CN219318672U - Refrigerating system and refrigerating equipment - Google Patents

Abstract

The application provides a refrigerating system and refrigeration equipment, refrigerating system includes refrigeration cycle circuit and semiconductor refrigerating device of circulation refrigerant, refrigeration cycle circuit is including the compressor, condenser, throttling arrangement, the evaporimeter that link to each other in proper order, the evaporimeter is configured to the cooling of first refrigeration compartment, semiconductor refrigerating device includes the semiconductor refrigeration chip, the semiconductor refrigeration chip has refrigeration end and radiating end, the radiating end is connected with heat dissipation module, heat dissipation module sets up in refrigeration cycle circuit, the refrigerant is in circulate in the heat dissipation module, the refrigerating end is configured to the cooling of second refrigeration compartment. The heat dissipation module of the semiconductor refrigeration device is arranged in the refrigeration cycle loop and takes away heat of the heat dissipation module by means of a refrigerant, so that the semiconductor refrigeration device continuously supplies cold for the second refrigeration compartment.

Description

Refrigerating system and refrigerating equipment

Technical Field

The application relates to the technical field of household appliances, in particular to a refrigerating system and refrigerating equipment.

Background

The traditional refrigeration equipment such as a refrigerator and the like usually adopts single-stage compression refrigeration, and the refrigeration temperature in a refrigerating chamber is generally between-18 ℃ and-20 ℃, but the low temperature below-40 ℃ cannot be realized. In order to cope with the user demand of ultra-low temperature storage in the high-end market, a two-stage compression system is generally adopted to realize low-temperature refrigeration. However, the refrigeration equipment of the two-stage compression system has the problems of huge volume, complex structure, high production cost, high noise and the like, and has low applicability and cannot be widely applied. Therefore, how to improve the applicability of the refrigeration equipment on the basis of realizing ultralow temperature storage is a technical problem to be solved urgently.

Disclosure of Invention

The application provides a refrigerating system and refrigerating equipment to solve the technical problem that refrigerating equipment can not consider ultralow temperature storage and high applicability.

To solve the above technical problem, the present application provides a refrigeration system, including:

a refrigeration cycle circuit through which a refrigerant flows, the refrigeration cycle circuit including a compressor, a condenser, a throttle device, and an evaporator that are sequentially connected, the evaporator configured to supply cold to the first refrigeration compartment;

the semiconductor refrigeration device comprises a semiconductor refrigeration chip, the semiconductor refrigeration chip is provided with a refrigeration end and a heat dissipation end, the heat dissipation end is in heat conduction connection with a heat dissipation module, the heat dissipation module is arranged in a refrigeration cycle loop, a refrigerant circulates in the heat dissipation module, and the refrigeration end is configured to supply cold to a second refrigeration compartment.

The heat dissipation module is located between the outlet of the throttling device and the inlet of the evaporator.

The refrigeration cycle loop comprises a plurality of branches connected in parallel, wherein the branches are positioned between an outlet of the condenser and an inlet of the compressor, any one branch is sequentially connected with a sub throttling device and a sub evaporator, and at least one branch is connected with the sub throttling device and the heat dissipation module between the sub throttling device and the sub evaporator.

Wherein the heat dissipation module is located between the outlet of the evaporator and the inlet of the compressor.

The refrigeration cycle loop comprises a plurality of branches connected in parallel, wherein the branches are positioned between an outlet of the condenser and an inlet of the compressor, any branch is sequentially connected with a sub-throttling device and a sub-evaporator, and at least one branch is connected with the heat dissipation module between the sub-evaporator and the compressor.

The semiconductor refrigeration device further comprises a cooling module, and the cooling module is connected with the refrigeration end.

The cooling module comprises a cooling device and a cooling fan, wherein the cooling device is connected with the refrigerating end, and the air inlet surface of the cooling fan faces the cooling device.

The refrigeration cycle loop further comprises a dry filter, wherein the dry filter is arranged between the condenser outlet and the throttling device inlet.

Wherein, the interior partial pipeline of evaporimeter passes the heat dissipation module.

Wherein the semiconductor refrigeration device comprises a temperature sensor.

The application also provides a refrigeration device provided with the refrigeration system, wherein the refrigeration device is provided with the first refrigeration compartment and the second refrigeration compartment.

Wherein the second refrigeration compartment is located within the first refrigeration compartment.

Compared with the prior art, the beneficial effects of the embodiment of the application are as follows: the application provides a refrigerating system and refrigeration equipment, refrigerating system includes refrigeration cycle circuit and semiconductor refrigerating device of circulation refrigerant, refrigeration cycle circuit is including compressor, condenser, throttling arrangement, the evaporimeter that links to each other in proper order, the evaporimeter is configured to the cooling of first refrigeration compartment, semiconductor refrigerating device includes the semiconductor refrigeration chip, the semiconductor refrigeration chip has refrigeration end and radiating end, the radiating end is connected with the heat dissipation module, the heat dissipation module sets up in refrigeration cycle circuit, the refrigerant is in circulate in the heat dissipation module, the refrigerating end is configured to the cooling of second refrigeration compartment. The heat dissipation module of the semiconductor refrigeration device is arranged in the refrigeration circulation loop, and the heat of the heat dissipation module is taken away by virtue of the refrigerant, so that the semiconductor refrigeration device continuously supplies cold for the second refrigeration compartment without arranging a two-stage compression system.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort to a person of ordinary skill in the art, in which:

FIG. 1 is a schematic diagram of a first embodiment of a refrigeration system provided herein;

FIG. 2 is a schematic diagram of a second embodiment of a refrigeration system provided herein;

fig. 3 is a schematic structural view of a first embodiment of a refrigeration apparatus provided herein;

FIG. 4 is a schematic diagram of a third embodiment of a refrigeration system provided herein;

FIG. 5 is a schematic diagram of a fourth embodiment of a refrigeration system provided herein;

fig. 6 is a schematic structural view of a second embodiment of a refrigeration apparatus provided herein;

FIG. 7 is a schematic diagram of a fifth embodiment of a refrigeration system provided herein;

fig. 8 is a schematic structural view of a sixth embodiment of a refrigeration system provided herein.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

According to the refrigerating system, the heat radiation module of the semiconductor refrigerating device is arranged in the refrigerating circulation loop, and the refrigerant in the refrigerating circulation loop is utilized to radiate heat for the semiconductor refrigerating device, so that the semiconductor chip can continuously provide refrigeration for the second refrigerating compartment, and the ultralow-temperature storage function of the refrigerating equipment is realized.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a refrigeration system provided in the present application. The refrigeration system 20 provided herein includes a refrigeration cycle 200 through which a refrigerant flows. The refrigeration cycle 200 includes a compressor 210, a condenser 220, a throttle device 230, and an evaporator 240, which are sequentially connected. The evaporator 240 is configured to cool the first refrigeration compartment 101 of the refrigeration appliance 10. The high-temperature and high-pressure gaseous refrigerant compressed by the compressor 210 is gradually transited to a normal-temperature and high-pressure gas-liquid two-phase refrigerant by reducing the heat of the gaseous refrigerant through an exothermic process because the temperature of the gaseous refrigerant is higher than the ambient temperature in the process of passing through the condenser 220. The condensed normal-temperature and high-pressure gas-liquid two-phase refrigerant is throttled and depressurized by the throttling device 230, meanwhile, a small amount of liquid refrigerant is changed into low-temperature and low-pressure wet steam refrigerant from the liquid refrigerant due to boiling heat absorption, then the wet steam refrigerant enters the evaporator 240, the outer surface of the evaporator 240 and the air in the first refrigeration compartment 101 are gradually cooled along with the continuous absorption of the heat in the liquid refrigerant in the wet steam refrigerant in the evaporator 240, then a small amount of gas appears at the front end of the evaporator 240, and then the continuous absorption of the heat in the liquid refrigerant is gradually converted into the normal-temperature and low-pressure gas refrigerant, and the refrigerant continuously absorbs heat from the environment in the tail end of the evaporator 240 and the air return pipe of the compressor 210 so as to be ready for the air absorption of the compressor 210, thereby completing the circulation process of the refrigerant in the refrigeration cycle circuit 200.

To achieve the ultra-low temperature storage requirement below the refrigeration temperature of the first refrigeration compartment 101, the refrigeration system 20 provided herein further includes a semiconductor refrigeration device 250. The semiconductor refrigeration device 250 includes a semiconductor refrigeration chip 251, and the semiconductor refrigeration chip 251 can continuously operate after being energized, and has no pollution source and rotating parts, and no turning effect. The refrigeration of the semiconductor refrigeration chip 251 is realized by utilizing the peltier effect of the semiconductor, namely when two different conductors are connected and are connected with a direct current power supply to form a loop, the phenomenon of heat absorption or heat release occurs at the junction of the two conductors, so that the temperature difference is formed at two ends to realize the refrigeration, and therefore, the temperature control with high precision can be realized through the control of input current, and the remote control, program control and computer control are easy to realize by adding a temperature detection and control means, so that an automatic control system is convenient to form.

The semiconductor refrigeration chip 251 has a refrigeration end 2511 and a heat dissipation end 2512, the heat dissipation end 2512 being thermally connected to the heat dissipation module 252. The heat dissipation module 252 is provided in the refrigeration cycle 200, and the refrigerant flows through the heat dissipation module 252. The refrigeration side 2511 is configured to cool the second refrigeration compartment 102. The temperature of the refrigerating end 2511 can be controlled by input current, so that the ultralow temperature refrigeration of the second refrigeration compartment 102 is realized. The heat dissipation module 252 absorbs heat of the heat dissipation end 2512, and when the low-temperature refrigerant flows through the heat dissipation module 252, the heat absorbed by the heat dissipation module 252 is taken away, so that the heat of the heat dissipation end 2512 is continuously dissipated, and the refrigerating end 2511 can continuously cool the second refrigerating compartment 102.

In order to ensure that the heat dissipation module 252 can dissipate heat in time, the semiconductor refrigeration device 250 is generally disposed in the refrigeration cycle 200 after the throttling device 230 and before the compressor 210. The refrigerant is throttled and depressurized by the throttling device 230 to be a low-temperature low-pressure wet vapor refrigerant, and the low-temperature low-pressure wet vapor refrigerant is converted into a normal-temperature low-pressure gaseous refrigerant after absorbing environmental heat by the evaporator 240. Therefore, the refrigerant flowing out of the throttling device 230 and before flowing into the compressor 210 is a gaseous refrigerant, the flow speed of the gaseous refrigerant is high, and when the gaseous refrigerant flows through the heat dissipation module 252, the heat of the heat dissipation module 252 can be rapidly taken away, and the refrigerant after heat absorption enters the compressor 210 for a new cycle.

To achieve a lower refrigeration temperature of the second refrigeration compartment 102, a second embodiment of the refrigeration system 20 is provided, as shown in fig. 2, which is a schematic diagram of a second embodiment of the refrigeration system provided herein. This embodiment disposes the heat rejection module 252 in the refrigeration cycle 200 between the outlet of the restriction 230 to the inlet of the evaporator 240. The low-temperature low-pressure wet vapor refrigerant throttled down by the throttle device 230 is the lowest temperature point in the refrigeration cycle 200. To achieve a lower cooling temperature of the second cooling compartment 102, a lower temperature of the cooling end 2511 is required, i.e. a larger temperature difference is required across the semiconductor cooling chip 251, the temperature of the cooling end 2512 increases, and the heat absorbed by the cooling module 252 increases. Therefore, the heat dissipation module 252 is disposed between the outlet of the throttling device 230 and the inlet of the evaporator 240, so that the lowest temperature refrigerant in the refrigeration cycle 200 can effectively and rapidly remove the heat of the heat dissipation module 252, and the heat accumulation at the heat dissipation end 2512 is avoided so as to maintain the temperature at the lower temperature refrigeration end 2511.

While adapting the refrigeration system 20 the present application provides a refrigeration appliance 10, as shown in fig. 3, which is a schematic diagram of a first embodiment of the refrigeration appliance provided herein. As shown in fig. 2 and 3, in this embodiment, the second refrigeration compartment 102 is disposed in the first refrigeration compartment 101, so that the refrigeration of the evaporator 240 can also act on the second refrigeration compartment 102 at the same time, and further, overlapping refrigeration is formed on the second refrigeration compartment 102, so that the power consumption of the semiconductor refrigeration device 250 is further reduced, and the refrigeration effect and the refrigeration efficiency of the second refrigeration compartment 102 are improved.

If the refrigerating capacity of the first refrigerating compartment 101 is synchronously stabilized on the basis of satisfying the ultralow temperature refrigeration of the second refrigerating compartment 102, the present application provides a third embodiment of the refrigerating system 20, and fig. 4 is a schematic structural diagram of the third embodiment of the refrigerating system provided in the present application. This embodiment disposes the heat rejection module 252 in the refrigeration cycle 200 between the outlet of the evaporator 240 to the inlet of the compressor 210. The low-temperature low-pressure wet vapor refrigerant is converted into normal-temperature low-pressure gaseous refrigerant after being absorbed by the evaporator 240, and the normal-temperature gaseous refrigerant is conveyed through the heat dissipation module 252 to take away the heat of the heat dissipation module 252 and then flows into the compressor 210 for compression. Since the heat dissipation module 252 is disposed at the outlet of the evaporator 240 without affecting the temperature of the refrigerant flowing into the inlet of the evaporator 240, the heat absorbed by the evaporator 240 in the first refrigerating compartment 101 is maintained stably, i.e., the refrigerating capacity of the evaporator 240 acting on the first refrigerating compartment 101 is maintained stably. Meanwhile, the heat dissipation module 252 of the semiconductor refrigeration device 250 can also dissipate heat through the refrigerant flowing out from the outlet of the evaporator 240, so as to maintain the ultralow temperature refrigeration of the second refrigeration compartment 102. In some embodiments, the refrigeration apparatus 10 may also be adapted to the refrigeration system 20 of the third embodiment, and the second refrigeration compartment 102 is disposed in the first refrigeration compartment 101, so as to form cascade refrigeration, enhance the refrigeration effect of the second refrigeration compartment 102, and improve the refrigeration efficiency of the second refrigeration compartment 102.

Some refrigeration units 10 require first refrigeration compartments 101 with different temperatures to meet the storage requirements of different items, so that a plurality of parallel branches 201 can be designed in the refrigeration cycle 200, the branches 201 being located between the outlet of the condenser 220 and the inlet of the compressor 210. A sub-throttling device 231 and sub-evaporators 241 are sequentially connected to any branch 201, and each sub-evaporator 241 corresponds to a first refrigeration compartment 101 for cooling. Since the throttling and depressurization efficiencies of the different sub-throttles 231 are different, the temperatures and states of the refrigerants flowing out of the different sub-throttles 231 are also different, and thus the refrigerating capacities of the respective sub-evaporators 241 are also different, thereby obtaining different temperatures of the first refrigerating compartments 101. Further, the restriction 230 may be selected from a capillary tube and/or an expansion valve, and may be selected based on different temperatures of the first refrigeration compartment 101.

As shown in fig. 5, a schematic diagram of a mechanism of a fourth embodiment of a refrigeration system provided in the present application is provided. In this embodiment, at least one branch 201 is connected to a sub-throttle 231, a heat dissipation module 252, and a sub-evaporator 241. The low-temperature low-pressure wet vapor refrigerant throttled and depressurized by the sub throttle 231 in the branch 201 is the lowest temperature point in the flowing refrigerant in the branch 201. To achieve a lower cooling temperature of the second cooling compartment 102, a lower temperature of the cooling end 2511 is required, i.e. a larger temperature difference is required across the semiconductor cooling chip 251, the temperature of the cooling end 2512 increases, and the heat absorbed by the cooling module 252 increases. Therefore, the heat dissipation module 252 is disposed between the outlet of the sub-throttling device 231 and the inlet of the sub-evaporator 241, and the lowest temperature refrigerant in the branch 201 can effectively and rapidly take away the heat of the heat dissipation module 252 so as to avoid heat accumulation at the heat dissipation end 2512, so as to maintain the temperature of the lower-temperature refrigeration end 2511 and realize the ultralow-temperature refrigeration of the second refrigeration compartment 102. If the second refrigeration compartments 102 are required to be disposed in each first refrigeration compartment 101 with different refrigeration temperatures to satisfy the ultralow temperature storage with different temperatures, the sub-throttling device 231, the heat dissipation module 252 and the sub-evaporator 241 are connected to each branch 201, so that the second refrigeration compartments 102 with different temperatures can be realized.

In order to improve the refrigerating effect and the refrigerating efficiency of the second refrigerating compartment 102, another embodiment of the refrigerating apparatus 10 is provided, as shown in fig. 6, which is a schematic structural diagram of the second embodiment of the refrigerating apparatus provided in the present application, and as shown in fig. 7, which is a schematic structural diagram of the fifth embodiment of the refrigerating system provided in the present application. In the embodiment shown in fig. 6 and 7, there are two first refrigerating compartments 101, and each first refrigerating compartment 101 has a sub-evaporator 241 therein. The second refrigeration compartment 102 is provided in one first refrigeration compartment 101, so that the refrigeration of the sub-evaporator 241 in the first refrigeration compartment 101 can also synchronously act on the second refrigeration compartment 102, and overlapping refrigeration is formed for the second refrigeration compartment 102, so that the power consumption of the semiconductor refrigeration device 250 is further reduced, and the refrigeration efficiency of the second refrigeration compartment 102 is improved. In some embodiments, the number of the first refrigerating compartments 101 and the number of the second refrigerating compartments 102 may be determined according to the actual needs of the refrigerating apparatus, and is not particularly limited.

As shown in fig. 8, a schematic structural diagram of a sixth embodiment of a refrigeration system provided in the present application is provided. In this embodiment, at least one branch 201 is connected to a sub-throttle 231, a sub-evaporator 241, and a heat dissipation module 252. The low-temperature low-pressure wet vapor refrigerant is converted into normal-temperature low-pressure gaseous refrigerant after being absorbed by the sub-evaporator 241 by the heat of the first refrigeration compartment 101, and the normal-temperature gaseous refrigerant is conveyed to the heat dissipation module 252 to take away the heat of the heat dissipation module 252 and then flows into the compressor 210 for compression. Since the heat dissipation module 252 is disposed at the outlet of the sub-evaporator 241 without affecting the temperature of the refrigerant flowing into the sub-evaporator 241, the cooling capacity of the sub-evaporator 241 acting on the first cooling compartment 101 is maintained stable. Meanwhile, the heat dissipation module 252 of the semiconductor refrigeration device 250 can also dissipate heat through the refrigerant flowing out from the outlet of the sub-evaporator 241, so as to maintain the ultralow temperature refrigeration of the second refrigeration compartment 102. In some embodiments, the refrigeration apparatus 10 may also be adapted to configure the refrigeration system 20 to provide the second refrigeration compartment 102 within the first refrigeration compartment 101 to form an overlapping refrigeration to enhance the refrigeration effect of the second refrigeration compartment 102. If the second refrigeration compartments 102 are required to meet different ultralow temperature storages in each first refrigeration compartment 101 with different refrigeration temperatures, the sub-throttle 231, the sub-evaporator 241 and the heat dissipation module 252 are connected to each branch 201, so that the second refrigeration compartments 102 with different temperatures can be realized.

In some embodiments of the present application, to improve the heat dissipation efficiency of the heat dissipation module 252, the heat dissipation module 252 is tightly attached to the heat dissipation end 2512 or attached to the heat dissipation end 2512 through a heat conducting medium, where the heat conducting medium may be a high thermal conductivity product such as a heat conducting silicone grease, a heat conducting glue, a heat conducting paste, etc.

In some embodiments, the semiconductor refrigeration device 250 may further include a heat conduction module thermally coupled between the heat dissipation end 2512 and the heat dissipation module 252 for more efficiently conducting heat from the heat dissipation end 2512 to the heat dissipation module 252. Specifically, the heat conduction module may be a metal block with a high heat conductivity coefficient. The cross-sectional area of the heat conduction module may be greater than or equal to the cross-sectional area of the heat dissipation end 2512, so that the heat dissipation end 2512 of the semiconductor refrigeration chip 251 is attached to the heat conduction module, heat of the heat dissipation end 2512 is conducted to the heat conduction module, and heat conduction efficiency of the heat conduction module is improved. And the surface of the heat conducting module close to the semiconductor refrigeration chip 251 is closely attached to the heat dissipation end 2512 or attached through a heat conducting medium, and the surface of the heat conducting module far away from the semiconductor refrigeration chip 251 is closely attached to the heat dissipation module 252 or attached through a heat conducting medium.

In some embodiments, portions of the tubes within the evaporator 240 pass through the heat dissipation module 252. The part of the pipeline in the evaporator 240 is configured to pass through the heat dissipation module 252, that is, the refrigerant in the part of the pipeline in the evaporator 240 flows through the heat dissipation module 252 and the evaporator 240, so that the heat absorption process of the evaporator 240 can be utilized to absorb the heat of the heat dissipation module 252, and further dissipate the heat of the heat dissipation module 252, so as to maintain the refrigeration effect of the refrigeration end 2511 of the semiconductor refrigeration chip 251.

In some embodiments, the semiconductor refrigeration device 250 further includes a cooling module 253, as shown in fig. 1-8, the cooling module 253 is connected to the refrigeration end 2511 and disposed within the second refrigeration compartment 102. The cooling module 253 rapidly transmits the cooling capacity of the cooling end 2511 to the second cooling compartment 102, so that the cooling in the second cooling compartment 102 is rapid and uniform.

In some embodiments, as shown in fig. 1-8, the cooling module 253 further includes a cooling radiator 2531 and a cooling fan 2532. The radiator 2531 is connected to the refrigerating end 2511, and is configured to absorb cold energy of the refrigerating end 2511 and radiate the cold energy to the second refrigerating compartment 102. The radiator 2531 may be a cold-radiating aluminum plate, which has good heat-conducting property and is not easy to rust. The radiator 2531 may also be a plurality of cooling fins fixed on one side of the bottom plate, and cooling channels are formed between the cooling fins to increase the area of the cooling medium. The air inlet surface of the cooling fan 2532 faces the cooling device 2531, when the cooling fan 2532 rotates, the air inlet surface can quickly absorb the cold energy of the cooling device 2531 and quickly emit the cold energy in the second refrigeration compartment 102, so that the cooling efficiency is quickened, and the refrigeration efficiency of the second refrigeration compartment 102 is further improved.

In some embodiments, as shown in fig. 1 and 2, the refrigeration cycle 200 further includes a dry filter 260, the dry filter 260 being disposed between the outlet of the condenser 220 and the inlet of the restriction 230. The filter drier 260 can filter impurities in the refrigerant to prevent the impurities from blocking the throttling device 230 or damaging the compressor 210, and can absorb residual moisture in the refrigerating system 20 to prevent ice blockage and reduce the corrosion of the moisture to the refrigerating system 20.

In some embodiments, as shown in fig. 1-8, the semiconductor refrigeration device 250 further includes a temperature sensor 254. A temperature sensor 254 may be provided at the cooling end 2511 of the semiconductor cooling chip 251 for detecting the temperature of the cooling end 2511. When the temperature of the refrigerating end 2511 is lower than the highest preset temperature of the second refrigerating compartment 102, the current at both ends of the semiconductor refrigerating chip 251 is increased, and the temperature difference between the refrigerating end 2511 and the heat dissipating end 2512 is further increased. When the temperature of the refrigerating end 2511 is lower than the lowest preset temperature of the second refrigerating compartment 102, the current at both ends of the semiconductor refrigerating chip 251 is reduced, the temperature difference between the refrigerating end 2511 and the heat dissipating end 2512 is reduced, and the refrigerating capacity of the refrigerating end 2511 is reduced.

The application provides a refrigerating system 20 and refrigeration equipment 10, the refrigerating system 20 includes a refrigerating circulation loop 200 for circulating a refrigerant and a semiconductor refrigerating device 250, the refrigerating circulation loop 200 includes a compressor 210, a condenser 220, a throttling device and an evaporator which are sequentially connected, the evaporator is configured to supply cold to a first refrigerating compartment 101, the semiconductor refrigerating device 250 includes a semiconductor refrigerating chip 251, the semiconductor refrigerating chip 251 has a refrigerating end 2511 and a radiating end 2512, the radiating end 2512 is connected with a radiating module 252, the radiating module 252 is arranged in the refrigerating circulation loop 200, the refrigerant circulates in the radiating module 252, and the refrigerating end 2511 is configured to supply cold to a second refrigerating compartment 102. The refrigerating system does not need to be provided with a two-stage compression system, and the heat dissipation module of the semiconductor refrigerating device is arranged in the refrigerating circulation loop and depends on a refrigerant to take away the heat of the heat dissipation module, so that the semiconductor refrigerating device continuously supplies cold for the second refrigerating compartment, the structure is further simplified, the volume of the refrigerating system is reduced, the production cost is saved, and the working noise is reduced because a compressor is not needed. In addition, when the second refrigeration compartment is positioned in the first refrigeration compartment, overlapping refrigeration can be formed, the power consumption of the semiconductor refrigeration device can be further reduced, and the refrigeration effect and the refrigeration efficiency of the second refrigeration compartment are improved. The refrigerating system has the advantages of simple structure, low production cost, small volume, low noise and high applicability, and can be widely applied to production and living.

The foregoing description is only the embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (12)

1. A refrigeration system, comprising:

a refrigeration cycle circuit through which a refrigerant flows, the refrigeration cycle circuit including a compressor, a condenser, a throttle device, and an evaporator that are sequentially connected, the evaporator configured to supply cold to the first refrigeration compartment;

the semiconductor refrigeration device comprises a semiconductor refrigeration chip, the semiconductor refrigeration chip is provided with a refrigeration end and a heat dissipation end, the heat dissipation end is in heat conduction connection with a heat dissipation module, the heat dissipation module is arranged in a refrigeration cycle loop, a refrigerant circulates in the heat dissipation module, and the refrigeration end is configured to supply cold to a second refrigeration compartment.

2. The refrigeration system of claim 1, wherein the heat dissipating module is located between an outlet of the throttling device and an inlet of the evaporator.

3. The refrigeration system of claim 2, wherein said refrigeration cycle comprises a plurality of parallel branches, said branches being located between said condenser outlet and said compressor inlet, a sub-throttling device and a sub-evaporator being connected in sequence to any one of said branches, said heat dissipation module being connected between said sub-throttling device and said sub-evaporator on at least one of said branches.

4. The refrigerant system as set forth in claim 1, wherein said heat dissipating module is located between an outlet of said evaporator to an inlet of said compressor.

5. The refrigeration system of claim 4, wherein said refrigeration cycle includes a plurality of parallel branches, said branches being located between said condenser outlet and said compressor inlet, a sub-throttling device and a sub-evaporator being connected in sequence to any one of said branches, at least one of said branches being connected to said heat dissipation module between said sub-evaporator and said compressor.

6. The refrigeration system according to any one of claims 1-5 wherein said semiconductor refrigeration device further comprises a cooling module, said cooling module being connected to said refrigeration end.

7. The refrigeration system of claim 6, wherein the cooling module comprises a cooling radiator and a cooling fan, the cooling radiator being connected to the refrigeration end, an air inlet surface of the cooling fan facing the cooling radiator.

8. The refrigeration system according to any one of claims 1-5, wherein said refrigeration circuit further comprises a dry filter disposed between said condenser outlet and said throttle inlet.

9. The refrigerant system as set forth in claim 1, wherein a portion of the line passes through said heat dissipating module.

10. The refrigeration system of claim 1 wherein said semiconductor refrigeration device includes a temperature sensor.

11. A refrigeration apparatus having the first refrigeration compartment and the second refrigeration compartment, wherein a refrigeration system as claimed in any one of claims 1 to 10 is provided.

12. The refrigeration apparatus of claim 11 wherein said second refrigeration compartment is located within said first refrigeration compartment.

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