CN208901742U - A kind of fast-refrigerating cup - Google Patents

A kind of fast-refrigerating cup Download PDF

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Publication number
CN208901742U
CN208901742U CN201821522455.XU CN201821522455U CN208901742U CN 208901742 U CN208901742 U CN 208901742U CN 201821522455 U CN201821522455 U CN 201821522455U CN 208901742 U CN208901742 U CN 208901742U
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CN
China
Prior art keywords
cup
radiator
refrigerating
heat insulation
insulation foam
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Expired - Fee Related
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CN201821522455.XU
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Chinese (zh)
Inventor
蒙惠逢
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Individual
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Individual
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Priority to CN201821522455.XU priority Critical patent/CN208901742U/en
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Publication of CN208901742U publication Critical patent/CN208901742U/en
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Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of fast-refrigerating cup, including lower casing, upper shell, the refrigerating plant being mounted between lower casing and upper shell and the conduction cooling cup on upper shell, refrigerating plant includes semiconductor chilling plate, food-grade aluminium cup, cool guide sheet, upper heat insulation foam, radiator, lower heat insulation foam and blower, freezed using semiconductor chilling plate, the P-N junction constituted using extraordinary semiconductor material forms thermocouple pair, generate Peltier effect, freezed by direct current, small in size, refrigeration is quick.It is absorbed heat by highly endothermic cold forging formula radiator, then DC fan is cooperated to form the mode of convection type active heat removal to reduce the hot-side temperature of semiconductor chilling plate, so that semiconductor chilling plate cold end be made to reach lower cryogenic temperature;And cold junction temperature can also be declined accordingly by the absorption of aluminium cup, thus reach lower cryogenic temperature, high cooling efficiency.

Description

A kind of fast-refrigerating cup
Technical field
The utility model relates to refrigeration cup field, in particular to a kind of fast-refrigerating cup and Quick refrigerator.
Background technique
Currently, extensive use has been obtained in semiconductor refrigerating technology, it is applied to refrigeration cup field and also has been reported that more. But since existing semiconductor refrigerating cup all has that refrigerating efficiency is not high all the time, thus its application receives very greatly It influences.Semiconductor refrigerating cup mainly passes through semiconductor chilling plate and freezes, and after powered up, side can generate semiconductor chilling plate Heat, and the other side then can quickly turn cold.The temperature of usual radiating end can reach 100 degree of left sides when no radiator The right side is easily more than the power limit of cooling piece, and the key for improving semiconductor refrigerating efficiency seeks to reduce hot-side temperature as early as possible To reduce temperature difference between the two ends.The radiating end of the cooling piece of existing refrigeration cup generallys use the form that radiator adds fan, fan and dissipates Hot device is installed in refrigeration cup interiors of products, and radiating efficiency is low, unreasonable structure.
Utility model content
The main purpose of the utility model is to provide a kind of fast-refrigerating cup, it is intended to improve the heat dissipation effect in cooling piece hot end Rate improves refrigerating efficiency.
The utility model proposes a kind of fast-refrigerating cup, including seperated upper shell and lower casing, be mounted on it is described lower outer Refrigerating plant between shell and the upper shell and the conduction cooling cup on the upper shell, the refrigerating plant include semiconductor Cooling piece, cool guide sheet, upper heat insulation foam, radiator, lower heat insulation foam and blower, the lower casing bottom is equipped with support leg, under described The groove that the face of shell upward is equipped with support frame and is adapted to the blower, is provided with air draft in the bottom portion of groove hollow out Hole, the assembling is in the groove, and the lower heat insulation foam lid is located on support frame as described above, and the lower heat insulation foam is equipped with Ventilation hole corresponding with the blower, the radiator are mounted on the lower heat insulation foam, and the air intake of the blower is towards institute State radiator, the outlet air end of the blower is towards the vent;The radiator includes the thermally conductive platform, vertical positioned at upper end The diversion column of the thermally conductive platform lower end surface central location is set and is vertically provided at the multiple of the thermally conductive platform lower end surface The cooling fin being radially arranged around the diversion column, the cooling fin is exposed outside, and the air inlet of the blower is dissipated from described Clearance space sucking between backing, forms around turbulent convection type active heat removal, to make the heat of radiator from lower casing Exhaust outlet discharge;
The upper heat insulation foam is mounted on the upper surface of the radiator, and the upper heat insulation foam is equipped with and the semiconductor system The hollow hole of cold adaptation, the semiconductor chilling plate are embedded in the hollow hole, the hot end direction of the semiconductor chilling plate The radiator, the thermally conductive contact with platform with the radiator;Cool guide sheet is installed in the cold end of the semiconductor chilling plate, it is described Upper casing cover is located on the upper heat insulation foam, and the upper shell is equipped with the slot position being adapted to conduction cooling cup lower end, described to lead Cold cup is placed in the slot position, and the slot position bottom is equipped with the through-hole contacted for the cool guide sheet with conduction cooling bottom of a cup portion.
Preferably, in the lower casing side wall inner surface mounting circuit boards, DC-12V is set in the lower casing sidewall outer Attaching plug.
Preferably, installation function switch key and LED light on the side wall of the upper shell.
Preferably, to be provided with multiple positions on the lower casing, blower, radiator, upper heat insulation foam one-to-one Connecting hole, on the lower end surface of the upper shell be equipped with the one-to-one screw location hole of the connecting hole, in corresponding institute It states and bolt is installed in lower casing, blower, radiator, the connecting hole of upper heat insulation foam and screw location hole and is locked, make described lower outer Shell, refrigerating plant and upper cage connection are fixed.
Preferably, the conduction cooling cup is food-class high-purity aluminium cup.
Preferably, waterproof sealing washer is installed on the inside of the through-hole edge of the upper shell.
Preferably, the radiator is highly endothermic cold forging formula radiator.
Preferably, the cooling fin is that surface sets ripply strip ripple refluence piece.
The utility model has the following beneficial effects:
The fast-refrigerating cup of the utility model is freezed using semiconductor chilling plate (abbreviation TEC), utilizes extraordinary semiconductor material Expect the P-N junction constituted, form thermocouple pair, generate Peltier effect, i.e., freezed by direct current, small in size, refrigeration is quick.
It is absorbed heat by highly endothermic cold forging formula radiator, then DC fan is cooperated to be formed around turbulent convection type active heat removal Mode reduces the hot-side temperature of semiconductor chilling plate, so that semiconductor chilling plate cold end be made to reach lower cryogenic temperature;And Cold junction temperature can also be declined accordingly by the absorption of aluminium cup, to reach lower cryogenic temperature, high cooling efficiency.
Detailed description of the invention
Fig. 1 is the structural decomposition diagram of the fast-refrigerating cup of the utility model;
Fig. 2 is the perspective view of the fast-refrigerating cup of the utility model;
Fig. 3 is the rearview of the fast-refrigerating cup of the utility model.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
It should be appreciated that specific embodiment described herein is only used to explain the utility model, it is not used to limit this Utility model.
Referring to figs. 1 to Fig. 3, an embodiment of the fast-refrigerating cup of the utility model is proposed:
A kind of fast-refrigerating cup including seperated lower casing 9 and upper shell 2, is mounted between lower casing 9 and upper shell 2 Refrigerating plant and the conduction cooling food-class high-purity aluminium cup 1 on upper shell 2.Refrigerating plant include semiconductor chilling plate 4, Cool guide sheet 3, upper heat insulation foam 5, radiator 6, lower heat insulation foam 8 and blower 7.Lower casing 9 is that upper port is rounded, 9 bottom of lower casing Equipped with support leg.The groove 91 that the face of lower casing 9 upward is equipped with support frame 93 and is adapted to blower 7, is engraved in 91 bottom of groove Sky is provided with vent 92.Blower 7 is mounted in groove 91, and the lower lid of heat insulation foam 8 is located on support frame 93, is set on lower heat insulation foam 8 There is the ventilation hole being adapted to blower 7.Radiator 6 is mounted on lower heat insulation foam 8, and the air intake of blower 7 is towards radiator 6, blower 7 Outlet air end towards vent 9.
Radiator 6 is highly endothermic cold forging formula radiator 6, including being located at the thermally conductive platform of upper end, being vertically provided at thermally conductive put down The cylindrical diversion column of platform lower end surface central location and the multiple diversion columns that surround for being vertically provided at thermally conductive platform lower end surface are in spoke Penetrate the cooling fin of shape setting.Cooling fin is that surface sets ripply strip ripple refluence piece, and heat dissipation area is big, radiating efficiency It is high.
Between lower casing 9 and upper shell 2, cooling fin is naked to be exposed on the external radiator 6, is directly contacted with outside air, Rapid cooling.The air inlet of blower 7 forms from the clearance space sucking between cooling fin and surround turbulent convection type active heat removal, from And the heat of radiator 6 is discharged from the exhaust outlet 92 of lower casing 9.
Upper casing cover is located on heat insulation foam, and upper shell is equipped with the slot position being adapted to conduction cooling cup lower end, and conduction cooling cup is placed in In slot position, slot position bottom is equipped with the through-hole contacted for cool guide sheet with conduction cooling bottom of a cup portion.
Upper heat insulation foam 5 is mounted on the upper surface of radiator 6, and upper heat insulation foam 5 is equipped with and engraves with what semiconductor chilling plate 4 was adapted to Emptying aperture, semiconductor chilling plate 4 are embedded in hollow hole.The hot end of semiconductor chilling plate 4 is thermally conductive with radiator 6 towards radiator 6 Platform directly contacts, and thermally conductive platform quickly exports the hot-side temperature of semiconductor chilling plate 4.In the cold end of semiconductor chilling plate 4 Cool guide sheet 3 is installed.The upper lid of shell 2 is located on heat insulation foam 5, and upper shell 2 is equipped with the slot position being adapted to 1 lower end of aluminium cup, aluminium cup 1 It is placed in slot position, slot position bottom is equipped with the through-hole contacted for cool guide sheet 3 with 1 bottom of aluminium cup, and semiconductor chilling plate 4 passes through cool guide sheet 3 make 1 fast-refrigerating of aluminium cup.
Aluminium cup 1 is to aoxidize out by food-class high-purity aluminium deep processing, has the fast energy storage of light-weight temperature conduction The features such as effect is good enables food or the rapid cooling refrigeration of liquid beverage in cup body.The bore of aluminium cup 1 is according to cooperation aluminum The design of the multipurpose product bore of product easy open can beverage, easy-to-draw tinned beer and fruit juice mixer glass and glass bottle beer bottle, symbol Filling (30MM-80MM) bore of bottle for closing on the market 90% or more, can obtain general.
Cool guide sheet 3 is aluminum conduction cooling aluminium flake.
Upper heat insulation foam 5 is isolated by the cold end of semiconductor chilling plate 4 with hot end, prevents the hot end heat of semiconductor chilling plate 4 And the heat of radiator 6 is conducted to aluminium cup 1.
Waterproof sealing washer 10 is installed on the inside of the through-hole edge of upper shell 2, waterproof sealing washer 10 is wrapped in conduction cooling The edge of piece 3, aluminium cup 1 are placed on cool guide sheet 3 and waterproof sealing washer 10, and cool guide sheet 3 and waterproof sealing washer 10 prevent aluminium cup 1 It is contacted with upper heat insulation foam 5,1 bottom of aluminium cup can be protected and 5 heat of heat insulation foam is prevented to be conducted to aluminium cup 1.
Main control board is installed in 9 side wall inner surface of lower casing, main control board electrically connects with blower 7, semiconductor chilling plate 4 It connects.Alternating current is passed through by 94 external power supply of attaching plug in 9 sidewall outer of lower casing setting DC-12V attaching plug 94 110V-270V Width funtion power supply adaptor converts DC-12V-2000-6000ma (vehicle-mounted 12V-2000-6000ma) burning voltage Main control board is inputted, is powered.The installation function switch key on the side wall of upper shell 2, by click switch key come Open or close refrigeration cup heat dissipation and refrigerating function.
The one-to-one connecting hole in multiple positions is provided on lower casing 9, blower 7, radiator 6, upper heat insulation foam 5, On the lower end surface of upper shell 2 be equipped with the one-to-one screw location hole of connecting hole, corresponding lower casing 9, blower 7, dissipate Hot device 6, upper heat insulation foam 5 connecting hole and screw location hole in install and bolt and lock, make lower casing 9, refrigerating plant and upper outer Shell 2 is connected and fixed, and assembly operation is easy.
Blower 7 in the present embodiment uses the DC fan 7 of direct current 12V-250-500ma/6cm-10cm.
The fast-refrigerating cup of the utility model is freezed using semiconductor chilling plate 4 (abbreviation TEC), utilizes extraordinary semiconductor material Expect the P-N junction constituted, form thermocouple pair, generate Peltier effect, i.e., freezed by direct current, small in size, refrigeration is quick.
It is absorbed heat by highly endothermic cold forging formula radiator 6, then the mode for cooperating DC fan 7 to form convection type active heat removal is come The hot-side temperature for reducing semiconductor chilling plate 4, so that 4 cold end of semiconductor chilling plate be made to reach lower cryogenic temperature;And cold end Temperature can also be declined accordingly by the absorption of aluminium cup 1, to reach lower cryogenic temperature, high cooling efficiency.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model, Equivalent structure transformation made by using the description of the utility model and the drawings is applied directly or indirectly in other phases The technical field of pass, is also included in the patent protection scope of the utility model.

Claims (8)

1. a kind of fast-refrigerating cup, which is characterized in that including seperated upper shell and lower casing, be mounted on the lower casing and institute The refrigerating plant between shell and the conduction cooling cup on the upper shell are stated, the refrigerating plant includes semiconductor refrigerating Piece, cool guide sheet, upper heat insulation foam, radiator, lower heat insulation foam and blower, the lower casing bottom are equipped with support leg, the lower casing The groove that face upward is equipped with support frame and is adapted to the blower, is provided with vent in the bottom portion of groove hollow out, institute Assembling is stated in the groove, the lower heat insulation foam lid is located on support frame as described above, and the lower heat insulation foam is equipped with and institute The corresponding ventilation hole of blower is stated, the radiator is mounted on the lower heat insulation foam, and the air intake of the blower is dissipated towards described Hot device, the outlet air end of the blower is towards the vent;The radiator includes the thermally conductive platform, vertically arranged positioned at upper end The thermally conductive platform lower end surface central location diversion column and be vertically provided at thermally conductive the multiple of platform lower end surface and surround The cooling fin that the diversion column is radially arranged, the cooling fin is exposed outside, and the air inlet of the blower is from the cooling fin Between clearance space sucking, formed around turbulent convection type active heat removal, to make the heat of radiator from lower casing air draft Mouth discharge;
The upper heat insulation foam is mounted on the upper surface of the radiator, and the upper heat insulation foam is equipped with and the semiconductor chilling plate The hollow hole of adaptation, the semiconductor chilling plate are embedded in the hollow hole, and the hot end of the semiconductor chilling plate is described in Radiator, the thermally conductive contact with platform with the radiator;Cool guide sheet is installed in the cold end of the semiconductor chilling plate, it is described outer Cap is located on the upper heat insulation foam, and the upper shell is equipped with the slot position being adapted to conduction cooling cup lower end, the conduction cooling cup It is placed in the slot position, the slot position bottom is equipped with the through-hole contacted for the cool guide sheet with conduction cooling bottom of a cup portion.
2. fast-refrigerating cup according to claim 1, which is characterized in that install circuit in the lower casing side wall inner surface DC-12V attaching plug is arranged in the lower casing sidewall outer in plate.
3. fast-refrigerating cup according to claim 1 or 2, which is characterized in that install function on the side wall of the upper shell It can switch key and LED light.
4. fast-refrigerating cup according to claim 1, which is characterized in that the lower casing, blower, radiator, on every It is provided with the one-to-one connecting hole in multiple positions on hot cotton, is equipped with and the connecting hole on the lower end surface of the upper shell One-to-one screw location hole, it is fixed in the corresponding lower casing, blower, radiator, the connecting hole of upper heat insulation foam and screw Bolt is installed in the hole of position and is locked, the lower casing, refrigerating plant and upper cage connection are fixed.
5. fast-refrigerating cup according to claim 1, which is characterized in that the conduction cooling cup is food-class high-purity aluminium cup.
6. fast-refrigerating cup according to claim 1, which is characterized in that installed on the inside of the through-hole edge of the upper shell There is waterproof sealing washer.
7. fast-refrigerating cup according to claim 1, which is characterized in that the radiator is the heat dissipation of highly endothermic cold forging formula Device.
8. fast-refrigerating cup according to claim 1 or claim 7, which is characterized in that the cooling fin sets ripply for surface Strip ripple flows backwards piece.
CN201821522455.XU 2018-09-18 2018-09-18 A kind of fast-refrigerating cup Expired - Fee Related CN208901742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821522455.XU CN208901742U (en) 2018-09-18 2018-09-18 A kind of fast-refrigerating cup

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821522455.XU CN208901742U (en) 2018-09-18 2018-09-18 A kind of fast-refrigerating cup

Publications (1)

Publication Number Publication Date
CN208901742U true CN208901742U (en) 2019-05-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821522455.XU Expired - Fee Related CN208901742U (en) 2018-09-18 2018-09-18 A kind of fast-refrigerating cup

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110558800A (en) * 2019-09-29 2019-12-13 得胜电子科技(深圳)有限公司 Stereo set refrigeration cup

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110558800A (en) * 2019-09-29 2019-12-13 得胜电子科技(深圳)有限公司 Stereo set refrigeration cup

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190524

Termination date: 20190918

CF01 Termination of patent right due to non-payment of annual fee