CN201570775U - Single-chip laser diode micro-channel phase change heat sink - Google Patents
Single-chip laser diode micro-channel phase change heat sink Download PDFInfo
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- CN201570775U CN201570775U CN2009202461420U CN200920246142U CN201570775U CN 201570775 U CN201570775 U CN 201570775U CN 2009202461420 U CN2009202461420 U CN 2009202461420U CN 200920246142 U CN200920246142 U CN 200920246142U CN 201570775 U CN201570775 U CN 201570775U
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- heat sink
- laser diode
- phase transition
- chip laser
- transition heat
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Abstract
The utility model discloses a monolithic formula laser diode microchannel phase transition is heat sink, including the fin, its characterized in that, the inlet channel that has cavitation structural style on the fin. The utility model discloses can effectively restrain the emergence of the in-process instability phenomenon of boiling, guarantee the reliable normal heat dissipation of laser diode. The cooling device has the advantages of high heat dissipation heat flow density, good cooling effect, stable work and the like.
Description
Technical field
The utility model belongs to the electronic radiation apparatus field, relates in particular to a kind of solid state laser one chip laser diode phase transition heat sink.
Background technology
Laser diode pump solid state laser device (DPL) has advantages such as efficient height, beam quality height, compact conformation, life-span length.In recent years, along with succeeding in developing in succession of high power diode laser, promoted the development of DPL and in the application in fields such as industry, medical treatment, scientific research.DPL is considered to the important directions of solid state laser technical development, has important purposes.
Usually, the hear rate during laser diode (LD) operate as normal accounts for more than 50% of total power consumption, and hear rate causes that the instability of laser diode working temperature will make its output wavelength change, and then influences the efficient stable output of DPL.Along with laser diode pump solid state laser device power increases, the heat load that device produces is increasing, and heat radiation density is also more and more higher, and LD cooling problem has become the technological difficulties in the present DPL research.
Generally speaking, the main mode that is used for DPL heat radiation has semiconductor refrigerating, adopting heat pipes for heat transfer, microchannel water-cooled etc.Wherein, the microchannel water-cooling is to study and use the more DPL type of cooling at present.Though the heat radiation of water-cooled microchannel has good effect of heat exchange, controls advantages such as simple, there are hidden danger such as microchannel corrosion and obstruction, heat sink temperature constantly fluctuation with the variation of in-channel water temperature simultaneously causes the laser works instability easily.
The utility model content
The purpose of this utility model is to overcome the defective of above-mentioned prior art, provides a kind of working medium of avoiding to take place to stop up and the more stable one chip laser diode phase transition heat sink of working temperature in flowing.
For achieving the above object, the utility model is by the following technical solutions:
According to first aspect of the present utility model, a kind of one chip laser diode microchannel phase transition heat sink is provided, comprise fin, have the feed pathway of cavitation structural shape on the wherein said fin.
In technique scheme, the feed pathway of feed pathway, Venturi tube or AND DEWATERING FOR ORIFICE STRUCTURE pattern that described feed pathway with cavitation structural shape is strip feed pathway, bell mouth shape.
In technique scheme, described feed pathway with cavitation structural shape is the strip feed pathway, and the ratio of its throat width and exit width is 1: 2.
In technique scheme, described fin is provided with a plurality of described strip feed pathway that are parallel to each other.
In technique scheme, also comprise the separatory sheet, this separatory sheet is provided with the rectangle hole for back flow.
In technique scheme, also comprise cold-producing medium.Preferably, described cold-producing medium is a freon.
Compared with prior art, advantage of the present utility model is:
1. avoid working medium in flowing, to stop up;
2. the stability and the reliability of system's operation have been improved.
Description of drawings
Below, describe embodiment of the present utility model in conjunction with the accompanying drawings in detail, wherein:
Fig. 1 a is the decomposition chart of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment;
Fig. 1 b is the schematic diagram of upper cover plate of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment;
Fig. 2 is the schematic diagram of fin of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment;
Fig. 3 is the schematic diagram of separatory sheet of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment;
Fig. 4 is the schematic diagram that returns the liquid sheet of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment;
Fig. 5 is the schematic diagram of lower cover slip of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment;
Fig. 6 is the stereogram of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment.
Embodiment
Fig. 1 a illustrates the decomposition chart of the one chip laser diode microchannel phase transition heat sink of embodiment of the present utility model.This is heat sink to comprise upper cover plate 10, fin 20, separatory sheet 30, return liquid sheet 40 and lower cover slip 50, and they are arranged in order from top to bottom, form by the pressure Diffusion Welding.Welding heat sink after finishing carries out the cutting edge processing by the line cutting with heat sink four peripheries, makes the length of heat sink final width and the single bar bar of laser diode (LD) suitable.Below each sheet is described in detail.
Fig. 1 b is the upper cover plate 10 of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment.This upper cover plate is provided with location hole 11, is used for welding and test installing and locating.
Fig. 2 is the fin 20 of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment.This fin 20 has the parallel feed pathway 21 of multi-ribbon cavitation structure, and wherein said cavitation structure is also referred to as sudden expansion formula passage, and promptly the throat width of passage is less than exit width, and it mainly acts on is that the instability that the growth of inhibition bubble adverse current is caused flows.In this embodiment, each passage is strip substantially, and preferably, feeder connection is 1: 2 with the width ratio of channel outlet, about 400 microns of the width of channel outlet.As shown in Figure 2, this fin 20 also has inlet hole 24, is provided with gusset 23 in this inlet hole, is beneficial to welding.This inlet hole is connected with parallel feed pathway 21, its position is corresponding to the inlet hole on the lower cover slip shown in Figure 5 50 53, during with the heat sink work of box lunch, to be cold-producing medium enter from the inlet hole 53 of lower cover slip 50 working medium, the inlet hole 45 through returning liquid sheet 40 and the inlet hole 34 of separatory sheet 30, flow into the inlet hole 24 of fin 20, enter parallel feed pathway 21 then.On the position of the fin 20 corresponding, be provided with location hole 22 equally with the location hole 11 of upper cover plate 10.
Fig. 3 is the separatory sheet 30 of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment.This separatory sheet 30 is used to separate fin 20 and returns liquid sheet 40, is communicated with the feed pathway 21 and the outlet opening 43 that returns liquid sheet 40 of fin 20 by the rectangle hole for back flow on this separatory sheet 31.The size of this rectangle hole for back flow is relevant with the flow of working medium, so that control back the flow velocity of liquid.On this separatory sheet 30, on corresponding with the location hole 22 of fin 20 and inlet hole 24 respectively position, be provided with location hole 33 and inlet hole 34, the hole on their shape, size and the corresponding separately fin 20 is similar.Also be provided with in the inlet hole 34 and strengthen gusset 32, consistent on its size dimension and position and the fin.
Fig. 4 is time liquid sheet 40 of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment.With the position of the position of rectangle hole for back flow 31 corresponding this time liquid sheet, be provided with outlet opening (also claiming the return flow line) 43, it is identical but the inconsistent reinforcement gusset 41 of length is beneficial to welding to be distributed with width in this return flow line.In addition, on the position corresponding with the location hole 33 of separatory sheet 30 and inlet hole 34, this time liquid sheet is provided with location hole 44 and inlet hole 45, and the hole on their shape, size and the corresponding separately separatory sheet 30 is similar.In inlet hole 45, also have and strengthen gusset 42, consistent on its size, size and position and the separatory sheet 30.
Fig. 5 is the lower cover slip 50 of the one chip laser diode microchannel phase transition heat sink of the utility model embodiment.This lower cover slip 50 comprises inlet hole 53, location hole 52 and outlet opening 51, and the position of this inlet hole, location hole and outlet opening corresponds respectively to inlet hole 45, location hole 44 and back flow channel 43.During heat sink work, cold-producing medium enters heat sink from inlet hole 53, then flows out by outlet opening 51.Fig. 6 is the stereogram after the one chip laser diode microchannel phase transition heat sink welding of the utility model embodiment is finished.
In technique scheme, the sudden expansion formula passage of strip only is an example, and the cavitation structure of any other pattern as the passage of bell mouth shape, the passage of orifice plate pattern, the passage of venturi tubulose etc., all can be used; Although the width ratio of the inlet of above-mentioned passage and outlet is 1: 2, but in other embodiment of the present utility model, also can adopt other ratios, but the width that should keep intake channel is less than exit passageway, and can make the cold-producing medium partial gasification of this passage of flowing through.In addition, the parallel channels in the present embodiment only is preferred arrangement mode, also can be not parallel between this passage, and the quantity of this passage decides according to actual bar bar length.Should also be appreciated that for those of ordinary skills, the shape of the inlet hole in the present embodiment, feed pathway, outlet opening and location hole and position only are example, in other embodiments, also can adopt inlet hole and the outlet opening of arranging such as the mode of a certain side that is parallel to sheet.In addition, the shape of the gusset in the present embodiment and number are also only for illustrating.
Before heat sink work, the confession, loop of at first guaranteeing the refrigerant feed liquid device docked with heat sink inlet hole 53 and outlet opening 51 respectively, because freon refrigerant (as R134a, R142b etc.) belongs to easy leakage working medium, therefore must guarantee that sealing joint is tight.Guarantee when leak detection under the situation of each working line good seal, open kind of refrigeration cycle, liquid refrigerant enters into heat sink from inlet hole 53, in heat sink behind the endothermic gasification, the gas-fluid two-phase mixture that is become is got back in the refrigerant feed liquid device by outlet opening 51, by liquid feed device self with condenser refrigerant gas is condensed into liquid state again, and then begin the circulation.When heat sink work, refrigerant liquid working medium enters from the heat sink inlet hole 53 of lower cover slip, in the time of in by the parallel multichannel 21 with cavitation structure of fin, the cold-producing medium endothermic gasification becomes gas-fluid two-phase mixture, rectangle hole for back flow 31 by separatory sheet 30 enters back in the back flow channel in the liquid sheet 40 subsequently, and the gas-liquid mixture of cold-producing medium flows out heat sink by outlet opening 51 then.
One chip laser diode of the present utility model microchannel phase transition heat sink has adopted the cavitation structure, can effectively suppress the oscillatory occurences in the boiling process in the passage, make explosive evaporation process and the working temperature of cold-producing medium in heat sink all keep stable state, improved the stability and the reliability of system's operation.Stable output when utilizing one chip laser diode of the present utility model microchannel phase transition heat sink can realize that the continuous luminous power of single bar bar reaches 120W.
Although the utility model is made specific descriptions with reference to the above embodiments, but for the person of ordinary skill of the art, should be appreciated that and to make amendment based on the disclosed content of the utility model within spirit of the present utility model and the scope or improve not breaking away from, these modifications and improving all within spirit of the present utility model and scope.
Claims (8)
1. an one chip laser diode microchannel phase transition heat sink comprises fin, it is characterized in that having the feed pathway of cavitation structural shape on the described fin.
2. one chip laser diode according to claim 1 microchannel phase transition heat sink, it is characterized in that the feed pathway of feed pathway, Venturi tube or AND DEWATERING FOR ORIFICE STRUCTURE pattern that described feed pathway with cavitation structural shape is strip feed pathway, bell mouth shape.
3. one chip laser diode according to claim 2 microchannel phase transition heat sink is characterized in that described feed pathway with cavitation structural shape is the strip feed pathway, and the ratio of its throat width and exit width is 1: 2.
4. one chip laser diode according to claim 3 microchannel phase transition heat sink is characterized in that, described fin is provided with a plurality of described strip feed pathway that are parallel to each other.
5. one chip laser diode according to claim 4 microchannel phase transition heat sink is characterized in that, about 400 microns of the width of described channel outlet.
6. one chip laser diode according to claim 1 microchannel phase transition heat sink is characterized in that also comprise the separatory sheet, this separatory sheet is provided with the rectangle hole for back flow.
7. according to the described one chip laser diode of one of claim 1 to 6 microchannel phase transition heat sink, it is characterized in that, also comprise cold-producing medium.
8. one chip laser diode according to claim 7 microchannel phase transition heat sink is characterized in that described cold-producing medium is a freon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202461420U CN201570775U (en) | 2009-10-10 | 2009-10-10 | Single-chip laser diode micro-channel phase change heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202461420U CN201570775U (en) | 2009-10-10 | 2009-10-10 | Single-chip laser diode micro-channel phase change heat sink |
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| Publication Number | Publication Date |
|---|---|
| CN201570775U true CN201570775U (en) | 2010-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202461420U Expired - Fee Related CN201570775U (en) | 2009-10-10 | 2009-10-10 | Single-chip laser diode micro-channel phase change heat sink |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109038210A (en) * | 2018-08-13 | 2018-12-18 | 西安炬光科技股份有限公司 | A kind of novel liquid chiller and capsulation structure for semiconductor laser |
| CN109794698A (en) * | 2019-04-01 | 2019-05-24 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with microchannel heat sink |
| CN112687450A (en) * | 2020-12-03 | 2021-04-20 | 江苏安靠智能电站科技有限公司 | Opening and changing integrated machine |
-
2009
- 2009-10-10 CN CN2009202461420U patent/CN201570775U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109038210A (en) * | 2018-08-13 | 2018-12-18 | 西安炬光科技股份有限公司 | A kind of novel liquid chiller and capsulation structure for semiconductor laser |
| CN109794698A (en) * | 2019-04-01 | 2019-05-24 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with microchannel heat sink |
| CN112687450A (en) * | 2020-12-03 | 2021-04-20 | 江苏安靠智能电站科技有限公司 | Opening and changing integrated machine |
| CN112687450B (en) * | 2020-12-03 | 2023-01-06 | 江苏安靠智能电站科技有限公司 | Opening and changing integrated machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100901 Termination date: 20121010 |