CN211242850U - Liquid heater - Google Patents
Liquid heater Download PDFInfo
- Publication number
- CN211242850U CN211242850U CN201921421966.7U CN201921421966U CN211242850U CN 211242850 U CN211242850 U CN 211242850U CN 201921421966 U CN201921421966 U CN 201921421966U CN 211242850 U CN211242850 U CN 211242850U
- Authority
- CN
- China
- Prior art keywords
- aluminum alloy
- disc
- stainless steel
- annular
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a liquid heater, include: the kettle body is used for containing liquid; the chassis assembly is arranged at the bottom of the kettle body to seal a bottom opening of the kettle body; the heating component is arranged at the bottom of the chassis component and is used for heating the liquid in the kettle body; the semiconductor refrigeration piece is arranged at the bottom of the chassis assembly and is used for cooling liquid in the kettle body; an insulation member disposed between the heating member and the semiconductor chilling plate; the heat dissipation assembly is arranged at the bottom of the semiconductor refrigeration piece and used for discharging heat outwards, and the heat dissipation assembly is simple in structure, can realize quick cooling of liquid, and is favorable for improving the use convenience.
Description
Technical Field
The utility model relates to a heater technical field especially relates to a liquid heater.
Background
In the related art, the liquid heater has become a common electric appliance in people's life due to the advantages of fast heating, no oil smoke, safety, convenience and the like.
However, since the liquid heater in the prior art only has the function of heating liquid, and the liquid which is just boiled needs a long time to be cooled to a proper temperature for people to drink due to high temperature, people often feel inconvenient because the liquid is too hot to drink when the people drink the liquid in an urgent way.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the problems that exist among the prior art to a certain extent at least, for this reason, the utility model aims to provide a liquid heater, its simple structure can realize the quick cooling to liquid, does benefit to the convenience that promotes the use.
The above purpose is realized by the following technical scheme:
a liquid heater comprising:
the kettle body is used for containing liquid;
the chassis assembly is arranged at the bottom of the kettle body to seal a bottom opening of the kettle body;
the heating component is arranged at the bottom of the chassis component and is used for heating the liquid in the kettle body;
the semiconductor refrigeration piece is arranged at the bottom of the chassis assembly and is used for cooling liquid in the kettle body;
an insulation member disposed between the heating member and the semiconductor chilling plate;
and the heat dissipation assembly is arranged at the bottom of the semiconductor refrigeration piece and used for discharging heat outwards.
In some embodiments, the chassis assembly comprises a first stainless steel disc and a first aluminum alloy disc, wherein an annular first clamping groove is formed in the outer edge of the first stainless steel disc, and the bottom of the kettle body is clamped in the first clamping groove;
first stainless steel dish center is provided with first through-hole first aluminium alloy dish center is provided with first bellying, first aluminium alloy dish set up in on the bottom of first stainless steel dish, first bellying nested in the first through-hole.
In some embodiments, the heating member is annular and fixed on the bottom of the first aluminum alloy disc, and the semiconductor chilling plate is arranged in the center of the heating member and fixed on the bottom of the first aluminum alloy disc;
the heat insulation component is annular and is sleeved on the periphery of the semiconductor refrigeration piece to separate the semiconductor refrigeration piece from the heating component.
In some embodiments, the heat dissipation assembly includes a first heat sink disposed within the bottom opening of the insulating member and a first fan disposed on a bottom of the first heat sink.
In some embodiments, the chassis subassembly includes second stainless steel dish, second aluminum alloy dish and third aluminum alloy dish, wherein be provided with annular second draw-in groove in the outer fringe of second aluminum alloy dish center is provided with the second through-hole the periphery of second through-hole be provided with annular third draw-in groove on the second aluminum alloy dish, the bottom joint of the kettle body in the second draw-in groove, the second stainless steel dish set up in just seal in the center of second aluminum alloy dish the second through-hole, the outer fringe of second stainless steel dish extend down and the joint in the third draw-in groove, the third aluminum alloy dish set up in on the bottom of second stainless steel dish, heating member set up in on the bottom of third aluminum alloy dish.
In some embodiments, the heat insulation member is annular and is sleeved on the periphery of the heating member for separating the heating member from the semiconductor chilling plate;
the semiconductor refrigeration piece is annular and is sleeved on the periphery of the heat insulation member and fixed on the bottom of the second aluminum alloy plate.
In some embodiments, the heat dissipation assembly includes an annular second heat sink, a second fan, and a first housing, wherein the second heat sink is disposed on the bottom of the semiconductor cooling fin, the first housing is disposed below the second heat sink, a first air duct with an open top is formed on the first housing, a plurality of second heat dissipation members extending downward are disposed on the second heat sink, the second heat dissipation members extend into the first air duct, the first air duct is annular, the second fan is disposed on one side of the first air duct, and a heat dissipation opening is disposed on the other side of the first air duct.
In some embodiments, the chassis assembly includes a third stainless steel plate and a fourth aluminum alloy plate, wherein an annular fourth clamping groove is formed in an outer edge of the third stainless steel plate, a second boss extending downward is formed in the center of the third stainless steel plate, the bottom of the kettle body is clamped in the fourth clamping groove, the fourth aluminum alloy plate is arranged on the bottom of the second boss, and the heating member is arranged on the bottom of the fourth aluminum alloy plate.
In some embodiments, the heat insulation member is annular and is sleeved on the periphery of the heating member for separating the heating member from the semiconductor chilling plate;
the chassis component further comprises a fifth aluminum alloy disc, the fifth aluminum alloy disc is annular and sleeved on the periphery of the heat insulation member, and the semiconductor refrigeration piece is arranged on the bottom of the fifth aluminum alloy disc.
In some embodiments, the liquid heater is a tea boiler, or a milk warmer, or an electric kettle.
Compared with the prior art, the utility model discloses an at least including following beneficial effect:
1. the utility model discloses a liquid heater, its simple structure can realize the quick cooling to liquid through the semiconductor refrigeration piece that sets up, makes the temperature of liquid reduce to required suitable temperature fast, does benefit to the convenience that promotes the use from this.
Drawings
FIG. 1 is a schematic perspective view of a liquid heater according to a first embodiment;
FIG. 2 is an exploded view of the liquid heater according to the first embodiment;
FIG. 3 is a sectional view of the liquid heater according to the first embodiment;
FIG. 4 is a schematic perspective view of a liquid heater according to a second embodiment;
FIG. 5 is an exploded view of the liquid heater according to the second embodiment;
FIG. 6 is a sectional view showing the structure of a liquid heater according to a second embodiment;
FIG. 7 is a schematic perspective view of a liquid heater according to a third embodiment;
FIG. 8 is an exploded view of a liquid heater according to a third embodiment;
FIG. 9 is a sectional view showing the structure of a liquid heater according to a third embodiment.
Detailed Description
The present invention is illustrated by the following examples, but the present invention is not limited to these examples. To the embodiment of the present invention, modify or replace some technical features, without departing from the spirit of the present invention, it should be covered in the technical solution scope of the present invention.
The first embodiment is as follows: as shown in fig. 1, 2 and 3, the present embodiment provides a liquid heater, which is a tea boiler, or a milk warmer, or an electric kettle, or other appliance suitable for heating liquid, and comprises:
a kettle body 1 for containing liquid, such as tap water, milk, tea and the like;
the chassis component 2 is arranged at the bottom of the kettle body 1 to seal the bottom opening of the kettle body 1, so that a space for containing liquid is formed by the kettle body 1 and the chassis component 2;
the heating component 3 is arranged at the bottom of the chassis component 2 and is used for heating the liquid in the kettle body 1;
the semiconductor refrigerating sheet 4 is arranged at the bottom of the chassis component 2 and is used for cooling liquid in the kettle body 1;
the heat insulation member 5 is arranged between the heating member 3 and the semiconductor refrigerating sheet 4 to separate the heating member 3 from the semiconductor refrigerating sheet 4, so that interference between the heating member 3 and the semiconductor refrigerating sheet 4 during operation is avoided;
the heat dissipation assembly 6 and the heat dissipation assembly 6 are arranged at the bottom of the semiconductor refrigeration piece 4 and used for discharging heat outwards, so that the heat dissipation efficiency of the semiconductor refrigeration piece 4 is improved, and the purpose of cooling efficiency is achieved.
The liquid heater of this embodiment, its simple structure can realize the quick cooling to liquid through the semiconductor refrigeration piece 4 that sets up, makes the temperature of liquid reduce to required suitable temperature fast, does benefit to the convenience that promotes the use from this.
In addition, can separate heating element 3 and semiconductor refrigeration piece 4 through the thermal-insulated component 5 that sets up, avoid producing at the during operation between heating element 3 and the semiconductor refrigeration piece 4 and interfere, do benefit to and promote the stability and the reliability of each part work, for example can avoid on the produced heat conduction of heating element 3 during operation is to semiconductor refrigeration piece 4, do benefit to the cooling efficiency of guaranteeing semiconductor refrigeration piece 4 during operation to the interior liquid of the kettle body 1.
In this embodiment, the chassis assembly 2 includes a first stainless steel plate 21 and a first aluminum alloy plate 22, wherein an annular first locking groove 210 is disposed on an outer edge of the first stainless steel plate 21, a bottom of the kettle body 1 is locked in the first locking groove 210, and in addition, the kettle body 1 and the first stainless steel plate 21 can be bonded together by using glue or other materials;
be provided with first through-hole 211 at first stainless steel dish 21 center, be provided with first bellying 221 at first aluminium alloy dish 22 center, first aluminium alloy dish 22 sets up on the bottom of first stainless steel dish 21, and first bellying 221 nests in first through-hole 211 and with first through-hole 211 interference fit. The first aluminum alloy disc 22 can facilitate the installation and fixation of the heating component 3, the heat conduction efficiency of the aluminum alloy is higher, and the efficiency of heating liquid is improved.
Further, the heating member 3 is annular and fixed on the bottom of the first aluminum alloy disc 22, for example, the heating member 3 can be fixed on the bottom of the first aluminum alloy disc 22 by welding, the structure is simple, the installation efficiency and the installation reliability of the heating member 3 are improved, and the semiconductor cooling plate 4 is arranged in the center of the heating member 3 and fixed on the bottom of the first aluminum alloy disc 22;
the heat insulation member 5 is annular and is sleeved on the periphery of the semiconductor refrigerating piece 4 and used for separating the semiconductor refrigerating piece 4 from the heating member 3, the structure is simple, the semiconductor refrigerating piece 4 and the heating member 3 can be effectively separated, interference in work between the semiconductor refrigerating piece 4 and the heating member 3 is avoided, and the stability and reliability of work of each part are favorably improved, for example, heat generated in the work process of the heating member 3 can be prevented from being conducted to the semiconductor refrigerating piece 4, and the cooling efficiency of the liquid in the kettle body 1 in the work process of the semiconductor refrigerating piece 4 is favorably ensured.
Further, the heat dissipation assembly 6 includes a first heat sink 61 and a first fan 62, wherein the first heat sink 61 is disposed in the bottom opening of the heat insulation member 5, and the semiconductor cooling plate 4 and the heating member 3 can be separated by the heat insulation member 5, so that the first heat sink 61 can be conveniently mounted and fixed, the assembly efficiency can be improved, and the assembly cost can be reduced. Furthermore, the first fan 62 is disposed at the bottom of the first heat sink 61, preferably, the first heat sink 61 is provided with a plurality of first heat dissipation members extending downward, the first heat dissipation members are fin-shaped or strip-shaped, heat generated when the liquid in the kettle body 1 is cooled will be conducted to the first heat dissipation members through the first heat sink 61, and the first fan 62 blows towards the first heat dissipation members to discharge the heat conducted to the first heat dissipation members.
The liquid heater of this embodiment has controller and power base, and heating member 3 is connected with power base through the coupler, and power base is controller, heating member 3 and the power supply of semiconductor refrigeration piece 4 respectively, and the controller respectively with heating member 3, semiconductor refrigeration piece 4, 6 signal connection of radiator unit, through controller control heating member 3, semiconductor refrigeration piece 4, radiator unit 6 work. At the beginning, the controller controls the heating element 3 to start working to heat the liquid in the kettle body 1 to a set temperature. After the liquid in the kettle body 1 is heated to the set temperature, the controller controls the heating component 3 to stop working and controls the semiconductor refrigerating sheet 4 and the heat dissipation assembly 6 to start working so as to cool the liquid in the kettle body 1 to the proper temperature, thereby reducing the time for a user to wait for the liquid to cool and being beneficial to improving the use convenience.
Example two: as shown in fig. 4, 5 and 6, the present embodiment provides a liquid heater, which is different from the liquid heater provided in the first embodiment in that: the chassis component 2 comprises a second stainless steel disc 23, a second aluminum alloy disc 24 and a third aluminum alloy disc 25, wherein an annular second clamping groove 241 is arranged on the outer edge of the second aluminum alloy disc 24, a second through hole 242 is arranged in the center of the second aluminum alloy disc 24, and an annular third clamping groove 243 is arranged on the periphery of the second through hole 242 and the second aluminum alloy disc 24. The bottom of the kettle body 1 is engaged with the second engaging groove 241, and the kettle body 1 and the second aluminum alloy plate 24 can be adhered together by using glue or other materials. The second stainless steel plate 23 is disposed at the center of the second aluminum alloy plate 24 and closes the second through hole 242, the outer edge of the second stainless steel plate 23 extends downward and is clamped in the third clamping groove 243, and in addition, the second stainless steel plate 23 and the second aluminum alloy plate 24 can be bonded together by using glue or other materials. Third aluminium alloy dish 25 sets up on the bottom of second stainless steel dish 23, and heating member 3 sets up on the bottom of third aluminium alloy dish 25, does benefit to through the third aluminium alloy dish 25 that sets up and install and fix heating member 3, in this embodiment, through the welding with heating member 3 be fixed in on the bottom of third aluminium alloy dish 25, the welded mode is simple relatively, and can be effectively fixed heating member 3.
Further, thermal-insulated component 5 is cyclic annular and the cover is located the periphery of heating component 3 and is used for separating heating component 3 and semiconductor refrigeration piece 4, its simple structure, can effectively separate heating component 3 and semiconductor refrigeration piece 4, avoid the work between heating component 3 and the semiconductor refrigeration piece 4 to produce and interfere, do benefit to and promote the stability and the reliability of each part work, for example, can avoid on the produced heat conduction of heating component 3 during operation is to semiconductor refrigeration piece 4, do benefit to the cooling efficiency of guaranteeing semiconductor refrigeration piece 4 during operation to the interior liquid of the kettle body 1.
Furthermore, the semiconductor chilling plate 4 is in a ring shape, and is sleeved on the periphery of the heat insulation member 5 and fixed on the bottom of the second aluminum alloy plate 24, so that the semiconductor chilling plate 4 and the heating member 3 can be effectively separated. In addition, the contact area between the semiconductor refrigerating sheet 4 and the second aluminum alloy plate 24 is relatively large, so that the refrigerating and cooling effects of the semiconductor refrigerating sheet 4 are improved.
In this embodiment, the heat dissipation assembly 6 includes a second heat sink 63, a second fan 64 and a first housing 65, wherein the second heat sink 63 is disposed on the bottom of the semiconductor cooling plate 4, the first housing 65 is disposed below the second heat sink 63, a first air duct 650 with an open top is formed on the first housing 65, a plurality of second heat dissipation members 631 extending downward are disposed on the second heat sink 63, the second heat dissipation members 631 extend into the first air duct 650, the first air duct 650 is annular, the second fan 64 is disposed on one side of the first air duct 650, and a heat dissipation port 651 is disposed on the other side of the first air duct 650. The heat generated when the liquid in the kettle body 1 is cooled is transferred to the second heat dissipating member 631 through the second heat sink 63, the second fan 64 blows cold air into the first air duct 650, and the cold air can take away the heat transferred to the second heat dissipating member 631 and is discharged through the heat dissipating port 651.
Example three: as shown in fig. 7, 8 and 9, the present embodiment provides a liquid heater, which is different from the liquid heater provided in the second embodiment in that: the chassis component 2 comprises a third stainless steel disc 26 and a fourth aluminum alloy disc 27, wherein an annular fourth clamping groove 261 is formed in the outer edge of the third stainless steel disc 26, a second boss 262 extending downwards is arranged in the center of the third stainless steel disc 26, the bottom of the kettle body 1 is clamped in the fourth clamping groove 261, and in addition, the kettle body 1 and the third stainless steel disc 26 can be bonded together by using glue or other materials. The fourth aluminum alloy plate 27 is disposed on the bottom of the second boss 262, and the heating member 3 is disposed on the bottom of the fourth aluminum alloy plate 27. The heating member 3 is installed and fixed by the arranged fourth aluminum alloy plate 27, in the embodiment, the heating member 3 is fixed on the bottom of the fourth aluminum alloy plate 27 by welding, the welding mode is relatively simple, and the heating member 3 can be effectively fixed.
Further, thermal-insulated component 5 is cyclic annular and the cover is located the periphery of heating component 3 and is used for separating heating component 3 and semiconductor refrigeration piece 4, its simple structure, can effectively separate heating component 3 and semiconductor refrigeration piece 4, avoid the work between heating component 3 and the semiconductor refrigeration piece 4 to produce and interfere, do benefit to and promote the stability and the reliability of each part work, for example, can avoid on the produced heat conduction of heating component 3 during operation is to semiconductor refrigeration piece 4, do benefit to the cooling efficiency of guaranteeing semiconductor refrigeration piece 4 during operation to the interior liquid of the kettle body 1.
Further, chassis subassembly 2 still includes fifth aluminum alloy dish 28, and fifth aluminum alloy dish 28 is the periphery that thermal-insulated component 5 was located to annular and cover, and semiconductor refrigeration piece 4 sets up on fifth aluminum alloy dish 28's bottom, can make semiconductor refrigeration piece 4's mounted position become more level and more smooth through the fifth aluminum alloy dish 28 that sets up, does benefit to effective installation, fixed semiconductor refrigeration piece 4, also does benefit to the even cooling of semiconductor refrigeration piece 4 to liquid simultaneously. In addition, can effectively separate semiconductor refrigeration piece 4 and heating member 3 through adopting above-mentioned structure, in addition, semiconductor refrigeration piece 4 is also relatively great with the area of contact of fifth aluminium alloy dish 28 to this is favorable to promoting semiconductor refrigeration piece 4 refrigeration, cooling effect.
In this embodiment, the heat dissipation assembly 6 has the same structure as the heat dissipation assembly 6 of the embodiment. Since the structure of the heat dissipation assembly 6 has been described in detail in the second embodiment, it is not repeated herein for brevity.
What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.
Claims (10)
1. A liquid heater, comprising:
the pot body (1) is used for containing liquid;
the base plate component (2) is arranged at the bottom of the kettle body (1) to seal the bottom opening of the kettle body (1);
the heating component (3) is arranged at the bottom of the chassis component (2) and is used for heating the liquid in the kettle body (1);
the semiconductor refrigeration piece (4) is arranged at the bottom of the chassis assembly (2) and is used for cooling liquid in the kettle body (1);
-an insulating member (5), said insulating member (5) being arranged between said heating member (3) and said semiconductor chilling plate (4);
the heat dissipation assembly (6), the heat dissipation assembly (6) set up in the bottom of semiconductor refrigeration piece (4) is used for outwards discharging the heat.
2. The liquid heater as claimed in claim 1, wherein the chassis component (2) comprises a first stainless steel disc (21) and a first aluminum alloy disc (22), wherein an annular first clamping groove (210) is arranged on the outer edge of the first stainless steel disc (21), and the bottom of the kettle body (1) is clamped in the first clamping groove (210);
first stainless steel dish (21) center is provided with first through-hole (211) first aluminium alloy dish (22) center is provided with first bellying (221), first aluminium alloy dish (22) set up in on the bottom of first stainless steel dish (21), first bellying (221) nest in first through-hole (211).
3. A liquid heater according to claim 2, characterized in that the heating member (3) is annular and fixed on the bottom of the first aluminum alloy disc (22), the semiconductor chilling plate (4) is arranged in the center of the heating member (3) and fixed on the bottom of the first aluminum alloy disc (22);
the heat insulation member (5) is annular and is sleeved on the periphery of the semiconductor refrigeration sheet (4) to separate the semiconductor refrigeration sheet (4) from the heating member (3).
4. A liquid heater according to claim 3, wherein the heat dissipating assembly (6) comprises a first heat sink (61) and a first fan (62), wherein the first heat sink (61) is arranged in a bottom opening of the thermal insulation member (5) and the first fan (62) is arranged on a bottom of the first heat sink (61).
5. The liquid heater according to claim 1, wherein the chassis component (2) comprises a second stainless steel disc (23), a second aluminum alloy disc (24) and a third aluminum alloy disc (25), wherein an annular second clamping groove (241) is arranged on the outer edge of the second aluminum alloy disc (24), a second through hole (242) is arranged at the center of the second aluminum alloy disc (24), an annular third clamping groove (243) is arranged on the periphery of the second through hole (242) and the second aluminum alloy disc (24), the bottom of the kettle body (1) is clamped in the second clamping groove (241), the second stainless steel disc (23) is arranged on the center of the second aluminum alloy disc (24) and seals the second through hole (242), the outer edge of the second stainless steel disc (23) extends downwards and is clamped in the third clamping groove (243), third aluminium alloy dish (25) set up in on the bottom of second stainless steel dish (23), heating member (3) set up in on the bottom of third aluminium alloy dish (25).
6. A liquid heater as claimed in claim 5, characterised in that the heat insulating member (5) is annular and is fitted around the heating member (3) for separating the heating member (3) from the semiconductor chilling plates (4);
the semiconductor refrigeration piece (4) is annular and is sleeved on the periphery of the heat insulation member (5) and fixed on the bottom of the second aluminum alloy disc (24).
7. A liquid heater according to claim 6, characterised in that the heat-radiating assembly (6) comprises a second heat sink (63) in the form of a ring, a second fan (64) and a first housing (65), wherein the second radiator (63) is arranged on the bottom of the semiconductor refrigeration sheet (4), the first housing (65) is disposed below the second heat sink (63), a first duct 650 opened at the top is formed on the first housing 65, a plurality of second heat dissipation components (631) extending downwards are arranged on the second heat sink (63), the second heat radiating member (631) is inserted into the first air duct (650), the first air channel (650) is annular, the second fan (64) is arranged at one side of the first air channel (650), and a heat radiation port (651) is arranged on the other side of the first air duct (650).
8. The liquid heater as claimed in claim 1, wherein the chassis component (2) comprises a third stainless steel disc (26) and a fourth aluminum alloy disc (27), wherein an annular fourth clamping groove (261) is arranged on the outer edge of the third stainless steel disc (26), a second boss (262) extending downwards is arranged at the center of the third stainless steel disc (26), the bottom of the kettle body (1) is clamped in the fourth clamping groove (261), the fourth aluminum alloy disc (27) is arranged on the bottom of the second boss (262), and the heating member (3) is arranged on the bottom of the fourth aluminum alloy disc (27).
9. A liquid heater as claimed in claim 8, characterised in that the insulating member (5) is annular and is fitted around the periphery of the heating member (3) for separating the heating member (3) from the semiconductor chilling plates (4);
chassis subassembly (2) still include fifth aluminium alloy dish (28), fifth aluminium alloy dish (28) are the annular and the cover is located the periphery of thermal-insulated component (5), semiconductor refrigeration piece (4) set up in on the bottom of fifth aluminium alloy dish (28).
10. A liquid heater as claimed in any one of claims 1 to 9, wherein the liquid heater is a tea boiler, or a milk warmer, or an electric kettle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921421966.7U CN211242850U (en) | 2019-08-29 | 2019-08-29 | Liquid heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921421966.7U CN211242850U (en) | 2019-08-29 | 2019-08-29 | Liquid heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211242850U true CN211242850U (en) | 2020-08-14 |
Family
ID=71966095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921421966.7U Active CN211242850U (en) | 2019-08-29 | 2019-08-29 | Liquid heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211242850U (en) |
-
2019
- 2019-08-29 CN CN201921421966.7U patent/CN211242850U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5941077A (en) | Chill-hot buffet serving tray | |
| CN211242850U (en) | Liquid heater | |
| CN211093364U (en) | Pressure cooker, cooker lid structure and radiator | |
| CN104905671B (en) | Electric cooker with refrigerating function | |
| CN204743710U (en) | Electric rice cooker of area refrigeration function | |
| JP2000332474A (en) | Cooling structure of electrical component | |
| CN211795805U (en) | Cooking utensil | |
| CN211459892U (en) | Self-service dining stove capable of switching cold and hot | |
| CN211582688U (en) | Pot body and have its cooking utensil | |
| CN208973296U (en) | A kind of juice extractor of good heat dissipation effect | |
| CN206929813U (en) | Electromagnetic oven | |
| JP4357222B2 (en) | Heat treatment system for heating cooker | |
| CN112113366A (en) | Refrigeration and heating device and household appliance | |
| CN214608795U (en) | Oxygen-control fruit preservation box with improved heat preservation effect | |
| CN213046504U (en) | Cooking utensil with cooling function | |
| CN210169739U (en) | Electric pressure cooker circuit board heat dissipation dustproof construction | |
| CN214341678U (en) | Interior pot subassembly and cooking utensil | |
| CN216651143U (en) | Cook machine with cooling function | |
| CN216822122U (en) | Multifunctional lunch box | |
| CN106691143B (en) | Juice extractor | |
| CN220366445U (en) | Commercial electromagnetic oven with novel heat abstractor | |
| CN218074579U (en) | Milk warming sterilizer | |
| CN219206509U (en) | Thermoelectric effect semiconductor cold-hot composite electric cooker chassis | |
| CN216317059U (en) | Cooking utensil | |
| CN214198793U (en) | Heating furnace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |