CN209436803U - A detachable cooling cup - Google Patents

A detachable cooling cup Download PDF

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CN209436803U
CN209436803U CN201821803005.8U CN201821803005U CN209436803U CN 209436803 U CN209436803 U CN 209436803U CN 201821803005 U CN201821803005 U CN 201821803005U CN 209436803 U CN209436803 U CN 209436803U
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cup
cup body
heat dissipation
semiconductor chilling
cold
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施玮
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Sunshine Institute
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Sunshine Institute
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Abstract

本实用新型涉及一种可分离式制冷杯,属于冷水杯领域。包括可拆卸连接的杯体和底座,所述底座包括壳体以及设置在壳体腔室内的制冷装置,所述制冷装置包括导冷板、半导体制冷片、供电模块、散热片和散热风扇,所述供电模块分别与半导体制冷片以及散热风扇电连接并为半导体制冷片和散热风扇提供电能,所述半导体制冷片的冷面与导冷板下端面粘连,导冷板上端面高度超过壳体顶部;半导体制冷片的热面与散热片粘连,散热片下方设置有散热腔,所述散热风扇设置在散热腔中,散热腔的侧壁上设置有散热孔。本实用新型的制冷杯采用可拆卸分体形式,杯体与底座分离,结构简单,且携带方便;杯体可与底座螺纹固定,也可直接放置,甚至可直接用饮品罐,功能多样化;杯体的盖上设置有进气阀,安全性高。

The utility model relates to a detachable refrigerating cup, which belongs to the field of cold water cups. It includes a detachably connected cup body and a base, the base includes a shell and a refrigeration device arranged in the cavity of the shell, the refrigeration device includes a cold-conducting plate, a semiconductor refrigeration sheet, a power supply module, a heat sink and a cooling fan, the The power supply module is respectively electrically connected with the semiconductor refrigeration sheet and the cooling fan, and provides electric energy for the semiconductor cooling sheet and the cooling fan, the cold surface of the semiconductor cooling sheet is adhered to the lower end surface of the cold-conducting plate, and the height of the upper surface of the cold-conducting plate exceeds the top of the casing; The hot surface of the semiconductor refrigeration sheet is adhered to the heat sink, a heat dissipation cavity is arranged under the heat sink, the heat dissipation fan is arranged in the heat dissipation cavity, and a heat dissipation hole is arranged on the side wall of the heat dissipation cavity. The refrigerating cup of the utility model adopts a detachable split form, the cup body is separated from the base, the structure is simple, and the carrying is convenient; the cup body can be screwed with the base, or can be placed directly, and even a beverage can can be used directly, and the functions are diversified; The lid of the cup body is provided with an intake valve, which has high safety.

Description

一种可分离式制冷杯A detachable cooling cup

技术领域technical field

本实用新型涉及一种可分离式制冷杯,属于冷水杯领域。The utility model relates to a detachable refrigerating cup, which belongs to the field of cold water cups.

背景技术Background technique

天气炎热时,冷水或冷却饮料是解暑解渴的必然选择。而在夏季,特别是在夏季户外活动或在长途驾驶或外出野外聚餐时,冰凉爽口的饮用水或饮料,对降温和提神尤为重要。但现有的水杯大多是保温水杯,不具有制冷功能,无法实现人们在高温环境下对冷饮的需求。When the weather is hot, cold water or a cooling drink is an inevitable choice to quench your thirst. And in summer, especially during summer outdoor activities or long drives or outdoor gatherings, cold and refreshing drinking water or beverages are especially important for cooling down and refreshing. However, most of the existing water cups are insulated water cups, which do not have a cooling function and cannot meet people's demand for cold drinks in a high temperature environment.

专利CN201810343487公开了一种便携式制冷水杯,但这种水杯与底座不能分开使用,功能相对单一、在使用及携带上有诸多不便;另外杯盖上没有进气孔,无法调节杯内的压力。Patent CN201810343487 discloses a portable refrigerating water cup, but the water cup and the base cannot be used separately, the function is relatively single, and there are many inconveniences in use and carrying; in addition, there is no air intake hole on the cup lid, so the pressure in the cup cannot be adjusted.

实用新型内容Utility model content

为了解决现有技术中的问题,本实用新型提供了一种便携、多功能且可调节杯内气压的制冷杯。In order to solve the problems in the prior art, the utility model provides a portable, multifunctional refrigerating cup which can adjust the air pressure in the cup.

本实用新型的技术方案如下:The technical scheme of the present utility model is as follows:

一种可分离式制冷杯,包括可拆卸连接的杯体和底座,所述底座包括壳体以及设置在壳体腔室内的制冷装置,所述制冷装置包括导冷板、半导体制冷片、供电模块、散热片和散热风扇,所述供电模块分别与半导体制冷片以及散热风扇电连接并为半导体制冷片和散热风扇提供电能,所述半导体制冷片的冷面与导冷板下端面粘连,导冷板上端面高度超过壳体顶部;半导体制冷片的热面与散热片粘连,散热片下方设置有散热腔,所述散热风扇设置在散热腔中,散热腔的侧壁上设置有散热孔。A detachable refrigerating cup comprises a detachably connected cup body and a base, the base comprises a shell and a refrigerating device arranged in a cavity of the shell, the refrigerating device comprises a cold-conducting plate, a semiconductor refrigerating sheet, a power supply module, A cooling fin and a cooling fan, the power supply module is electrically connected to the semiconductor cooling sheet and the cooling fan respectively and provides electrical energy for the semiconductor cooling sheet and the cooling fan, the cold surface of the semiconductor cooling sheet is adhered to the lower end surface of the cooling plate, the cooling plate The height of the upper end surface exceeds the top of the casing; the hot surface of the semiconductor refrigeration fin is adhered to the heat sink, a heat dissipation cavity is arranged below the heat sink, the heat dissipation fan is arranged in the heat dissipation cavity, and the side wall of the heat dissipation cavity is provided with heat dissipation holes.

其中,所述壳体上还设置有控制器以及控制器操作面板,控制器分别与半导体制冷片、测温探头电连接,测温探头传输电信号到控制器,控制器接收测温探头的电信号并控制半导体制冷片的通断电;所述测温探头设置在导冷板上。The casing is also provided with a controller and a controller operation panel. The controller is electrically connected to the semiconductor refrigeration sheet and the temperature measuring probe respectively. The temperature measuring probe transmits electrical signals to the controller, and the controller receives the electrical signals of the temperature measuring probe. Signal and control the on-off of the semiconductor refrigeration sheet; the temperature-measuring probe is arranged on the cold-conducting plate.

其中,所述杯体与底座通过螺纹连接,杯体上设置有杯盖,杯盖上设置有进气阀。Wherein, the cup body and the base are connected by threads, the cup body is provided with a cup cover, and the cup cover is provided with an air intake valve.

其中,所述杯体接触设置在底座上方。Wherein, the cup body is arranged above the base in contact with each other.

其中,所述半导体制冷片通过第一泡棉胶与导冷板粘连,半导体制冷片通过第二泡棉胶与散热片粘连。Wherein, the semiconductor refrigerating sheet is adhered to the cold-conducting plate through the first foam glue, and the semiconductor refrigerating sheet is adhered to the heat sink through the second foam glue.

其中,所述杯体侧壁为双层中空结构,杯体底部为单层结构。Wherein, the side wall of the cup body is a double-layer hollow structure, and the bottom of the cup body is a single-layer structure.

其中,所述导冷板为下端面带有凹槽,所述半导体制冷片套接在凹槽内。Wherein, the lower end surface of the cold-conducting plate is provided with a groove, and the semiconductor refrigeration chip is sleeved in the groove.

本实用新型具有如下有益效果:The utility model has the following beneficial effects:

本实用新型的制冷杯采用可拆卸分体形式,杯体与底座分离,结构简单,且携带方便;杯体可与底座螺纹固定,也可直接放置,甚至可直接用饮品罐,功能多样化;杯体的盖上设置有进气阀,安全性高。The refrigerating cup of the utility model adopts a detachable split form, the cup body is separated from the base, the structure is simple, and the carrying is convenient; the cup body can be screwed with the base, or can be placed directly, and even a beverage can can be used directly, and the functions are diversified; The lid of the cup body is provided with an intake valve, which has high safety.

附图说明Description of drawings

图1为本实用新型实施例1中可分离式制冷杯主视图;1 is a front view of a detachable refrigerating cup in Embodiment 1 of the present utility model;

图2为本实用新型实施例1中可分离式制冷杯后视图;Fig. 2 is the rear view of the detachable refrigeration cup in Embodiment 1 of the present utility model;

图3为本实用新型实施例1中可分离式制冷杯侧视图;3 is a side view of the detachable refrigeration cup in Embodiment 1 of the present invention;

图4为本实用新型实施例1中可分离式制冷杯内部结构示意图;4 is a schematic diagram of the internal structure of the separable refrigeration cup in Embodiment 1 of the present invention;

图5为本实用新型实施例1中可分离式制冷杯杯体主视图;5 is a front view of a detachable refrigerating cup body in Embodiment 1 of the present utility model;

图6为本实用新型实施例1中可分离式制冷杯底座内部结构示意图;6 is a schematic diagram of the internal structure of the detachable refrigerating cup base in Embodiment 1 of the present invention;

图7为本实用新型实施例2中可分离式制冷杯主视图;Fig. 7 is the front view of the detachable refrigeration cup in Embodiment 2 of the present utility model;

图8为本实用新型实施例3中可分离式制冷杯主视图;Fig. 8 is the front view of the detachable refrigeration cup in Embodiment 3 of the present utility model;

图9为本实用新型可分离式制冷杯的电路原理图。FIG. 9 is a circuit schematic diagram of the detachable refrigerating cup of the present invention.

图中附图标记表示为:The reference numbers in the figure are indicated as:

1-杯体、11-杯盖、 111-进气阀、2-底座、21-壳体、221-导冷板、222-半导体制冷片、223-供电模块、224-散热片、225-散热风扇、23-控制器、231-控制器操作面板、226-第一泡棉胶、227-第二泡棉胶、24-散热孔、25-测温探头。1-Cup body, 11-Cup cover, 111-Inlet valve, 2-Base, 21-Shell, 221-Cold guide plate, 222-Semiconductor cooling sheet, 223-Power supply module, 224-Heat sink, 225-Heat dissipation Fan, 23-controller, 231-controller operation panel, 226-first foam glue, 227-second foam glue, 24- cooling hole, 25- temperature probe.

具体实施方式Detailed ways

下面结合附图和具体实施例来对本实用新型进行详细的说明。The present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

参见图1至图6,一种可分离式制冷杯,包括可拆卸连接的杯体1和底座2,所述底座2包括壳体21以及设置在壳体21腔室内的制冷装置,所述制冷装置包括导冷板221、半导体制冷片222、供电模块223、散热片224和散热风扇225,所述供电模块223分别与半导体制冷片222以及散热风扇225电连接,为半导体制冷片222和散热风扇225提供电能,所述半导体制冷片222的冷面与导冷板221下端面粘连,导冷板221上端面高度超过壳体21顶部;半导体制冷片222的热面与散热片224粘连,散热片224下方设置有散热腔,所述散热风扇225设置在散热腔中,散热腔的侧壁上设置有散热孔24,用于将散热腔内的热量散发出来。供电模块223可为蓄电池或其他电源,其可直接与家用220V电源连接,也可以与USB接口电源相连,亦可以与车载电源相连。Referring to FIGS. 1 to 6 , a detachable refrigeration cup includes a cup body 1 and a base 2 that are detachably connected, and the base 2 includes a casing 21 and a refrigeration device disposed in the cavity of the casing 21 . The refrigeration The device includes a cold-conducting plate 221, a semiconductor cooling sheet 222, a power supply module 223, a heat sink 224 and a cooling fan 225. The power supply module 223 is electrically connected to the semiconductor cooling sheet 222 and the cooling fan 225, respectively, and is the semiconductor cooling sheet 222 and the cooling fan. 225 provides electrical energy, the cold surface of the semiconductor refrigeration sheet 222 is adhered to the lower end surface of the cold-conducting plate 221, and the height of the upper end surface of the cold-conducting plate 221 exceeds the top of the casing 21; A heat dissipation cavity is provided below the 224, the heat dissipation fan 225 is disposed in the heat dissipation cavity, and a heat dissipation hole 24 is provided on the side wall of the heat dissipation cavity for dissipating the heat in the heat dissipation cavity. The power supply module 223 can be a battery or other power source, which can be directly connected to a household 220V power source, can also be connected to a USB interface power source, or can be connected to a vehicle power source.

进一步的,所述壳体21上还设置有控制器23以及控制器操作面板231,控制器23分别与半导体制冷片222、测温探头25电连接,测温探头25传输电信号到控制器,控制器23接收测温探头25的电信号并控制半导体制冷片222的工作状态;所述测温探头25设置在导冷板221上端面。测温探头25可选择用温度传感器,用于探测杯体1底部的温度,并将温度信号传送到控制器23。控制器操作面板231上可设置有温度指示灯、数字键盘以及显示屏,通过数字键盘进行预设温度,并显示在显示屏上,测温探头25探测杯体1底部的温度并传送到控制器23,控制器23对实时测试到的温度与预设的温度进行比较,当实测温度低于预设温度,控制器23控制供电模块停止为半导体制冷片222供电,且控制器操作面板231上的恒温灯亮起;反之,当实测温度高于预设温度,控制器23控制供电模块为半导体制冷片222通电进行制冷,且控制器面板231上的制冷灯亮起。Further, the housing 21 is also provided with a controller 23 and a controller operation panel 231. The controller 23 is electrically connected to the semiconductor refrigeration sheet 222 and the temperature measuring probe 25 respectively, and the temperature measuring probe 25 transmits electrical signals to the controller. The controller 23 receives the electrical signal of the temperature measuring probe 25 and controls the working state of the semiconductor refrigeration chip 222 ; the temperature measuring probe 25 is arranged on the upper end face of the cold conducting plate 221 . The temperature measuring probe 25 can optionally use a temperature sensor to detect the temperature of the bottom of the cup body 1 and transmit the temperature signal to the controller 23 . The controller operation panel 231 can be provided with a temperature indicator light, a numerical keyboard and a display screen, the temperature can be preset through the numerical keyboard and displayed on the display screen, and the temperature measuring probe 25 detects the temperature at the bottom of the cup body 1 and transmits it to the controller 23. The controller 23 compares the temperature measured in real time with the preset temperature. When the measured temperature is lower than the preset temperature, the controller 23 controls the power supply module to stop supplying power to the semiconductor refrigeration chip 222, and the The constant temperature light is on; on the contrary, when the measured temperature is higher than the preset temperature, the controller 23 controls the power supply module to energize the semiconductor refrigeration chip 222 for cooling, and the cooling light on the controller panel 231 is on.

进一步的,所述杯体1与底座2通过螺纹连接,杯体1为内螺纹,底座2为外螺纹,杯体1与底座2旋紧后,杯体1底部与底座2上的导冷板紧密接触;杯体1上设置有杯盖11,杯盖11上设置有进气阀111,当杯体1内部的压力低于大气压较多时,进气阀111自动打开,以调解杯内的压力。杯体1底座2可拆开使用,杯体1可直接作为水杯使用。Further, the cup body 1 and the base 2 are connected by threads, the cup body 1 is an internal thread, and the base 2 is an external thread. Close contact; the cup body 1 is provided with a cup cover 11, and the cup cover 11 is provided with an intake valve 111. When the pressure inside the cup body 1 is much lower than the atmospheric pressure, the intake valve 111 is automatically opened to adjust the pressure in the cup . The base 2 of the cup body 1 can be disassembled for use, and the cup body 1 can be used directly as a water cup.

参见图7至图8,进一步的,所述杯体1接触设置在底座上。Referring to FIGS. 7 to 8 , further, the cup body 1 is arranged in contact with the base.

进一步的,所述半导体制冷片222通过第一泡棉胶226与导冷板221粘连,半导体制冷片222通过第二泡棉胶227与散热片224粘连,第一泡棉胶226和第二泡棉胶227为泡棉双面胶,泡棉双面胶具有粘着力强、保持力佳、防水性能好、耐温性强等特性,适于导冷或导热。Further, the semiconductor refrigeration sheet 222 is adhered to the cold-conducting plate 221 through the first foam glue 226, the semiconductor refrigeration sheet 222 is adhered to the heat sink 224 through the second foam glue 227, and the first foam glue 226 and the second foam glue Cotton glue 227 is foam double-sided tape, which has the characteristics of strong adhesion, good retention, good waterproof performance, and strong temperature resistance, and is suitable for cold or heat conduction.

进一步的,所述杯体1侧壁为双层中空结构,便于保冷,所述杯底为单层结构,便于传冷。Further, the side wall of the cup body 1 is a double-layer hollow structure, which is convenient for cold preservation, and the bottom of the cup is a single-layer structure, which is convenient for cooling.

进一步的,所述导冷板221为金属材料,优选铁、铜、铝、不锈钢等。Further, the cold conducting plate 221 is made of a metal material, preferably iron, copper, aluminum, stainless steel and the like.

进一步的,所述散热片224为导热金属材料,优选铝、铜材料。Further, the heat sink 224 is made of a thermally conductive metal material, preferably aluminum or copper material.

进一步的,所述导冷板221为下端面带有凹槽,所述半导体制冷片222套接在凹槽内,结构上稳固且导冷效果好。Further, the lower end surface of the cold-conducting plate 221 has a groove, and the semiconductor refrigeration sheet 222 is sleeved in the groove, which is structurally stable and has a good cooling-conducting effect.

实施例1Example 1

参见图1至图6,将杯体1螺纹连接固定到底座上后,将需要制冷的饮品导入杯体1内,接通电源,通过控制器操作面板231调解需要制冷的温度,便开启了制冷模式。半导体制冷片222的冷面温度开始降低,通过第一泡棉胶226对导冷板221进行传冷,导冷板221再传冷到杯体1底部,通过杯体1对饮品进行制冷。参见图9,控制器操作面板231上可显示预设的温度以及测温探头25实测到的温度。当测温探头25探测到的温度为高于预设温度时,面板上的制冷灯亮起,此时,控制器23控制供电模块继续为半导体制冷片222供电。当测温探头25探测到的温度为低于预设温度时,面板上的恒温灯亮起,此时,控制器23控制供电模块断开对半导体制冷片222供电。Referring to FIGS. 1 to 6 , after the cup body 1 is screwed and fixed to the base, the beverage to be refrigerated is introduced into the cup body 1, the power is turned on, and the temperature to be refrigerated is adjusted through the controller operation panel 231, and the refrigeration is turned on model. The temperature of the cold surface of the semiconductor refrigerating sheet 222 begins to decrease, and the cold conducting plate 221 is cooled by the first foam glue 226 , and the cold conducting plate 221 is further cooled to the bottom of the cup body 1 , and the beverage is refrigerated through the cup body 1 . Referring to FIG. 9 , the preset temperature and the temperature actually measured by the temperature measuring probe 25 can be displayed on the operation panel 231 of the controller. When the temperature detected by the temperature measuring probe 25 is higher than the preset temperature, the cooling light on the panel lights up. At this time, the controller 23 controls the power supply module to continue to supply power to the semiconductor cooling chip 222 . When the temperature detected by the temperature measuring probe 25 is lower than the preset temperature, the constant temperature light on the panel lights up, and at this time, the controller 23 controls the power supply module to disconnect the power supply to the semiconductor refrigeration chip 222 .

实施例2Example 2

参见图7,与实施例1不同的是,杯体1为杯底大于或小于底座的容器,杯体1直接放置在底座上,杯体1的底部与半导体制冷片222接触。向杯体1内加入水或其他导冷的液体作为制冷剂,将需要制冷的饮品罐放在杯体内的水中,通过对杯体1内的水进行制冷,已达到对饮品进行间接制冷的效果。7 , the difference from Embodiment 1 is that the cup body 1 is a container whose bottom is larger or smaller than the base, the cup body 1 is directly placed on the base, and the bottom of the cup body 1 is in contact with the semiconductor refrigeration chip 222 . Add water or other cold-conducting liquid into the cup body 1 as a refrigerant, and place the beverage can that needs to be refrigerated in the water in the cup body. By refrigerating the water in the cup body 1, the effect of indirect refrigeration has been achieved. .

实施例3Example 3

参见图8,与实施例1不同的是,杯体1为盛装饮品的金属罐,如八宝粥罐等,直接将金属罐放置在底座上,对罐体的饮品进行制冷。Referring to FIG. 8 , the difference from Embodiment 1 is that the cup body 1 is a metal can for containing drinks, such as an eight-treasure porridge can, and the metal can is directly placed on the base to refrigerate the drinks in the can body.

以上所述仅为本实用新型的实施例,并非因此限制本实用新型的专利范围,凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本实用新型的专利保护范围内。The above descriptions are only the embodiments of the present invention, and are not intended to limit the scope of the patent of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other Relevant technical fields are similarly included in the scope of patent protection of the present invention.

Claims (7)

1. a kind of detachable refrigeration cup, it is characterised in that: including the cup body (1) and pedestal (2) being detachably connected, the pedestal It (2) include shell (21) and setting in the indoor refrigerating plant of shell (21) chamber, the refrigerating plant includes conduction cooling plate (221), semiconductor chilling plate (222), power supply module (223), cooling fin (224) and radiator fan (225), the power supply module (223) it is electrically connected respectively with semiconductor chilling plate (222) and radiator fan (225) and is semiconductor chilling plate (222) and scattered Hot-air fan (225) provides electric energy, the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate (222) and conduction cooling plate (221) lower end surface adhesion, conduction cooling plate (221) upper surface height is more than at the top of shell (21);The hot face of semiconductor chilling plate (222) and cooling fin (224) adhesion, heat dissipation Heat dissipation cavity is provided with below piece (224), the radiator fan (225) is arranged in heat dissipation cavity, is provided on the side wall of heat dissipation cavity Heat release hole (24).
2. a kind of detachable refrigeration cup as described in claim 1, it is characterised in that: be additionally provided with control on the shell (21) Device (23) processed and controller operation panel (231), controller (23) respectively with semiconductor chilling plate (222), temperature probe (25) it is electrically connected, temperature probe (25) transmission telecommunications number to controller (23), controller (23) receives the electricity of temperature probe (25) Signal and the power on/off for controlling semiconductor chilling plate (222);The temperature probe (25) is arranged on conduction cooling plate (221).
3. a kind of detachable refrigeration cup as claimed in claim 2, it is characterised in that: the cup body (1) passes through with pedestal (2) It is threadedly coupled, is provided with cup lid (11) on cup body (1), intake valve (111) are provided on cup lid (11).
4. a kind of detachable refrigeration cup as claimed in claim 2, it is characterised in that: cup body (1) contact is arranged the bottom of at Above seat (2).
5. a kind of detachable refrigeration cup as described in claim 3 or 4, it is characterised in that: the semiconductor chilling plate (222) By the first foam rubber (226) and conduction cooling plate (221) adhesion, semiconductor chilling plate (222) is by the second foam rubber (227) and dissipates Backing (224) adhesion.
6. a kind of detachable refrigeration cup as claimed in claim 5, it is characterised in that: cup body (1) side wall is in bilayer Hollow structure.
7. a kind of detachable refrigeration cup as claimed in claim 6, it is characterised in that: the conduction cooling plate (221) is lower end surface With fluted, the semiconductor chilling plate (222) is socketed in groove.
CN201821803005.8U 2018-11-02 2018-11-02 A detachable cooling cup Expired - Fee Related CN209436803U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821803005.8U CN209436803U (en) 2018-11-02 2018-11-02 A detachable cooling cup

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821803005.8U CN209436803U (en) 2018-11-02 2018-11-02 A detachable cooling cup

Publications (1)

Publication Number Publication Date
CN209436803U true CN209436803U (en) 2019-09-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110558800A (en) * 2019-09-29 2019-12-13 得胜电子科技(深圳)有限公司 Stereo set refrigeration cup
CN113324359A (en) * 2021-05-19 2021-08-31 佛山市顺德区大磐电器实业有限公司 Portable medical refrigeration storage cup

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110558800A (en) * 2019-09-29 2019-12-13 得胜电子科技(深圳)有限公司 Stereo set refrigeration cup
CN113324359A (en) * 2021-05-19 2021-08-31 佛山市顺德区大磐电器实业有限公司 Portable medical refrigeration storage cup

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