CN214341527U

CN214341527U - Novel water cup device

Info

Publication number: CN214341527U
Application number: CN202120140340.XU
Authority: CN
Inventors: 吴宝山
Original assignee: Xindonghai Hardware & Electrical Appliance Co ltd
Current assignee: Xindonghai Hardware & Electrical Appliance Co ltd
Priority date: 2021-01-19
Filing date: 2021-01-19
Publication date: 2021-10-08
Anticipated expiration: 2031-01-19

Abstract

The utility model provides a novel water cup device, include: the cup body is used for containing water; a base having a mounting space therein; the cup body is placed on the base; the heating component is positioned at the upper end of the base; the semiconductor refrigeration piece is arranged in the base and positioned below the heating assembly, and one surface of the semiconductor refrigeration piece is combined with the heating assembly; the mainboard is electrically connected with the heating assembly and the semiconductor refrigerating sheet. The cup body is placed on the base, and the cup body and the base can be separated, so that the cup body is lighter and convenient to use. Heating element is located the upper end of base, and heating element can contact with the bottom of cup, and heating element generates heat the back and can give the cup with heat transfer to the water in the heating cup. The semiconductor refrigeration piece sets up in the base and is located heating element's below, and the one side of semiconductor refrigeration piece combines with heating element, and semiconductor refrigeration piece accessible heating element absorbs the heat of water in the cup to the water in the rapid cooling cup.

Description

Novel water cup device

Technical Field

The utility model relates to a drinking cup technical field, in particular to novel drinking cup device.

Background

A cup is a container for holding water. With the development of science and technology, the function of the water cup is gradually enhanced, and a refrigeration water cup appears on the market at present, but the refrigeration water cup has a single function and only has a refrigeration function.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to solve the problem of ordinary drinking cup function singleness among the prior art.

In order to solve the technical problem, the utility model adopts the following technical scheme:

according to an aspect of the utility model, the utility model provides a novel water cup device, include: the cup body is used for containing water; a base having a mounting space therein; the cup body is placed on the base; the heating component is positioned at the upper end of the base; the semiconductor refrigeration piece is arranged in the base and positioned below the heating assembly, and one surface of the semiconductor refrigeration piece is combined with the heating assembly; the mainboard is electrically connected with the heating assembly and the semiconductor refrigerating sheet.

In some embodiments, the heating assembly comprises a heating tube and a heat conducting plate with a cavity inside; the heating tube is arranged in the cavity of the heat conducting disc.

In some embodiments, the semiconductor chilling plate is attached to the bottom of the heat conducting plate.

In some embodiments, the thermally conductive disk is a metallic thermally conductive disk.

In some embodiments, a temperature sensor is included, the temperature sensor being disposed on the heating assembly and electrically connected to the motherboard.

In some embodiments, a heat dissipation assembly is included, the heat dissipation assembly being disposed within the base and below the semiconductor chilling plate.

In some embodiments, the heat dissipation assembly comprises a heat sink and a fan; one end of the radiator is combined with the semiconductor refrigerating sheet, and the other end of the radiator is combined with the fan.

In some embodiments, the base is provided with a through heat dissipation hole and a through ventilation hole; the heat dissipation holes are positioned on the peripheral wall of the base; the ventilation hole is located at the bottom of the base and below the fan.

In some embodiments, a mount is included; the fixing frame is located in the base, the bottom of the fixing frame is fixedly connected with the bottom of the base through a fastener, and the top of the fixing frame supports the heat conducting disc.

In some embodiments, a heat insulation pad is sandwiched between the fixing frame and the heat conduction disc.

According to the above technical scheme, the utility model discloses following advantage and positive effect have at least:

the utility model discloses in, novel drinking cup device includes cup, base, heating element, semiconductor refrigeration piece and mainboard. The cup body for containing water is placed on the base, so the cup body and the base are separable, and the base is not attached to the bottom of the cup body when the cup body is taken up to drink water, so that the cup body is more portable and convenient to use. Heating element is located the upper end of base, places on the base when the cup, and heating element can contact with the bottom of cup, and heating element generates heat after can giving the cup with heat transfer to the water in the heating cup. The semiconductor refrigeration piece sets up in the base and is located heating element's below, and the one side of semiconductor refrigeration piece combines with heating element, therefore the heat of water in the semiconductor refrigeration piece accessible heating element absorption cup to reduce the temperature of water in the cup fast.

The novel water cup device integrates the heating function and the refrigerating function, and solves the problem that the function of a common water cup is single in the prior art.

Drawings

Fig. 1 is a schematic structural view of a novel water cup device according to an embodiment of the present invention.

Fig. 2 is a sectional view of the novel cup device according to an embodiment of the present invention.

Fig. 3 is an exploded view of a base of the novel water cup device according to an embodiment of the present invention, in which components installed in the base are mainly illustrated.

Fig. 4 is an exploded view of a heating assembly according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a heat sink according to an embodiment of the present invention.

The reference numerals are explained below:

100. a novel cup device;

1. a cup body; 11. a connecting portion; 12. a cup cover; 13. a handle; 2. a base; 21. a fastening part; 22. a first heat dissipation hole; 23. a second heat dissipation hole; 3. a heating assembly; 31. a heat generating tube; 32. a heat conducting plate; 4. A semiconductor refrigeration sheet; 5. a heat dissipating component; 51. a heat sink; 52. a fan; 6. a fixed mount; 7. a heat insulating pad; 8. a temperature sensor.

Detailed Description

Exemplary embodiments that embody features and advantages of the present invention will be described in detail in the following description. It is to be understood that the invention is capable of other and different embodiments and its several details are capable of modification without departing from the scope of the invention, and that the description and drawings are to be regarded as illustrative in nature and not as restrictive.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

For further explanation of the principles and construction of the present invention, reference will now be made in detail to the preferred embodiments of the present invention, which are illustrated in the accompanying drawings.

Referring to fig. 1 to 2, the present invention provides a novel cup device 100, wherein the novel cup device 100 has heating and cooling functions. The novel water cup device 100 comprises a cup body 1, a base 2, a heating assembly 3, a semiconductor refrigerating sheet 4, a heat dissipation assembly 5, a fixing frame 6, a heat insulation pad 7, a temperature sensor 8 and a main board.

The cup body 1 can be cylindrical, the bottom of the cup body is closed, and the top of the cup body is provided with an opening. The space inside the cup body 1 is used for storing water. The specific structure of the cup body 1 can be referred to the related art. In some embodiments, the cup body 1 may have other shapes, such as a pot body, a can body, and other containers.

The bottom of the cup body 1 is provided with a connecting part 11, and the connecting part 11 is formed by inward contraction of the side wall of the cup body 1 close to the bottom. The cup body 1 is provided with the connecting part 11, so that the bottom of the cup body 1 is approximately in an inverted boss shape.

In a preferred embodiment, cup 1 is further provided with lid 12 and handle 13.

The cap 12 is generally disc-shaped. The cup cover 12 covers the opening at the top of the cup body 1, plays a role in heat preservation during heating, and can prevent dust and sundries from falling into the cup body 1 through the cup cover 12. The cup cover 12 and the cup body 1 are designed in a separable mode, so that the cup cover 12 can be opened when drinking water, and the cup is convenient to use.

The handle 13 is approximately in a C shape, the handle 13 is vertically installed, and the free ends of the two ends of the handle 13 are fixedly connected with the peripheral wall of the cup body 1. The handle 13 is arranged, so that a user can hold the cup body 1 conveniently to drink water.

Referring to fig. 1 to 3, the base 2 may be in the shape of a circular truncated cone. The base 2 has a seating space therein for seating other components. The base 2 is used for bearing the cup body 1, and the cup body 1 is placed on the base 2, so that the base 2 and the cup body 1 can be separated. Base 2 and cup 1 are separable, and base 2 is not adhered to the bottom of cup 1 when taking up cup 1 and drinking water for cup 1 can be lighter-weighted more, convenient to use.

The base 2 is provided with an engaging portion 21, a heat dissipating hole therethrough, and a vent hole (not shown).

The engaging portion 21 is formed by extending upward from the peripheral wall of the base 2. The clamping part 21 is approximately in a circular ring shape, the inner contour of the clamping part 21 is the same as the outer contour of the connecting part 11 in shape, the inner contour of the clamping part 21 is positioned outside the outer contour of the connecting part 11, the clamping part 21 is abutted to the connecting part 11 to play a limiting role, the cup body 1 can be prevented from falling off the base 2, and the safety of a product can be improved.

In a preferred embodiment, there are two heat dissipation holes, which are the first heat dissipation hole 22 and the second heat dissipation hole 23.

The first heat dissipation holes 22 are distributed on one side of the peripheral wall of the base 2, and the second heat dissipation holes 23 are distributed on the other side of the peripheral wall of the base 2.

The first heat dissipation hole 22 and the second heat dissipation hole 23 are both communicated with the installation space in the base 2, so as to be beneficial to heat dissipation during refrigeration. The first heat dissipation hole 22 and the second heat dissipation hole 23 can be arranged at the same height, and the connection line of the first heat dissipation hole 22 and the second heat dissipation hole 23 passes through the circle center of the base 2, so that the external air can conveniently enter the arrangement space of the base 2. In some embodiments, the first heat dissipation holes 22 and the second heat dissipation holes 23 may be disposed in plural numbers to increase the air intake, and the plural first heat dissipation holes 22 and the plural second heat dissipation holes 23 are spaced apart from each other around the peripheral wall of the base 2.

The through ventilation holes are located on the bottom surface of the base 2. The ventilation hole communicates with the installation space in the base 2, and hot air in the base 2 can flow out of the base 2 through the ventilation hole to dissipate heat during refrigeration. The ventilation hole can set up a plurality ofly, a plurality of ventilation holes in the bottom surface evenly distributed of base 2 to increase the air volume.

Referring to fig. 2-4, the heating element 3 is used to generate heat. Heating element 3 can generate heat after the circular telegram, and heating element 3's upper surface contacts with the bottom of cup 1. When heating, heating element 3 transmits the heat that produces to cup 1, makes the water in the cup 1 heat up fast.

The heating assembly 3 includes a heat generating pipe 31 and a heat conducting plate 32 having a cavity therein.

The heating tube 31 can be a resistance wire, and the heating tube 31 can generate heat after being electrified.

The thermally conductive disk 32 is generally disc-shaped. The cavity in the heat conduction plate 32 is used for installing the heating tube 31, and the heating tube 31 is annularly distributed in the heat conduction plate 32, so that the occupied space can be reduced. The bottom of the heat conducting plate 32 is located in the base 2, the upper surface of the heat conducting plate 32 is upward beyond the upper surface of the base 2, and the upper surface of the heat conducting plate 32 is lower than the vertex of the connecting part 11. The cup body 1 is placed on the base 2, the upper surface of the heat conducting disc 32 is in contact with the bottom of the cup body 1, and after the heat conducting disc 32 absorbs the heat emitted by the heating tube 31, the heat can be uniformly transmitted to the cup body 1.

The heat conducting plate 32 is a metal heat conducting plate 32, and metal has good heat conducting performance, so that heat can be conducted conveniently, and heat generated by the heating tube 31 can be rapidly transferred to the cup body 1. Therefore, during heating, the heat transfer path is: the heat pipe 31 → the heat conductive plate 32 → the cup 1 → water. In a preferred embodiment, the heat conducting plate 32 is an aluminum heat conducting plate 32, which is lighter in weight and better in heat conductivity than other metals, so as to facilitate heat transfer.

Referring to fig. 1 to 3, the semiconductor cooling plate 4 is also called a thermoelectric cooling plate, and is a heat pump. The semiconductor chilling plates 4 are made of semiconductor materials, and the specific structure thereof can be referred to the related art. The semiconductor refrigerating plate 4 utilizes the Peltier effect of the semiconductor materials to refrigerate, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and refrigeration is achieved.

The semiconductor chilling plate 4 is substantially plate-shaped. The one side of semiconductor refrigeration piece 4 combines with heating element 3, and when refrigerating, semiconductor refrigeration piece 4 absorbs the heat of the interior water of cup 1 through heating element 3 to reduce the temperature of the interior water of cup 1.

In particular, the semiconductor chilling plates 4 comprise a cold end and a hot end.

The cold end is located the upper surface of semiconductor refrigeration piece 4, and the cold end laminating heat conduction dish 32 to absorb the heat of heat conduction dish 32 and cup 1 when refrigerating. The hot end is arranged on the lower surface of the semiconductor refrigerating sheet 4 and faces the bottom of the base 2, so that heat dissipation is facilitated. During refrigeration, the cold end of the semiconductor refrigeration piece 4 continuously absorbs the heat of the water in the cup body 1 and the cup body 1 through the heat conduction plate 32, and transfers the heat to the hot end, and the hot end of the semiconductor refrigeration piece 4 dissipates the heat, so that the process can be continuously carried out to achieve the purpose of refrigeration. In the cooling process, the heat transfer path is as follows: water → cup body 1 → heat conducting disc 32 → cold end of semiconductor refrigeration piece 4 → hot end of semiconductor refrigeration piece 4.

Referring to fig. 2, fig. 3 and fig. 5, the heat dissipation assembly 5 can enhance the heat dissipation effect of the semiconductor chilling plate 4 during chilling, and the heat dissipation assembly 5 is disposed in the base 2 and below the hot end of the semiconductor chilling plate 4. The heat radiating assembly 5 actively radiates heat to the hot end of the semiconductor refrigerating sheet 4, and the temperature of the cold end of the semiconductor refrigerating sheet 4 is correspondingly reduced, so that the refrigerating effect is improved.

The heat radiation module 5 includes a heat sink 51 and a fan 52.

The heat sink 51 is block-shaped, the heat sink 51 is located below the semiconductor cooling fins 4, and the upper surface of the heat sink 51 is in contact with the semiconductor cooling fins 4. The radiator 51 is provided with a plurality of ventilation grooves in the horizontal direction, the ventilation grooves penetrate through the radiator 51 in the horizontal direction, the ventilation grooves penetrate through the bottom surface of the radiator 51 downwards, and the ventilation grooves are distributed at intervals in parallel. The distribution direction of the ventilation grooves is parallel to the line connecting the first heat dissipation hole 22 and the second heat dissipation hole 23, and therefore the ventilation grooves can be communicated with the outside of the base 2 through the first heat dissipation hole 22 and the second heat dissipation hole 23.

The fan 52 is located below the heat sink 51, the fan 52 is disposed upright, and the fan 52 is disposed in close proximity to the heat sink 51. The fan 52 is energized to draw air from the ventilation slot. In a preferred embodiment, the fan 52 is disposed opposite to the vent hole, and the fan 52 discharges the air in the base 2 to the outside of the base 2 through the vent hole, so as to form a circulation of the air outside the base 2 → the first heat dissipation hole 22 or the second heat dissipation hole 23 → the radiator 51 → the ventilation slot → the fan 52 → the vent hole → the outside of the base 2, the circulation is started during the cooling, the air circulates through the path, the heat absorbed by the semiconductor chilling plate 4 can be transferred to the outside of the base 2, the heat dissipation of the semiconductor chilling plate 4 is facilitated, and the cooling effect of the semiconductor chilling plate 4 can be improved.

Referring to fig. 1 and 3, the fixing frame 6 is disposed in the installation space of the base 2. The top of the fixing frame 6 may be cylindrical. The top of the fixing frame 6 supports the heat conducting plate 32, and the bottom of the fixing frame 6 is fixedly connected with the bottom of the base 2 through a fastener (not shown). The fastener penetrates through the bottom of the base 2 and enters the bottom of the fixing frame 6 to fixedly connect the fixing frame 6 with the base 2, and the fastener can be a bolt or a rivet. The fixing frame 6 can be arranged in a plurality of numbers, and the fixing frames 6 are symmetrically distributed to improve the stability of the support.

Referring to fig. 3, the heat insulating pad 7 is sandwiched between the bottom of the heat conducting plate 32 and the top of the fixing frame 6. The heat insulating pad 7 may have a disk shape with a large surface area to separate the heat conductive disk 32 from the fixing frame 6. The heat insulation pad 7 can be a glass fiber heat insulation pad 7, and the glass fiber material has good heat insulation performance and can prevent the fixing frame 6 from being damaged by heat.

Referring to fig. 2 and 3, the temperature sensor 8 is located in the base 2. The temperature sensor 8 is arranged on the heat conducting disc 32, the temperature sensor 8 is flush with the upper surface of the heat conducting disc 32, and the bottom of the cup body 1 is in contact with the upper surface of the heat conducting disc 32, so that the temperature sensor 8 can contact the cup body 1, the temperature of the cup body 1 is detected, and the temperature of the water in the cup body 1 is indirectly obtained.

The motherboard (not shown) is used to control the activation and deactivation of the electrical components. One end of the main board is connected with the heating tube 31, the semiconductor refrigerating sheet 4, the fan 52 and the temperature sensor 8 in parallel, and one end of the main board is electrically connected with a power supply which can be commercial power or a storage battery. The specific structure of the main board can refer to the related art. The mainboard combines temperature sensor 8 for the temperature of the water in the cup 1 is controllable, and when the temperature of the water in the cup 1 reached the default, the mainboard can automatic cutout power.

In a preferred embodiment, the novel cup apparatus 100 has three modes, namely, a heating mode, a cooling mode, and an automatic mode. The user can select any one of the modes to use, when the user selects a heating mode, under the action of the main board, the temperature sensor 8 and the heating assembly 3, the novel water cup device 100 can heat cold water in the cup body 1 to a preset temperature or automatically stop after the water cup device is boiled, and a single heating function can be realized. When the user selects the refrigeration mode, under the effect of mainboard, temperature sensor 8 and semiconductor refrigeration piece 4, novel drinking cup device 100 can be with the hot water cooling in the cup 1 to automatic shutdown behind the preset temperature, can realize single refrigeration function. When the user selects automatic mode, under mainboard, temperature sensor 8, heating element 3 and semiconductor refrigeration piece 4's effect, novel drinking cup device 100 can heat the cold water in the cup 1 earlier to preset temperature or boil, then refrigerates the cooling again, and the water cooling in the cup 1 stops after presetting the temperature automatically, and automatic mode can be quick the hot water cooling with boiling, and convenient to use person drinks.

Based on the above description, the general working principle of the novel cup device 100 in the present application is:

the novel water cup device 100 comprises a cup body 1, a base 2, a heating assembly 3, a semiconductor refrigerating sheet 4, a heat dissipation assembly 5, a fixing frame 6, a heat insulation pad 7, a temperature sensor 8 and a main board. The cup body 1 filled with water is placed on the base 2, so that the cup body 1 and the base 2 can be separated, and the use is convenient. The heating component 3 can generate heat and is used for heating hot water in the cup body 1. Semiconductor refrigeration piece 4 sets up in heating element 3's below, and the cold junction of semiconductor refrigeration piece 4 is laminated in heating element 3's lower surface, and heating element 3's hot junction is towards the lower surface of base 2, and during the refrigeration, the heat of the water in the cup 1 passes through semiconductor refrigeration piece 4 and transmits to in the base 2. The heat in the base 2 is discharged out of the base 2 by the heat dissipation assembly 5. The fixing frame 6 is used for supporting the heating assembly 3, and the heat insulation pad 7 can prevent the fixing frame 6 from being damaged by heat. The temperature sensor 8 is used to measure the temperature of the bottom of the cup body 1 to indirectly obtain the temperature of the water in the cup body 1. The mainboard controls the on-off state of each power utilization component.

In this application, novel drinking cup device 100's cup 1 and base 2 are separable, convenient to use, and novel drinking cup device 100 has integrated heating function and refrigeration function, has solved the comparatively single problem of function of ordinary drinking cup among the prior art.

While the present invention has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims

1. A novel water cup device is characterized by comprising:

the cup body is used for containing water;

a base having a mounting space therein; the cup body is placed on the base;

the heating component is positioned at the upper end of the base;

the semiconductor refrigeration piece is arranged in the base and positioned below the heating assembly, and one surface of the semiconductor refrigeration piece is combined with the heating assembly;

the mainboard is electrically connected with the heating assembly and the semiconductor refrigerating sheet.

2. The novel water cup device as claimed in claim 1, wherein the heating assembly comprises a heating tube and a heat conducting plate with a cavity inside; the heating tube is arranged in the cavity of the heat conducting disc.

3. The novel water cup device as claimed in claim 2, wherein the semiconductor refrigeration sheet is attached to the bottom of the heat conducting plate.

4. The novel water cup device as claimed in claim 2, wherein the heat conducting plate is a metal heat conducting plate.

5. The novel water cup device according to claim 1, wherein the novel water cup device comprises a temperature sensor, and the temperature sensor is arranged on the heating assembly and is electrically connected with the main board.

6. The novel water cup device according to claim 1, comprising a heat dissipation assembly, wherein the heat dissipation assembly is arranged in the base and located below the semiconductor chilling plate.

7. The novel water cup device as claimed in claim 6, wherein the heat dissipation assembly comprises a heat sink and a fan; one end of the radiator is combined with the semiconductor refrigerating sheet, and the other end of the radiator is combined with the fan.

8. The novel water cup device according to claim 7, wherein the base is provided with a through heat dissipation hole and a through ventilation hole; the heat dissipation holes are positioned on the peripheral wall of the base; the ventilation hole is located at the bottom of the base and below the fan.

9. The novel water cup device as claimed in claim 2, comprising a fixing frame; the fixing frame is located in the base, the bottom of the fixing frame is fixedly connected with the bottom of the base through a fastener, and the top of the fixing frame supports the heat conducting disc.

10. The novel cup device as claimed in claim 9, including a thermal insulation pad; the heat insulation pad is clamped between the fixing frame and the heat conduction disc.