CN220931410U - A semiconductor refrigeration device - Google Patents

Abstract

A semiconductor refrigerating device belongs to refrigerating equipment. In order to solve the problem that the existing semiconductor refrigerating device cannot meet the user demand due to low heat dissipation efficiency and low heat dissipation capacity, which results in lower refrigerating capacity of the semiconductor refrigerating device. The semiconductor refrigerating device comprises a semiconductor refrigerating sheet, a hot-end heat exchange assembly and a radiator which are sequentially arranged side by side, wherein the heating surface of the semiconductor refrigerating sheet is attached to one side surface of the hot-end heat exchange assembly, the radiator is attached to the other side surface of the hot-end heat exchange assembly, and heat generated by the semiconductor refrigerating sheet is sequentially conducted out through the hot-end heat exchange assembly and the radiator; the hot end heat exchange assembly comprises a heat conduction shell and a phase change heat dissipation chip, wherein the phase change heat dissipation chip is positioned in the heat conduction shell and is tightly attached to the inner wall of the heat conduction shell. The utility model is mainly used for refrigeration of refrigeration equipment.

Description

A semiconductor refrigeration device

Technical Field

The utility model belongs to refrigeration equipment, in particular to a semiconductor refrigeration device.

Background technique

Semiconductor refrigerator, also known as thermoelectric refrigerator, is a heat pump that uses the Seebeck effect, Peltier effect and Thomson effect of semiconductor materials to achieve cooling. When direct current passes through the semiconductor refrigerator, the surfaces on both sides of the semiconductor refrigerator absorb heat and release heat respectively. The surface of the semiconductor refrigerator that absorbs heat is called the cold surface, and the surface of the semiconductor refrigerator that releases heat is called the hot surface. The semiconductor refrigerator can achieve cooling, and the temperature difference between the cold surface and the hot surface can reach about 60°C.

Semiconductor refrigeration is usually used in mobile refrigeration equipment or small refrigeration equipment, such as cooling fans, water dispensers, etc. However, in the prior art, due to the limitation of the volume of the refrigeration equipment and the use of relatively large water cooling or air cooling on the hot surface of the semiconductor refrigeration plate, the area of the semiconductor refrigeration plate is small and the cooling capacity is relatively low; at the same time, due to the low heat dissipation efficiency of water cooling or air cooling, the heat dissipation of the semiconductor refrigeration plate is low, and ultimately the cooling capacity of the semiconductor refrigeration device cannot meet the cooling needs of users.

Utility Model Content

The utility model provides a semiconductor refrigeration device to solve the problem that the existing semiconductor refrigeration device has low cooling efficiency and low heat dissipation, resulting in low cooling capacity of the semiconductor refrigeration device and cannot meet user needs.

The technical solution adopted by the utility model to solve the above technical problems is:

A semiconductor refrigeration device comprises a semiconductor refrigeration plate, a hot end heat exchange component and a radiator which are arranged side by side in sequence, wherein the heat generating surface of the semiconductor refrigeration plate is in contact with one side surface of the hot end heat exchange component, and the radiator is in contact with the other side surface of the hot end heat exchange component, and the heat generated by the semiconductor refrigeration plate is conducted out through the hot end heat exchange component and the radiator in sequence; the hot end heat exchange component comprises a heat conductive shell and a phase change heat dissipation chip, and the phase change heat dissipation chip is in the heat conductive shell and is in close contact with the inner wall of the heat conductive shell.

Preferably, the semiconductor refrigeration plate comprises two ceramic substrates, a plurality of electrode plates, a P-type semiconductor and an N-type semiconductor; the two ceramic substrates are arranged opposite to each other up and down, the P-type semiconductor and the N-type semiconductor are arranged horizontally and alternately between the two ceramic substrates, and the adjacent P-type semiconductors and N-type semiconductors are connected in sequence from head to tail through the electrode plates, and the electrode plates are located between the ends of the P-type semiconductor and the N-type semiconductor and the ceramic substrate.

Preferably, the ceramic substrate is a silicon nitride substrate.

Preferably, a mounting cavity is provided on a surface of the heat-conducting shell facing the semiconductor cooling chip, the semiconductor cooling chip is inserted into the mounting cavity, the cold surface of the semiconductor cooling chip is exposed, and the hot surface of the semiconductor cooling chip is in close contact with the heat-conducting shell.

Preferably, the installation cavity is composed of two oppositely arranged slide grooves, and the two ends of the semiconductor refrigeration plate in the width direction are respectively inserted into the two slide grooves.

Preferably, the heat-conducting shell is made of copper material.

Preferably, the phase-change heat dissipation chip is composed of a plurality of annular capillary wicks arranged side by side, and the outer wall of the capillary wick is tightly fitted with the inner wall of the heat-conducting shell.

Preferably, the side of the heat sink that contacts the heat-conducting shell is in the shape of a flat plate, and a side of the heat sink that faces away from the heat-conducting shell is laterally provided with a plurality of heat-dissipating grooves.

Compared with the prior art, the utility model has the following beneficial effects:

1. The semiconductor refrigeration plate and the hot end heat exchange component of the present application are connected by means of a slot to ensure the stability and tightness of the connection between the two.

2. The ceramic substrate in the semiconductor refrigeration plate of the present application adopts a silicon nitride substrate, and its high thermal conductivity is used to replace the original low thermal conductivity substrate to improve the working performance of the refrigeration plate.

3. This application uses a copper-based microfluidic phase change heat dissipation chip as a hot-end heat exchange component, which accelerates the heat dissipation efficiency of the semiconductor refrigeration plate and increases the heat dissipation, increases the cooling capacity of the semiconductor refrigeration plate, and achieves a better cooling effect.

4. The heat sink of the present application is provided with a heat dissipation groove to increase the heat dissipation area, further accelerate the heat dissipation efficiency of the semiconductor refrigeration plate and increase the heat dissipation amount.

BRIEF DESCRIPTION OF THE DRAWINGS

As a part of this application, the accompanying drawings are used to provide a further understanding of the present invention.

Fig. 1 is an axonometric view of the utility model.

FIG. 2 is a front view of the present utility model.

FIG. 3 is a schematic diagram of the structure of a semiconductor cooling sheet.

FIG4 is a schematic diagram of heat exchange of a capillary wick.

FIG. 5 is a schematic diagram showing the structure of a phase-change heat dissipation chip in which capillary wicks are arranged.

FIG. 6 is a schematic diagram of the structure of the heat-conducting shell.

Explanation of the reference numerals: 1-semiconductor cooling sheet; 1-1-ceramic substrate; 1-2-electrode sheet; 1-3-P-type semiconductor; 1-4-N-type semiconductor; 2-heat sink; 3-thermal shell; 3-1-installation cavity; 3-1-1-slide groove; 4-phase change heat dissipation chip; 4-1-capillary wick.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model.

Referring to Figure 1, an embodiment of the present application provides a semiconductor refrigeration device, which includes a semiconductor refrigeration plate 1, a hot end heat exchange component and a radiator 2 arranged side by side in sequence, the heat generating surface of the semiconductor refrigeration plate 1 is in contact with one side surface of the hot end heat exchange component, and the radiator 2 is in contact with the other side surface of the hot end heat exchange component. The heat generated by the semiconductor refrigeration plate 1 is conducted out through the hot end heat exchange component and the radiator 2 in sequence.

Referring to FIG. 2 , the semiconductor refrigeration sheet 1 is used for refrigeration in mobile refrigeration equipment or small refrigeration equipment, and includes two ceramic substrates 1-1, several electrode sheets 1-2, P-type semiconductors 1-3 and N-type semiconductors 1-4; the two ceramic substrates 1-1 are arranged opposite to each other, the P-type semiconductors 1-3 and N-type semiconductors 1-4 are arranged horizontally and alternately between the two ceramic substrates 1-1, and the adjacent P-type semiconductors 1-3 and N-type semiconductors 1-4 are connected end to end in sequence through the electrode sheets 1-2, and the electrode sheets 1-2 are located between the ends of the P-type semiconductors 1-3 and N-type semiconductors 1-4 and the ceramic substrates 1-1. When the semiconductor refrigeration sheet 1 is powered on, one side of the semiconductor refrigeration sheet 1 absorbs heat to achieve refrigeration, forming a cold surface, and the other side of the surface dissipates the absorbed heat, forming a hot surface.

Furthermore, the ceramic substrate 1-1 is a silicon nitride substrate, which is made of high-purity raw materials and a special sintering process, and has a thermal conductivity of up to 120W/m K, which is 8 to 9 times that of a low thermal conductivity alumina substrate. This embodiment uses its high thermal conductivity to replace the original low thermal conductivity substrate to improve the working performance of the refrigeration plate.

Referring to Figure 3, the hot end heat exchange component is a copper-based microfluidic phase change heat dissipation chip, which is used to conduct the heat emitted by the hot surface of the semiconductor refrigeration plate 1; the hot end heat exchange component includes a heat conductive shell 3 and a phase change heat dissipation chip 4, and the phase change heat dissipation chip 4 is in the heat conductive shell 3 and is tightly fitted to the inner wall of the heat conductive shell 3.

Furthermore, the heat-conducting shell 3 is a rectangular shell, and a semi-enclosed installation cavity 3-1 is provided on the surface of the heat-conducting shell 3 facing the semiconductor cooling plate 1. The semiconductor cooling plate 1 is inserted into the installation cavity 3-1, and the cold surface of the semiconductor cooling plate 1 is exposed. The hot surface of the semiconductor cooling plate 1 is in close contact with the outer surface of the heat-conducting shell 3 and transfers heat to the heat-conducting shell 3, so that the side of the heat-conducting shell 3 in contact with the semiconductor cooling plate 1 is the hot end, and the side opposite to the hot end of the heat-conducting shell 3 is the cold end, and the radiator 2 is located on the cold end side of the heat-conducting shell 3.

Furthermore, the installation cavity 3-1 is composed of two oppositely arranged slide grooves 3-1-1, and the two ends of the semiconductor cooling plate 1 in the width direction are respectively inserted into the two slide grooves 3-1-1, so that the side of the semiconductor cooling plate 1 facing outward (cold surface) can be exposed.

Furthermore, the heat-conducting shell 3 is made of copper material with high thermal conductivity to accelerate the heat conduction efficiency between the semiconductor refrigeration plate 1 and the hot end heat exchange component, and between the hot end heat exchange component and the radiator 2, thereby further accelerating the heat dissipation efficiency of the semiconductor refrigeration plate 1.

Furthermore, the phase change heat dissipation chip 4 is composed of a plurality of annular capillary wicks 4-1 arranged side by side. The outer wall of the capillary wick 4-1 is tightly fitted with the inner wall of the heat-conducting shell 3. The side of the capillary wick 4-1 in contact with the hot end of the heat-conducting shell 3 is the heat-absorbing end, and the side in contact with the cold end of the heat-conducting shell 3 is the heat-dissipating end. The liquid heat exchange medium at the heat-absorbing end of the capillary wick 4-1 is heated and evaporated rapidly into hot steam under the vacuum ultra-low pressure environment. The hot steam is heated and rises, passing through the capillary wick. The liquid core 4-1 flows through the cavity to the heat dissipation end of the capillary liquid core 4-1, contacts the relatively cold end of the heat-conducting shell 3 to release heat, and re-condenses into liquid; the condensed coolant flows back to the heat absorption end of the capillary liquid core 4-1 through the capillary structure to continue absorbing heat; the refluxed coolant is vaporized again after being heated at the heat absorption end, and this action is repeated, thereby continuously taking away the heat conducted from the hot side of the semiconductor refrigeration plate 1, thereby reducing the temperature of the hot side of the semiconductor refrigeration plate 1 and further improving the refrigeration performance.

Referring to FIG. 4 , the heat sink 2 is used for the final dissipation of heat from the hot side of the semiconductor refrigeration plate 1. The side of the heat sink 2 that contacts the heat-conducting shell 3 is in the shape of a flat plate to increase the contact area between the two. The side of the heat sink 2 that faces away from the heat-conducting shell 3 is laterally provided with a plurality of heat dissipation grooves 2-1 that penetrate the upper and lower end surfaces to increase the heat dissipation area of the heat sink 2.

It should be noted that in this embodiment, since the hot end heat exchange component adopts a heat-conducting shell 3 and a phase-change heat dissipation chip 4, the two are set into an integrated structure, so that the phase-change heat dissipation chip 4 is in a vacuum-sealed environment, and no additional connectors are required for connection, thereby improving the overall integration and volume of the system. Compared with traditional water-cooled heat dissipation, air-cooled heat dissipation and other applications, the use of copper-based microfluidic phase-change heat dissipation chips has the advantages of simple structure, low thermal resistance, fast heat conduction speed and no additional power consumption; at the same time, the heat dissipation performance is improved by 30%, thereby greatly improving the working performance of the semiconductor refrigeration sheet.

In this embodiment, the overall performance of the semiconductor refrigeration plate is optimized under the action of the hot end heat exchange component and the radiator. The performance of the optimized refrigeration plate is greatly improved, so that the cooling capacity is increased on the basis of a smaller system size and lower energy consumption.

Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments, and other arrangements may be designed without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the features described in the various dependent claims and herein may be combined in a manner different from that described in the original claims. It may also be understood that the features described in conjunction with the individual embodiments may be used in other described embodiments.

Claims (8)

1. A semiconductor refrigeration device, characterized in that it comprises a semiconductor refrigeration plate (1), a hot end heat exchange component and a radiator (2) arranged side by side in sequence, wherein the heat generating surface of the semiconductor refrigeration plate (1) is in contact with one side surface of the hot end heat exchange component, and the radiator (2) is in contact with the other side surface of the hot end heat exchange component, and the heat generated by the semiconductor refrigeration plate (1) is conducted out through the hot end heat exchange component and the radiator (2) in sequence; The hot end heat exchange component comprises a heat-conducting shell (3) and a phase-change heat dissipation chip (4); the phase-change heat dissipation chip (4) is located in the heat-conducting shell (3) and is tightly fitted to the inner wall of the heat-conducting shell (3). 2. A semiconductor refrigeration device according to claim 1, characterized in that: the semiconductor refrigeration plate (1) comprises two ceramic substrates (1-1), a plurality of electrode plates (1-2), a P-type semiconductor (1-3) and an N-type semiconductor (1-4); the two ceramic substrates (1-1) are arranged opposite to each other up and down, the P-type semiconductor (1-3) and the N-type semiconductor (1-4) are arranged horizontally and alternately between the two ceramic substrates (1-1), and adjacent P-type semiconductors (1-3) and N-type semiconductors (1-4) are connected end to end in sequence through the electrode plates (1-2), and the electrode plates (1-2) are located between the ends of the P-type semiconductor (1-3) and the N-type semiconductor (1-4) and the ceramic substrate (1-1). 3. A semiconductor refrigeration device according to claim 2, characterized in that the ceramic substrate (1-1) is a silicon nitride substrate. 4. A semiconductor refrigeration device according to claim 1, characterized in that: a mounting cavity (3-1) is provided on the surface of the heat-conducting shell (3) facing the semiconductor refrigeration plate (1), the semiconductor refrigeration plate (1) is inserted into the mounting cavity (3-1), the cold surface of the semiconductor refrigeration plate (1) is exposed to the outside, and the hot surface of the semiconductor refrigeration plate (1) is in close contact with the heat-conducting shell (3). 5. A semiconductor refrigeration device according to claim 4, characterized in that: the installation cavity (3-1) is composed of two oppositely arranged slide grooves (3-1-1), and the two ends of the semiconductor refrigeration plate (1) in the width direction are respectively inserted into the two slide grooves (3-1-1). 6. A semiconductor refrigeration device according to claim 1, characterized in that the heat-conducting shell (3) is made of copper material. 7. A semiconductor refrigeration device according to claim 1, characterized in that the phase change heat dissipation chip (4) is composed of a plurality of annular capillary wicks (4-1) arranged side by side, and the outer wall of the capillary wick (4-1) is tightly fitted with the inner wall of the heat conductive shell (3). 8. A semiconductor refrigeration device according to claim 1, characterized in that: the side of the radiator (2) in contact with the heat-conducting shell (3) is in the shape of a flat plate, and the side of the radiator (2) facing away from the heat-conducting shell (3) is laterally provided with a plurality of heat dissipation grooves (2-1).