CN2611779Y - Twin air cooling type semiconductor refrigerator - Google Patents
Twin air cooling type semiconductor refrigerator Download PDFInfo
- Publication number
- CN2611779Y CN2611779Y CNU032296541U CN03229654U CN2611779Y CN 2611779 Y CN2611779 Y CN 2611779Y CN U032296541 U CNU032296541 U CN U032296541U CN 03229654 U CN03229654 U CN 03229654U CN 2611779 Y CN2611779 Y CN 2611779Y
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- CN
- China
- Prior art keywords
- heat
- fan
- casing
- air
- heat absorbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a conjoined air-cooled semiconductor refrigerating installation, wherein an inner concave cavity communicated with the casing is arranged on the outer side of one of the walls of a foaming heat-proof casing, and a semiconductor refrigerating installation assembly constituted by a heat releasing side radiator and a heat absorbing side radiator which are welded on the two end surfaces of the semiconductor refrigerating installation and a fan assembly constituted by a heat releasing side fan and a heat absorbing side fan are fixed in a chamber type wind-guiding sleeve equipped with an air inlet and an air outlet, also the wind-guiding sleeve and the casing are fixed to seal the end surface of the inner concave cavity. The structure of the refrigerating installation is compact and convenient to install, and the wind direction of heat releasing side and the heat absorbing side self-circulates along the respective wind direction to achieve that only two air inlet and outlet are arranged in the casing without conductive metal between the casing and the outside, thereby achieving very low heat waste in the casing, low power consumption, and appreciable higher refrigerating efficiency than the traditional air-cooled semiconductor refrigerating installation.
Description
Technical field
The utility model relates to semiconductor cooling device.
Background technology
Traditional air-cooled semiconductor cooling device, as shown in Figure 1, it comprises foaming heat insulation casing 1, heat absorbing side fan 9 is arranged outside case in case, heat absorbing side radiator 4, cold 2-1 of transition, semiconductor cooler 2, heat release side radiator 3, heat release crosswind fan 8 is installed successively through a tank wall, wherein cold of transition and semiconductor cooler are arranged in the tank wall hole, heat absorbing side radiator and heat release side radiator utilize respectively installing rack be fixed on casing in, on the outer wall, and contact with semiconductor cooler through cold of thermal grease conduction coating and transition respectively, this air-cooled semiconductor cooling device parts are many, the assembly technology complexity, volume is big, because heat absorbing side radiator and heat release side radiator contact the transmission heat with cold of transition respectively by the thermal grease conduction coating with semiconductor cooler, so contact-making surface place's thermal losses is bigger, reduced pyroconductivity, and the temperature difference that heat absorbing end exists in outer release end of heat of case and the case, the very easy heat that conducts ambient temperature by heat is delivered in the refrigerating box, the temperature inside the box gos up fast, therefore traditional air-cooled semiconductor cooling device needs the frequent starting refrigeration, both power consumptions also influence service life.
Summary of the invention
The purpose of this utility model provides that a kind of simple in structure, power consumption consumptive material is economized, the good air-cooled semiconductor cooling device of disjunctor of refrigeration performance.
The air-cooled semiconductor cooling device of disjunctor of the present utility model comprises the foaming heat insulation casing, semiconductor cooler, the heat release side radiator, the heat absorbing side radiator, heat release crosswind fan and heat absorbing side fan, arranged outside concave cavity at foaming heat insulation casing one wall, there are fresh air inlet and exhaust vent to be connected between the inner chamber of concave cavity and casing, one has the box air guiding sleeve of air inlet and air outlet and the end face that casing is fixedly sealed concave cavity, heat release side radiator and heat absorbing side radiator are welded on the both ends of the surface of semiconductor cooler respectively and form the semiconductor cooler assembly, heat release crosswind fan and heat absorbing side fan are installed on the same driving shaft and constitute combination fan, semiconductor cooler assembly and combination fan are fixed with box air guiding sleeve respectively, wherein semiconductor cooler places the wall of air guiding sleeve, the heat absorbing side radiator is positioned at concave cavity, its end face is close to box body wall, the heat release side radiator is positioned at the case of box air guiding sleeve, the heat absorbing side fan is positioned at the fresh air inlet place of concave cavity, and heat release crosswind fan is positioned at the air inlet place of box wind-guiding casing.
After this device was connected power supply, semiconductor cooler, fan were started working.After the semiconductor cooler work, the heat absorbing side radiator begins refrigeration, and temperature descends, and according to the operation principle of semiconductor cooler, heat release side radiator temperature rises simultaneously, needs heat radiation in time.The wind direction of two fans is led circulation voluntarily along wind separately, and heat release crosswind fan constantly sucks air under the normal temperature from air inlet, blow to the heat release side radiator, blows out from air outlet, constantly takes away the heat that the heat release side radiator produces; The heat absorbing side fan constantly sucks the air in the case from fresh air inlet, blow to the heat absorbing side radiator, blows out from exhaust vent, gets back in the case, makes the air circulation process heat absorbing side radiator in the case, reduces air themperature in the case gradually, reaches the refrigeration instructions for use.
This utility model De You Dian:
1. because heat release side radiator, heat absorbing side radiator and semiconductor cooler directly weld, eliminated the assembling thermal resistance, can make more direct, the more effectively transmission of heat.And cancelled cold of transition, the heat overwhelming majority of heat absorbing side is applied in the refrigerating box, so its refrigerating efficiency is apparently higher than the air-cooled semiconductor cooler of tradition.
2. compact conformation is easy for installation, and the device that heat release side radiator, heat absorbing side can be loose, semiconductor cooler, air guiding sleeve, fan are assembled into individual components, combine with casing again, are suitable for producing in enormous quantities.
3. have only two inlet and outlets with external environment in the case, do not have the conductive metal body, so thermal loss is very little in the case with the external world, the temperature inside the box gos up slow, the time interval that starts refrigeration system so once more is long, both can reduce power consumption, also can increase the service life relatively.
Description of drawings
Fig. 1 is the schematic diagram of traditional air-cooled semiconductor cooling device;
Fig. 2 is the air-cooled semiconductor cooling device schematic diagram of disjunctor of the present utility model.
Fig. 3 is that the A of Fig. 2 is to view;
Fig. 4 is the refrigerating speed comparison diagram of the air-cooled semiconductor cooling device of disjunctor and traditional air-cooled semiconductor cooling device, and solid line is the refrigerating speed of the air-cooled semiconductor cooling device of disjunctor among the figure;
The power consumption comparison diagram of the air-cooled semiconductor cooling device of Fig. 5 disjunctor and traditional air-cooled semiconductor cooling device, solid line is the power consumption of the air-cooled semiconductor cooling device of disjunctor among the figure.
The specific embodiment
With reference to Fig. 2, the air-cooled semiconductor cooling device of disjunctor comprises foaming heat insulation casing 1, semiconductor cooler 2, heat release side radiator 3, heat absorbing side radiator 4, heat release crosswind fan 8 and heat absorbing side fan 9, the outside at foaming heat insulation casing one wall has concave cavity, have fresh air inlet 5 and exhaust vent 6 to be connected between the inner chamber of concave cavity and casing 1, box air guiding sleeve 7 with air inlet 10 and air outlet 11 and casing are fixedly sealed the end face of concave cavity.Heat release side radiator 3 and heat absorbing side radiator 4 are welded on the both ends of the surface of semiconductor cooler 2 and form the semiconductor cooler assembly, and heat release crosswind fan 8 and heat absorbing side fan 9 be by same motor-driven, are installed on the same driving shaft to constitute combination fan.Semiconductor cooler assembly and combination fan are fixing with glue and box air guiding sleeve 7 respectively, adopt glue both to fix semiconductor cooler assembly and combination fan, have also sealed air channel, cold and hot both sides simultaneously.Wherein semiconductor cooler 2 and motor place the wall of air guiding sleeve 7, glue sealing all around, heat absorbing side radiator 4 is positioned at concave cavity, its end face is close to box body wall, heat release side radiator 3 is positioned at the case of box air guiding sleeve 7, heat absorbing side fan 9 is positioned at fresh air inlet 5 places of concave cavity, and heat release crosswind fan 8 is positioned at air inlet 10 places of box air guiding sleeve 7 casees.
Claims (1)
1. the air-cooled semiconductor cooling device of disjunctor comprises foaming heat insulation casing (1), semiconductor cooler (2), heat release side radiator (3), heat absorbing side radiator (4), heat release crosswind fan (8) and heat absorbing side fan (9), it is characterized in that arranged outside concave cavity at foaming heat insulation casing one wall, there are fresh air inlet (5) and exhaust vent (6) to be connected between the inner chamber of concave cavity and casing (1), one has the box air guiding sleeve (7) of air inlet (10) and air outlet (11) and the end face that casing is fixedly sealed concave cavity, heat release side radiator (3) and heat absorbing side radiator (4) are welded on the both ends of the surface of semiconductor cooler (2) respectively and form the semiconductor cooler assembly, heat release crosswind fan (8) and heat absorbing side fan (9) are installed on the same driving shaft and constitute combination fan, semiconductor cooler assembly and combination fan are fixing with box air guiding sleeve (7) respectively, wherein semiconductor cooler (2) places the wall of air guiding sleeve (7), heat absorbing side radiator (4) is positioned at concave cavity, its end face is close to box body wall, heat release side radiator (3) is positioned at the case of box air guiding sleeve (7), heat absorbing side fan (9) is positioned at the fresh air inlet (5) of concave cavity to be located, and heat release crosswind fan (8) is positioned at the air inlet (10) of box air guiding sleeve (7) case and locates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032296541U CN2611779Y (en) | 2003-03-19 | 2003-03-19 | Twin air cooling type semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032296541U CN2611779Y (en) | 2003-03-19 | 2003-03-19 | Twin air cooling type semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2611779Y true CN2611779Y (en) | 2004-04-14 |
Family
ID=34164984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032296541U Expired - Fee Related CN2611779Y (en) | 2003-03-19 | 2003-03-19 | Twin air cooling type semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2611779Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105352075A (en) * | 2015-09-09 | 2016-02-24 | 南京中格科技发展有限公司 | Electronic air conditioner |
| CN106723773A (en) * | 2017-01-10 | 2017-05-31 | 陈思韵 | A kind of parasols based on semiconductor chilling plate |
| CN107883652A (en) * | 2017-10-13 | 2018-04-06 | 江苏捷帝机器人股份有限公司 | A kind of entirety for metalwork and local cooler bin |
| CN107975998A (en) * | 2017-10-13 | 2018-05-01 | 江苏捷帝机器人股份有限公司 | A kind of quick cooler bin for metal machinery part |
-
2003
- 2003-03-19 CN CNU032296541U patent/CN2611779Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105352075A (en) * | 2015-09-09 | 2016-02-24 | 南京中格科技发展有限公司 | Electronic air conditioner |
| CN106723773A (en) * | 2017-01-10 | 2017-05-31 | 陈思韵 | A kind of parasols based on semiconductor chilling plate |
| CN107883652A (en) * | 2017-10-13 | 2018-04-06 | 江苏捷帝机器人股份有限公司 | A kind of entirety for metalwork and local cooler bin |
| CN107975998A (en) * | 2017-10-13 | 2018-05-01 | 江苏捷帝机器人股份有限公司 | A kind of quick cooler bin for metal machinery part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |