CN205425614U - Fast cold charge of easy open can is put based on semiconductor refrigeration - Google Patents
Fast cold charge of easy open can is put based on semiconductor refrigeration Download PDFInfo
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- CN205425614U CN205425614U CN201521087454.3U CN201521087454U CN205425614U CN 205425614 U CN205425614 U CN 205425614U CN 201521087454 U CN201521087454 U CN 201521087454U CN 205425614 U CN205425614 U CN 205425614U
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Abstract
The utility model discloses a fast cold charge of easy open can is put based on semiconductor refrigeration, its imitative type aluminium cover outer wall is hollow cylinder, the upper portion opening, the lower part is sealed, and hollow partial shape is unanimous with the easy open can appearance, and the easy open can is put in hollow, with imitative type aluminium cover bottom, it is cotton that imitative type aluminium cover periphery is equipped with the one deck protection, the protection cotton is cylindrical hollow jacket layer, and the cotton material of protection is adiabatic cotton, it hugs closely to lead cold piece imitative type aluminium cover bottom, the cold junction of semiconductor refrigeration piece is hugged closely lead cold piece lower surface, the hot junction is hugged closely heat conduction piece upper surface, just the refrigeration piece with lead and cool the piece on every side all with the adiabatic cotton insulation cover parcel of making, the heat conduction piece is connected with heat abstractor. Compare with traditional refrigerator or refrigerator -freezer, the utility model discloses the device have low cost, simple structure, refrigeration rapidly, nos vibratoty noise, convenient to use, compact structure etc. The advantage, owing to not using the refrigerant, thus pollution -free to the environment, accord with green's theory.
Description
Technical field
This utility model relates to a kind of pop can quick cooler based on semiconductor refrigerating technology, especially relates to how to utilize heat pipe or fin is efficient, the method for quick heat radiating.
Background technology
Development and the raising of people's living standard along with society, increasing commodity occur in our daily life, pop can volume is little, easy to carry, and because it is its production process low energy consumption, pollution-free, meet the requirement of energy-conserving and environment-protective and enjoy people to favor, occupy an leading position in the field such as medicated beer, beverage packaging, such as Tsingtao beer, Harbin Beer, Wang Laoji, add everybody the commodity that what's frequently heard can be repeated in detail such as treasured, coca cola and have the unique pop can packaging of their own.
People are increasing to the demand of pop can, simultaneously for can drinking with it is also proposed a lot of requirement.For sales volume, the pop can sales volume in summer is far above other seasons.Summer temp is high, and people are often through having a drink or medicated beer quenches one's thirst, and cooling reaches nice and cool effect.In order to keep the beverage in pop can bring people " ice is felt well " in scorching summer, conventional way is to place it in refrigerator or refrigerator-freezer carries out cold preservation, the most directly take out and drink, but like this need refrigerator or refrigerator-freezer to be constantly in duty, for a long time from the point of view of can bring no small spending.Normal domestic use refrigerator or refrigerator-freezer, not only volume is heavy, take up room big, electric motor starting is frequent, noise is big, energy consumption is high, price is currently also on the price of thousands of units, not being everyone rising of can undertaking, and use cold-producing medium is working medium more, and environmental disruption and greenhouse effect are also had facilitation.
Utility model content
The purpose of this utility model be for prior art exist problem, it is provided that a kind of with low cost, simple in construction, refrigeration noise rapid, shockproof, the pop can quick cooler of semiconductor refrigerating easy to use.
Semiconductor refrigerating technology, because being increasingly taken seriously without cold-producing medium, shockproof, noiselessness, simple in construction, the most extensively applies to the fields such as water dispenser.The principle of semiconductor refrigerating is Peltier principle, when the thermocouple centering that one block of N-type semiconductor material and one block of P-type semiconductor material are coupled to has electric current to pass through, will produce heat transfer between two ends, heat will be transferred to the other end, thus produce the temperature difference and form cold and hot end from one end.Its advantage is compact conformation, environmentally safe.When cooling piece works, one end face releases heat, another end face absorbs heat, both ends of the surface can reach the biggest temperature difference in a short period of time, also just because of must have good radiating condition when this semiconductor chilling plate works, otherwise cancel out each other with cold end heat in hot junction, greatly deteriorates refrigeration.
Heat pipe and fin are all good heat conducting elements, and heat pipe is typically made up of shell, wick and end cap, and inside is to be pumped into negative pressure state, being filled with suitable liquid, this boiling point of liquid is low, readily volatilized, utilize sweat cooling so that heat pipe two ends temperature difference is very big, makes heat quickly conduct.The features such as heat pipe, because of simple in construction, has the highest heat conductivity, excellent isothermal and be widely used.Fin is to need to carry out the sheet metal that the heat-exchanger rig surface of heat transfer is stronger by increasing heat conductivity, can increase the heat exchange surface area of heat-exchanger rig thus enhanced heat exchange effect, and the shape according to practical situation fin is of all kinds.
In order to achieve the above object, this utility model adopts the following technical scheme that
A kind of pop can quick cooler based on semiconductor refrigerating, is mainly made up of pop can, imitative type aluminum set, cool guiding block, semiconductor chilling plate, heat-conducting block, insulation material and heat abstractor；Described imitative type aluminum set outer wall be hollow cylinder, upper opening, bottom close, hollow parts shape is consistent with pop can profile, pop can be placed on hollow in, with imitative type aluminum overlap bottom；Imitative type aluminum overlaps periphery and is provided with one layer of protection cotton, and described protection cotton is cylinder type hollow jacket layer, and the material of protection cotton is adiabatic cotton；Described cool guiding block is close to bottom described imitative type aluminum set；The cold end of described semiconductor chilling plate is close to described cool guiding block lower surface, and described heat-conducting block upper surface is close in hot junction, and the muff parcel all made of adiabatic cotton around described cooling piece and described cool guiding block；Described heat-conducting block is connected with heat abstractor.
For realizing this utility model purpose further, it is preferable that described heat abstractor includes fin fan；Fin is connected with heat-conducting block, and the lower end of fin is provided with fan；The cross section of described fin is square, and is provided with rectangle aluminium flake on square aluminium flake, and aluminium flake is embarked on journey and is disposed on square aluminium flake in column.
Preferably, a height of 20mm of described aluminium flake, often row, each column have 16 aluminium flakes, and aluminium flake uses soldering to be fixed on square aluminium sheet；Distance between described aluminium flake is 5mm.
Preferably, described heat abstractor includes heat pipe and cylindric aluminium alloy radiating fin sheet；Heat pipe is provided with a plurality of, and the middle part of heat pipe is heat pipe evaporator section, and a plurality of heat pipe evaporator section is embedded on heat-conducting block, arranges straight up after curved 90 ° of a plurality of heat pipe condenser section heat pipe, is fixed on straight up in cylindric aluminium alloy radiating fin sheet；Fin in cylindric aluminium alloy radiating fin sheet is evenly arranged.
Preferably, described a plurality of heat pipe evaporator section is embedded on heat-conducting block by the method for soldering or fastening；Heat pipe condenser section is circular tube shaped, is 4 sections of heat pipe condenser sections, the respectively first heat pipe condenser section, the second heat pipe condenser section, the 3rd heat pipe condenser section and the 4th heat pipe condenser section；The circular hole of multiple rows of vertical spacing distribution is circumferentially set in cylindric aluminium alloy radiating fin sheet；Heat pipe is the aqueous medium slug type copper heat pipe of diameter 6mm.
Preferably, described heat pipe evaporator section is flat.
Preferably, described heat abstractor includes heat pipe, aerofoil fan, cylindric aluminium alloy radiating fin sheet, gripper shoe and base；Support plate upper surface is connected with heat-conducting block, and lower surface is all connected by screwed hole screw with aerofoil fan；Multiple aperture is had in the middle part of gripper shoe；Gripper shoe is embedded on base, and base exterior is a cylinder, and lower end, bottom is provided with four feet, and the bottom even of base has multiple aperture.
Preferably, described gripper shoe aluminium alloy makes.
Preferably, described pop can quick cooler also includes wall of cup and bowl cover；Wall of cup and bowl cover are that hollow cylindrical structure, wall of cup and bowl cover are consistent with people's external diameter of base, and wall of cup places protection cotton, muff, cylindric aluminium alloy radiating fin sheet be connected wall of cup with base in；Wall of cup top has evenly spaced louvre, and bowl cover has with cylinder wall of cup threadeds.
Preferably, the material of wall of cup and bowl cover is temperature resistant plastic, metal or alloy.
Compared with prior art, this utility model has the advantages that
1) this utility model utilizes the fin or heat pipe that semiconductor chilling plate freezes and heat dispersion is good, by reasonable disposition, layout each several part assembly, reaches quickly to cool down the effect of pop can beverage.
2) this utility model is mainly made up of parts such as pop can, imitative type aluminum set, cool guiding block, semiconductor chilling plate, insulation material, heat-conducting block and heat abstractors.Aluminum set and cool guiding block all play transmission cooling piece cold end cold out to carry out Natural Heat Convection by heat pipe or fins conduct to the effect of pop can, cooling piece hot junction heat, or carries out forced convertion heat radiation with fan.
3) compared with conventional refrigerator or refrigerator-freezer, this utility model have with low cost, simple in construction, refrigeration noise rapid, shockproof, easy to use, compact conformation etc. advantage, owing to not using cold-producing medium, so environmentally safe, meet the theory of environmental protection.
Accompanying drawing explanation
Fig. 1 is the overall assembling schematic appearance of the pop can quick cooler of embodiment 1 semiconductor refrigerating.
Fig. 2 is the overall assembling schematic appearance of the pop can quick cooler of embodiment 2 semiconductor refrigerating.
Fig. 3 is the overall assembling schematic appearance of the pop can quick cooler of embodiment 3 semiconductor refrigerating.
Fig. 4 is the exploded perspective view of the pop can quick cooler of embodiment 1 semiconductor refrigerating.
Fig. 5 is the exploded perspective view of the pop can quick cooler of embodiment 2 semiconductor refrigerating.
Fig. 6 is the exploded perspective view of the pop can quick cooler internal structure of embodiment 3 semiconductor refrigerating.
Fig. 7 is embodiment 1 fin structure schematic diagram.
Fig. 8 is embodiment 2,3 cylindric radiating fin sheet, heat pipe, heat-conducting block schematic top plan view.
Fig. 9 is embodiment 2,3 heat pipe, heat-conducting block structural representation.
Figure 10 is embodiment 3 understructure schematic diagram.
Figure 11 is embodiment 3 heat pipe, heat-conducting block, gripper shoe, fan, base assembling schematic diagram.
Figure 12 is embodiment 3 heat-conducting block, gripper shoe, fan assembling schematic diagram.
Figure 13 is embodiment 3 supporting plate structure schematic diagram.
Figure 14 is embodiment 1,2,3 aluminum nested structure schematic diagram.
Shown in figure: pop can 1, imitative type aluminum set 2, protection cotton 3, cool guiding block 4, semiconductor chilling plate 5, muff 6, heat-conducting block 7, fin 8-1, heat pipe 8-2, fan 9-1, cylinder 1111 shape aluminium alloy radiating fin sheet 9-2, gripper shoe 10, base 11, wall of cup 12, bowl cover 13.
Detailed description of the invention
For being more fully understood that this utility model, below in conjunction with drawings and Examples, this utility model is further described, but embodiment of the present utility model is not limited to this.
Embodiment 1
As Figure 1 and Figure 4, the pop can quick cooler of a kind of semiconductor refrigerating, mainly it is made up of pop can 1, imitative type aluminum set 2, protection cotton 3, cool guiding block 4, semiconductor chilling plate 5, muff 6, heat-conducting block 7, fin 8-1 and fan 9-1；Described imitative type aluminum set 2 be hollow cylindrical structure, upper opening, and bottom is closed, and hollow parts shape is consistent with pop can profile, pop can be placed on hollow in, pop can and imitative type aluminum overlap bottom periphery fit；As shown in figure 14, the bottom preferably imitating type aluminum set 2 is tapered frustum cone structure, so can be in close contact bottom pop can, reduce thermal contact resistance.The periphery of described imitative type aluminum set 2 is provided with one layer and protects cotton, and described protection cotton 3 is cylinder type hollow jacket layer, and the material of protection cotton is adiabatic cotton, prevents cold to be lost to the external world.Described cooling piece 5 fits tightly with the contact surface of described cool guiding block 4 and heat-conducting block 7, and smears with heat-conducting glue with uniform heat conduction.Specifically, cool guiding block 4 is close to the bottom of described imitative type aluminum set 2；The cold end of described semiconductor chilling plate 5 is close to described cool guiding block 4 lower surface, described heat-conducting block 7 upper surface is close in the hot junction of semiconductor chilling plate 5, and the muff 6 all made of adiabatic cotton around described semiconductor chilling plate 5 and described cool guiding block 4 wraps up, cold is prevented to scatter and disappear.
Semiconductor chilling plate is the most common general semiconductor cooling piece, semiconductor chilling plate such as TEC1-12706 type commonly used on water dispenser, running voltage is generally 12V, Energy Efficiency Ratio is about 0.6, and the size such as refrigerating capacity to be changed can realize by changing model such as TEC1-12704 or TEC1-12705 of cooling piece.
Heat-conducting block 7 is connected with heat abstractor.Heat abstractor includes fin 8-1 and fan 9-1；Fin 8-1 is connected with heat-conducting block 7, and the lower end of fin 8-1 is provided with fan 9-1.As it is shown in fig. 7, the cross section of described fin plate 8-1 is square, being to be provided with rectangle aluminium flake on square aluminium flake, aluminium flake is embarked on journey and is disposed on square aluminium flake in column；The most often row, each column have 16 aluminium flakes, a height of 20mm of aluminium flake, and aluminium flake uses soldering to be fixed on square aluminium sheet.Distance between described aluminium flake is preferably 5mm, and the appropriate design of spacing of fin is conducive to strengthening from flow heat dissipation.
Cooling piece 5 hot junction has heat to come out endlessly, heat is transmitted to the fin 8-1 back side by heat-conducting block 7, the area ratio cooling piece of fin is big, so hot junction heat first can be uniformly transferred to whole plane, play the purpose of samming, then be transmitted to flight tip, the fan 9-1 that flight tip has, fan running drives surrounding flow, is distributed in time by the heat of flight tip, thus realizes the normal work of package unit.
Work process: when people need to drink ice-cold easy open can beverage, they have only to a pop can 1 and put in imitative type aluminum set 2, after semiconductor chilling plate 5 is switched on power, semiconductor chilling plate 5 two ends can form the bigger temperature difference in a short period of time, the most cold and hot two ends need timely conduction cooling, heat radiation, to ensure that cooling piece normally works.The cold of the cold end of semiconductor chilling plate 5 can pass to rapidly the imitative type aluminum set 2 fitted tightly with it by cool guiding block 4, aluminum set 2 is again by conductive force direct bottom bottom and pop can 1, and the Effect of Nature Convection of inwall and pop can 1 outer wall carries out Cooling capacity exchanging.Due to aluminum set 2 outer protected cotton 3, so heat will not be lost to the external world.
Embodiment 2
As shown in Fig. 2, Fig. 5; the pop can quick cooler of a kind of semiconductor refrigerating, is mainly made up of pop can 1, imitative type aluminum set 2, protection cotton 3, cool guiding block 4, semiconductor chilling plate 5, muff 6, heat-conducting block 7, heat pipe 8-2 and cylindric aluminium alloy radiating fin sheet 9-2.Described imitative type aluminum set 2 be hollow cylindrical structure, upper opening, and bottom is closed, and hollow parts shape is consistent with pop can profile, pop can be placed on hollow in, pop can and imitative type aluminum overlap bottom periphery fit；As shown in figure 14, preferably imitate type aluminum set 2 bottom in reducing frustum cone structure, so can with pop can bottom be in close contact, reduce thermal contact resistance.The periphery of described imitative type aluminum set 2 is provided with one layer and protects cotton, and described protection cotton 3 is cylinder type hollow jacket layer, and the material of protection cotton is adiabatic cotton, prevents cold to be lost to the external world.Described cooling piece 5 fits tightly with the contact surface of described cool guiding block 4 and heat-conducting block 7, and smears with heat-conducting glue with uniform heat conduction.Specifically, cool guiding block 4 is close to the bottom of described imitative type aluminum set 2；The cold end of described semiconductor chilling plate 5 is close to described cool guiding block 4 lower surface, described heat-conducting block 7 upper surface is close in the hot junction of semiconductor chilling plate 5, and the muff 6 all made of adiabatic cotton around described semiconductor chilling plate 5 and described cool guiding block 4 wraps up, cold is prevented to scatter and disappear.
Semiconductor chilling plate is the most common general semiconductor cooling piece, semiconductor chilling plate such as TEC1-12706 type commonly used on water dispenser, running voltage is generally 12V, Energy Efficiency Ratio is about 0.6, and the size such as refrigerating capacity to be changed can realize by changing model such as TEC1-12704 or TEC1-12705 of cooling piece.
As shown in Figure 8, Figure 9, heat-conducting block 7 is connected with heat abstractor.Heat abstractor includes heat pipe 8-2 and cylindric aluminium alloy radiating fin sheet 9-2；Heat pipe 8-2 is provided with a plurality of, and the middle part of heat pipe 8-2 is heat pipe evaporator section, and a plurality of heat pipe evaporator section is embedded on heat-conducting block 7, is fixed with heat-conducting block 7 by the method for soldering or fastening；Arrange straight up after curved 90 ° of a plurality of heat pipe condenser section heat pipe, be fixed on straight up in cylindric aluminium alloy radiating fin sheet 9-2, preferably closely welded by soldering；Heat pipe condenser section is circular tube shaped, preferably 4 sections heat pipe condenser sections, the respectively first heat pipe condenser section 8-2-1, the second heat pipe condenser section 8-2-2, the 3rd heat pipe condenser section 8-2-3 and the 4th heat pipe condenser section 8-2-4；Fin in cylindric aluminium alloy radiating fin sheet 9-2 is evenly arranged；The circular hole of multiple rows of vertical spacing distribution, appropriate design rational deployment circular hole are circumferentially set in cylindric aluminium alloy radiating fin sheet 9-2, are conducive to reducing consumptive material, but strengthen heat transfer free convection while reducing area of dissipation, increase heat dissipation capacity.Heat pipe 8-2 is the aqueous medium slug type copper heat pipe of diameter 6mm；Preferably heat pipe evaporator section is flat.
Cooling piece 5 hot junction has heat to come out endlessly, heat is transmitted to heat pipe 8-2 evaporator section, due to action of thermal difference, heat is delivered to condensation segment by heat pipe again, condensation segment heat pipe is embedded in cylindric aluminium alloy radiating fin sheet 9-2, heat pipe 8-2 contacts well with aluminium alloy radiating fin sheet 9-2, and heat can carry out free convection by aluminium alloy radiating fin 9-2 with air and distribute in atmosphere, thus realizes the normal work of package unit.
Work process: when people need to drink ice-cold easy open can beverage, they have only to a pop can 1 and put in imitative type aluminum set 2, after semiconductor chilling plate 5 is switched on power, cooling piece 5 two ends can form the bigger temperature difference in a short period of time, and the most cold and hot two ends need timely conduction cooling, heat radiation to ensure that cooling piece normally works.The imitative type aluminum set 2 that the cold of the cold end of cooling piece 5 can pass to rapidly to fit tightly with it by cool guiding block 4, aluminum set 2 is again by direct conductive force bottom bottom and pop can 1, and the Effect of Nature Convection of inwall and pop can 1 outer wall carries out Cooling capacity exchanging.Due to aluminum set 2 outer protected cotton 3, so heat will not be lost to the external world.
Embodiment 3
As shown in Fig. 3, Fig. 6; the pop can quick cooler of a kind of semiconductor refrigerating, is mainly made up of pop can 1, imitative type aluminum set 2, protection cotton 3, cool guiding block 4, semiconductor chilling plate 5, muff 6, heat-conducting block 7, heat pipe 8-2, aerofoil fan 9-1, cylindric aluminium alloy radiating fin sheet 9-2, gripper shoe 10, base 11, wall of cup 12 and bowl cover 13.Described imitative type aluminum set 2 be hollow cylindrical structure, upper opening, and bottom is closed, and hollow parts shape is consistent with pop can profile, pop can be placed on hollow in, pop can and imitative type aluminum overlap bottom periphery fit；As shown in figure 14, the bottom preferably imitating type aluminum set 2 is tapered frustum cone structure, so can be in close contact bottom pop can, reduce thermal contact resistance.The periphery of described imitative type aluminum set 2 is provided with one layer and protects cotton, and described protection cotton 3 is cylinder type hollow jacket layer, and the material of protection cotton is adiabatic cotton, prevents cold to be lost to the external world.Described cooling piece 5 fits tightly with the contact surface of described cool guiding block 4 and heat-conducting block 7, and smears with heat-conducting glue with uniform heat conduction.Specifically, cool guiding block 4 is close to the bottom of described imitative type aluminum set 2；The cold end of described semiconductor chilling plate 5 is close to described cool guiding block 4 lower surface, described heat-conducting block 7 upper surface is close in the hot junction of semiconductor chilling plate 5, and the muff 6 all made of adiabatic cotton around described semiconductor chilling plate 5 and described cool guiding block 4 wraps up, cold is prevented to scatter and disappear.
Semiconductor chilling plate is the most common general semiconductor cooling piece, semiconductor chilling plate such as TEC1-12706 type commonly used on water dispenser, running voltage is generally 12V, Energy Efficiency Ratio is about 0.6, and the size such as refrigerating capacity to be changed can realize by changing model such as TEC1-12704 or TEC1-12705 of cooling piece.
As shown in Fig. 3, Figure 11, Figure 12, Figure 13, heat-conducting block 7 is connected with heat abstractor.Heat abstractor includes heat pipe 8-2, fan 9-1, cylindric aluminium alloy radiating fin sheet 9-2, gripper shoe 10 and base 11；Gripper shoe 10 upper surface is connected with heat-conducting block 7, and lower surface is all connected by screwed hole screw with fan 9-1；Having multiple aperture in the middle part of gripper shoe 10, the gripper shoe 10 having multiple aperture contacts with heat-conducting block 7, makes the enough heat convections of wind energy of aerofoil fan 9-1；Gripper shoe 10 is embedding on the pedestal 11, and as shown in Figure 10, base exterior is a cylinder to base 11 structure, lower end, bottom is provided with four feet, can make the placement that device can consolidate, the bottom even of base 11 has multiple aperture, enables fan " hot blast " to be blown out from bottom.
Gripper shoe 10 preferably makes of aluminium alloy, and the mode that gripper shoe 10 is connected with heat-conducting block 7 and fan is conveniently dismantled, cleans and changed.The effect of gripper shoe 10 is to support and fixing heat-conducting block 7 and above section thereof.
Attractive in appearance in order to realize facilitating of device, can pack at device, make device more like the cup of an exquisiteness attractive in appearance so that it is to have more use value.The pop can quick cooler of a kind of semiconductor refrigerating also includes wall of cup 12 and bowl cover 13.Wall of cup 12 and bowl cover 13 are hollow cylindrical structure; wall of cup 12 is consistent with people's external diameter of base 11 with bowl cover 13; wall of cup 12 places protection cotton 3, muff 6, cylindric aluminium alloy radiating fin sheet 9-2 etc. be connected wall of cup 12 with base 11 in; wall of cup 12 top has evenly spaced louvre; bowl cover 13 has with cylinder wall of cup 12 threadeds; can open easily, tighten.The material of wall of cup 12 and bowl cover 13 can be temperature resistant plastic, metal or alloy.
Semiconductor chilling plate hot junction has heat to come out endlessly, heat is transmitted to heat pipe 8-2 evaporator section, due to action of thermal difference, heat is delivered to condensation segment by heat pipe again, condensation segment heat pipe is embedded in cylindric aluminium alloy radiating fin sheet 9-2, and heat pipe 8-2 contacts well with aluminium alloy heat transmission fin plate 9-2.The present embodiment, unlike examples detailed above 2, is on the one hand dispelled the heat by top heat pipe 8-2 and radiating fin sheet 9-2, on the other hand utilizes the swabbing action of aerofoil fan 9-1 to be distributed from bottom by heat.
Work process: when people need to drink ice-cold easy open can beverage, they have only to a pop can 1 and put in imitative type aluminum set 2, after semiconductor chilling plate 5 is switched on power, cooling piece 5 two ends can form the bigger temperature difference in a short period of time, and the most cold and hot two ends need timely conduction cooling, heat radiation to ensure that cooling piece 5 normally works.The imitative type aluminum set 2 that the cold of the cold end of cooling piece 5 can pass to rapidly to fit tightly with it by cool guiding block 4, aluminum set 2 is again by direct conductive force bottom bottom and pop can 1, and the Effect of Nature Convection of inwall and pop can 1 outer wall carries out Cooling capacity exchanging.Due to aluminum set outer protected cotton 3, so heat will not be lost to the external world.
For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.All spirit and principle within any amendment, equivalent and the improvement etc. made, within this utility model scope of the claims all should be contained in.
Claims (10)
1. pop can quick cooler based on semiconductor refrigerating, it is characterised in that be mainly made up of pop can, imitative type aluminum set, cool guiding block, semiconductor chilling plate, heat-conducting block, insulation material and heat abstractor；Described imitative type aluminum set outer wall be hollow cylinder, upper opening, bottom close, hollow parts shape is consistent with pop can profile, pop can be placed on hollow in, with imitative type aluminum overlap bottom；Imitative type aluminum overlaps periphery and is provided with one layer of protection cotton, and described protection cotton is cylinder type hollow jacket layer, and the material of protection cotton is adiabatic cotton；Described cool guiding block is close to bottom described imitative type aluminum set；The cold end of described semiconductor chilling plate is close to described cool guiding block lower surface, and described heat-conducting block upper surface is close in hot junction, and the muff parcel all made of adiabatic cotton around described cooling piece and described cool guiding block；Described heat-conducting block is connected with heat abstractor.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 1, it is characterised in that: described heat abstractor includes fin fan；Fin is connected with heat-conducting block, and the lower end of fin is provided with fan；The cross section of described fin is square, and is provided with rectangle aluminium flake on square aluminium flake, and aluminium flake is embarked on journey and is disposed on square aluminium flake in column.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 2, it is characterised in that: a height of 20mm of described aluminium flake, often row, each column have 16 aluminium flakes, and aluminium flake uses soldering to be fixed on square aluminium sheet；Distance between described aluminium flake is 5mm.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 1, it is characterised in that: described heat abstractor includes heat pipe and cylindric aluminium alloy radiating fin sheet；Heat pipe is provided with a plurality of, and the middle part of heat pipe is heat pipe evaporator section, and a plurality of heat pipe evaporator section is embedded on heat-conducting block, arranges straight up after curved 90 ° of a plurality of heat pipe condenser section heat pipe, is fixed on straight up in cylindric aluminium alloy radiating fin sheet；Fin in cylindric aluminium alloy radiating fin sheet is evenly arranged.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 4, it is characterised in that: described a plurality of heat pipe evaporator section is embedded on heat-conducting block by the method for soldering or fastening；Heat pipe condenser section is circular tube shaped, is 4 sections of heat pipe condenser sections, the respectively first heat pipe condenser section, the second heat pipe condenser section, the 3rd heat pipe condenser section and the 4th heat pipe condenser section；The circular hole of multiple rows of vertical spacing distribution is circumferentially set in cylindric aluminium alloy radiating fin sheet；Heat pipe is the aqueous medium slug type copper heat pipe of diameter 6mm.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 4, it is characterised in that: described heat pipe evaporator section is flat.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 1, it is characterised in that: described heat abstractor includes heat pipe, aerofoil fan, cylindric aluminium alloy radiating fin sheet, gripper shoe and base；Support plate upper surface is connected with heat-conducting block, and lower surface is all connected by screwed hole screw with aerofoil fan；Multiple aperture is had in the middle part of gripper shoe；Gripper shoe is embedded on base, and base exterior is a cylinder, and lower end, bottom is provided with four feet, and the bottom even of base has multiple aperture.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 1, it is characterised in that: described gripper shoe aluminium alloy makes.
9. according to a kind of based on semiconductor refrigerating the pop can quick cooler described in claim 7 or 8, it is characterised in that: described pop can quick cooler also includes wall of cup and bowl cover；Wall of cup and bowl cover are that hollow cylindrical structure, wall of cup and bowl cover are consistent with people's external diameter of base, and wall of cup places protection cotton, muff, cylindric aluminium alloy radiating fin sheet be connected wall of cup with base in；Wall of cup top has evenly spaced louvre, and bowl cover has with cylinder wall of cup threadeds.
A kind of pop can quick cooler based on semiconductor refrigerating the most according to claim 9, it is characterised in that: the material of wall of cup and bowl cover is temperature resistant plastic, metal or alloy.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521087454.3U CN205425614U (en) | 2015-12-22 | 2015-12-22 | Fast cold charge of easy open can is put based on semiconductor refrigeration |
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| CN201521087454.3U CN205425614U (en) | 2015-12-22 | 2015-12-22 | Fast cold charge of easy open can is put based on semiconductor refrigeration |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105466152A (en) * | 2015-12-22 | 2016-04-06 | 华南理工大学 | Zip-top can quick-cooling device based on semiconductor refrigeration |
| CN106524566A (en) * | 2016-12-26 | 2017-03-22 | 上海工程技术大学 | Device for conducting refrigeration through semiconductors |
-
2015
- 2015-12-22 CN CN201521087454.3U patent/CN205425614U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105466152A (en) * | 2015-12-22 | 2016-04-06 | 华南理工大学 | Zip-top can quick-cooling device based on semiconductor refrigeration |
| CN105466152B (en) * | 2015-12-22 | 2021-05-14 | 华南理工大学 | Semiconductor refrigeration-based pop can rapid cooling device |
| CN106524566A (en) * | 2016-12-26 | 2017-03-22 | 上海工程技术大学 | Device for conducting refrigeration through semiconductors |
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