CN2333975Y - Semiconductor wafer refrigerator - Google Patents
Semiconductor wafer refrigerator Download PDFInfo
- Publication number
- CN2333975Y CN2333975Y CN 98234279 CN98234279U CN2333975Y CN 2333975 Y CN2333975 Y CN 2333975Y CN 98234279 CN98234279 CN 98234279 CN 98234279 U CN98234279 U CN 98234279U CN 2333975 Y CN2333975 Y CN 2333975Y
- Authority
- CN
- China
- Prior art keywords
- cold
- chip
- water tank
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a semiconductor wafer refrigerator, relating to a refrigerant water fountain. The utility model is mainly composed of a semiconductor refrigerator, a wafer cold gathering device, a water tank, a radiator, etc., wherein, the wafer cold gathering device is composed of a disk-shaped cold gathering plate and sheet cold conducting pieces, the semiconductor refrigerator and a casing are connected into a whole by bolts, and the cold gathering plate of the cold gathering device is pressed in the groove of the water tank and is fixed. The utility model has the advantages of reasonable structure, convenient process, large cold conducting area, high cooling speed, and good refrigeration effect. Compared with the like water fountain, the energy can be saved by 20%, and the cost can be reduced by 5%; the utility model is an ideal drinking device.
Description
But the utility model relates to a kind of water fountain of refrigeration.
Existing mechanical compression-type refrigeration water fountain, generally all exist refrigeration not good enough, big and the defectives such as heaviness of volume, therefore there is the people to propose the scheme of semiconductor refrigerating, as the patent No. is 95205288, name is called the utility model patent of " a kind of conductor refrigeration water fountain ", the technical scheme of " cold junction of semiconductor cooler is close to the bar type cold collector, the hot junction held against heat sink " is proposed, yet, find that in use bar type cold collector conduction surface is little, casting material inside is not fine and close, and cooling effect is undesirable, is connected with screw between bar type cold collector and the radiator, thereby the formation heat bridge causes loss of refrigeration capacity.
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art part, and provides a kind of conduction cooling area big, the semiconductor-type refrigerator that cooling rate is fast.
The utility model is achieved by the following scheme: the chip cold collector is made up of poly-cold drawing of garden plate-like and sheet cool guide sheet, by screw semiconductor cooler and shell are connected as a single entity, and the poly-cold drawing of chip cold collector is pressed in the groove of water tank fixingly, be with silica gel heat-insulating and sealing circle at the outer garden end face of the poly-cold drawing of chip cold collector.
The utility model is rational in infrastructure, processes easyly, and the conduction cooling area is big, has improved cooling rate and cooling effect, compares with similar water fountain, and is energy-conservation 20%, reduces cost 5%, is a kind of desirable drinking device.
Below in conjunction with accompanying drawing to the further enumeration of the utility model:
Accompanying drawing is the utility model structure cutaway view.
See accompanying drawing, the utility model is by air exhauster 1, radiator 2, semiconductor cooler 3, heat-insulating and sealing circle 4, chip cold collector 5, water tank 6, thermal insulation layer 7, shell 8 is formed, the galvanic couple that semiconductor cooler 3 is made by P type and N-type semiconductor material is to being connected in series, its hot junction is attached on the radiator 2, cold junction is close to the chip cold collector 5 that the clad aluminum material is made, chip cold collector 5 is made up of poly-cold drawing 5-1 and cool guide sheet 5-2, the cool guide sheet 5-2 of sheet is standing on the poly-cold drawing 5-1 that is fixed on the garden plate-like, chip cold collector 5 places water tank 6, by screw semiconductor cooler 3 and shell 8 are connected as a single entity, and the poly-cold drawing 5-1 of chip cold collector 5 is pressed in the groove of water tank 6 fixing, air exhauster 1 is installed in the place ahead of radiator 2, between water tank 6 and shell 8, be filled with the thermal insulation layer 7 that heat-barrier material is formed, be with silica gel heat-insulating and sealing circle 4 at the outer garden end face of the poly-cold drawing 5-1 of chip cold collector 5.
When using the utility model, when semiconductor cooler 3 is connected direct current, to produce the heat absorption phenomenon at the end face of being close to chip cold collector 5, end face in held against heat sink 2 then produces exothermic phenomenon, the cold of semiconductor cooler 3 carries out heat exchange by chip cold collector 5 at the drinking water of water tank 6 reduces water temperature, the air exhauster 1 in the then logical radiator 2 of the heat of semiconductor cooler 3 and radiator 2 the place aheads is discharged into heat in the air, because chip cold collector 5 is hedged off from the outer world, cut off heat bridge fully, again owing to garden end face outside the poly-cold drawing 5-1 of chip cold collector 5 is with silica gel heat-insulating and sealing circle 4, make the heat absorption phenomenon of semiconductor cooler 3 obtain the performance of fullest, improved cooling rate and cooling effect.
Claims (1)
- Semiconductor chip refrigerator, comprise air exhauster (1), radiator (2), semiconductor cooler (3), heat-insulating and sealing circle (4), chip cold collector (5), water tank (6), thermal insulation layer (7), shell (8), the galvanic couple that semiconductor cooler (3) is made by P type and N-type semiconductor material is to being connected in series, its hot junction is close on the radiator (2), cold junction is close to chip cold collector (5), air exhauster (1) is installed in the place ahead of radiator (2), between water tank (6) and shell (8), be filled with the thermal insulation layer (7) that heat-barrier material is formed, chip cold collector (5) places water tank (6), it is characterized in that: chip cold collector (5) is made up of the poly-cold drawing (5-1) of garden plate-like and the cool guide sheet (5-2) of sheet, by screw semiconductor cooler (3) and shell (8) are connected as a single entity, and the poly-cold drawing (5-1) of chip cold collector (5) is pressed in the groove of water tank (6) fixingly, be with silica gel heat-insulating and sealing circle (4) at the outer garden end face of the poly-cold drawing (5-1) of chip cold collector (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98234279 CN2333975Y (en) | 1998-05-22 | 1998-05-22 | Semiconductor wafer refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98234279 CN2333975Y (en) | 1998-05-22 | 1998-05-22 | Semiconductor wafer refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2333975Y true CN2333975Y (en) | 1999-08-18 |
Family
ID=33982831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98234279 Expired - Fee Related CN2333975Y (en) | 1998-05-22 | 1998-05-22 | Semiconductor wafer refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2333975Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105841271A (en) * | 2016-03-31 | 2016-08-10 | 青岛海尔空调器有限总公司 | Solar semiconductor refrigerating device |
| CN106895602A (en) * | 2017-02-21 | 2017-06-27 | 山东大学 | A kind of semiconductor refrigerating auxiliary steam compression refrigerating system and method |
| CN107449217A (en) * | 2017-09-23 | 2017-12-08 | 广东富信科技股份有限公司 | Semiconductor cooling water system |
| CN107940799A (en) * | 2017-10-28 | 2018-04-20 | 东台市凯润精密机械股份有限公司 | A kind of high-effect radiating refrigerator |
| CN108736098A (en) * | 2018-05-03 | 2018-11-02 | 安徽新能科技有限公司 | A kind of bottom liquid cooling battery modules of high-energy density |
-
1998
- 1998-05-22 CN CN 98234279 patent/CN2333975Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105841271A (en) * | 2016-03-31 | 2016-08-10 | 青岛海尔空调器有限总公司 | Solar semiconductor refrigerating device |
| CN105841271B (en) * | 2016-03-31 | 2019-03-01 | 青岛海尔空调器有限总公司 | A kind of solar semiconductor refrigeration device |
| CN106895602A (en) * | 2017-02-21 | 2017-06-27 | 山东大学 | A kind of semiconductor refrigerating auxiliary steam compression refrigerating system and method |
| CN107449217A (en) * | 2017-09-23 | 2017-12-08 | 广东富信科技股份有限公司 | Semiconductor cooling water system |
| CN107940799A (en) * | 2017-10-28 | 2018-04-20 | 东台市凯润精密机械股份有限公司 | A kind of high-effect radiating refrigerator |
| CN108736098A (en) * | 2018-05-03 | 2018-11-02 | 安徽新能科技有限公司 | A kind of bottom liquid cooling battery modules of high-energy density |
| CN108736098B (en) * | 2018-05-03 | 2024-01-12 | 安徽新能科技有限公司 | Bottom liquid cooling battery module with high energy density |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |