CN107104360B - The micro- sweat cooling of large power laser diode array throttling is heat sink - Google Patents
The micro- sweat cooling of large power laser diode array throttling is heat sink Download PDFInfo
- Publication number
- CN107104360B CN107104360B CN201710572100.5A CN201710572100A CN107104360B CN 107104360 B CN107104360 B CN 107104360B CN 201710572100 A CN201710572100 A CN 201710572100A CN 107104360 B CN107104360 B CN 107104360B
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- Prior art keywords
- heat sink
- plate
- strip groove
- laser diode
- diode array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
- H01S5/0243—Laser is immersed in the coolant, i.e. the whole laser chip is immersed in the liquid for cooling
Abstract
The invention discloses a kind of throttle micro- sweat cooling of large power laser diode array is heat sink, including at least the heat sink upper plate and heat sink lower plate overlapped；The bottom surface of the heat sink upper plate offers multiple upper strip grooves, and the top surface of the heat sink lower plate is provided with multiple lower strip grooves being connected to the upper strip groove one-to-one correspondence, and individually upper strip groove misplaces and be connected to form single runner with corresponding lower strip groove；Coolant liquid flow direction in two neighboring runner is on the contrary, the heat sink upper sheet top surface is the working face for radiating to large power laser diode array；Heat sink cooling efficiency can be effectively improved, and improves heat into cooling uniformity, avoids large power laser diode array temperature uneven and causes working efficiency low, guarantee that large power laser diode array normally and efficiently works；Structure precision is high simultaneously and preparation is convenient.
Description
Technical field
The present invention relates to laser cooling fields, and in particular to a kind of micro- evaporation system of large power laser diode array throttling
It is cold and hot heavy.
Background technique
It is a kind of benefit that miniature throttling and evaporation chamber refrigeration (Micro miniature J-T Refrigerator:MMR) is heat sink
Refrigerating plant is miniaturized made of both vapor compression, throttling and evaporation, the principle of decalescence, includes micro-compressor, air-cooled cold
The components such as condenser, restricting element, micro- evaporation cavity.It is exclusively used in the electronic component that heating area is small, heat flow density is high, especially greatly
Powered laser diodes (Laser Diode:LD) heat dissipation.Compared with heat sink with the traditional microchannel LD liquid cooling, coolant is utilized
Latent heat of phase change can realize very big heat exchange amount under the quality of coolant very little and flow, have very high heat radiation density；It is cold
But agent temperature when decalescence remains unchanged, overcome traditional liquid cooling micro-channel heat sink due to coolant liquid entrance, go out
LD array caused by mouthful temperature difference leads to light power variation, wave length shift in different luminous point refrigeration effect differences etc.
Unfavorable factor.Have both that cooling temperature is lower, cooling system structure is simpler, cooling system volume is smaller, total energy consumption is lower simultaneously
The advantages that.And with the development of high power laser technology, more high-power, the higher LD of heat flow density is developed, traditional liquid cooling
Single-phase heat transfer cooling in microchannel is no longer satisfied requirement；And since the uniformity of heat sink cooling is poor, cause high-power sharp
Light diode array inhomogeneous cooling is even, is unfavorable for whole large power laser diode array and normally and efficiently works, and makes essence
Spend low, production difficulty that high-precision is heat sink.
Therefore, in order to solve the above problem, need a kind of micro- sweat cooling of large power laser diode array throttling heat sink, energy
Heat sink cooling efficiency is enough effectively improved, and improves heat into cooling uniformity, avoids large power laser diode array temperature
Degree is uneven and causes working efficiency low, guarantees that large power laser diode array normally and efficiently works；Simultaneously structure precision it is high and
Preparation is convenient.
Summary of the invention
In view of this, providing large power laser diode array the purpose of the present invention is overcoming defect in the prior art
Micro- sweat cooling that throttles is heat sink, can effectively improve heat sink cooling efficiency, and improves heat into cooling uniformity, avoids big
Powered laser diodes array temperature is uneven and causes working efficiency low, guarantees large power laser diode array normally and efficiently work
Make；Structure precision is high simultaneously and preparation is convenient.
The micro- sweat cooling of large power laser diode array throttling of the invention is heat sink, heat sink including at least what is overlapped
Upper plate and heat sink lower plate；The bottom surface of the heat sink upper plate offers multiple upper strip grooves, and the top surface of the heat sink lower plate is provided with
Multiple to correspond the lower strip groove being connected to the upper strip groove, individually upper strip groove misplaces and is connected to corresponding lower strip groove
Form single runner；Coolant liquid flow direction in two neighboring runner is on the contrary, the heat sink upper sheet top surface is for swashing to high-power
The working face of light diode array heat dissipation.
Further, it is parallel to each other between the lower strip groove and is semi-open slot, the aperture position of two neighboring strip groove
On the contrary；It is parallel to each other between the upper strip groove and is the semi-open slot ipsilateral with corresponding lower bar shaped channel opening, the upper bar shaped
The not opening end of slot or lower strip groove is provided with for being connected to the link slot to form runner with corresponding lower strip groove or upper strip groove.
It further, further include upper cover plate, lower cover plate and the coaming plate being set between upper cover plate and lower cover plate, the coaming plate
Thickness, which is equal among the sum of heat sink upper plate thickness and heat sink lower plate thickness and coaming plate, to be provided with for accommodating heat sink upper plate and heat sink
The utensil receiving opening of lower plate, the upper cover plate correspond to heat sink upper plate and are provided with opening；The heat sink upper plate and heat sink lower plate are rectangle, institute
It states and extends to form two opposite partitions among the side wall of utensil receiving opening, the partition side is sealedly attached to heat sink upper plate and heat sink
Make to form the exhaust passage for collecting runner discharge gas, partition between partition upper side and upper cover plate downside between lower plate
It is formed between downside and lower cover plate upper side for the inlet channel to runner injection coolant.
Further, the coaming plate upper wall is provided with radiating groove, and heat dissipation cavity is formed between the radiating groove and upper cover plate, described
Heat dissipation cavity is connected to exhaust passage and heat dissipation cavity is provided with exhaust outlet；The coaming plate is additionally provided with what outlet was connected to inlet channel
Jet pump, the heat dissipation cavity are connected to the suction chamber of jet pump.
Further, the upper cover plate is prepared for Heat Conduction Material.
Further, the radiating groove is rectangle and is set to the import and export of radiating groove and is located at the opposite two sides of radiating groove；It dissipates
The slot bottom of heat channel is provided with the refluxing opening being connected to the suction chamber of jet pump, and the refluxing opening is close to outlet setting.
Further, the heat sink upper plate and heat sink lower plate are the rectangular slab of relative superposition setting, and the runner is along rectangular
The length direction arrangement of shape plate, width direction parallelly distribute on of multiple runners along rectangular slab.
Further, the upper strip groove and lower strip groove are formed by laser ablation.
Micro- sweat cooling the beneficial effects of the present invention are: a kind of large power laser diode array disclosed by the invention throttles
It is heat sink, the interlaced setting in flow direction by the way that cooling runner will be used for, conducive to the cooling uniformity for guaranteeing heat sink upper plate,
Heat sink cooling efficiency can be effectively improved, and improves heat into cooling uniformity, avoids large power laser diode array
Temperature is uneven and causes working efficiency low, guarantees that large power laser diode array normally and efficiently works；Structure precision is high simultaneously
And preparation is convenient.
Detailed description of the invention
The invention will be further described with reference to the accompanying drawings and examples:
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the structural schematic diagram of coaming plate in the present invention；
Fig. 3 is the structural schematic diagram of partition installation in the present invention；
Fig. 4 is the structural schematic diagram of each runner flow direction of the present invention.
Specific embodiment
Fig. 1 is the structural diagram of the present invention, and Fig. 2 is the structural schematic diagram of coaming plate in the present invention, and Fig. 3 is interval of the present invention
The structural schematic diagram of plate installation, Fig. 4 is the structural schematic diagram of each runner flow direction of the present invention, as shown, big in the present embodiment
The micro- sweat cooling of powered laser diodes array throttling is heat sink；Including at least the heat sink upper plate 1 and heat sink lower plate 2 overlapped；
The bottom surface of the heat sink upper plate 1 offers multiple upper strip grooves 3, and the top surface of the heat sink lower plate 2 is provided on multiple and described
Strip groove 3 corresponds the lower strip groove 4 of connection, and single upper strip groove 3 misplaces and be connected to corresponding lower strip groove 4 to be formed individually
Runner；Coolant liquid flow direction in two neighboring runner is on the contrary, 1 top surface of heat sink upper plate is for high power laser diode
The working face 5 of array heat dissipation；The coolant liquid can be existing coolant liquid, such as water or evaporative cooled liquid fluorine Lyons etc., lead to
The interlaced setting in flow direction that will be used for cooling runner is crossed, conducive to the cooling uniformity for guaranteeing heat sink upper plate 1, Neng Gouyou
Effect improves heat sink cooling efficiency, and improves heat into cooling uniformity, avoids large power laser diode array temperature not
Cause working efficiency low, guarantees that large power laser diode array normally and efficiently works；Structure precision is high simultaneously and prepares
It is convenient.
It is parallel to each other in the present embodiment, between the lower strip groove 4 and is semi-open slot, the opening of two neighboring strip groove
Position is opposite；It is parallel to each other between the upper strip groove 3 and to be open ipsilateral semi-open slot with corresponding time strip groove 4, it is described
The not opening end of upper strip groove 3 or lower strip groove 4 is provided with for forming stream with corresponding lower strip groove 4 or the connection of upper strip groove 3
The link slot in road；Side opening (the side opening 4a and upper item including lower strip groove 4 of the lower strip groove 4 and upper strip groove 3
The side of shape slot 3 is open 3a) it is located at the side wall of heat sink lower plate 2 and heat sink upper plate 1, coolant is from the side of heat sink lower plate 2
Opening, which enters and is open from the side of heat sink upper plate 1, to be flowed out and cools down to large power laser diode array.
It further include upper cover plate 6, lower cover plate 7 and the coaming plate 8 being set between upper cover plate 6 and lower cover plate 7 in the present embodiment,
The thickness of the coaming plate 8, which is equal among the sum of 2 thickness of heat sink 1 thickness of upper plate and heat sink lower plate and coaming plate 8, to be provided with for accommodating
The utensil receiving opening 9 of heat sink upper plate 1 and heat sink lower plate 2, the corresponding heat sink upper plate 1 of the upper cover plate 6 are provided with opening；The heat sink upper plate
1 and heat sink lower plate 2 be rectangle, extend to form among the side wall of the utensil receiving opening 9 two opposite partitions (including partition 9a and every
Plate 9b), the partition side, which is sealedly attached between heat sink upper plate 1 and heat sink lower plate 2, makes 6 downside of partition upper side and upper cover plate
The exhaust passage (heat sink upper plate two sides are provided with exhaust passage) for collecting runner discharge gas is formed between face, under partition
For the inlet channel to runner injection coolant, (heat sink lower plate two sides are respectively provided with for formation between 7 upper side of side and lower cover plate
There is inlet channel)；Partition is salable to be welded between heat sink upper plate 1 and heat sink lower plate 2, and (certainly, partition unsealing is located at heat sink
The side of 2 side wall of upper plate 1 and heat sink lower plate is open), enter inlet channel after coolant throttling is micro- and respectively enters single runner,
And exhaust passage collects the high-temperature low-pressure gas of runner outflow, two inlet channels are respectively communicated with coolant source and carry out coolant
Circulation, i.e., cooling system is cooled down by two cooling circuits independently, and cooling efficiency is high.
In the present embodiment, 8 upper wall of coaming plate is provided with radiating groove (including left radiating groove 11a and right radiating groove 11b), institute
It states and forms heat dissipation cavity between radiating groove and upper cover plate 6, the heat dissipation cavity is connected to exhaust passage and heat dissipation cavity is provided with exhaust outlet；
The coaming plate 8 is additionally provided with the jet pump 12 that outlet is connected to inlet channel, the suction chamber company of the heat dissipation cavity and jet pump 12
It is logical；It is utilized again by the coolant reflux after heat dissipation, greatly improves cooling efficiency.
In the present embodiment, the upper cover plate 6 is prepared for Heat Conduction Material；Heat sink material can be the good material of existing thermal conductivity
Expect, such as copper etc., certainly settable wind-cooling heat dissipating or water-cooling on upper cover plate 6.
In the present embodiment, the radiating groove is rectangle and is set to the import and export of radiating groove and is located at opposite two of radiating groove
Side；The slot bottom of radiating groove is provided with the refluxing opening 13 being connected to the suction chamber of jet pump 12, and the refluxing opening 13 is set close to outlet
It sets；It is fully cooled conducive to the coolant of reflux, guarantees that radiating efficiency is high.
In the present embodiment, the rectangular slab of the heat sink upper plate 1 and heat sink lower plate 2 for relative superposition setting, the runner
Along the length direction arrangement of rectangular slab, width direction parallelly distribute on of multiple runners along rectangular slab；3 He of upper strip groove
Lower strip groove 4 is formed by laser ablation；Easy to process, structure is conducive to coolant and sufficiently absorbs heat.
Finally, it is stated that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to compared with
Good embodiment describes the invention in detail, those skilled in the art should understand that, it can be to skill of the invention
Art scheme is modified or replaced equivalently, and without departing from the objective and range of technical solution of the present invention, should all be covered at this
In the scope of the claims of invention.
Claims (7)
1. a kind of large power laser diode array throttles, micro- sweat cooling is heat sink, it is characterised in that: including at least overlapping
Heat sink upper plate and heat sink lower plate；The bottom surface of the heat sink upper plate offers multiple upper strip grooves, the top surface of the heat sink lower plate
Be provided with it is multiple correspond lower strip grooves be connected to the upper strip groove, individually upper strip groove and corresponding lower strip groove misplace
And it is connected to and to form single runner；Coolant liquid flow direction in two neighboring runner is on the contrary, the heat sink upper sheet top surface is for big
The working face of powered laser diodes array heat dissipation；
It is parallel to each other between the lower strip groove and is semi-open slot, the aperture position of two neighboring strip groove is opposite；On described
It is parallel to each other between strip groove and is the semi-open slot ipsilateral with corresponding lower bar shaped channel opening, the upper strip groove or lower strip groove
Not opening end be provided with for being connected to the link slot to form runner with corresponding lower strip groove or upper strip groove.
2. large power laser diode array according to claim 1 throttles, micro- sweat cooling is heat sink, it is characterised in that: also
Including upper cover plate, lower cover plate and the coaming plate being set between upper cover plate and lower cover plate, the thickness of the coaming plate is equal to heat sink upper plate
The utensil receiving opening for accommodating heat sink upper plate and heat sink lower plate is provided among the sum of thickness and heat sink lower plate thickness and coaming plate, it is described
Upper cover plate corresponds to heat sink upper plate and is provided with opening；The heat sink upper plate and heat sink lower plate are rectangle, in the side wall of the utensil receiving opening
Between extend to form two opposite partitions, the partition side, which is sealedly attached between heat sink upper plate and heat sink lower plate, to be made on partition
The exhaust passage for collecting runner discharge gas is formed between side and upper cover plate downside, on partition downside and lower cover plate
It is formed between side for the inlet channel to runner injection coolant.
3. large power laser diode array according to claim 2 throttles, micro- sweat cooling is heat sink, it is characterised in that: institute
It states coaming plate upper wall and is provided with radiating groove, form heat dissipation cavity, the heat dissipation cavity and exhaust passage between the radiating groove and upper cover plate
It is connected to and heat dissipation cavity is provided with exhaust outlet；The coaming plate is additionally provided with the jet pump that outlet is connected to inlet channel, the heat dissipation
Chamber is connected to the suction chamber of jet pump.
4. large power laser diode array according to claim 3 throttles, micro- sweat cooling is heat sink, it is characterised in that: institute
Upper cover plate is stated to be prepared for Heat Conduction Material.
5. large power laser diode array according to claim 3 throttles, micro- sweat cooling is heat sink, it is characterised in that: institute
Radiating groove is stated to be rectangle and be set to the import and export of radiating groove and be located at the opposite two sides of radiating groove；The slot bottom of radiating groove is provided with
The refluxing opening being connected to the suction chamber of jet pump, the refluxing opening is close to outlet setting.
6. large power laser diode array according to claim 1 throttles, micro- sweat cooling is heat sink, it is characterised in that: institute
It states heat sink upper plate and heat sink lower plate is the rectangular slab of relative superposition setting, length direction cloth of the runner along rectangular slab
It sets, width direction parallelly distribute on of multiple runners along rectangular slab.
7. large power laser diode array according to claim 1 throttles, micro- sweat cooling is heat sink, it is characterised in that: institute
It states strip groove and lower strip groove is formed by laser ablation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710572100.5A CN107104360B (en) | 2017-07-13 | 2017-07-13 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710572100.5A CN107104360B (en) | 2017-07-13 | 2017-07-13 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
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| CN107104360A CN107104360A (en) | 2017-08-29 |
| CN107104360B true CN107104360B (en) | 2019-06-07 |
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| CN201710572100.5A Active CN107104360B (en) | 2017-07-13 | 2017-07-13 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
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| CN113659426B (en) * | 2021-07-19 | 2023-01-06 | 中国科学院西安光学精密机械研究所 | Light source chip array heat radiation structure |
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| US4386505A (en) * | 1981-05-01 | 1983-06-07 | The Board Of Trustees Of The Leland Stanford Junior University | Refrigerators |
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| CN101667561A (en) * | 2009-09-04 | 2010-03-10 | 厦门大学 | Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof |
| CN201682169U (en) * | 2009-11-11 | 2010-12-22 | 中国科学院理化技术研究所 | Micro-channel flow boiling heat sink for cooling high power solid laser |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN102044842A (en) * | 2009-10-10 | 2011-05-04 | 中国科学院理化技术研究所 | Single-fin type laser diode micro-channel phase-change heat sink |
| CN204966961U (en) * | 2015-10-09 | 2016-01-13 | 杭州虹视科技有限公司 | High -efficient compact laser instrument heat abstractor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6921603B2 (en) * | 2002-04-24 | 2005-07-26 | The Regents Of The University Of California | Microfluidic fuel cell systems with embedded materials and structures and method thereof |
| EP2646154A2 (en) * | 2010-11-30 | 2013-10-09 | Quantumdx Group Limited | The design, fabrication and use of a microfluidics multitemperature flexible reaction device |
| CN207320568U (en) * | 2017-07-13 | 2018-05-04 | 重庆师范大学 | New laser refrigeration is heat sink |
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2017
- 2017-07-13 CN CN201710572100.5A patent/CN107104360B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4386505A (en) * | 1981-05-01 | 1983-06-07 | The Board Of Trustees Of The Leland Stanford Junior University | Refrigerators |
| CN201260024Y (en) * | 2007-12-29 | 2009-06-17 | 北京中视中科光电技术有限公司 | Phase changing heat radiating device |
| CN101667561A (en) * | 2009-09-04 | 2010-03-10 | 厦门大学 | Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof |
| CN102044842A (en) * | 2009-10-10 | 2011-05-04 | 中国科学院理化技术研究所 | Single-fin type laser diode micro-channel phase-change heat sink |
| CN201682169U (en) * | 2009-11-11 | 2010-12-22 | 中国科学院理化技术研究所 | Micro-channel flow boiling heat sink for cooling high power solid laser |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN204966961U (en) * | 2015-10-09 | 2016-01-13 | 杭州虹视科技有限公司 | High -efficient compact laser instrument heat abstractor |
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| CN107104360A (en) | 2017-08-29 |
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Effective date of registration: 20230627 Address after: 613-616F2, Building A, International Chamber of Commerce Building, 138 Fuhua 1st Road, Fu'an Community, Futian Street, Futian District, Shenzhen, Guangdong 518046 Patentee after: Shenzhen Deyuan Laser Technology Co.,Ltd. Address before: 401331 No.37 Middle Road, University Town, Shapingba District, Chongqing Patentee before: CHONGQING NORMAL University |
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