CN102044842A - Single-chip laser diode micro-channel phase change heat sink - Google Patents
Single-chip laser diode micro-channel phase change heat sink Download PDFInfo
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- CN102044842A CN102044842A CN2009100939875A CN200910093987A CN102044842A CN 102044842 A CN102044842 A CN 102044842A CN 2009100939875 A CN2009100939875 A CN 2009100939875A CN 200910093987 A CN200910093987 A CN 200910093987A CN 102044842 A CN102044842 A CN 102044842A
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- heat sink
- laser diode
- phase transition
- chip laser
- transition heat
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- 230000008859 change Effects 0.000 title abstract description 3
- 230000007704 transition Effects 0.000 claims description 28
- 230000037361 pathway Effects 0.000 claims description 21
- 239000007788 liquid Substances 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 3
- 238000009835 boiling Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 208000018530 Disseminated peritoneal leiomyomatosis Diseases 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000002309 gasification Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Semiconductor Lasers (AREA)
Abstract
The invention discloses a monolithic laser diode micro-channel phase change heat sink which comprises a heat radiating fin and is characterized in that a liquid inlet channel with a cavitation structure type is arranged on the heat radiating fin. The invention can effectively inhibit the instability phenomenon in the boiling process and ensure the reliable and normal heat dissipation of the laser diode. The cooling device has the advantages of high heat dissipation heat flow density, good cooling effect, stable work and the like.
Description
Technical field
The invention belongs to the electronic radiation apparatus field, relate in particular to a kind of solid state laser one chip laser diode phase transition heat sink.
Background technology
Laser diode pump solid state laser device (DPL) has advantages such as efficient height, beam quality height, compact conformation, life-span length.In recent years, along with succeeding in developing in succession of high power diode laser, promoted the development of DPL and in the application in fields such as industry, medical treatment, scientific research.DPL is considered to the important directions of solid state laser technical development, has important purposes.
Usually, the hear rate during laser diode (LD) operate as normal accounts for more than 50% of total power consumption, and hear rate causes that the instability of laser diode working temperature will make its output wavelength change, and then influences the efficient stable output of DPL.Along with laser diode pump solid state laser device power increases, the heat load that device produces is increasing, and heat radiation density is also more and more higher, and LD cooling problem has become the technological difficulties in the present DPL research.
Generally speaking, the main mode that is used for DPL heat radiation has semiconductor refrigerating, adopting heat pipes for heat transfer, microchannel water-cooled etc.Wherein, the microchannel water-cooling is to study and use the more DPL type of cooling at present.Though the heat radiation of water-cooled microchannel has good effect of heat exchange, controls advantages such as simple, there are hidden danger such as microchannel corrosion and obstruction, heat sink temperature constantly fluctuation with the variation of in-channel water temperature simultaneously causes the laser works instability easily.
Summary of the invention
The objective of the invention is to overcome the defective of above-mentioned prior art, provide a kind of working medium of avoiding in flowing, to take place to stop up and the more stable one chip laser diode phase transition heat sink of working temperature.
For achieving the above object, the present invention is by the following technical solutions:
According to a first aspect of the invention, provide a kind of one chip laser diode microchannel phase transition heat sink, comprise fin, have the feed pathway of cavitation structural shape on the wherein said fin.
In technique scheme, the feed pathway of feed pathway, Venturi tube or AND DEWATERING FOR ORIFICE STRUCTURE pattern that described feed pathway with cavitation structural shape is strip feed pathway, bell mouth shape.
In technique scheme, described feed pathway with cavitation structural shape is the strip feed pathway, and the ratio of its throat width and exit width is 1: 2.
In technique scheme, described fin is provided with a plurality of described strip feed pathway that are parallel to each other.
In technique scheme, also comprise the separatory sheet, this separatory sheet is provided with the rectangle hole for back flow.
In technique scheme, also comprise cold-producing medium.Preferably, described cold-producing medium is a freon.
Compared with prior art, the invention has the advantages that:
1. avoid working medium in flowing, to stop up;
2. the stability and the reliability of system's operation have been improved.
Description of drawings
Below, describe embodiments of the invention in conjunction with the accompanying drawings in detail, wherein:
Fig. 1 a is the decomposition chart of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention;
Fig. 1 b is the schematic diagram of upper cover plate of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention;
Fig. 2 is the schematic diagram of fin of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention;
Fig. 3 is the schematic diagram of separatory sheet of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention;
Fig. 4 is the schematic diagram that returns the liquid sheet of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention;
Fig. 5 is the schematic diagram of lower cover slip of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention;
Fig. 6 is the stereogram of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention.
Embodiment
Fig. 1 a illustrates the decomposition chart of the one chip laser diode microchannel phase transition heat sink of embodiments of the invention.This is heat sink to comprise upper cover plate 10, fin 20, separatory sheet 30, return liquid sheet 40 and lower cover slip 50, and they are arranged in order from top to bottom, form by the pressure Diffusion Welding.Welding heat sink after finishing carries out the cutting edge processing by the line cutting with heat sink four peripheries, makes the length of heat sink final width and the single bar bar of laser diode (LD) suitable.Below each sheet is described in detail.
Fig. 1 b is the upper cover plate 10 of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention.This upper cover plate is provided with location hole 11, is used for welding and test installing and locating.
Fig. 2 is the fin 20 of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention.This fin 20 has the parallel feed pathway 21 of multi-ribbon cavitation structure, and wherein said cavitation structure is also referred to as sudden expansion formula passage, and promptly the throat width of passage is less than exit width, and it mainly acts on is that the instability that the growth of inhibition bubble adverse current is caused flows.In this embodiment, each passage is strip substantially, and preferably, feeder connection is 1: 2 with the width ratio of channel outlet, about 400 microns of the width of channel outlet.As shown in Figure 2, this fin 20 also has inlet hole 24, is provided with gusset 23 in this inlet hole, is beneficial to welding.This inlet hole is connected with parallel feed pathway 21, its position is corresponding to the inlet hole on the lower cover slip shown in Figure 5 50 53, during with the heat sink work of box lunch, to be cold-producing medium enter from the inlet hole 53 of lower cover slip 50 working medium, the inlet hole 45 through returning liquid sheet 40 and the inlet hole 34 of separatory sheet 30, flow into the inlet hole 24 of fin 20, enter parallel feed pathway 21 then.On the position of the fin 20 corresponding, be provided with location hole 22 equally with the location hole 11 of upper cover plate 10.
Fig. 3 is the separatory sheet 30 of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention.This separatory sheet 30 is used to separate fin 20 and returns liquid sheet 40, is communicated with the feed pathway 21 and the outlet opening 43 that returns liquid sheet 40 of fin 20 by the rectangle hole for back flow on this separatory sheet 31.The size of this rectangle hole for back flow is relevant with the flow of working medium, so that control back the flow velocity of liquid.On this separatory sheet 30, on corresponding with the location hole 22 of fin 20 and inlet hole 24 respectively position, be provided with location hole 33 and inlet hole 34, the hole on their shape, size and the corresponding separately fin 20 is similar.Also be provided with in the inlet hole 34 and strengthen gusset 32, consistent on its size dimension and position and the fin.
Fig. 4 is time liquid sheet 40 of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention.With the position of the position of rectangle hole for back flow 31 corresponding this time liquid sheet, be provided with outlet opening (also claiming the return flow line) 43, it is identical but the inconsistent reinforcement gusset 41 of length is beneficial to welding to be distributed with width in this return flow line.In addition, on the position corresponding with the location hole 33 of separatory sheet 30 and inlet hole 34, this time liquid sheet is provided with location hole 44 and inlet hole 45, and the hole on their shape, size and the corresponding separately separatory sheet 30 is similar.In inlet hole 45, also have and strengthen gusset 42, consistent on its size, size and position and the separatory sheet 30.
Fig. 5 is the lower cover slip 50 of the one chip laser diode microchannel phase transition heat sink of the embodiment of the invention.This lower cover slip 50 comprises inlet hole 53, location hole 52 and outlet opening 51, and the position of this inlet hole, location hole and outlet opening corresponds respectively to inlet hole 45, location hole 44 and back flow channel 43.During heat sink work, cold-producing medium enters heat sink from inlet hole 53, then flows out by outlet opening 51.Fig. 6 is the stereogram after the one chip laser diode microchannel phase transition heat sink welding of the embodiment of the invention is finished.
In technique scheme, the sudden expansion formula passage of strip only is an example, and the cavitation structure of any other pattern as the passage of bell mouth shape, the passage of orifice plate pattern, the passage of venturi tubulose etc., all can be used; Although the width ratio of the inlet of above-mentioned passage and outlet is 1: 2, also can adopt other ratios in other embodiments of the invention, but the width that should keep intake channel is less than exit passageway, and can makes the cold-producing medium partial gasification of this passage of flowing through.In addition, the parallel channels in the present embodiment only is preferred arrangement mode, also can be not parallel between this passage, and the quantity of this passage decides according to actual bar bar length.Should also be appreciated that for those of ordinary skills, the shape of the inlet hole in the present embodiment, feed pathway, outlet opening and location hole and position only are example, in other embodiments, also can adopt inlet hole and the outlet opening of arranging such as the mode of a certain side that is parallel to sheet.In addition, the shape of the gusset in the present embodiment and number are also only for illustrating.
Before heat sink work, the confession, loop of at first guaranteeing the refrigerant feed liquid device docked with heat sink inlet hole 53 and outlet opening 51 respectively, because freon refrigerant (as R134a, R142b etc.) belongs to easy leakage working medium, therefore must guarantee that sealing joint is tight.Guarantee when leak detection under the situation of each working line good seal, open kind of refrigeration cycle, liquid refrigerant enters into heat sink from inlet hole 53, in heat sink behind the endothermic gasification, the gas-fluid two-phase mixture that is become is got back in the refrigerant feed liquid device by outlet opening 51, by liquid feed device self with condenser refrigerant gas is condensed into liquid state again, and then begin the circulation.When heat sink work, refrigerant liquid working medium enters from the heat sink inlet hole 53 of lower cover slip, in the time of in by the parallel multichannel 21 with cavitation structure of fin, the cold-producing medium endothermic gasification becomes gas-fluid two-phase mixture, rectangle hole for back flow 31 by separatory sheet 30 enters back in the back flow channel in the liquid sheet 40 subsequently, and the gas-liquid mixture of cold-producing medium flows out heat sink by outlet opening 51 then.
One chip laser diode of the present invention microchannel phase transition heat sink has adopted the cavitation structure, can effectively suppress the oscillatory occurences in the boiling process in the passage, make explosive evaporation process and the working temperature of cold-producing medium in heat sink all keep stable state, improved the stability and the reliability of system's operation.Stable output when utilizing one chip laser diode of the present invention microchannel phase transition heat sink can realize that the continuous luminous power of single bar bar reaches 120W.
Although the present invention is made specific descriptions with reference to the above embodiments, but for the person of ordinary skill of the art, should be appreciated that and to make amendment based on content disclosed by the invention within spirit of the present invention and the scope or improve not breaking away from, these modifications and improving all within spirit of the present invention and scope.
Claims (8)
1. an one chip laser diode microchannel phase transition heat sink comprises fin, it is characterized in that having the feed pathway of cavitation structural shape on the described fin.
2. one chip laser diode according to claim 1 microchannel phase transition heat sink, it is characterized in that the feed pathway of feed pathway, Venturi tube or AND DEWATERING FOR ORIFICE STRUCTURE pattern that described feed pathway with cavitation structural shape is strip feed pathway, bell mouth shape.
3. one chip laser diode according to claim 2 microchannel phase transition heat sink is characterized in that described feed pathway with cavitation structural shape is the strip feed pathway, and the ratio of its throat width and exit width is 1: 2.
4. one chip laser diode according to claim 3 microchannel phase transition heat sink is characterized in that, described fin is provided with a plurality of described strip feed pathway that are parallel to each other.
5. one chip laser diode according to claim 4 microchannel phase transition heat sink is characterized in that, about 400 microns of the width of described channel outlet.
6. one chip laser diode according to claim 1 microchannel phase transition heat sink is characterized in that also comprise the separatory sheet, this separatory sheet is provided with the rectangle hole for back flow.
7. according to the described one chip laser diode of one of claim 1 to 6 microchannel phase transition heat sink, it is characterized in that, also comprise cold-producing medium.
8. one chip laser diode according to claim 7 microchannel phase transition heat sink is characterized in that described cold-producing medium is a freon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100939875A CN102044842A (en) | 2009-10-10 | 2009-10-10 | Single-chip laser diode micro-channel phase change heat sink |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100939875A CN102044842A (en) | 2009-10-10 | 2009-10-10 | Single-chip laser diode micro-channel phase change heat sink |
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| Publication Number | Publication Date |
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| CN102044842A true CN102044842A (en) | 2011-05-04 |
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| CN2009100939875A Pending CN102044842A (en) | 2009-10-10 | 2009-10-10 | Single-chip laser diode micro-channel phase change heat sink |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105305226A (en) * | 2015-12-06 | 2016-02-03 | 北京工业大学 | Microchannel heatsink having backwater layer provided with staggered inclined cylindrical flow-disturbing ridges |
| CN107104360A (en) * | 2017-07-13 | 2017-08-29 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
| CN110265877A (en) * | 2019-06-24 | 2019-09-20 | 淮阴工学院 | A kind of space angle closes beam semiconductor laser and its preparation process and closes Shu Fangfa |
| CN114323568A (en) * | 2022-03-14 | 2022-04-12 | 武汉普赛斯电子技术有限公司 | Three-temperature testing system of optical device |
-
2009
- 2009-10-10 CN CN2009100939875A patent/CN102044842A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105305226A (en) * | 2015-12-06 | 2016-02-03 | 北京工业大学 | Microchannel heatsink having backwater layer provided with staggered inclined cylindrical flow-disturbing ridges |
| CN107104360A (en) * | 2017-07-13 | 2017-08-29 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
| CN107104360B (en) * | 2017-07-13 | 2019-06-07 | 重庆师范大学 | The micro- sweat cooling of large power laser diode array throttling is heat sink |
| CN110265877A (en) * | 2019-06-24 | 2019-09-20 | 淮阴工学院 | A kind of space angle closes beam semiconductor laser and its preparation process and closes Shu Fangfa |
| CN114323568A (en) * | 2022-03-14 | 2022-04-12 | 武汉普赛斯电子技术有限公司 | Three-temperature testing system of optical device |
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Application publication date: 20110504 |