CN219735655U - Thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system - Google Patents
Thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system Download PDFInfo
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- CN219735655U CN219735655U CN202321337421.4U CN202321337421U CN219735655U CN 219735655 U CN219735655 U CN 219735655U CN 202321337421 U CN202321337421 U CN 202321337421U CN 219735655 U CN219735655 U CN 219735655U
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 146
- 230000006835 compression Effects 0.000 title claims abstract description 47
- 238000007906 compression Methods 0.000 title claims abstract description 47
- 230000008878 coupling Effects 0.000 title claims abstract description 6
- 238000010168 coupling process Methods 0.000 title claims abstract description 6
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 6
- 239000004065 semiconductor Substances 0.000 claims abstract description 45
- 239000003507 refrigerant Substances 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims description 9
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system, which comprises a vapor compression refrigeration module and a thermoelectric refrigeration module, wherein the cold end of the vapor compression refrigeration module is arranged at a target refrigeration place, the hot end of the vapor compression refrigeration module is connected with the thermoelectric refrigeration module, the other end of the thermoelectric refrigeration module is arranged at a target heat emission place, and the thermoelectric refrigeration module absorbs heat at the hot end of the vapor compression refrigeration module and emits the heat to the target heat emission place; the vapor compression refrigeration module sequentially comprises an evaporator, a compressor, a condenser and a throttle valve which are connected through pipelines, wherein the throttle valve is connected with the evaporator through a pipeline to circulate the refrigerant in the pipeline, and the evaporator is arranged at the target refrigeration place; the thermoelectric refrigeration module comprises a semiconductor refrigeration sheet and a heat dissipation assembly, wherein the cold end of the semiconductor refrigeration sheet is in heat conduction connection with the condenser, the hot end of the semiconductor refrigeration sheet is in heat conduction connection with the heat dissipation assembly, and the heat dissipation assembly is arranged at a target heat emission place.
Description
Technical Field
The utility model belongs to the technical field of refrigeration, and particularly relates to a thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system.
Background
When vapor compression refrigeration is generally used to obtain low temperature below minus 40 ℃, a single-stage vapor compression refrigeration system needs a high-pressure ratio compressor, and the reliability requirements on the refrigerant and pipelines are high. Therefore, in low-temperature occasions, cascade vapor compression refrigeration is generally used as a cold source, two refrigeration systems are connected in series, and an intermediate heat exchanger is used as a medium for connecting high-temperature circulation and low-temperature circulation in series, so that the requirements on a compressor and pipelines are reduced.
The utility model patent with the application number of CN201510586843.9 discloses an adsorption and vapor compression cascade refrigeration device and a control method thereof, wherein the refrigeration device comprises a two-stage adsorption refrigeration system, a phase-change cold accumulation system and a vapor compression refrigeration system, the two-stage adsorption refrigeration system is driven by low-grade heat energy to realize refrigeration, a first evaporator in the two-stage adsorption refrigeration system is coupled with a second condenser in the vapor compression refrigeration system through the phase-change cold accumulation system, so that vapor compression refrigerant of the vapor compression refrigeration system can release heat outwards at a lower condensation temperature, and when the same refrigeration temperature is realized, the power consumption of the adsorption and vapor compression cascade refrigeration device is greatly reduced compared with that of the single-stage vapor compression refrigeration device. The first evaporator of the two-stage adsorption refrigeration system is provided with a phase change cold accumulation system.
The cascade vapor compression refrigeration system has a series of defects, and because of a plurality of refrigeration cycles, the refrigeration system has large complex occupied space, and has low COP (coefficient of performance) and poor economical efficiency when the design working temperature is low, and a series of problems such as pipeline heat leakage, refrigerant leakage, poor maintainability and the like exist.
Disclosure of Invention
Aiming at the problems in the background art, the utility model aims to provide a thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system which comprises a vapor compression refrigeration module and a thermoelectric refrigeration module, wherein the cold end of the vapor compression refrigeration module is arranged at a target refrigeration place, the hot end of the vapor compression refrigeration module is connected with the thermoelectric refrigeration module, the other end of the thermoelectric refrigeration module is arranged at a target heat emission place, and the thermoelectric refrigeration module absorbs the heat of the hot end of the vapor compression refrigeration module and emits the heat to the target heat emission place;
the vapor compression refrigeration module sequentially comprises an evaporator, a compressor, a condenser and a throttle valve which are connected through pipelines, wherein the throttle valve is connected with the evaporator through a pipeline to circulate the refrigerant in the pipeline, and the evaporator is arranged at the target refrigeration place;
the thermoelectric refrigeration module comprises a semiconductor refrigeration sheet and a heat dissipation assembly, wherein the cold end of the semiconductor refrigeration sheet is in heat conduction connection with the condenser, the hot end of the semiconductor refrigeration sheet is in heat conduction connection with the heat dissipation assembly, and the heat dissipation assembly is arranged at the target heat emission place.
Preferably, the heat dissipation component is a fin radiator.
Preferably, heat conducting materials are arranged between the cold end of the semiconductor refrigerating sheet and the condenser, and between the hot end of the semiconductor refrigerating sheet and the heat radiating component.
Preferably, the heat conducting material is heat conducting silicone grease.
Preferably, the thermoelectric refrigeration module comprises at least two semiconductor refrigeration sheets.
Preferably, each semiconductor refrigeration sheet is sequentially arranged along the refrigerant channel in the condenser, and at least one semiconductor refrigeration sheet is respectively arranged at the refrigerant inlet and the refrigerant outlet of the condenser.
Preferably, a temperature sensor is arranged at the refrigerant outlet of the condenser.
Preferably, the condenser is a plate heat exchanger.
By adopting the technical scheme, the utility model has the following advantages and positive effects compared with the prior art:
compared with the existing cascade vapor compression refrigeration system, the utility model reduces the number of compressors, heat exchangers, throttle valves and pipelines required by a whole set of high-temperature-stage circulation, reduces the volume, weight and complexity of the cascade refrigeration system, and increases the maintainability of the cascade refrigeration system; the semiconductor refrigerating sheet is used, so that the temperature control complexity of the cascade refrigerating system can be effectively reduced, the temperature stability of the system is enhanced, and the time required by the cascade refrigerating system to reach the working temperature is reduced.
Drawings
The utility model is described in further detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a schematic view of the whole of the present utility model;
fig. 2 is an enlarged view of a portion of the junction of the semiconductor refrigeration sheets of the present utility model.
Reference numerals illustrate:
1. a throttle valve; 2. a fin radiator; 3. heat conductive silicone grease; 4. a cold end electrode; 5. a hot-end electrode; 6. a metal conductor; 7. a semiconductor unit.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the specific examples. The advantages and features of the present utility model will become more apparent from the following description. It is noted that the drawings are in a very simplified form and utilize non-precise ratios, and are intended to facilitate a convenient, clear, description of the embodiments of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Referring to fig. 1 to 2, the core of the present utility model is to provide a thermoelectric refrigeration and vapor compression refrigeration coupled cascade refrigeration system, which comprises a vapor compression refrigeration module and a thermoelectric refrigeration module, wherein the cold end of the vapor compression refrigeration module is arranged at a target refrigeration place, the hot end of the vapor compression refrigeration module is connected with the thermoelectric refrigeration module, the other end of the thermoelectric refrigeration module is arranged at a target heat discharge place, and the thermoelectric refrigeration module absorbs the heat of the hot end of the vapor compression refrigeration module and discharges the heat to the target heat discharge place.
The target cooling location is a location requiring cooling, such as a refrigerator. The target heat discharge site is a site where heat can be discharged, such as the external atmosphere, etc.
The vapor compression refrigeration module sequentially comprises an evaporator, a compressor, a condenser and a throttle valve 1 which are connected through pipelines, wherein the throttle valve 1 is connected with the evaporator through the pipelines to circulate the refrigerant in the pipelines, and the evaporator is arranged at a target refrigeration place.
The thermoelectric refrigeration module comprises a semiconductor refrigeration sheet and a heat dissipation assembly, wherein the cold end of the semiconductor refrigeration sheet is in heat conduction connection with the condenser, the hot end of the semiconductor refrigeration sheet is in heat conduction connection with the heat dissipation assembly, and the heat dissipation assembly is arranged at a target heat emission place. The condenser transfers heat to the semiconductor refrigeration sheet, which in turn transfers heat to the air through the heat sink assembly.
Referring to fig. 2, the semiconductor refrigeration sheet includes a cold side electrode 4 at its cold side, a hot side electrode 5 at its hot side, a metal conductor 6, and a semiconductor unit 7. The cold end electrode 4 and the hot end electrode 5 are respectively connected with the semiconductor unit 7 through the metal conductor 6, and the semiconductor unit 7 is formed by alternately combining an N-type semiconductor and a P-type semiconductor. The semiconductor refrigerating sheet is a refrigerating device without sliding parts, and the semiconductor refrigerating sheet is used for electrifying a couple formed by connecting two different semiconductor materials in series through the Peltier effect of the semiconductor materials, so that heat absorption and heat release can be respectively carried out at two ends of the thermocouple, and the refrigerating effect is realized.
The heat dissipation assembly in this embodiment is a fin radiator 2, and the condenser is a plate heat exchanger, but may be of other types in other embodiments, which is not limited herein.
Heat conducting materials are arranged between the cold end and the condenser and between the hot end and the heat radiating component of the semiconductor refrigerating sheet so as to strengthen heat exchange between the components, the heat conducting materials are heat conducting silicone grease 3 in the embodiment, and the heat conducting silicone grease 3 can improve heat conducting capacity and accelerate heat conducting rate.
Specifically, the thermoelectric refrigeration module includes at least two semiconductor refrigeration sheets. Each semiconductor refrigeration piece is arranged along the refrigerant channel in the condenser in sequence, and at least one semiconductor refrigeration piece is respectively arranged at the refrigerant inlet and the refrigerant outlet of the condenser.
Further, a temperature sensor is further arranged at the refrigerant outlet of the condenser and used for detecting the temperature of the refrigerant outlet of the condenser.
The control system is electrically connected with each semiconductor refrigerating piece, the throttle valve 1 and the temperature sensor, and can control the opening and closing of each semiconductor refrigerating piece and the opening and closing and flow of the throttle valve 1. The temperature sensor feeds back the temperature of the condenser refrigerant outlet of the control system, so that the opening quantity of the semiconductor refrigerating sheets is controlled by the control system, the purpose of controlling the temperature of the condenser refrigerant outlet is achieved, and the optimal working mode is achieved.
The working process of the utility model is further described below:
the liquid refrigerant is vaporized into low-temperature steam after absorbing heat in a target refrigeration place in the evaporator, then is sucked and compressed into high-pressure high-temperature steam by the compressor, then the high-pressure high-temperature steam enters the condenser to be condensed into high-pressure liquid, and then is throttled into low-pressure low-temperature liquid refrigerant by the throttle valve 1, and finally enters the evaporator in a circulating mode.
When the high-pressure high-temperature steam enters the condenser, the condenser transfers heat to the semiconductor refrigerating sheet, and the semiconductor refrigerating sheet transfers heat to the air through the fin radiator 2.
Compared with the existing cascade vapor compression refrigeration system, the utility model reduces the number of compressors, heat exchangers, throttle valves 1 and pipelines required by a whole set of high-temperature-stage circulation, reduces the volume, weight and complexity of the cascade refrigeration system, and increases the maintainability of the cascade refrigeration system; the semiconductor refrigerating sheet is used, so that the temperature control complexity of the cascade refrigerating system can be effectively reduced, the temperature stability of the system is enhanced, and the time required by the cascade refrigerating system to reach the working temperature is reduced, so that the product competitiveness is improved.
The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited to the above embodiments. Even if various changes are made to the present utility model, it is within the scope of the appended claims and their equivalents to fall within the scope of the utility model.
Claims (8)
1. The thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system is characterized by comprising a vapor compression refrigeration module and a thermoelectric refrigeration module, wherein the cold end of the vapor compression refrigeration module is arranged at a target refrigeration place, the hot end of the vapor compression refrigeration module is connected with the thermoelectric refrigeration module, the other end of the thermoelectric refrigeration module is arranged at a target heat emission place, and the thermoelectric refrigeration module absorbs heat at the hot end of the vapor compression refrigeration module and emits the heat to the target heat emission place;
the vapor compression refrigeration module sequentially comprises an evaporator, a compressor, a condenser and a throttle valve which are connected through pipelines, wherein the throttle valve is connected with the evaporator through a pipeline to circulate the refrigerant in the pipeline, and the evaporator is arranged at the target refrigeration place;
the thermoelectric refrigeration module comprises a semiconductor refrigeration sheet and a heat dissipation assembly, wherein the cold end of the semiconductor refrigeration sheet is in heat conduction connection with the condenser, the hot end of the semiconductor refrigeration sheet is in heat conduction connection with the heat dissipation assembly, and the heat dissipation assembly is arranged at the target heat emission place.
2. The thermoelectric refrigeration and vapor compression refrigeration coupled cascade refrigeration system of claim 1, wherein the heat dissipation assembly is a fin heat sink.
3. The thermoelectric refrigeration and vapor compression refrigeration coupled cascade refrigeration system of claim 1, wherein a thermally conductive material is disposed between the cold end of the semiconductor refrigeration sheet and the condenser, and between the hot end and the heat sink assembly.
4. The thermoelectric refrigeration and vapor compression refrigeration coupled cascade refrigeration system of claim 3 wherein the thermally conductive material is thermally conductive silicone grease.
5. The coupled thermoelectric refrigeration and vapor compression refrigeration cascade refrigeration system of claim 1 wherein the thermoelectric refrigeration module comprises at least two of the semiconductor refrigeration sheets.
6. The coupled thermoelectric refrigeration and vapor compression refrigeration cascade refrigeration system of claim 5 wherein each of said semiconductor refrigeration sheets is disposed in sequence along a refrigerant path within said condenser and wherein at least one of said semiconductor refrigeration sheets is disposed at a refrigerant inlet and a refrigerant outlet of said condenser, respectively.
7. The thermoelectric refrigeration and vapor compression refrigeration coupled cascade refrigeration system of claim 1, wherein a temperature sensor is disposed at a refrigerant outlet of the condenser.
8. The coupled thermoelectric refrigeration and vapor compression refrigeration cascade refrigeration system of claim 1 wherein the condenser is a plate heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321337421.4U CN219735655U (en) | 2023-05-30 | 2023-05-30 | Thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321337421.4U CN219735655U (en) | 2023-05-30 | 2023-05-30 | Thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219735655U true CN219735655U (en) | 2023-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321337421.4U Active CN219735655U (en) | 2023-05-30 | 2023-05-30 | Thermoelectric refrigeration and vapor compression refrigeration coupling cascade refrigeration system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219735655U (en) |
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2023
- 2023-05-30 CN CN202321337421.4U patent/CN219735655U/en active Active
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