CN214477404U - Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof - Google Patents
Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof Download PDFInfo
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- CN214477404U CN214477404U CN202120761402.9U CN202120761402U CN214477404U CN 214477404 U CN214477404 U CN 214477404U CN 202120761402 U CN202120761402 U CN 202120761402U CN 214477404 U CN214477404 U CN 214477404U
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Abstract
The utility model discloses a heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device, including the base and thermoelectric refrigeration piece, first soaking plate, heat pipe exchanger, second soaking plate, radiator and the fan that are used for fixed chip, wherein thermoelectric refrigeration piece hugs closely the chip and keeps away from the one side of base, and thermoelectric refrigeration piece is hugged closely to first soaking plate, and thermoelectric refrigeration piece is kept away from to the second soaking plate, and is put through heat pipe exchanger between second soaking plate and the first soaking plate, and the radiator is fixed on the surface of second soaking plate, and the fan is used for giving the heat dissipation of second soaking plate; the utility model discloses combine together thermoelectric refrigeration technique and heat pipe technique, utilize thermoelectric refrigeration piece to cool off the chip surface, take away the heat from thermoelectric refrigeration piece to the radiator by the fan again in time through heat pipe exchanger, whole radiating process does not need liquid cooling, the stability and the security of the equipment of improvement.
Description
Technical Field
The invention relates to the field of electronic chip heat dissipation technology, in particular to a heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and a control loop thereof.
Background
In recent years, with the development of high integration and miniaturization of electronic chips, the heating power of the chips is greatly increased, the temperature of the chips is rapidly increased, and too high temperature not only destroys the stability of the operation of the chips, but also shortens the service life of the chips, so how to effectively dissipate heat of the chips is a prerequisite for improving the performance of the chips.
Thermoelectric refrigeration, also known as temperature difference refrigeration, is an active cooling technology, has the advantages of no moving parts, small volume, easy integration and the like, is widely concerned, and can realize accurate adjustment of refrigeration temperature by adjusting the magnitude of input current. Thermoelectric refrigeration is based on the following principle: the N-type semiconductor and the P-type semiconductor are connected in series, after an external direct current power supply applies current, electrons and holes need to absorb heat when entering the high-level N-type semiconductor from the low-level P-type semiconductor, and a refrigeration process is formed.
The heat pipe technology mainly utilizes the evaporation and condensation of working fluid to transfer heat. The heat pipe is composed of an evaporation section, a heat insulation section and a condensation section 3, when in preparation, the inside of the pipe is pumped to a higher vacuum degree and then filled with a proper amount of working fluid, so that the capillary porous material of the liquid absorption core tightly attached to the inner wall of the pipe is filled with liquid for sealing. When the heat pipe works, the evaporation end is heated, liquid is quickly evaporated, steam flows to the other end under a slight pressure difference and releases heat to be condensed into liquid again, the liquid flows to the other end along the porous material under the action of capillary force or gravity, releases heat to be condensed into liquid again, and the circulation is repeated.
Patent CN 104779229a proposes a heat sink based on thermoelectric cooling principle, which adopts both thermoelectric cooling and liquid cooling technologies, and although the heat dissipation capability of the chip is improved, due to the introduction of a liquid circulation system, not only the complexity of the heat sink structure is increased, but also the safety factor is reduced, and the application range is limited.
Disclosure of Invention
The invention aims to solve the technical problems and provides a heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and a control loop thereof, which can enhance the heat dissipation capacity of a chip and reduce the temperature of the chip.
In order to achieve the purpose, the invention provides a heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device, which comprises a base used for fixing a chip, a thermoelectric refrigeration piece, a first soaking plate, a heat pipe heat exchanger, a second soaking plate, a radiator and a fan, wherein the thermoelectric refrigeration piece is tightly attached to one surface of the chip, which is far away from the base, the first soaking plate is tightly attached to the thermoelectric refrigeration piece, the second soaking plate is far away from the thermoelectric refrigeration piece, the second soaking plate is communicated with the first soaking plate through the heat pipe heat exchanger, the radiator is fixed on the surface of the second soaking plate, and the fan is used for dissipating heat for the second soaking plate.
The invention combines the thermoelectric refrigeration technology and the heat pipe technology, utilizes the thermoelectric refrigeration piece to cool the surface of the chip, and the heat pipe heat exchanger transfers heat from the thermoelectric refrigeration piece to the radiator in time to be taken away by the fan, so that the whole radiating process does not need liquid cooling, thereby improving the stability and the safety of the equipment.
Preferably, heat-conducting grease is coated between the chip and the thermoelectric refrigeration piece and between the thermoelectric refrigeration piece and the first vapor chamber, so that the thermal contact resistance at the interface boundary between the chip surface and the thermoelectric refrigeration piece and between the thermoelectric refrigeration piece and the first vapor chamber is reduced.
Preferably, the first vapor chamber and the second vapor chamber are both provided with fixing holes for installing the heat pipe heat exchanger, and the heat pipe heat exchanger is horizontally arranged to facilitate the fixed installation of the heat pipe heat exchanger.
Preferably, the contact surfaces of the heat pipe heat exchanger and the first soaking plate and the second soaking plate are coated with heat conducting grease, so that the contact thermal resistance of the heat pipe heat exchanger and the junction between the first soaking plate and the second soaking plate is reduced.
Preferably, the radiator adopts a fin radiator, and the heat radiation area of the second soaking plate is increased.
The control loop of the heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device comprises a direct current power supply, a controller, a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is arranged on one surface, close to the chip, of a thermoelectric refrigerating sheet;
the current control loop of the invention timely adjusts the current of the direct current power supply according to the temperature of the end surface of the thermoelectric refrigerating piece, so that the thermoelectric refrigerating piece is in the optimal working state.
Specifically, when the surface temperature of the chip is higher than the optimal working temperature of the chip, the direct-current power supply is adjusted according to the temperature collected by the temperature sensor so that the current of the thermoelectric refrigerating piece is as follows:
at the moment, the thermoelectric refrigerating sheet has the strongest heat dissipation capacity, and can quickly reduce the surface temperature of the chip to a target temperature range value, wherein
Is the temperature measured by the first temperature sensor,
the Seebeck coefficient of the thermoelectric refrigeration piece,
is the resistance of the thermoelectric refrigerating sheet.
Specifically, when the surface temperature of the chip is reduced to a target temperature range value, in order to ensure that the thermoelectric cooling plate operates at the best efficiency, the direct-current power supply is adjusted to ensure that the current of the thermoelectric cooling plate is as follows:
wherein
Is the temperature measured by the second temperature sensor,
the heat transfer coefficient of the thermoelectric refrigerating sheet.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. the invention combines the thermoelectric refrigeration technology and the heat pipe technology, utilizes the thermoelectric refrigeration piece to cool the surface of the chip, transfers heat from the thermoelectric refrigeration piece to the radiator in time through the heat pipe exchanger and then is taken away by the fan, and the whole heat radiation process does not need liquid cooling, thereby improving the stability and the safety of the equipment.
2. The current control loop of the invention can adjust the current of the direct current power supply in time according to the temperature of the cold and hot end surfaces of the thermoelectric refrigerating piece, so that the thermoelectric refrigerating piece is in the optimal working state.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention.
FIG. 1 is a schematic view of a heat pipe-semiconductor combined electronic chip heat dissipation structure according to the present invention;
FIG. 2 is a diagram of a thermoelectric cooling plate temperature sensor arrangement of the present invention;
FIG. 3 is a schematic view of a vapor chamber structure according to the present invention;
FIG. 4 is a schematic diagram of a control circuit according to the present invention.
Description of reference numerals:
1. the heat pipe type solar water heater comprises a substrate, 2, a chip, 3, a thermoelectric refrigeration piece, 4, a first soaking plate, 5, a heat pipe heat exchanger, 6, a second soaking plate, 7, a finned radiator, 8, a fan, 9, a second temperature sensor, 10, a first temperature sensor, 11, a direct current power supply, 12 and a controller.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1:
as shown in fig. 1, the heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device comprises a base 1 for fixing a chip 2, a thermoelectric cooling plate 3, a first soaking plate 4, a heat pipe heat exchanger 5, a second soaking plate 6, a heat sink 7 and a fan 8, wherein the thermoelectric cooling plate 3 is tightly attached to one surface of the chip 2, which is far away from the base 1, the thermoelectric cooling plate 3 is tightly attached to the first soaking plate 4, the thermoelectric cooling plate 3 is far away from the second soaking plate 6, the second soaking plate 6 is communicated with the first soaking plate 4 through the heat pipe heat exchanger 5, the heat sink 7 is fixed on the surface of the second soaking plate 6, and the fan 8 is used for dissipating heat for the second soaking plate 6.
During implementation, the thermoelectric refrigerating piece 3 is used for cooling the chip 2, the heat absorbed by the thermoelectric refrigerating piece 3 in the process of cooling the chip 2 is absorbed by the first vapor chamber 4 and is transferred to the second vapor chamber 6 through the heat pipe exchanger 5, and then the heat transferred to the second vapor chamber 6 is taken away by the radiator 7 and the fan 8.
The invention combines the thermoelectric refrigeration technology and the heat pipe technology, utilizes the thermoelectric refrigeration piece 3 to cool the surface of the chip 2, and the heat pipe heat exchanger 5 transfers the heat from the thermoelectric refrigeration piece 3 to the radiator 7 in time to be taken away by the fan 8, so that the whole radiating process does not need liquid cooling, thereby improving the stability and the safety of the equipment.
As a preferable scheme of the above embodiment, in order to reduce the thermal contact resistance at the interface boundaries between the surface of the chip 2 and the thermoelectric cooling plate 3 and between the thermoelectric cooling plate 3 and the first soaking plate 4, the thermal grease is coated between the chip 2 and the thermoelectric cooling plate 3 and between the thermoelectric cooling plate 3 and the first soaking plate 4.
As a preferable scheme of the above embodiment, in order to facilitate the fixing and installation of the heat pipe heat exchanger 5, as shown in fig. 3, fixing holes for installing the heat pipe heat exchanger 5 are respectively formed on the first soaking plate 4 and the second soaking plate 6, and the heat pipe heat exchanger 5 is horizontally arranged.
As a preferable scheme of the above embodiment, in order to reduce the contact thermal resistance at the boundary between the heat pipe heat exchanger 5 and the first soaking plate 4 and the second soaking plate 6, the contact surfaces of the heat pipe heat exchanger 5 and the first soaking plate 4 and the second soaking plate 6 are coated with the thermally conductive grease.
As a preferable example of the above embodiment, in order to increase the heat radiation area, the heat sink 7 is a fin heat sink.
Example 2:
on the basis of embodiment 1, a control circuit is provided, as shown in fig. 2 and fig. 4, the control circuit includes a dc power supply 11, a controller 12, a first temperature sensor 10 and a second temperature sensor 9, wherein the first temperature sensor 10 is disposed on one surface of the thermoelectric cooling plate 3 tightly attached to the chip 2, the second temperature sensor 9 is disposed between the thermoelectric cooling plate 3 tightly attached to the first soaking plate 4, the second temperature sensor 9 and the first temperature sensor 10 are both connected to the controller 12, the dc power supply 11 is connected to the thermoelectric cooling plate 3 through a wire, and the controller 12 is used for controlling an output current of the dc power supply 11.
The controller 12 adjusts the output current of the dc power supply 11 according to the temperatures measured by the second temperature sensor 9 and the first temperature sensor 10, so as to ensure that the electric refrigerating sheet 3 is always in the optimal refrigerating efficiency state.
Specifically, when the surface temperature of the chip 2 is higher than the optimal working temperature of the chip 2, the direct-current power supply is adjusted according to the temperature collected by the temperature sensor so that the current of the thermoelectric refrigerating piece 3 is as follows:
at this time, the thermoelectric refrigerating sheet 3 has the strongest heat dissipation capability, and can quickly reduce the surface temperature of the chip 2 to a target temperature range value, wherein
The temperature measured by the first temperature sensor 10,
the Seebeck coefficient of the thermoelectric cooling plate 3,
the resistance of the thermoelectric cooling plate 3.
Specifically, when the surface temperature of the chip 2 is reduced to the target temperature range value, in order to ensure that the thermoelectric cooling plate 3 operates with the best efficiency, the direct-current power supply is adjusted to ensure that the current of the thermoelectric cooling plate 3 is:
wherein
The temperature measured by the second temperature sensor 9,
the heat transfer coefficient of the thermoelectric cooling fins 3.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. The utility model provides a heat pipe-semiconductor refrigeration combined electronic chip heat abstractor, its characterized in that, including the base and thermoelectric refrigeration piece, first soaking plate, heat pipe exchanger, second soaking plate, radiator and the fan that are used for fixed chip, wherein thermoelectric refrigeration piece hugs closely the chip and keeps away from the one side of base, thermoelectric refrigeration piece is hugged closely to first soaking plate, thermoelectric refrigeration piece is kept away from to the second soaking plate, and put through the heat pipe exchanger between second soaking plate and the first soaking plate, the radiator is fixed on the surface of second soaking plate, the fan is used for giving the heat dissipation of second soaking plate.
2. A heat pipe-semiconductor refrigeration combined electronic chip heat sink as claimed in claim 1, wherein heat conductive grease is coated between the chip and the thermoelectric refrigeration chip and between the thermoelectric refrigeration chip and the first vapor chamber.
3. A heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device as defined in claim 1, wherein the first vapor chamber and the second vapor chamber are both provided with fixing holes for mounting heat pipe heat exchangers, and the heat pipe heat exchangers are horizontally arranged.
4. A heat pipe-semiconductor refrigeration combined electronic chip heat sink as recited in claim 3, wherein the contact surfaces of the heat pipe heat exchanger and the first vapor chamber and the second vapor chamber are coated with heat conductive grease.
5. A heat pipe-semiconductor refrigeration combination electronic chip heat sink as recited in claim 1 wherein said heat sink is a finned heat sink.
6. A control loop of a heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device is characterized by comprising a direct current power supply, a controller, a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is arranged on one surface, close to a chip, of a thermoelectric refrigeration piece, the second temperature sensor is arranged between the thermoelectric refrigeration piece and a first soaking plate, the second temperature sensor and the first temperature sensor are connected with the controller, the direct current power supply is connected with the thermoelectric refrigeration piece through a lead, and the controller is used for controlling the output current of the direct current power supply.
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| CN202120761402.9U CN214477404U (en) | 2021-04-14 | 2021-04-14 | Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof |
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| CN202120761402.9U CN214477404U (en) | 2021-04-14 | 2021-04-14 | Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968009A (en) * | 2021-04-14 | 2021-06-15 | 四川大学 | Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968009A (en) * | 2021-04-14 | 2021-06-15 | 四川大学 | Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof |
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