CN207849866U - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
- Publication number
- CN207849866U CN207849866U CN201820247040.XU CN201820247040U CN207849866U CN 207849866 U CN207849866 U CN 207849866U CN 201820247040 U CN201820247040 U CN 201820247040U CN 207849866 U CN207849866 U CN 207849866U
- Authority
- CN
- China
- Prior art keywords
- heat
- semiconductor chilling
- hole
- chilling plate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model is related to a kind of semiconductor cooling devices.It includes heat insulation support plate, semiconductor chilling plate and radiating block, it is provided with mounting hole on heat insulation support plate, semiconductor chilling plate is set in mounting hole, mounting hole is equipped with installation groove, heat conductive block is equipped in installation groove, and heat conductive block is sticked on the chill surface of semiconductor chilling plate or heating surface, and the first heat insulation loop is equipped between the lateral wall and installation groove madial wall of heat conductive block.The utility model by by semiconductor chilling plate and heat conductive block be separately mounted in the mounting hole of heat insulation support plate and installation groove in, it is sticked on the chill surface of the semiconductor chilling plate in heat conductive block, the cold that semiconductor chilling plate generates is passed to other heat-conduction components by heat conductive block, first heat insulation loop effectively prevents heat conductive block that heat occurs with external environment, heat insulation support plate and transmits, to improve the refrigerating efficiency and heat dissipation effect of semiconductor chilling plate.
Description
Technical field
The utility model is related to semiconductor refrigerating technology field, more particularly to a kind of semiconductor cooling device.
Background technology
Currently, with the continuous development of society, requirement of the people to life is also higher and higher, such as refrigerator, almost every family
Each household is all configured with refrigerator, and refrigerator is a kind of device by food, water and other items frozen for storage, can be to avoid food due to high temperature
And damage, while the refrigeration such as beverage to certain temperature can be drunk in summer, it is very tasty and refreshing, but existing refrigerator is most
All it is the large refrigerator in household and shop, the groups such as university student cannot be met.
Student enrollment, office's white collar, housewife are equipped with computer and mobile charging treasured mostly simultaneously, this practicality is new
Type USB minifridges allow minifridge to work, university student, office using USB interface by connecting computer or mobile power
The small article such as pop can, facial mask, milk, insulin can be placed in minifridge by room white collar, housewife, edible for it, greatly
Big improves quality of life, for this purpose, it is proposed that a kind of USB minifridges.
But all minifridge of existing market is using micro semiconductor refrigerating plant, micro semiconductor refrigeration dress
It sets due to by main energy limit（Maximum upper limit power 10W）, separately plus it is heat-insulated, transmission method is not right, therefore existing semiconductor
The heat dissipation effect of refrigerating plant is poor, refrigerating efficiency is low, causes 99% or more minifridge is practical 5 ~ 8 degree real cold is not achieved
It hides, actual temperature is all between 14 ~ 18 degree, and cold storage effect is undesirable, and article cannot be effectively fresh-keeping.
In conclusion semiconductor cooling device currently on the market there is still a need for be further improved.
Utility model content
That the purpose of the utility model is to overcome existing semiconductor cooling device heat dissipation effects is poor, refrigerating efficiency is low not
Foot, and the semiconductor cooling device of a kind of good heat dissipation effect, high cooling efficiency is provided.
What the purpose of this utility model was realized in：
A kind of semiconductor cooling device, including heat insulation support plate, semiconductor chilling plate, the first bolt, the second bolt, third
Bolt and radiating block, the heat insulation support plate are set to the top surface of radiating block, and the heat-insulated branch of perforation is provided on the heat insulation support plate
The mounting hole of the upper and lower surface of fagging, the semiconductor chilling plate are set in mounting hole, the semiconductor chilling plate
Top and bottom are respectively chill surface and heating surface, and the heating surface of the semiconductor chilling plate and the top surface of radiating block are in direct contact
Or mediate contact, the mounting hole are equipped with installation groove, the installation groove is connected to mounting hole, is set in the installation groove
There is heat conductive block, and the heat conductive block is sticked on the chill surface of semiconductor chilling plate or heating surface.The heat passes
The first heat insulation loop is equipped between the lateral wall and installation groove madial wall of guide block, the first heat insulation loop effectively prevents heat to conduct
Block occurs heat with external environment, heat insulation support plate and transmits, to improve the refrigerating efficiency of semiconductor chilling plate.
The utility model can also improve further below.
The installation groove is located at the top of mounting hole, and the bottom surface of the heat conductive block is sticked in semiconductor chilling plate
The top surface of chill surface, the heat conductive block is in exposed shape, so that heat conductive block abuts together with other heat-conduction components,
Realize that heat is transmitted.
The top surface of the heat conductive block protrudes the opening of installation groove, so as to heat conductive block and other heat-conduction components
It abuts together, realizes that heat is transmitted.
The first thermal insulation board is equipped between the top surface and heat insulation support plate of the radiating block, the first thermal insulation board correspondence is partly led
Body cooling piece is equipped with the first relief hole, and the heating surface of the semiconductor chilling plate is exposed relief hole and pasted with the top surface of radiating block
It closes, the lower surface of the heat insulation support plate is sticked on the top surface of radiating block.First thermal insulation board effectively prevents semiconductor
Cooling piece occurs heat with radiating block and transmits.
The heat conductive block is equipped with the first screw hole, and the installation groove inner bottom wall corresponds to the first screw hole and allowed equipped with bolt
Position hole, the T-shaped shape of bolt relief hole, bolt relief hole are connected to the first screw hole, and the first bolt passes through bolt relief hole simultaneously
It is threadedly coupled with the first screw hole, so that heat conductive block is fixed in installation groove.
The heat insulation support plate is equipped with multiple first through hole, and first through hole is corresponded on first thermal insulation board equipped with multiple
Second through-hole, corresponding second through-hole is equipped with multiple second screw holes on the radiating block, and second screw bolt passes first are logical
Hole, the second through-hole are simultaneously threadedly coupled with the second screw hole, to which heat insulation support plate, the first thermal insulation board, radiating block three to be fixed on
Together.
The installation groove is located at the lower part of mounting hole, and the top and bottom of the heat conductive block are sticked respectively is partly leading
In the heating surface of body cooling piece and the top surface of radiating block, the chill surface of the semiconductor chilling plate is exposed in the upper of heat insulation support plate
Surface.
The upper surface of the heat insulation support plate is equipped with the second thermal insulation board.Second thermal insulation board effectively prevents heat-insulated branch
Fagging occurs heat with external environment and transmits.
Second thermal insulation board corresponds to semiconductor chilling plate and is equipped with the second relief hole, and the chill surface of the semiconductor chilling plate exposes
Second relief hole abuts together with other heat-conduction components so as to the chill surface of semiconductor chilling plate, realizes that heat is transmitted.
The chill surface of the semiconductor chilling plate is equipped with heat-conducting silicone grease oil reservoir, the heat conduction of heat-conducting silicone grease oil reservoir with heating surface
Performance is good, to improve semiconductor chilling plate radiating efficiency and refrigerating efficiency.
Semiconductor chilling plate is corresponded on the heat insulation support plate and is equipped with threading groove, and the threading groove is connected to mounting hole, institute
The positive electrical wire and negative electrical wire for stating semiconductor chilling plate stretch out heat insulation support plate by threading groove.
The radiating block is aluminium block, and the bottom surface of the radiating block is equipped with radiating fin, and cooling fin increases dissipating for radiating block
Hot area, to improve conductor cooling piece radiating efficiency and refrigerating efficiency.
First heat insulation loop, the first thermal insulation board and the second thermal insulation board are made of heat-insulated silica gel.
The upper surface area of the heat conductive block is more than the base area of semiconductor chilling plate, to improve semiconductor
The refrigerating efficiency of cooling piece.
The shape of the semiconductor chilling plate, the shape of size and mounting hole, size match, the heat conductive block
The shape of shape and installation groove matches.
The shape of the heat insulation support plate, size and shape, the size of the first thermal insulation board are mutually matched.
The beneficial effects of the utility model are as follows：
（One）Semiconductor chilling plate and heat conductive block by being separately mounted to the peace of heat insulation support plate by the utility model
It fills in hole and in installation groove, the heating surface of the semiconductor chilling plate and the top surface of radiating block occur heat and transmit, semiconductor refrigerating
It is sticked on the chill surface of piece in heat conductive block, the cold that semiconductor chilling plate generates is passed to other heat by heat conductive block
Conducting parts, radiating block is that the heating surface of semiconductor chilling plate radiates, in addition in the lateral wall and installation groove of heat conductive block
The first heat insulation loop is equipped between side wall, the first heat insulation loop effectively prevents heat conductive block and external environment, heat insulation support plate
Heat occurs to transmit, to improve the refrigerating efficiency and heat dissipation effect of semiconductor chilling plate.Compared to existing refrigerating plant, this reality
It can reach 90% or more with the heat-insulating efficiency and cold conduction efficiency of Novel refrigeration device.
（Two）Moreover, the first thermal insulation board is equipped between the top surface and heat insulation support plate of the radiating block of the utility model, first
Thermal insulation board effectively prevents semiconductor chilling plate that heat occurs with radiating block and transmits.
（Three）In addition, being equipped with thermal conductive silicon fatty oil on the chill surface and heating surface of the semiconductor chilling plate of the utility model
Layer, the good heat conductivity of heat-conducting silicone grease oil reservoir, to improve semiconductor chilling plate radiating efficiency and refrigerating efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model semiconductor cooling device embodiment one.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the decomposition texture schematic diagram of Fig. 1.
Fig. 4 is the schematic cross-sectional view at A-A in Fig. 2.
Fig. 5 is that the utility model semiconductor cooling device embodiment one applies the structural schematic diagram on minifridge.
Fig. 6 is the decomposition texture schematic diagram of Fig. 5.
Fig. 7 is the structural schematic diagram of the utility model semiconductor cooling device embodiment two.
Fig. 8 is the vertical view of Fig. 7.
Fig. 9 is the decomposition texture schematic diagram of Fig. 7.
Figure 10 is the schematic cross-sectional view at A-A in Fig. 8.
Figure 11 is that the utility model semiconductor cooling device embodiment two applies the structural schematic diagram on minifridge.
Specific implementation mode
The utility model is further described with reference to the accompanying drawings and embodiments.
Embodiment one, as shown in Figures 1 to 4, a kind of semiconductor cooling device 2, including heat insulation support plate 23, semiconductor system
Cold 20, first bolt 254, the second bolt（It is not shown in figure）, third bolt 33 and radiating block 25, the heat insulation support plate
23 are set to the top surface of radiating block 25, and the peace of the upper and lower surface of perforation heat insulation support plate is provided on the heat insulation support plate 23
Hole 29 is filled, the semiconductor chilling plate 20 is set in mounting hole 29, and the top and bottom of the semiconductor chilling plate 20 are respectively
Chill surface and heating surface, the heating surface of the semiconductor chilling plate 20 and the top surface of radiating block 25 are in direct contact, the mounting hole
29 are equipped with installation groove 26, and the installation groove 26 is located at the upper surface of heat insulation support plate 23, the installation groove 26 and peace
It fills hole 29 to be connected to, heat conductive block 21 is equipped in the installation groove 26, and the bottom surface of the heat conductive block 21 is sticked half
On the chill surface of conductor cooling piece 20, the top surface of heat conductive block 21 is exposed in the upper surface of heat insulation support plate, and the heat passes
The first heat insulation loop 22 is equipped between 26 madial wall of lateral wall and installation groove of guide block 21.
As the more specific technical solution of the utility model.
The installation groove 26 is located at the top of mounting hole 29, and the bottom surface of the heat conductive block 21 is sticked in semiconductor system
The top surface of cold 20 chill surface, the heat conductive block 21 is in exposed shape.The top surface of the heat conductive block 21 protrudes installation
The opening of groove 26.
The heat conductive block 21 is equipped with the first screw hole 211, and the installation groove inner bottom wall corresponds to the first screw hole 211 and sets
There are the first bolt relief hole 232, the outer end of the 232 T-shaped shape of the first bolt relief hole, the first bolt relief hole to extend
To the bottom surface of heat insulation support plate 23, the inner end of the first bolt relief hole 232 is connected to the first screw hole 211, and the first bolt 254 is under
It up passes through the first bolt relief hole 232 and is threadedly coupled with the first screw hole 211, so that heat conductive block is fixed on installation
In groove.
The upper surface area of the heat conductive block is more than the base area of semiconductor chilling plate, to improve semiconductor
The refrigerating efficiency of cooling piece.
The shape of the semiconductor chilling plate, the shape of size and mounting hole, size match, the heat conductive block
The shape of shape and installation groove matches.
The first thermal insulation board 24, first thermal insulation board 24 are equipped between the top surface and heat insulation support plate 23 of the radiating block 25
Corresponding semiconductor chilling plate 20 is equipped with the first relief hole 28, and the heating surface of the semiconductor chilling plate 20 exposes the first relief hole 28
And it is bonded with the top surface of radiating block 25.The lower surface of the heat insulation support plate 23 is sticked on the top surface of radiating block 25.
The shape of the heat insulation support plate 23, size and shape, the size of the first thermal insulation board 24 are mutually matched.
The heat insulation support plate 23 is equipped with multiple first through hole 231, and first through hole is corresponded on first thermal insulation board 24
231 are equipped with multiple second through-holes 241, and corresponding second through-hole 241 is equipped with multiple second screw holes 252 on the radiating block, and described the
Two screw bolt passes first through hole 231, the second through-hole 241 are simultaneously threadedly coupled with the second screw hole 252, so that heat insulation support
Plate 23, the first thermal insulation board, radiating block three are fixed together.
The chill surface of the semiconductor chilling plate 20 is equipped with heat-conducting silicone grease oil reservoir with heating surface（It is not shown in figure）.
Semiconductor chilling plate 20 is corresponded on the heat insulation support plate 23 is equipped with threading groove 27, the threading groove 27 and mounting hole
29 connections, the positive electrical wire and negative electrical wire of the semiconductor chilling plate 20 stretch out heat insulation support plate 23 by threading groove 27.
The radiating block is metal derby, preferably aluminium block, and the bottom surface of the radiating block 25 is equipped with radiating fin 251.
First heat insulation loop 22, the first thermal insulation board 24 and the second thermal insulation board are made of heat-insulated silica gel.
As shown in Figure 5 to Figure 6, a kind of minifridge, including head cover（It is not shown in figure）, case mouth holder 4, fuselage 1, conduction cooling
The top edge of box 3, semiconductor cooling device 2, bottom cover 5 and radiator fan 6, the conduction cooling box 3 is connected to case mouth holder 4
The top edge installation of bottom, the case mouth holder 4 is equipped with demarcation strip 13, the conduction cooling box 3 on the fuselage 1 in the fuselage 1
In fuselage 1 and on demarcation strip 13, about 1 fuselage is separated into refrigeration by the conduction cooling box 3 and demarcation strip 13 together
Chamber 11 and heat dissipation cavity of resorption 12,3 bottom surface of conduction cooling box have been covered with heat preservation foam 14, and the center of conduction cooling box is in exposed shape, is not had
Packet heat preservation foam, so that heat conductive block 21 abuts.The bottom cover 5 is set to the bottom of fuselage 1 and is connect with fuselage 1, described to lead
Cold box 3, demarcation strip 13, bottom cover 5 and fuselage 1 surround the heat dissipation cavity of resorption 12, and the radiator fan 6 is fixed on bottom cover 5 simultaneously
In heat dissipation cavity of resorption 12, the demarcation strip 13 is equipped with third through-hole 31, and corresponding to third through-hole 31 on the radiating block is equipped with
Third screw hole 253, the third bolt 33 pass through third through-hole 31 and are threadedly coupled with third screw hole 253, thus by this practicality
The novel bottom surface for being fixed on conduction cooling box and demarcation strip.
Corresponding heat dissipation cavity of resorption 12 is equipped with air inlet 15 on the fuselage 1, and 5 bottom of the bottom cover corresponds to heat dissipation cavity of resorption 12 and is arranged
There is air outlet 16.The utility model semiconductor cooling device 2 is mounted on the bottom of conduction cooling box 3 and in heat dissipation cavity of resorption 12, institute
The top surface for stating heat conductive block 21 is sticked in the bottom surface of conduction cooling box 3.
When above-mentioned minifridge work, the chill surface and heating surface of semiconductor chilling plate 20 freeze and generate heat respectively, partly lead
Cold caused by the chill surface of body cooling piece 20 first passes to heat conductive block 21, then passes to conduction cooling box again, to make
It obtains conduction cooling box interior energy and keeps low temperature.At the same time, the heating surface of conductor cooling piece 20 transfers heat to radiating block, and radiating block is logical
The radiating fin crossed thereon comes out, and radiator fan starts exhausting, and wind enters heat dissipation cavity of resorption from the air inlet 15 of fuselage, then
Fast speed belt walks the heat on radiating fin, then is discharged from air outlet 16, radiates and cools down to semiconductor chilling plate 20 to realize.
Embodiment two, as shown in Fig. 7 to Figure 11, the embodiment of embodiment two is identical as the embodiment of embodiment one,
Difference is：The installation groove 26 is provided at the lower part of mounting hole 29 and the lower surface positioned at heat insulation support plate, the heat
The top and bottom of amount conductive block 21 are sticked respectively in the heating surface of semiconductor chilling plate 20 and the top surface of radiating block 25, described
The chill surface of semiconductor chilling plate 20 is exposed in the upper surface of heat insulation support plate 23.It is set on the upper surface of the heat insulation support plate 23
Having the second thermal insulation board 240, the lower surface of heat insulation support plate is directly sticked in the top surface of radiating block, the second thermal insulation board 240 correspondence
Semiconductor chilling plate 20 is equipped with the second relief hole 281, and the chill surface of the semiconductor chilling plate 20 exposes the second relief hole 281.
The heat conductive block 21 is equipped with the first screw hole 211, and the installation groove inner bottom wall corresponds to the first screw hole 211 and sets
There are the second bolt relief hole 234, the outer end of the 234 T-shaped shape of the second bolt relief hole, the first bolt relief hole to extend
To the top surface of heat insulation support plate 23, the inner end of the second bolt relief hole 234 is connected to the first screw hole 211, the first bolt 254 by
On pass through the second bolt relief hole 234 and be threadedly coupled with the first screw hole 211 down so that heat conductive block is fixed on peace
It fills in groove.
When the semiconductor cooling device installation of the present embodiment, the chill surface of semiconductor chilling plate 20 is directly to be led with refrigerator
Cold box is in direct contact, and heat conductive block 2 is used to transfer heat to radiating block for the heating surface of semiconductor chilling plate 20.
Claims (10)
1. a kind of semiconductor cooling device, including heat insulation support plate, semiconductor chilling plate and radiating block, the heat insulation support plate
Set on the top surface of radiating block, the mounting hole of the upper and lower surface of perforation heat insulation support plate is provided on the heat insulation support plate,
The semiconductor chilling plate is set in mounting hole, and the top and bottom of the semiconductor chilling plate are respectively chill surface and fever
Face, it is characterised in that：The heating surface of the semiconductor chilling plate and top surface of radiating block is in direct contact or mediate contact, the peace
It fills hole and is equipped with installation groove, the installation groove is connected to mounting hole, and heat conductive block, and institute are equipped in the installation groove
It states heat conductive block to be sticked on the chill surface of semiconductor chilling plate or heating surface, the lateral wall of the heat conductive block and installation
The first heat insulation loop is equipped between groove madial wall.
2. semiconductor cooling device according to claim 1, it is characterised in that：The installation groove is located at the upper of mounting hole
The bottom surface in portion, the heat conductive block is sticked in the chill surface of semiconductor chilling plate, and the top surface of the heat conductive block is in exposed
Shape.
3. semiconductor cooling device according to claim 2, it is characterised in that：The top surface of the radiating block and heat insulation support
The first thermal insulation board is equipped between plate, first thermal insulation board corresponds to semiconductor chilling plate and is equipped with the first relief hole, the semiconductor
The heating surface of cooling piece is exposed relief hole and is bonded with the top surface of radiating block.
4. semiconductor cooling device according to claim 3, it is characterised in that：Further include the first bolt, the heat passes
Guide block is equipped with the first screw hole, and the installation groove inner bottom wall corresponds to the first screw hole and is equipped with bolt relief hole, bolt relief hole with
First screw hole is connected to, and the first bolt passes through bolt relief hole and is threadedly coupled with the first screw hole.
5. semiconductor cooling device according to claim 4, it is characterised in that：The heat insulation support plate is equipped with multiple the
One through-hole corresponds to first through hole on first thermal insulation board and is equipped with multiple second through-holes, corresponding second through-hole on the radiating block
Equipped with multiple second screw holes, the second screw bolt passes first through hole, the second through-hole are simultaneously threadedly coupled with the second screw hole.
6. semiconductor cooling device according to claim 1, it is characterised in that：The installation groove is located under mounting hole
The top and bottom in portion, the heat conductive block are sticked respectively in the heating surface of semiconductor chilling plate and the top surface of radiating block,
The chill surface of the semiconductor chilling plate is exposed in the upper surface of heat insulation support plate.
7. semiconductor cooling device according to claim 6, it is characterised in that：It is set on the upper surface of the heat insulation support plate
There are the second thermal insulation board, the second thermal insulation board to correspond to semiconductor chilling plate and be equipped with the second relief hole, the refrigeration of the semiconductor chilling plate
Show out the second relief hole.
8. the semiconductor cooling device according to claim 2 or 6, it is characterised in that：The shape of the semiconductor chilling plate,
Size and the shape of mounting hole, size match, and the shape of the heat conductive block and the shape of installation groove match.
9. the semiconductor cooling device according to claim 2 or 6, it is characterised in that：It is first heat insulation loop, first heat-insulated
Plate and the second thermal insulation board are made of heat-insulated silica gel.
10. the semiconductor cooling device according to claim 2 or 6, it is characterised in that：The refrigeration of the semiconductor chilling plate
Face is equipped with heat-conducting silicone grease oil reservoir with heating surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820247040.XU CN207849866U (en) | 2018-02-11 | 2018-02-11 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820247040.XU CN207849866U (en) | 2018-02-11 | 2018-02-11 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207849866U true CN207849866U (en) | 2018-09-11 |
Family
ID=63409524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820247040.XU Active CN207849866U (en) | 2018-02-11 | 2018-02-11 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207849866U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110999683A (en) * | 2019-12-26 | 2020-04-14 | 重庆大学 | Environment forming device suitable for biological cultivation of extraterrestrial space |
| CN111084027A (en) * | 2019-12-26 | 2020-05-01 | 重庆大学 | Housing assembly for a biological growth system for an off-ground space |
| CN113629029A (en) * | 2021-10-11 | 2021-11-09 | 江苏煜晶光电科技有限公司 | Semiconductor device and method for producing semiconductor device |
| CN114501935A (en) * | 2022-01-13 | 2022-05-13 | 深圳市迈科龙生物技术有限公司 | Temperature control device and dry-type fluorescence immunoassay appearance incubator |
-
2018
- 2018-02-11 CN CN201820247040.XU patent/CN207849866U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110999683A (en) * | 2019-12-26 | 2020-04-14 | 重庆大学 | Environment forming device suitable for biological cultivation of extraterrestrial space |
| CN111084027A (en) * | 2019-12-26 | 2020-05-01 | 重庆大学 | Housing assembly for a biological growth system for an off-ground space |
| CN110999683B (en) * | 2019-12-26 | 2022-10-04 | 重庆大学 | Environment forming device suitable for biological culture of extraterrestrial space |
| CN113629029A (en) * | 2021-10-11 | 2021-11-09 | 江苏煜晶光电科技有限公司 | Semiconductor device and method for producing semiconductor device |
| CN114501935A (en) * | 2022-01-13 | 2022-05-13 | 深圳市迈科龙生物技术有限公司 | Temperature control device and dry-type fluorescence immunoassay appearance incubator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207849866U (en) | A kind of semiconductor cooling device | |
| CN205649576U (en) | Constant temperature cold compress heat sink | |
| CN207956590U (en) | A kind of take-away dedicated constant temperature cabinet | |
| CN203478683U (en) | Semiconductor cooler | |
| CN208751104U (en) | A kind of water-cooling semiconductor refrigeration air duct refrigerates rice bin | |
| CN206412867U (en) | A kind of compulsive-cooling motor casing | |
| CN105466152A (en) | Zip-top can quick-cooling device based on semiconductor refrigeration | |
| CN202382514U (en) | Minitype refrigeration cup | |
| CN206933903U (en) | A kind of portable refrigeration heats thermos cup | |
| CN208478518U (en) | Battery suspension cooling circulation mechanism | |
| CN207702762U (en) | A kind of Two-way Cycle semiconductor refrigerating water circulation system | |
| CN203709731U (en) | Refrigerating and heating cup | |
| CN207935992U (en) | A kind of heat radiation lampshade | |
| CN205425614U (en) | Fast cold charge of easy open can is put based on semiconductor refrigeration | |
| CN210220096U (en) | Portable bladeless air feeder based on semiconductor refrigeration | |
| CN214065426U (en) | Medicine direct-cooling refrigeration cup | |
| CN209747557U (en) | Semiconductor device and temperature control device | |
| CN210425377U (en) | Portable contact temperature adjusting device | |
| CN209047967U (en) | A kind of cooking machine to freeze | |
| CN203280179U (en) | Heat preservation cup sleeve capable of refrigerating and heating | |
| CN207922644U (en) | A kind of small-sized ice maker based on semiconductor chilling plate | |
| CN2773573Y (en) | Semi conductor refrigerator | |
| CN205980428U (en) | Portable snacks box based on peltier effect | |
| CN216897900U (en) | Portable metal block refrigerator | |
| CN210980530U (en) | Novel cold and hot dual-purpose case |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |