CN114501935A - Temperature control device and dry-type fluorescence immunoassay analyzer incubator - Google Patents

Abstract

The invention discloses a temperature control device and a dry-type fluorescence immunoassay incubator. The temperature control device includes a mounting plate, a semiconductor refrigeration sheet, a heat conduction component and an incubation splint, and the mounting plate is formed with an up-and-down through hole for letting go The semiconductor refrigeration sheet is arranged on the upper end of the mounting plate, and the hot end of the semiconductor refrigeration sheet is exposed in the escape hole; the heat conduction assembly includes a heat conduction plate and a heat transfer plate, and the lower part of the heat conduction plate is The end face is abutted against the cold end of the semiconductor refrigerating sheet, the heat transfer plate is arranged on the lower end of the mounting plate, the upper end face of the heat transfer plate is formed with a heat transfer part, and the heat transfer part is adapted to protrude into the The escape hole is in contact with the hot end of the semiconductor refrigeration sheet; the incubation splint is arranged on the upper end of the heat conduction plate, and the incubation splint is used for placing the reagent card. The temperature control is performed by the semiconductor refrigeration sheet, which solves the problem of poor temperature control accuracy of the temperature control device in the existing dry-type fluorescence immunoassay analyzer.

Description

Temperature control device and dry-type fluorescence immunoassay analyzer incubator

technical field

The invention relates to the technical field of dry-type fluorescent immunoassay analyzers, in particular to a temperature control device and a dry-type fluorescent immunoassay analyzer incubator.

Background technique

The reagent card of the dry-type fluorescence immunoassay analyzer has high requirements on the ambient temperature and must be kept within a certain temperature range to ensure the accuracy and repeatability of the measurement results. At present, the temperature adjustment of the incubator of the dry-type fluorescence immunoassay analyzer generally adopts the fan to directly drive heat dissipation. The heat dissipation is not well controlled, the temperature control accuracy is not high, and the temperature of the incubator fluctuates greatly, resulting in the dry-type fluorescence immunoassay analyzer. It is difficult for the reagent card to reach the required temperature in the incubator.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a temperature control device and a dry-type fluorescence immunoassay analyzer incubator, aiming at solving the problem of poor temperature control accuracy of the temperature control device in the existing dry-type fluorescence immunoassay analyzer.

In order to achieve the above object, the present invention provides a temperature control device for a dry-type fluorescence immunoassay incubator, the temperature control device includes:

an installation plate, the installation plate is formed with an upper and lower pass-through hole;

a semiconductor refrigeration chip, which is arranged on the upper end of the mounting plate, and the hot end of the semiconductor refrigeration chip is exposed in the escape hole;

A heat-conducting assembly includes a heat-conducting plate and a heat-transfer plate, the lower end surface of the heat-conducting plate is in contact with the cold end of the semiconductor refrigeration sheet, the heat-transfer plate is arranged at the lower end of the mounting plate, and the upper end of the heat-transfer plate A heat transfer portion is formed on the end surface, and the heat transfer portion is adapted to extend into the escape hole to abut the hot end of the semiconductor refrigeration chip; and,

The incubation splint is arranged on the upper end of the heat conduction plate, and the incubation splint is used for placing the reagent card.

Optionally, an accommodating groove is formed upward on the lower end face of the mounting plate, and the upper wall surface of the accommodating groove is in conduction with the escape hole;

The heat transfer plate is fitted into the accommodating groove, so that the lower end surface of the heat transfer plate is flush with the lower surface of the mounting plate.

Optionally, the temperature control device further includes a heat dissipation device, the heat dissipation device includes a heat dissipation member, and the heat dissipation member has a plurality of heat dissipation fins arranged at intervals along the left and right directions and a plurality of upper ends of the heat dissipation fins are connected. A connecting plate, the upper end face of the connecting plate at least partially abuts the lower end face of the heat transfer plate.

Optionally, a cooling air duct extending in the front-rear direction is formed between two adjacent heat-dissipating fins;

The heat dissipation device further includes a heat dissipation fan and an air choke, the heat dissipation fan is arranged at the rear end of the plurality of the heat dissipation fins to draw air to the plurality of the heat dissipation air ducts, and the air choke has a structure connected to a plurality of the heat dissipation air ducts. The air choke plate on the lower end surface of the heat dissipation fin, the rear side of the air choke plate is flush with the rear side of the heat dissipation fin, and the front end of the air choke plate correspondingly extends below the heat transfer plate.

Optionally, the temperature control device further includes a heat insulating plate, the heat insulating plate is arranged between the mounting plate and the heat conducting plate, the heat insulating plate is formed with a placement hole that penetrates up and down, and the placement hole is formed. holes for placement of the cryocooler; and/or,

The temperature control device further includes a heat shield, and an installation cavity is formed through the heat shield to the front end surface. An escape hole, the second escape hole is used for accommodating the heat conducting plate.

Optionally, thermally conductive silica gel is attached between the thermally conductive plate and the semiconductor refrigeration sheet; and/or,

A thermally conductive silica gel is attached between the heat transfer plate and the semiconductor refrigeration sheet.

Optionally, the material of the thermally conductive plate is an aluminum alloy; and/or,

The material of the heat transfer plate is an aluminum alloy material.

Optionally, the incubation splint is provided with a plurality of incubation chambers with openings forward, for placing a plurality of reagent cards.

Optionally, a partition block is formed between two adjacent incubation cavities, and a mounting hole is formed in each partition block upward to the upper surface of the incubation splint;

The temperature control device also includes a temperature control assembly, and the temperature control assembly includes:

a control circuit board, the control circuit board is arranged on the upper end surface of the mounting board, and the control circuit board is electrically connected to the semiconductor refrigeration chip; and,

A plurality of temperature sensors, respectively disposed in the plurality of the mounting holes, and electrically connected to the control circuit board.

The present invention also provides a dry-type fluorescence immunoassay incubator, comprising the above temperature control device, the temperature control device comprising:

an installation plate, the installation plate is formed with an upper and lower pass-through hole;

a semiconductor refrigeration chip, which is arranged on the upper end of the mounting plate, and the hot end of the semiconductor refrigeration chip is exposed in the escape hole;

A heat-conducting assembly includes a heat-conducting plate and a heat-transfer plate, the lower end surface of the heat-conducting plate is in contact with the cold end of the semiconductor refrigeration sheet, the heat-transfer plate is arranged at the lower end of the mounting plate, and the upper end of the heat-transfer plate A heat transfer portion is formed on the end surface, and the heat transfer portion is adapted to extend into the escape hole to abut the hot end of the semiconductor refrigeration chip; and,

The incubation splint is arranged on the upper end of the heat conduction plate, and the incubation splint is used for placing the reagent card.

In the technical solution provided by the present invention, the temperature difference between the cold end and the hot end of the semiconductor refrigeration plate can be controlled by controlling the magnitude of the current flowing through the semiconductor refrigeration plate, thereby achieving the purpose of accurately controlling the temperature in the incubation splint, Then, through the arrangement of the heat-conducting plate and the heat-transfer plate, the semiconductor refrigeration sheet can reach a heat dissipation state that meets the expected temperature of the incubation splint. The lower end surface of the mounting plate is abutted with the hot end of the semiconductor refrigeration sheet through the escape hole through the heat transfer part, so that the incubation splint, the heat conduction assembly and the semiconductor refrigeration sheet are carried At the same time, the heat dissipation effect of the semiconductor refrigeration sheet is not affected.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

FIG. 1 is a schematic three-dimensional structural diagram of an embodiment of a dry-type fluorescence immunoassay analyzer incubator provided by the present invention;

FIG. 2 is a schematic diagram of the exploded structure of the incubator of the dry-type fluorescence immunoassay analyzer in FIG. 1;

FIG. 3 is a schematic three-dimensional structure diagram of the mounting plate (another direction) in FIG. 1;

FIG. 4 is a schematic three-dimensional structure diagram of the heat transfer plate in FIG. 1 .

Description of reference numbers:

label name label name 100 temperature control device 5 heat sink 1 mounting plate 51 heat sink 11 give way hole 511 cooling fins 12 accommodating slot 512 connection board 2 Semiconductor refrigeration chip 52 cooling fan 3 Thermal components 53 wind choke 31 Thermal plate 531 wind choke 32 heat transfer plate 6 heat shield 321 heat transfer section 7 heat shield 4 Incubation splint 8 temperature control components 41 Incubation chamber 81 control circuit board 42 divider block 82 Temperature Sensor 421 Mounting holes 9 reagent card

The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that, if there is a directional indication involved in the embodiment of the present invention, the directional indication is only used to explain the relative positional relationship, motion, etc. between the components under a certain posture. If the specific posture changes , the directional indication changes accordingly.

In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for the purpose of description, and should not be construed as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.

The reagent card of the dry-type fluorescence immunoassay analyzer has high requirements on the ambient temperature and must be kept within a certain temperature range to ensure the accuracy and repeatability of the measurement results. At present, the temperature adjustment of the incubator of the dry-type fluorescence immunoassay analyzer generally adopts the fan to directly drive heat dissipation. The heat dissipation is not well controlled, the temperature control accuracy is not high, and the temperature of the incubator fluctuates greatly, resulting in the dry-type fluorescence immunoassay analyzer. It is difficult for the reagent card to reach the required temperature in the incubator.

In view of this, the present invention proposes a temperature control device, which aims to solve the problem of poor temperature control accuracy of the temperature control device in the incubator of the existing dry-type fluorescence immunoassay analyzer. 1 to 4 are schematic structural diagrams of an embodiment of the temperature control device provided by the present invention.

Please refer to FIG. 1 , FIG. 2 and FIG. 4 , the temperature control device 100 includes a mounting plate 1 , a semiconductor refrigeration sheet 2 , a heat conduction assembly 3 and an incubation splint 4 , and the mounting plate 1 is formed with an escape hole 11 penetrating up and down. ; The semiconductor refrigeration sheet 2 is arranged on the upper end of the mounting plate 1, and the hot end of the semiconductor refrigeration sheet 2 is exposed in the escape hole 11; , the lower end surface of the heat transfer plate 31 is in contact with the cold end of the semiconductor refrigeration sheet 2, the heat transfer plate 32 is arranged on the lower end of the mounting plate 1, and the upper end surface of the heat transfer plate 32 is formed with a heat transfer plate The heat transfer part 321 is adapted to extend into the escape hole 11 to abut the hot end of the semiconductor refrigeration sheet 2; the incubation splint 4 is arranged on the upper end of the heat conduction plate 31, the The incubation splint 4 is used to place the reagent card 9 .

In the technical solution provided by the present invention, the temperature difference between the cold end and the hot end of the semiconductor refrigeration plate 2 can be controlled by controlling the magnitude of the current flowing through the semiconductor refrigeration plate 2, so as to accurately control the temperature inside the incubation splint 4 Then, through the setting of the heat transfer plate 31 and the heat transfer plate 32, the semiconductor refrigeration sheet 2 can reach the heat dissipation state that meets the expected temperature of the incubation splint 4 more quickly. The heat transfer plate 32 is disposed on the lower end surface of the mounting plate 1, and the heat transfer portion 321 passes through the escape hole 11 to abut with the hot end of the semiconductor refrigeration chip 2, so that the incubation splint 4 , The heat-conducting component 3 and the semiconductor refrigeration sheet 2 are carried, and at the same time, the heat dissipation effect of the semiconductor refrigeration sheet 2 is not affected.

It can be understood that the area of the heat conduction plate 31 and the heat transfer plate 32 are both larger than the area of the semiconductor refrigeration sheet 2 , so that the effect of accelerating heat conduction can be achieved.

It should be noted that the semiconductor refrigeration sheet 2 is a tool for heat transfer. When a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form a galvanic pair, after the DC current is connected in this circuit, energy transfer can be generated, and the current flows from the N-type element to the P-type element. The joint absorbs heat, It becomes the cold end; the joint that flows from the P-type element to the N-type element releases heat and becomes the hot end. The heat between the plates also undergoes reverse heat transfer through the air and the semiconductor material itself. When the hot and cold ends reach a certain temperature difference, when the two kinds of heat transfer are equal, an equilibrium point will be reached, and the positive and negative heat transfer will cancel each other out. At this time, the temperature of the hot and cold ends will not continue to change; the magnitude of heat absorption and heat release is determined by the magnitude of the current and the number of elements of the semiconductor material N and P.

Further, please refer to FIG. 3 , an accommodating groove 12 is formed on the lower end face of the mounting plate 1 upward, and the upper wall surface of the accommodating groove 12 is in conduction with the escape hole 11 ; the heat transfer plate 32 is suitable for Fitted into the accommodating groove 12 , so that the lower end surface of the heat transfer plate 32 is flush with the lower surface of the mounting plate 1 . In this way, the heat transfer plate 32 is built in the lower end of the mounting plate 1 , and the overall thickness of the temperature control device 100 is reduced without affecting the heat dissipation efficiency of the heat transfer plate 32 .

In order to accelerate the heat dissipation effect of the heat transfer plate 32, so that the semiconductor refrigeration sheet 2 can reach a heat dissipation state that meets the expected temperature of the incubation splint 4 more quickly, please refer to FIG. 2, in this embodiment, the temperature control The device 100 further includes a heat dissipation device 5, the heat dissipation device 5 includes a heat dissipation member 51, and the heat dissipation member 51 has a plurality of heat dissipation fins 511 spaced along the left and right directions and a connection connecting the upper ends of the plurality of heat dissipation fins 511 The plate 512, the upper end surface of the connecting plate 512 at least partially abuts the lower end surface of the heat transfer plate 32, and is arranged in this way. The contact area with the air improves the natural heat dissipation efficiency of the heat transfer plate 32 .

In order to further improve the heat dissipation efficiency of the heat transfer plate 32, a forced cooling device can be used to dissipate heat, and the forced cooling device includes an air cooling device and a water cooling device. , please refer to FIG. 2, in this embodiment, a cooling air duct extending in the front and rear direction is formed between the two adjacent cooling fins 511; the cooling device 5 also includes a cooling fan 52 and a wind choke 53 , the cooling fan 52 is arranged at the rear end of the plurality of cooling fins 511 to draw air to the plurality of cooling air ducts. The rear side of the wind choke plate 531 is flush with the rear side of the heat dissipation fins 511 , and the front end of the wind choke plate 531 correspondingly extends below the heat transfer plate. Through the arrangement of the wind blocking plate 531, the air drawn by the cooling fan 52 can pass through the cooling air duct completely, and the heat in the cooling air duct can be taken away by the outside air to the greatest extent. The front end of the air choke plate 531 extends below the heat transfer plate correspondingly, so that the area of the heat dissipation fins 511 corresponding to the heat transfer plate 32 is not closed by the air choke cover 53, so that it can dissipate heat naturally, and at the same time , so that the air can enter from the front end and the lower end of the heat dissipation channel, and pass through the area of the heat dissipation fins 511 corresponding to the heat transfer plate 32, which increases the air intake and improves the heat dissipation efficiency. While dissipating heat, the temperature difference between the cold end and the hot end can be effectively increased, thereby increasing the cooling range of the semiconductor refrigeration sheet 2 .

In order to reduce the influence of the external environment on the operation of the semiconductor refrigeration sheet 2, please refer to FIG. 2. In this embodiment, the temperature control device 100 further includes a heat insulating plate 6, and the heat insulating plate 6 is arranged on the Between the mounting plate 1 and the heat-conducting plate, the heat-insulating plate 6 is formed with a placement hole that penetrates up and down. The placement hole is used to place the semiconductor refrigeration sheet 2, and the heat-insulating plate 6 is arranged to cover the The side walls of the semiconductor refrigerating sheet 2 not only block the external environment, but also play a certain supporting role, which can effectively prevent the semiconductor refrigerating sheet 2 from being crushed.

In order to prevent the external environment from affecting the constant temperature incubation of the incubation splint 4, please refer to FIG. 2, the temperature control device 100 further includes a heat shield 7, and the heat shield 7 penetrates to the front end surface to form an installation cavity, so The installation cavity is used to fit and install the incubation splint 4, and the lower end face of the heat shield 7 is provided with a second hole for accommodating the heat-conducting plate 31. The setting of the heat shield 7 can prevent the semiconductor refrigeration sheet 2 from needing to maintain a large current input to maintain the temperature in the incubation splint 4 due to the large difference between the temperature in the incubation splint 4 and the external ambient temperature. Happening.

It should be noted that, the above-mentioned two parallel technical features "the temperature control device 100 further includes a heat insulating plate 6, and the heat insulating plate 6 is arranged between the mounting plate 1 and the heat conducting plate. The hot plate 6 is formed with a mounting hole that penetrates up and down, and the mounting hole is used to place the semiconductor cooling chip 2" and "the heat shield 7 through to the front end surface to form a mounting cavity, and the mounting cavity is used for fitting The incubation splint 4 is installed, and the lower end face of the heat shield 7 is provided with a second hole for accommodating the heat-conducting plate 31 ″. Obviously, the effect of setting both is better.

In order to enhance the heat absorption efficiency of the cold end of the semiconductor refrigeration sheet 2, in this embodiment, thermally conductive silica gel is attached between the thermally conductive plate 31 and the semiconductor refrigeration sheet 2. The thermally conductive silica gel has good thermal conductivity and flexibility. , the two ends of the thermally conductive silica gel can be closely attached to the semiconductor refrigeration sheet 2 and the thermally conductive plate 31 to ensure the thermal conductivity efficiency, and at the same time, to a certain extent, it can prevent the pressing force of the thermally conductive plate 31 from being too large. And crush the semiconductor refrigeration sheet 2 .

In order to enhance the heat dissipation efficiency of the hot end of the semiconductor refrigeration sheet 2, in this embodiment, thermally conductive silica gel is attached between the heat transfer plate 32 and the semiconductor refrigeration sheet 2. The thermal conductive silica gel has good thermal conductivity and flexibility. , the two ends of the thermally conductive silica gel can be closely attached to the semiconductor refrigeration sheet 2 and the heat transfer plate 32, which ensures the thermal conductivity and prevents the pressing force of the heat transfer plate 32 to a certain extent. If it is too large, the semiconductor refrigeration chip 2 will be crushed.

It should be noted that the above two parallel technical features “a thermally conductive silica gel is attached between the heat transfer plate 31 and the semiconductor refrigeration sheet 2” and “between the heat transfer plate 32 and the semiconductor refrigeration sheet 2” Paste with thermal silica gel" can choose one setting, or set it at the same time, obviously, the effect of setting at the same time is better.

In order to enhance the heat absorption efficiency of the cold end of the semiconductor refrigerating sheet 2, in this embodiment, the material of the heat-conducting plate 31 is aluminum alloy, which has good thermal conductivity and is more economical than copper. Affordable;

In order to enhance the heat dissipation efficiency of the hot end of the semiconductor refrigerating sheet 2, in this embodiment, the material of the heat transfer plate 32 is aluminum alloy, which has good thermal conductivity and is more economical than copper. Affordable.

It should be noted that, the above two parallel technical features "the material of the heat transfer plate 31 is an aluminum alloy material" and "the material of the heat transfer plate 32 is an aluminum alloy material" can be selected or set at the same time. Obviously, the effect of setting at the same time is better, which can improve the heat absorption effect of the cold end and the heat dissipation effect of the hot end of the semiconductor refrigeration sheet 2 at the same time, so that the semiconductor refrigeration sheet 2 can quickly reach the heat dissipation balance state of the expected temperature.

Referring to FIG. 2 , in this embodiment, the incubation splint 4 is provided with a plurality of incubation cavities 41 with openings facing forward, for placing a plurality of reagent cards 9 , so that a plurality of the reagent cards 9 can be incubated simultaneously, which improves Incubation efficiency.

Since the incubation splint 4 conducts temperature conduction through the heat conducting sheet, it can be understood that the temperature of the incubation cavity 41 farther from the semiconductor refrigeration sheet 2 is higher than the temperature of the incubation chamber 41 that is closer to the semiconductor refrigeration sheet 2 The temperature of the incubation chambers 41 may vary to some extent. Based on this, please refer to FIG. 2 . In this embodiment, a partition block 42 is formed between two adjacent incubation chambers 41 . A mounting hole 421 is formed upward through the upper end surface of the incubation splint 4; the temperature control device 100 further includes a temperature control assembly 8, and the temperature control assembly 8 includes a control circuit board 81 and a plurality of temperature sensors 82, the control The circuit board 81 is arranged on the upper end surface of the mounting board 1 , and the control circuit board 81 is electrically connected to the semiconductor refrigeration chip 2 ; a plurality of the temperature sensors 82 are respectively arranged in the plurality of the mounting holes 421 , And electrically connected to the control circuit board 81 . By arranging a plurality of the temperature sensors 82 in the installation holes 421 of each of the partition blocks 42, the temperature of the reagent card 9 in each of the incubation chambers 41 can be monitored in real time, and then the temperature of each of the incubation chambers 41 can be determined. Whether the temperature inside is within the expected temperature range, and then the current flowing through the semiconductor refrigeration chip 2 is regulated in real time through the control circuit board 81 to ensure that the incubation temperature of the reagent cards 9 in the same batch is up to standard, ensuring that all The accuracy and repeatability of the measurement results of the reagent card 9.

Since the control circuit board 81 also generates a large amount of heat during operation, if the control circuit board 81 is not dissipated, the control effect of the control circuit board 81 will be affected, and its feedback adjustment will be delayed. 2 , in this embodiment, the control circuit board 81 is arranged on the rear side of the semiconductor refrigeration chip 2 , and the mounting position corresponding to the control circuit board 81 on the mounting board 1 even has The third escape hole, a second heat transfer plate is arranged in the third escape hole, and the cooling air duct extends backward at least to the bottom of the second heat transfer plate. The heat dissipation device 5 completes the simultaneous heat dissipation of the control circuit board 81 and the semiconductor cooling chip 2 , which simplifies the structure of the temperature control device 100 and saves the manufacturing cost.

In addition, in order to achieve the above purpose, the present invention also provides a dry-type fluorescence immunoassay incubator, the dry-type fluorescence immunoassay incubator includes the temperature control device 100 described in the above technical solution, it should be noted that the For the detailed structure of the temperature control device 100 of the dry-type fluorescence immunoassay incubator, reference may be made to the above-mentioned embodiments of the temperature control device 100, which will not be repeated here; The above temperature control device 100, therefore, the embodiments of the dry-type fluorescence immunoassay incubator of the present invention include all the technical solutions of all the above embodiments of the temperature control device 100, and the technical effects achieved are also the same, which will not be repeated here. .

The above descriptions are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the conception of the present invention, any equivalent structural transformations made by the contents of the description and drawings of the present invention, or direct/indirect application Other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. a temperature control device for dry-type fluorescence immunoassay incubator, is characterized in that, described temperature control device comprises: an installation plate, the installation plate is formed with an upper and lower pass-through hole; a semiconductor refrigeration chip, which is arranged on the upper end of the mounting plate, and the hot end of the semiconductor refrigeration chip is exposed in the escape hole; A heat-conducting assembly includes a heat-conducting plate and a heat-transfer plate, the lower end surface of the heat-conducting plate is in contact with the cold end of the semiconductor refrigeration sheet, the heat-transfer plate is arranged at the lower end of the mounting plate, and the upper end of the heat-transfer plate A heat transfer portion is formed on the end face, and the heat transfer portion is adapted to extend into the escape hole to abut the hot end of the semiconductor refrigeration sheet; and, An incubation splint is arranged on the upper end of the heat conducting plate, and the incubation splint is used for placing the reagent card. 2 . The temperature control device according to claim 1 , wherein an accommodating groove is formed upward on the lower end surface of the mounting plate, and the upper wall surface of the accommodating groove is in conduction with the escape hole; 3 . The heat transfer plate is fitted into the accommodating groove, so that the lower end surface of the heat transfer plate is flush with the lower surface of the mounting plate. 3 . The temperature control device according to claim 1 , wherein the temperature control device further comprises a heat dissipation device, the heat dissipation device includes a heat dissipation member, and the heat dissipation member has a plurality of heat dissipation fins spaced along the left and right directions. 4 . A fin and a connecting plate connecting the upper ends of the plurality of heat dissipation fins, the upper end surface of the connecting plate at least partially abuts the lower end surface of the heat transfer plate. 4 . The temperature control device according to claim 3 , wherein a cooling air duct extending in the front-rear direction is formed between two adjacent heat-dissipating fins; 5 . The heat dissipation device further includes a heat dissipation fan and an air choke, the heat dissipation fan is arranged at the rear end of the plurality of heat dissipation fins to draw air to the plurality of the heat dissipation air ducts, and the air choke cover has a connection to a plurality of the heat dissipation air ducts. The air choke plate on the lower end surface of the heat dissipation fin, the rear side of the air choke plate is flush with the rear side of the heat dissipation fin, and the front end of the air choke plate correspondingly extends below the heat transfer plate. 5 . The temperature control device according to claim 1 , wherein the temperature control device further comprises a thermal insulation board, the thermal insulation board is arranged between the installation board and the heat conduction board, and the insulation board is 5 . The hot plate is formed with an upper and lower through placement hole, and the placement hole is used to place the semiconductor refrigeration chip; and/or, The temperature control device further includes a heat shield, and an installation cavity is formed through the heat shield to the front end surface. An escape hole, the second escape hole is used for accommodating the heat conducting plate. 6. The temperature control device according to claim 1, wherein a thermally conductive silica gel is attached between the thermally conductive plate and the semiconductor refrigeration sheet; and/or, A thermally conductive silica gel is attached between the heat transfer plate and the semiconductor refrigeration sheet. 7. The temperature control device according to claim 1, wherein the material of the heat conducting plate is an aluminum alloy; and/or, The material of the heat transfer plate is an aluminum alloy material. 8 . The temperature control device according to claim 1 , wherein a plurality of incubation chambers are provided in the incubation splint with forward openings for placing a plurality of reagent cards. 9 . 9 . The temperature control device according to claim 8 , wherein a partition block is formed between two adjacent incubation chambers, and each partition block penetrates upward to the end surface of the incubation splint to form a partition block. 10 . Mounting holes; The temperature control device also includes a temperature control assembly, and the temperature control assembly includes: a control circuit board, the control circuit board is arranged on the upper end surface of the mounting board, and the control circuit board is electrically connected to the semiconductor refrigeration chip; and, A plurality of temperature sensors, respectively disposed in the plurality of the mounting holes, and electrically connected to the control circuit board. 10 . A dry-type fluorescence immunoassay incubator, characterized in that it comprises the temperature control device according to any one of claims 1 to 9 .

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