CN220931410U - Semiconductor refrigerating device - Google Patents
Semiconductor refrigerating device Download PDFInfo
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- CN220931410U CN220931410U CN202322554731.8U CN202322554731U CN220931410U CN 220931410 U CN220931410 U CN 220931410U CN 202322554731 U CN202322554731 U CN 202322554731U CN 220931410 U CN220931410 U CN 220931410U
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- heat
- semiconductor
- hot
- semiconductor refrigerating
- radiator
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 107
- 238000005057 refrigeration Methods 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims abstract description 35
- 230000008859 change Effects 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 11
- 238000010521 absorption reaction Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- 230000005680 Thomson effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A semiconductor refrigerating device belongs to refrigerating equipment. In order to solve the problem that the existing semiconductor refrigerating device cannot meet the user demand due to low heat dissipation efficiency and low heat dissipation capacity, which results in lower refrigerating capacity of the semiconductor refrigerating device. The semiconductor refrigerating device comprises a semiconductor refrigerating sheet, a hot-end heat exchange assembly and a radiator which are sequentially arranged side by side, wherein the heating surface of the semiconductor refrigerating sheet is attached to one side surface of the hot-end heat exchange assembly, the radiator is attached to the other side surface of the hot-end heat exchange assembly, and heat generated by the semiconductor refrigerating sheet is sequentially conducted out through the hot-end heat exchange assembly and the radiator; the hot end heat exchange assembly comprises a heat conduction shell and a phase change heat dissipation chip, wherein the phase change heat dissipation chip is positioned in the heat conduction shell and is tightly attached to the inner wall of the heat conduction shell. The utility model is mainly used for refrigeration of refrigeration equipment.
Description
Technical Field
The utility model belongs to refrigeration equipment, and particularly relates to a semiconductor refrigeration device.
Background
The semiconductor refrigerating sheet is also called a thermoelectric refrigerating sheet, and is a heat pump, refrigeration is realized by utilizing the Seebeck effect, the Peltier effect and the Thomson effect of semiconductor materials, when direct current passes through the semiconductor refrigerating sheet, the surfaces on two sides of the semiconductor refrigerating sheet respectively absorb heat and emit heat, wherein the surface on one side of the semiconductor refrigerating sheet which absorbs heat is called a cold surface, and the surface on one side of the semiconductor refrigerating sheet which emits heat is called a hot surface, so that the semiconductor refrigerating sheet can realize refrigeration, and the temperature difference between the cold surface and the hot surface can reach about 60 ℃.
Semiconductor refrigeration is commonly used in mobile refrigeration devices or small refrigeration devices, such as cooling fans, water dispensers, and the like. However, in the prior art, the area of the semiconductor refrigerating piece is smaller and the refrigerating capacity is lower because the heat surface of the semiconductor refrigerating piece adopts water cooling heat dissipation or air cooling heat dissipation and the like with relatively larger volume due to the limitation of the volume of the refrigerating equipment; meanwhile, due to low heat dissipation efficiency such as water cooling heat dissipation or air cooling heat dissipation, the heat dissipation capacity of the semiconductor refrigerating plate is low, and finally the refrigerating capacity of the semiconductor refrigerating device cannot meet the refrigerating requirement of a user.
Disclosure of utility model
The utility model aims to solve the problem that the conventional semiconductor refrigerating device cannot meet the requirements of users due to low heat dissipation efficiency and low heat dissipation capacity, and further provides the semiconductor refrigerating device.
The utility model adopts the technical scheme for solving the technical problems that:
The semiconductor refrigerating device comprises a semiconductor refrigerating sheet, a hot end heat exchange assembly and a radiator which are sequentially arranged side by side, wherein the heating surface of the semiconductor refrigerating sheet is attached to one side surface of the hot end heat exchange assembly, the radiator is attached to the other side surface of the hot end heat exchange assembly, and heat generated by the semiconductor refrigerating sheet is sequentially conducted out through the hot end heat exchange assembly and the radiator; the hot end heat exchange assembly comprises a heat conduction shell and a phase change heat dissipation chip, wherein the phase change heat dissipation chip is positioned in the heat conduction shell and is tightly attached to the inner wall of the heat conduction shell.
Preferably, the semiconductor refrigeration piece comprises two ceramic substrates, a plurality of electrode pieces, a P-type semiconductor and an N-type semiconductor; the two ceramic substrates are arranged up and down oppositely, the P-type semiconductor and the N-type semiconductor are horizontally and alternately arranged between the two ceramic substrates, the adjacent P-type semiconductor and N-type semiconductor are connected in sequence through electrode plates from head to tail, and the electrode plates are positioned at positions between the end parts of the P-type semiconductor and the N-type semiconductor and the ceramic substrates.
Preferably, the ceramic substrate is a silicon nitride substrate.
Preferably, a mounting cavity is arranged on one side surface of the heat conducting shell facing the semiconductor refrigerating piece, the semiconductor refrigerating piece is inserted into the mounting cavity, the cold surface of the semiconductor refrigerating piece is exposed, and the hot surface of the semiconductor refrigerating piece is tightly attached to the heat conducting shell.
Preferably, the mounting cavity is composed of two opposite sliding grooves, and two ends of the semiconductor refrigerating sheet in the width direction are respectively inserted into the two sliding grooves.
Preferably, the heat conducting shell is made of copper materials.
Preferably, the phase-change heat dissipation chip is composed of a plurality of annular capillary liquid absorption cores which are arranged side by side, and the outer walls of the capillary liquid absorption cores are closely attached to the inner walls of the heat conduction shells.
Preferably, one surface of the radiator, which is contacted with the heat conducting shell, is in a flat plate shape, and a plurality of radiating grooves are transversely formed in one surface of the radiator, which is away from the heat conducting shell.
Compared with the prior art, the utility model has the beneficial effects that:
1. the semiconductor refrigerating sheet and the hot end heat exchange component are connected in a slot mode, so that the stability and compactness of connection of the semiconductor refrigerating sheet and the hot end heat exchange component are ensured.
2. The ceramic substrate in the semiconductor refrigeration sheet adopts the silicon nitride substrate, and the high heat conduction performance of the ceramic substrate is utilized to replace the original low heat conduction substrate, so that the working performance of the refrigeration sheet is improved.
3. The copper-based micro-channel phase-change heat dissipation chip is used as the hot end heat exchange component, so that the heat dissipation efficiency of the semiconductor refrigeration piece is improved, the heat dissipation capacity is increased, the refrigeration capacity of the semiconductor refrigeration piece is increased, and a better refrigeration effect is realized.
4. The radiator is provided with the radiating grooves, so that the radiating area is enlarged, the radiating efficiency of the semiconductor refrigerating plate is further improved, and the radiating capacity is increased.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model.
Fig. 1 is an isometric view of the present utility model.
Fig. 2 is a front view of the present utility model.
Fig. 3 is a schematic structural view of a semiconductor refrigeration sheet.
Fig. 4 is a schematic illustration of capillary wick heat exchange.
Fig. 5 is a schematic structural diagram of a capillary wick arranged in a phase-change heat-dissipating chip.
Fig. 6 is a schematic structural view of the heat conductive shell.
Reference numerals illustrate: 1-a semiconductor refrigeration piece; 1-1-ceramic substrate; 1-2 electrode plates; 1-3-P type semiconductor; 1-4-N type semiconductor; 2-a heat sink; 3-a thermally conductive shell; 3-1-mounting cavity; 3-1-1-sliding grooves; 4-a phase-change heat dissipation chip; 4-1-capillary wick.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model, and the following embodiments are used to illustrate the present utility model, but are not intended to limit the scope of the present utility model.
Referring to fig. 1, an embodiment of the present application provides a semiconductor refrigeration device, which includes a semiconductor refrigeration sheet 1, a hot-end heat exchange component and a radiator 2 sequentially arranged side by side, wherein a heating surface of the semiconductor refrigeration sheet 1 is attached to one side surface of the hot-end heat exchange component, the radiator 2 is attached to the other side surface of the hot-end heat exchange component, and heat generated by the semiconductor refrigeration sheet 1 is sequentially conducted out through the hot-end heat exchange component and the radiator 2.
Referring to fig. 2, the semiconductor refrigerating sheet 1 is used for refrigerating in a mobile refrigerating device or a small refrigerating device, and comprises two ceramic substrates 1-1, a plurality of electrode sheets 1-2, a P-type semiconductor 1-3 and an N-type semiconductor 1-4; the two ceramic substrates 1-1 are arranged up and down oppositely, the P-type semiconductors 1-3 and the N-type semiconductors 1-4 are horizontally and alternately arranged between the two ceramic substrates 1-1, the adjacent P-type semiconductors 1-3 and N-type semiconductors 1-4 are connected end to end through electrode plates 1-2 in sequence, and the electrode plates 1-2 are positioned at positions between the end parts of the P-type semiconductors 1-3 and N-type semiconductors 1-4 and the ceramic substrates 1-1. The semiconductor refrigerating sheet 1 is in an electrified state, one side surface of the semiconductor refrigerating sheet 1 absorbs heat to realize refrigeration, a cold surface is formed, and the other side surface emits the absorbed heat to form a hot surface.
Furthermore, the ceramic substrate 1-1 is a silicon nitride substrate, and the silicon nitride substrate is manufactured by adopting a high-purity raw material and a special sintering process, and the heat conductivity coefficient can reach 120W/m K and is 8-9 times that of a low-heat-conductivity aluminum oxide substrate. The embodiment replaces the original low-heat-conductivity substrate with the high-heat-conductivity substrate, and improves the working performance of the refrigerating sheet.
Referring to fig. 3, the hot-end heat exchange component is a copper-based micro-channel phase-change heat dissipation chip, and is used for conducting heat emitted by a hot surface of the semiconductor refrigeration sheet 1; the hot end heat exchange assembly comprises a heat conduction shell 3 and a phase change heat dissipation chip 4, wherein the phase change heat dissipation chip 4 is positioned in the heat conduction shell 3 and is tightly attached to the inner wall of the heat conduction shell 3.
Further, the heat conducting shell 3 is a rectangular shell, a semi-enclosed installation cavity 3-1 is arranged on the surface of one side, facing the semiconductor refrigerating sheet 1, of the heat conducting shell 3, the semiconductor refrigerating sheet 1 is inserted into the installation cavity 3-1, the cold surface of the semiconductor refrigerating sheet 1 is exposed, the hot surface of the semiconductor refrigerating sheet 1 is tightly attached to the outer surface of the heat conducting shell 3, heat is transferred to the heat conducting shell 3, one surface, contacting with the semiconductor refrigerating sheet 1, of the heat conducting shell 3 is a hot end, the surface, opposite to the hot end, of the heat conducting shell 3 is a cold end, and the radiator 2 is positioned on the cold end side of the heat conducting shell 3.
Furthermore, the installation cavity 3-1 is composed of two opposite sliding grooves 3-1-1, and two ends of the semiconductor refrigeration piece 1 in the width direction are respectively inserted into the two sliding grooves 3-1-1, so that one side of the semiconductor refrigeration piece 1 facing outwards (cold surface) can be exposed outwards.
Furthermore, the heat conducting shell 3 is made of copper material with high heat conducting efficiency, so that the heat conducting efficiency between the semiconductor refrigerating sheet 1 and the hot end heat exchange component and the heat conducting efficiency between the hot end heat exchange component and the radiator 2 are improved, and the heat radiating efficiency of the semiconductor refrigerating sheet 1 is further improved.
Further, the phase-change heat dissipation chip 4 is composed of a plurality of annular capillary liquid absorption cores 4-1 which are arranged side by side, the outer wall of the capillary liquid absorption cores 4-1 is closely attached to the inner wall of the heat conduction shell 3, one surface of the capillary liquid absorption cores 4-1, which is contacted with the hot end of the heat conduction shell 3, is a heat absorption end, and the surface of the capillary liquid absorption cores 4-1, which is contacted with the cold end of the heat conduction shell 3, is a heat dissipation end; the liquid heat exchange working medium in the capillary wick 4-1 at the heat absorption end is heated under the vacuum ultra-low pressure environment and quickly evaporated into hot vapor, the hot vapor rises after being heated, passes through the cavity in the capillary wick 4-1 and flows to the heat dissipation end of the capillary wick 4-1, contacts with the relatively cold end of the heat conduction shell 3 for heat dissipation and is condensed into liquid again; the condensed cooling liquid flows back to the heat absorbing end of the capillary liquid absorbing core 4-1 through the capillary structure to absorb heat continuously; the back-flowing cooling liquid is gasified again after being heated at the heat absorbing end, and the repeated action is performed, so that the heat conducted by the hot side of the semiconductor refrigerating piece 1 is continuously taken away, the temperature of the hot side of the semiconductor refrigerating piece 1 is reduced, and the refrigerating performance is further improved.
Referring to fig. 4, the radiator 2 is used for final dissipation of heat on the hot side of the semiconductor refrigeration sheet 1, and a surface of the radiator 2, which is in contact with the heat conducting shell 3, is flat so as to increase the contact area between the radiator 2 and the heat conducting shell 3, and a plurality of heat dissipation grooves 2-1 penetrating through the upper end surface and the lower end surface are transversely formed in a surface of the radiator 2, which is opposite to the heat conducting shell 3, so that the heat dissipation area of the radiator 2 is increased.
It should be noted that, in this embodiment, since the heat-conducting shell 3 and the phase-change heat-dissipating chip 4 are adopted by the hot-end heat-exchanging component and are integrally configured, the phase-change heat-dissipating chip 4 is in a vacuum sealed environment, and no additional connecting piece is needed for connection, so that the overall integration level and volume of the system are improved. Compared with the traditional application of water cooling heat dissipation, air cooling heat dissipation and the like, the phase change heat dissipation chip using the copper-based micro-channel has the advantages of simple structure, low thermal resistance, high heat conduction speed, no extra power consumption and the like; meanwhile, the heat dissipation performance is improved by 30%, so that the working performance of the semiconductor refrigerating sheet is greatly improved.
In the embodiment, the semiconductor refrigerating sheet is optimized in overall performance under the action of the hot end heat exchange component and the radiator, and the performance of the optimized refrigerating sheet is greatly improved, so that the refrigerating capacity is improved on the basis of smaller system volume and lower energy consumption.
Although the utility model herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present utility model. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present utility model as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways other than as described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.
Claims (8)
1. A semiconductor refrigeration device, characterized in that: the heat-exchange type solar heat radiator comprises a semiconductor refrigeration sheet (1), a hot-end heat exchange assembly and a radiator (2) which are sequentially arranged side by side, wherein a heating surface of the semiconductor refrigeration sheet (1) is attached to one side surface of the hot-end heat exchange assembly, the radiator (2) is attached to the other side surface of the hot-end heat exchange assembly, and heat generated by the semiconductor refrigeration sheet (1) is sequentially conducted out through the hot-end heat exchange assembly and the radiator (2);
the hot end heat exchange assembly comprises a heat conduction shell (3) and a phase change heat dissipation chip (4), wherein the phase change heat dissipation chip (4) is positioned in the heat conduction shell (3) and is tightly attached to the inner wall of the heat conduction shell (3).
2. A semiconductor refrigeration device according to claim 1, wherein: the semiconductor refrigerating sheet (1) comprises two ceramic substrates (1-1), a plurality of electrode sheets (1-2), a P-type semiconductor (1-3) and an N-type semiconductor (1-4); the two ceramic substrates (1-1) are arranged up and down oppositely, the P-type semiconductors (1-3) and the N-type semiconductors (1-4) are horizontally and alternately arranged between the two ceramic substrates (1-1), the adjacent P-type semiconductors (1-3) and N-type semiconductors (1-4) are sequentially connected end to end through electrode plates (1-2), and the electrode plates (1-2) are positioned at positions between the ends of the P-type semiconductors (1-3) and the N-type semiconductors (1-4) and the ceramic substrates (1-1).
3. A semiconductor refrigeration device according to claim 2, wherein: the ceramic substrate (1-1) is a silicon nitride substrate.
4. A semiconductor refrigeration device according to claim 1, wherein: the heat conducting shell (3) is provided with a mounting cavity (3-1) towards one side surface of the semiconductor refrigerating sheet (1), the semiconductor refrigerating sheet (1) is inserted into the mounting cavity (3-1), the cold surface of the semiconductor refrigerating sheet (1) is exposed, and the hot surface of the semiconductor refrigerating sheet (1) is tightly attached to the heat conducting shell (3).
5. The semiconductor refrigeration device of claim 4, wherein: the mounting cavity (3-1) is composed of two opposite sliding grooves (3-1-1), and two ends of the semiconductor refrigerating sheet (1) in the width direction are respectively inserted into the two sliding grooves (3-1-1).
6. A semiconductor refrigeration device according to claim 1, wherein: the heat conducting shell (3) is made of copper materials.
7. A semiconductor refrigeration device according to claim 1, wherein: the phase-change heat dissipation chip (4) is composed of a plurality of annular capillary liquid absorption cores (4-1) which are arranged side by side, and the outer wall of each capillary liquid absorption core (4-1) is tightly attached to the inner wall of the heat conduction shell (3).
8. A semiconductor refrigeration device according to claim 1, wherein: one surface of the radiator (2) contacted with the heat conducting shell (3) is in a flat plate shape, and a plurality of radiating grooves (2-1) are transversely formed in one surface of the radiator (2) facing away from the heat conducting shell (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322554731.8U CN220931410U (en) | 2023-09-20 | 2023-09-20 | Semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322554731.8U CN220931410U (en) | 2023-09-20 | 2023-09-20 | Semiconductor refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220931410U true CN220931410U (en) | 2024-05-10 |
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ID=90960540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322554731.8U Active CN220931410U (en) | 2023-09-20 | 2023-09-20 | Semiconductor refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220931410U (en) |
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2023
- 2023-09-20 CN CN202322554731.8U patent/CN220931410U/en active Active
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