CN212619455U

CN212619455U - Semiconductor refrigeration heat abstractor based on thermoelectric generation

Info

Publication number: CN212619455U
Application number: CN202021516026.9U
Authority: CN
Inventors: 李月锋; 翟鑫梦; 邹军; 王昭; 石明明; 杨波波
Original assignee: Shanghai Institute of Technology
Current assignee: Shanghai Institute of Technology
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-02-26
Anticipated expiration: 2030-07-28

Abstract

The utility model relates to a semiconductor refrigeration heat abstractor based on thermoelectric generation for dispel the heat to the heat source, the device includes thermoelectric generation system, semiconductor refrigerating system and heat pipe cooling system, and thermoelectric generation system and semiconductor refrigerating system all link to each other with the heat source, and heat pipe cooling system links to each other with semiconductor refrigerating system. Compared with the prior art, the utility model discloses combine together thermoelectric generation technique and semiconductor refrigeration technique, effectively utilize heat source and environment thermoelectric generation, through microcontroller's rectification, steady voltage after the storage in the lithium cell, replace external power supply to provide operating voltage, energy-concerving and environment-protective for the semiconductor power generation piece.

Description

Semiconductor refrigeration heat abstractor based on thermoelectric generation

Technical Field

The utility model belongs to the technical field of the semiconductor refrigeration, a semiconductor refrigeration heat abstractor based on thermoelectric generation is related to.

Background

With the rapid development of electronic technology in China, various electronic products have gradually entered the lives of people, become an indispensable part of life and work, promote the lives of people and improve the quality of life. But at the same time presents some problems, the most significant of which is the waste heat generated during the operation of the electronic product. Along with the increase of the continuous service time of the electronic product, the temperature also rises along with the increase of the continuous service time, and the service performance and the service life of the electronic product are seriously influenced.

At present, the commonly used heat dissipation technologies of electronic devices mainly include natural convection heat dissipation, forced air cooling heat dissipation, liquid cooling, heat pipes, micro-channel cooling, integrated heat circuits, thermoelectric refrigeration and the like, but with the rapid development of microelectronic technologies, electronic products are continuously developing towards high-density packaging and multi-functionalization, and the commonly used heat dissipation technologies have certain limitations. In order to meet the requirement of electronic technology development, a thermoelectric power generation technology and a semiconductor refrigeration technology are well developed.

The chinese utility model patent with publication number CN110425766A (a semiconductor refrigeration system) solves the problem of low heat exchange efficiency of the prior art, increases the area of the cold guide block attached to the metallic aluminum inner container, but fails to make full use of the temperature difference, and the radiator fin is single, and the refrigeration effect is not obvious.

Chinese utility model patent with publication number CN109974331A (a semiconductor refrigeration device) solves the problem of low heat exchange efficiency and refrigeration efficiency of the prior art, and the noise is well controlled, and the fan is arranged in the middle of the heat dissipation fins of the heat dissipation unit, so as to improve the space utilization rate of the refrigeration device, which is beneficial to miniaturization design, but the heat dissipation mode of the heat dissipation fins is single, and the best refrigeration effect can not be achieved.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor refrigeration heat abstractor based on thermoelectric generation, the device can effectively utilize heat source and environmental temperature difference electricity generation, replaces external power supply to provide operating voltage for the semiconductor refrigeration piece, and is energy-concerving and environment-protective to the problem that external power supply need be connected to present semiconductor refrigeration piece has been solved.

The purpose of the utility model can be realized through the following technical scheme:

the semiconductor refrigeration heat dissipation device comprises a temperature difference power generation system, a semiconductor refrigeration system and a heat pipe heat dissipation system, wherein the temperature difference power generation system and the semiconductor refrigeration system are connected with a heat source, and the heat pipe heat dissipation system is connected with the semiconductor refrigeration system.

Furthermore, the thermoelectric generation system comprises a thermoelectric generation element, a lithium battery and a microcontroller which are arranged on the heat source, wherein the microcontroller is electrically connected with the thermoelectric generation element and the lithium battery respectively.

Furthermore, the lithium battery and the microcontroller are both arranged on the heat pipe cooling system.

Furthermore, the semiconductor refrigeration system comprises at least one semiconductor refrigeration piece arranged on the heat source, and the microcontroller is electrically connected with the semiconductor refrigeration piece.

Furthermore, the heat pipe heat dissipation system comprises a steam chamber arranged on the semiconductor refrigeration piece and a heat pipe arranged on the steam chamber.

Furthermore, the heat pipe is provided with fins.

Furthermore, the lithium battery and the microcontroller are both arranged on the outer wall of the steam chamber.

Further, the diameter of the steam chamber is gradually increased along the direction from the semiconductor refrigeration piece to the heat pipe.

Furthermore, heat-conducting silicone grease is arranged between the semiconductor refrigerating piece and the heat source and between the semiconductor refrigerating piece and the steam chamber.

Furthermore, a porous copper powder sintering layer is arranged on the inner wall of the heat pipe.

The utility model provides a semiconductor refrigeration heat abstractor based on thermoelectric generation, thermoelectric generation component hug closely the heat source, and when cold and hot both ends had the difference in temperature to exist, the direct current that thermoelectric generation component produced is saved in the lithium cell after rectifier, the steady voltage through microcontroller to provide operating voltage for the semiconductor refrigeration piece. The cold end of the semiconductor refrigeration piece is tightly attached to the heat source, the hot end of the semiconductor refrigeration piece is connected with the steam chamber, and the middle of the semiconductor refrigeration piece is coated with heat-conducting silicone grease to enhance the heat-conducting effect. The steam chamber has a large area at one end and a small area at the other end, and the heat exchange efficiency is enhanced. The heat pipe is welded on the steam chamber in an array shape, the cold ends of the array are connected with the hot end of the steam chamber in space, and meanwhile the fins are superposed on the heat pipe to enhance the heat dissipation effect.

Particularly, the utility model discloses in each part of device:

the thermoelectric generation element is tightly attached to the heat source, when temperature difference exists at the cold end and the hot end, direct current generated by the thermoelectric generation element is stored in the lithium battery after rectification and voltage stabilization of the microcontroller, so that working voltage is provided for the semiconductor refrigeration piece. The thermoelectric power generation element can be selected as a thermoelectric couple, when temperature difference is generated at the cold end and the hot end, the heat movement of a cavity at the hot end of the P-type semiconductor material is higher than that at the cold end, and the cavity is diffused from the high-temperature end to the low-temperature end to form potential difference; the thermal motion of the electrons at the hot end of the N-type semiconductor material is higher than that at the cold end, and then the electrons diffuse from the high-temperature end to the low-temperature end to form a potential difference. In the formed loop, when a temperature difference exists between the two ends of the composite semiconductor material, an electromotive force is generated to form a current.

The microcontroller is installed in steam chamber one side, and inside is equipped with rectifier circuit, electric capacity, steady voltage charging circuit etc. and is connected with thermoelectric generation component, lithium cell and semiconductor refrigeration piece electricity.

The lithium battery is arranged on the other side of the steam chamber and is mainly used for storing electric energy generated by the thermoelectric generation element and providing working voltage for the semiconductor refrigeration piece. The unit of the lithium battery is milliampere (mAh), and when the capacity of the lithium battery is 1000mA and the output current is 1mA, the current can be output for 1000 h. The lithium battery preferably has a capacity of 100 AH.

The cold end of the semiconductor refrigeration piece is tightly attached to the heat source, the hot end of the semiconductor refrigeration piece is connected with the steam chamber, and the middle of the semiconductor refrigeration piece is coated with heat-conducting silicone grease to enhance the heat-conducting effect. The semiconductor refrigeration piece is also called as a thermoelectric semiconductor refrigeration assembly, because the refrigeration piece is divided into two sides, one side absorbs heat and is called as a hot side, the other side dissipates heat and is called as a cold side, and the refrigeration piece only plays a heat conduction role and is a heat transfer tool. The semiconductor refrigerating sheet can be applied to occasions with limited space, high reliability requirement and no refrigerant pollution.

The heat-conducting silicone grease is coated between the semiconductor refrigeration sheet and the steam chamber, and mainly used for enhancing the heat conductivity.

The steam chamber (VC) is arranged on the semiconductor refrigerating sheet and mainly used for transferring heat. The vapor chamber is also called as a vacuum chamber vapor chamber, and after absorbing the heat of the chip, the liquid at the bottom of the vacuum chamber is evaporated and diffused into the vacuum chamber, the heat is conducted to the other end, and then the liquid is condensed into the liquid to return to the bottom, and the heat is conducted by utilizing phase change. The areas of the two ends of the steam chamber are different, and the heat exchange efficiency is improved.

The heat pipe is arranged on the steam chamber and realizes heat transfer by the phase change of working liquid in the heat pipe. The heat pipes are arranged on the steam chamber in an array shape, the cold ends of the array are connected with the hot end of the steam chamber in space, and meanwhile the fins are superposed on the heat pipes to enhance the heat dissipation effect. The tube core of the heat pipe is sintered with copper powder, and the porous sintering layer can enhance the evaporation process and the thermal property of the heat pipe.

Compared with the prior art, the utility model has the characteristics of it is following:

1) the utility model combines the thermoelectric power generation technology with the semiconductor refrigeration technology, effectively utilizes the heat source and the environmental temperature difference to generate power, and stores the power in the lithium battery after rectification and voltage stabilization of the microcontroller, replaces an external power supply to provide working voltage for the semiconductor power generation piece, and is energy-saving and environment-friendly;

2) the steam chamber in the utility model is designed with a variable cross-section form, thereby improving the heat exchange efficiency;

3) the utility model discloses mainly to being high-power electronic equipment, the heat pipe is array form welding on the steam chamber, and the cold junction of array links to each other with the hot junction of steam chamber in the space, and the fin stacks on the heat pipe simultaneously, reinforcing radiating effect.

4) The tube core sintering copper powder of the heat tube of the utility model, the porous sintering layer can enhance the evaporation process and the thermal performance of the heat tube.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

the notation in the figure is:

1-thermoelectric power generation element, 2-semiconductor refrigeration piece, 3-lithium battery, 4-steam chamber, 5-microcontroller, 6-heat pipe, 7-fin, 8-heat source.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.

Example (b):

the semiconductor refrigeration heat dissipation device based on thermoelectric generation shown in fig. 1 is used for dissipating heat of a heat source 8, and comprises a thermoelectric generation system, a semiconductor refrigeration system and a heat pipe heat dissipation system, wherein the thermoelectric generation system and the semiconductor refrigeration system are connected with the heat source 8, and the heat pipe heat dissipation system is connected with the semiconductor refrigeration system.

Wherein, thermoelectric generation system is including setting up thermoelectric generation component 1, lithium cell 3 and microcontroller 5 on heat source 8, and microcontroller 5 is connected with thermoelectric generation component 1, lithium cell 3 electricity respectively. The lithium battery 3 and the microcontroller 5 are both arranged on the heat pipe cooling system.

The semiconductor refrigerating system comprises at least one semiconductor refrigerating piece 2 arranged on a heat source 8, and the microcontroller 5 is electrically connected with the semiconductor refrigerating piece 2.

The heat pipe heat dissipation system comprises a steam chamber 4 arranged on the semiconductor chilling plate 2 and a heat pipe 6 arranged on the steam chamber 4. The heat pipe 6 is provided with fins 7. The lithium battery 3 and the microcontroller 5 are both arranged on the outer wall of the steam chamber 4. The diameter of the steam chamber 4 gradually increases along the direction from the semiconductor chilling plate 2 to the heat pipe 6.

And heat-conducting silicone grease is arranged between the semiconductor refrigerating sheet 2 and the heat source 8 and between the semiconductor refrigerating sheet 2 and the steam chamber 4. The inner wall of the heat pipe 6 is provided with a porous copper powder sintering layer.

The device is used for heat dissipation of high-power electronic equipment, the specific size of the device is determined according to the specific equipment size, and the device is flexible to use and convenient to install.

When the heat dissipation device is used for heat dissipation of the IGBT in the electric welding machine, the heat dissipation mode of the traditional electric welding machine is fin heat dissipation and air cooling heat dissipation, and the problems of thermal contact resistance and low heat dissipation efficiency exist. The device can be combined with a fan to be used for heat dissipation of the IGBT, and the required fan is small in power and low in noise.

The embodiments described above are intended to facilitate the understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention according to the disclosure of the present invention.

Claims

1. The semiconductor refrigeration heat dissipation device based on thermoelectric generation is used for dissipating heat of a heat source (8), and is characterized by comprising a thermoelectric generation system, a semiconductor refrigeration system and a heat pipe heat dissipation system, wherein the thermoelectric generation system and the semiconductor refrigeration system are connected with the heat source (8), and the heat pipe heat dissipation system is connected with the semiconductor refrigeration system.

2. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 1, wherein the thermoelectric generation system comprises a thermoelectric generation element (1), a lithium battery (3) and a microcontroller (5) which are arranged on a heat source (8), and the microcontroller (5) is electrically connected with the thermoelectric generation element (1) and the lithium battery (3) respectively.

3. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 2, wherein the lithium battery (3) and the microcontroller (5) are both disposed on a heat pipe heat dissipation system.

4. The semiconductor refrigeration heat dissipation device based on thermoelectric power generation as claimed in claim 3, wherein the semiconductor refrigeration system comprises at least one semiconductor refrigeration chip (2) arranged on the heat source (8), and the microcontroller (5) is electrically connected with the semiconductor refrigeration chip (2).

5. The thermoelectric power generation-based semiconductor refrigeration heat dissipation device as recited in claim 4, wherein the heat pipe heat dissipation system comprises a steam chamber (4) disposed on the semiconductor refrigeration sheet (2) and a heat pipe (6) disposed on the steam chamber (4).

6. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 5, wherein the heat pipe (6) is provided with fins (7).

7. The thermoelectric power generation-based semiconductor refrigeration and heat dissipation device as claimed in claim 5, wherein the lithium battery (3) and the microcontroller (5) are both disposed on the outer wall of the steam chamber (4).

8. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 5, wherein the diameter of the steam chamber (4) is gradually increased along the direction from the semiconductor refrigeration piece (2) to the heat pipe (6).

9. The semiconductor refrigeration heat dissipation device based on thermoelectric power generation as claimed in claim 5, wherein heat-conducting silicone grease is arranged between the semiconductor refrigeration piece (2) and the heat source (8) and between the semiconductor refrigeration piece (2) and the steam chamber (4).

10. The semiconductor refrigeration and heat dissipation device based on thermoelectric power generation as claimed in claim 5, wherein the inner wall of the heat pipe (6) is provided with a porous copper powder sintered layer.