that: the upper end surface of the packaging cover is detachably provided with a top decorative sheet.
8. An electric heating refrigeration cup cover according to claim 1, characterized in that: the temperature conduction pipe is a metal aluminum pipe, a copper pipe or a high-heat-conductivity ceramic pipe, the shape of the temperature conduction pipe can be set to be circular, square or triangular, and through holes can be arranged on the pipe wall of the temperature conduction pipe in an array or irregular arrangement mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921772457.9U CN210611769U (en) | 2019-10-22 | 2019-10-22 | Electric heating refrigeration cup cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921772457.9U CN210611769U (en) | 2019-10-22 | 2019-10-22 | Electric heating refrigeration cup cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210611769U true CN210611769U (en) | 2020-05-26 |
Family
ID=70755857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921772457.9U Active CN210611769U (en) | 2019-10-22 | 2019-10-22 | Electric heating refrigeration cup cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210611769U (en) |
-
2019
- 2019-10-22 CN CN201921772457.9U patent/CN210611769U/en active Active
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