CN112509999B - Intelligent-control phase change cooler and cooling method thereof - Google Patents
Intelligent-control phase change cooler and cooling method thereof Download PDFInfo
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- CN112509999B CN112509999B CN202011374788.4A CN202011374788A CN112509999B CN 112509999 B CN112509999 B CN 112509999B CN 202011374788 A CN202011374788 A CN 202011374788A CN 112509999 B CN112509999 B CN 112509999B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention relates to an intelligent control phase-change cooler and a cooling method thereof, wherein the phase-change cooler comprises a liquid storage chamber, a backflow chamber and a cooling chamber which are sequentially arranged from top to bottom, the liquid storage chamber and the backflow chamber are respectively provided with a main inlet/a main outlet for flowing in/out a cooling working medium, the liquid storage chamber is correspondingly connected with a plurality of cooling units in the cooling chamber through a plurality of flow-controllable communicating pipes, the plurality of cooling units correspond to different positions of a microelectronic chip, a cover plate is arranged between the cooling chamber and the backflow chamber, the cover plate is provided with a plurality of branch outlets for flowing out a vapor-liquid mixed working medium, the cover plate is further provided with a branch inlet connected with the communicating pipes, the main inlet is connected with a liquid feeding pump, the main outlet is connected with a condenser, and the condenser is connected with the liquid feeding pump through a liquid pool. Compared with the prior art, the invention can effectively solve the heat dissipation problem under the condition of uneven heating of the chip and can reduce the power consumption of the liquid feeding pump on the premise of ensuring the heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of microelectronic chip heat dissipation, in particular to an intelligent control phase change cooler and a cooling method thereof.
Background
With the increase of integration level and power density of microelectronic chips, the heating problem is becoming more severe, the operating temperature of the chips has an important influence on the performance of the chips, and various microelectronic chip coolers are also being developed. At present, common microelectronic chip coolers are of an air cooling type, a phase change cooling type and the like, and particularly, the phase change coolers have received wide attention and use due to strong cooling capacity.
The heating of the chip during actual operation is often uneven, some local areas with large heating value are called as hot spots of the chip, the chip is easy to generate local failure due to the existence of the hot spots, and the normal operation of the chip can be seriously affected if the chip is not processed in time. The existing phase change coolers are designed from the angle of considering uniform heating of a chip, and although a heat dissipation bottom plate with high heat conductivity is adopted to balance temperature differences at different positions, when the heat dissipation area of the chip is large or the heating unevenness is strong, the heat dissipation effect of the existing phase change cooler is poor. In addition, the pump power consumption of the prior microelectronic chip phase-change cooler is generally higher.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an intelligent control phase change cooler and a cooling method thereof, so as to solve the heat dissipation problem under the condition of nonuniform heating of a microelectronic chip and reduce the pump power consumption of the phase change cooler.
The purpose of the invention can be realized by the following technical scheme: the utility model provides an intelligent control's phase transition cooler, includes stock solution cavity, backward flow cavity and the cooling cavity that top-down arranged in proper order, be provided with the total entry that is used for flowing into the cooling medium on the stock solution cavity, be provided with the total export that is used for flowing out vapour-liquid mixed working medium on the backward flow cavity, the stock solution cavity corresponds with a plurality of cooling units in the cooling cavity through controllable communicating pipe of a plurality of flows and is connected, a plurality of cooling units are the matrix arrangement structure and arrange in the cooling cavity, a plurality of cooling units correspond to the different positions of microelectronic chip, be provided with the apron between cooling cavity and the backward flow cavity, offer a plurality of minutes exports that are used for flowing out vapour-liquid mixed working medium on the apron, still offer the branch entry of being connected with communicating pipe on the apron, the total entry is connected with the liquid feeding pump, the total export is connected with the condenser, the condenser is connected to the liquid feeding pump through the liquid bath.
Furthermore, the cooling chamber comprises a heat dissipation bottom plate and a cooling chamber baffle plate surrounding the periphery of the heat dissipation bottom plate, the heat dissipation bottom plate is divided into a plurality of cooling units, backflow channels are formed between the cooling units and the cooling chamber baffle plate, and the backflow channels are correspondingly communicated with the branch outlets.
Further, the surface of the cooling unit is provided with a micro-scale structure, and the micro-scale structure comprises a branched arrangement rib column structure and a parallel micro-channel structure.
Further, the branch inlet corresponds to a central position of the cooling unit.
Furthermore, the backflow chamber comprises a backflow chamber baffle plate surrounding the periphery of the cover plate, and the main outlet is formed in the side wall of the backflow chamber baffle plate.
Further, the main inlet is arranged at the top of the liquid storage chamber.
Furthermore, be provided with the solenoid valve on communicating pipe, the cooling unit disposes temperature sensor, solenoid valve and temperature sensor all are connected to heat dissipation control system, temperature sensor is used for gathering cooling unit's temperature data to give heat dissipation control system with temperature data transmission, heat dissipation control system is used for controlling the aperture of solenoid valve, with the flow of the interior cooling working medium of regulation communicating pipe.
Further, the heat dissipation control system comprises a control chip, the control chip is respectively connected with the electromagnetic valve, the liquid feeding pump and the temperature sensor, the control chip is further connected with a touch display screen, a memory, a pressure sensor, a flow meter, a buzzer and a communication module, and the touch display screen is used for displaying the operating parameters of the phase change cooler and receiving operation control information input by a user;
the memory stores corresponding reference flow of the phase change cooler under different control target temperatures and heat flux densities;
the pressure sensors are arranged at the positions of the main inlet and the main outlet and are used for collecting pressure data of the phase change cooler;
the flowmeter is arranged at the position of the main inlet and is used for collecting the total flow of the cooling working medium entering the phase change cooler;
the communication module is used for realizing data information transmission between the control chip and external equipment;
the control chip is used for controlling the liquid feeding pump to be opened and closed, controlling the opening of the electromagnetic valve and outputting alarm control information to the buzzer.
A cooling method applying the phase change cooler comprises the following steps:
s1, controlling a chip to calculate according to the rated power of a microelectronic chip and the contact area of the microelectronic chip and a phase change cooler to obtain the heat flow density;
s2, according to the target temperature set by a user and the calculated heat flux density, the control chip calls data in the memory to obtain the initial reference flow of the phase change cooler, so that the initial opening of the electromagnetic valve is controlled;
and S3, the temperature sensor transmits the acquired temperature data of each cooling unit to the control chip in real time, and the control chip compares the temperature data of each cooling unit with the target temperature to respectively control the opening of each electromagnetic valve, so that the aim of performing differential heat dissipation adjustment on the temperatures of different positions of the microelectronic chip is fulfilled.
Further, the specific process of controlling the opening of each electromagnetic valve by the control chip in the step S3 is as follows:
the control chip compares the temperature data of each cooling unit with a target temperature respectively, and controls to increase the opening degree of an electromagnetic valve on a communicating pipe connected with the cooling unit if the temperature data of the cooling unit is greater than the target temperature and the absolute value of the difference between the temperature data of the cooling unit and the target temperature is greater than or equal to a preset value;
if the temperature data of the cooling unit is less than the target temperature and the absolute value of the difference between the target temperature and the target temperature is greater than or equal to a preset value, the control chip controls to reduce the opening degree of an electromagnetic valve on a communicating pipe connected with the cooling unit;
and if the absolute value of the difference between the temperature data of the cooling unit and the target temperature is smaller than the preset value, the control chip controls and maintains the opening degree of the electromagnetic valve on the communicating pipe connected with the cooling unit at present.
Compared with the prior art, the invention has the following advantages:
1. according to the invention, the phase change cooler is internally provided with the plurality of cooling units corresponding to different positions of the microelectronic chip, and each cooling unit is connected with the liquid storage chamber through the flow-controllable communicating pipe, so that cooling working media with different flows can respectively enter the cooling units, and intelligent and differentiated heat dissipation adjustment is carried out on different positions of the microelectronic chip, thereby effectively solving the heat dissipation problem under the condition of nonuniform heating of the microelectronic chip.
2. According to the invention, the cover plate is arranged between the reflux chamber and the cooling chamber, the cover plate is respectively provided with the plurality of branch inlets communicated with the cooling units and the plurality of branch outlets communicated with the reflux channels in the cooling chamber, and the microscale structure design of the cooling units is combined, so that a cooling working medium can fully and rapidly enter the corresponding cooling units through the branch inlets and absorb a large amount of heat through a vapor-liquid phase change process, and a vapor-liquid mixed working medium generated in the cooling chamber can fully and rapidly flow out of the branch outlets, thereby greatly improving the cooling effect and the heat dissipation efficiency.
3. The invention utilizes the heat dissipation control system, combines the temperature sensor arranged in the cooling unit, and can respectively and intelligently control the opening degree of the electromagnetic valve on the communicating pipe connected with each cooling unit according to the actual temperature data and the set target temperature of each cooling unit, so as to adjust the flow rate of the cooling working medium corresponding to each cooling unit, thereby not only reliably ensuring the heat dissipation effect in real time, but also reducing the opening degree of the electromagnetic valve and the flow rate of the inflow cooling working medium under the condition that the actual temperature data of the cooling unit is lower than the target temperature, thereby realizing the purpose of reducing the power consumption of the liquid feeding pump and further generating the energy-saving effect.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is an exploded view of a phase change cooler according to an embodiment;
FIG. 3a is a schematic view of a single cooling unit according to a first embodiment;
FIG. 3b is a schematic diagram illustrating the arrangement of the cooling unit in the cooling chamber according to the first embodiment;
FIG. 4a is a schematic view of a single cooling unit in a second embodiment;
FIG. 4b is a schematic diagram illustrating the arrangement of the cooling units in the cooling chamber according to the second embodiment;
FIG. 5 is a schematic view of the flow cycle of the cooling medium in the first embodiment;
FIG. 6 is a schematic diagram of a connection structure of the heat dissipation control system of the present invention;
FIG. 7 is a flowchart of the heat dissipation control system of the present invention;
the notation in the figure is: 1. the device comprises a main inlet, 2, a liquid storage chamber, 3, a backflow chamber, 4, a backflow chamber baffle, 5, a communicating pipe, 6, an electromagnetic valve, 7, a cover plate, 8, a branch inlet, 9, a cooling chamber baffle, 10, a cooling chamber, 11, a backflow channel, 12, a radiating bottom plate, 13, a branched arrangement rib column structure, 14, a branch outlet, 15, a main outlet, 16, a phase change cooler main body, 17, a liquid pool, 18, a liquid feeding pump, 19, a condenser, 20, a vapor bubble, 21, a flow distribution channel, 22, a parallel micro-channel structure, 23, a control chip, 24, a touch display screen, 25, a memory, 26, a temperature sensor, 27, a pressure sensor, 28, a flow meter, 29, a buzzer, 30 and a communication module.
Detailed Description
The invention is described in detail below with reference to the figures and the specific embodiments.
Examples
As shown in fig. 1, an intelligently controlled phase change cooler includes a phase change cooler body 16 having a rectangular parallelepiped structure, the size of which can be adjusted according to specific cooling requirements under the condition of following the design principle, and a main inlet 1 and a main outlet 15 are respectively provided at the top and the side of the phase change cooler body 16. Specifically, as shown in fig. 2, in the first embodiment, a liquid storage chamber 2, a backflow chamber 3 and a cooling chamber 10 are sequentially arranged from top to bottom in a phase change cooler, wherein the liquid storage chamber 2 and the backflow chamber 3 both have a certain thickness to eliminate influence on flow distribution, the liquid storage chamber 2 is correspondingly connected with a plurality of cooling units in the cooling chamber 10 through a plurality of communicating pipes 5 with controllable flow, an electromagnetic valve 6 is arranged on the communicating pipe 5, the plurality of cooling units are arranged in the cooling chamber 10 in a matrix arrangement structure, and the plurality of cooling units respectively correspond to different positions of a microelectronic chip;
a cover plate 7 is arranged between the cooling chamber 10 and the reflux chamber 3, a plurality of branch outlets 14 for discharging vapor-liquid mixed working media are formed in the cover plate 7, and branch inlets 8 connected with the communicating pipes 5 are formed in the cover plate 7;
the cooling chamber 10 comprises a heat dissipation bottom plate 12 and a cooling chamber baffle plate 9 surrounding the periphery of the heat dissipation bottom plate 12, the heat dissipation bottom plate 12 is divided into a plurality of cooling units, a backflow channel 11 is formed between the cooling units and the cooling chamber baffle plate, and the backflow channel 11 is correspondingly communicated with the branch outlet 14;
the backflow cavity 3 comprises a backflow cavity baffle 4 surrounding the cover plate 7, a main outlet 15 is formed in the side wall of the backflow cavity baffle 4, and a main inlet 1 is formed in the top of the liquid storage cavity 2.
As shown in fig. 3a, in the first embodiment, the cooling unit is specifically a bifurcate arrangement rib column structure 13, the cooling working medium enters from the branch inlet 8 located at the central position of the cooling unit and then flows to the periphery in a divergent manner, the bifurcate arrangement rib column structure 13 can eliminate a flow stagnation region, ensure that fluids on the surface of the cooling working medium have relatively high flow velocity, the cooling working medium can undergo vapor-liquid phase change when flowing through the rib column structure to absorb a large amount of heat, and simultaneously vaporize to form vapor bubbles 20, and the flow pattern of the cooling working medium is also changed from single-phase flow to vapor-liquid two-phase flow. The flowing speed of the cooling working medium is gradually reduced when the cooling working medium flows from the center to the periphery, so that a thinner liquid film thickness is formed between the peripheral steam bubble and the heating wall surface, and the heat transfer is enhanced.
As shown in fig. 3b, in the first embodiment, there are 9 different cooling units, and 9 branch inlets 8 correspond to the 9 different cooling units, it should be noted that the number of the cooling units of the phase change cooler can be adjusted according to the actual cooling requirement, the phase change cooler is provided with 12 branch outlets 14, 8 of the cooling units are arranged at the edge position of the cooling chamber 10, 4 cooling units are arranged at the middle position of the cooling chamber 10, and the number and the positions of the branch outlets 14 can also be adjusted according to the actual cooling requirement. A backflow channel 11 is defined between each cooling unit and other cooling units or the cooling chamber baffle plates 9, the steam-liquid mixed working medium after absorbing heat flows to the branch outlet 14 through the backflow channel 11, and the width of the backflow channel 11 can be adjusted according to actual cooling requirements.
As shown in fig. 4a, in the second embodiment, the cooling unit is specifically a parallel microchannel structure 22, and the liquid cooling working medium enters the distribution channel 21 from the branch inlet 8, flows along the distribution channel 21, and simultaneously gradually flows into the parallel microchannel structure 22, and is gradually converted into a vapor-liquid mixed working medium under the heating action of the microchannel wall surface. In the second embodiment shown in fig. 4b, the inlet and outlet layout of the parallel microchannel phase change cooler are the same as those of the branched rib column phase change cooler of the first embodiment, so the flow modes between the cooling units are very close.
Taking the first embodiment as an example, the flow cycle of the cooling medium is schematically shown in fig. 5, and the liquid cooling medium is stored in the liquid pool 17 and is sent to the phase change cooler by the liquid feeding pump 18. The cooling working medium enters the liquid storage chamber 2 from the main inlet 1 and then flows into the cooling chamber 10 from the branch inlets 8 through the communicating pipes 5 at different lower parts, and the cooling working medium can be selected according to actual cooling requirements. Be provided with solenoid valve 6 in communicating pipe, can control the cooling working medium flow that flows into in cooling chamber 10 through solenoid valve 6's aperture, apron 7 department on cooling chamber 10 upper portion is provided with different branch mouth 8, it corresponds the cooling unit of difference in the cooling chamber respectively, so as to carry out subregion differentiation regulation and control, it distributes on the radiating bottom plate 12 of cooling unit bottom has branching arrangement rib post 13 or parallel microchannel structure 22, can increase the area of contact of cooling working medium and radiating bottom plate, and then strengthen the heat transfer, cooling chamber 10 is provided with cooling chamber baffle 9 all around, in order to ensure cooling chamber's leakproofness. The vapor-liquid mixed working medium after phase change in the cooling unit is converged into the backflow channel 11, then flows into the backflow chamber 3 through the branch outlet 14 at the upper cover plate 7 of the backflow channel 11, and finally flows out of the phase change cooler through the main outlet 15 arranged at one side of the backflow chamber baffle 4. The gas-liquid mixed working medium is converted into a liquid cooling working medium in the condenser 19 and then flows into the liquid pool 17 for the next cycle. In practical application, the heat dissipation bottom plate 12 of the phase change cooler is made of a high-thermal-conductivity material, and the rest parts are made of heat-insulating materials, so that heating of the vapor-liquid mixed working medium after heat absorption to the liquid-phase cooling working medium is reduced, and a better cooling effect is obtained.
In order to realize the purposes of controllable heat dissipation effect and reduction of power loss of a liquid feeding pump, the invention adopts a heat dissipation control system to control the opening degree of the electromagnetic valve 6 on each communicating pipe 5, and particularly adjusts the opening degree of the electromagnetic valve 6 through a corresponding intelligent temperature control algorithm to adjust the flow of cooling working media entering different cooling units, wherein the intelligent temperature control algorithm is set as follows: increasing the opening degree of the electromagnetic valve when the temperature measurement value of the cooling unit is higher than the target temperature; when the temperature measurement value of the cooling unit is lower than the target temperature value, reducing the opening degree of the electromagnetic valve; and when the temperature measured value of the cooling unit is close to the target temperature value, the opening degree of the current electromagnetic valve is not adjusted and maintained.
As shown in fig. 6, the heat dissipation control system includes a control chip 23 responsible for data information processing, and the control chip 23 is connected to a touch display screen 24, a memory 25, a temperature sensor 26, a pressure sensor 27, a flow meter 28, the electromagnetic valve 6, the liquid feeding pump 18, a buzzer 29, and a communication module 30. The touch display screen 24 is responsible for displaying the operating parameters of the phase change cooler, and can also input control information; the memory 25 is internally provided with reference flow data of the phase change cooler under the conditions of different control target temperatures and different heat flux densities, and the preset data are obtained through experiments, so that the phase change cooler can be helped to realize accurate temperature regulation and control more quickly; the temperature sensor 26 is responsible for collecting real-time collected temperature, and the lower part of each phase change cooling unit is provided with an independent temperature sensor; two pressure sensors 27 are respectively positioned at the general inlet and the general outlet of the phase change cooler and are responsible for monitoring the pressure of the system so as to ensure normal operation; the flow meter 28 is located at the total inlet position and is responsible for obtaining the total liquid working medium flow entering the phase change cooler.
The control chip 23 combines the set target temperature and the actual temperature data of each cooling unit to respectively adjust the opening degree of each electromagnetic valve 6, so as to control the flow rate, the liquid feeding pump 18 adopts a constant pressure type pump, when the temperature of the chip can not be controlled at the target temperature by the phase change cooler, the buzzer 29 is used for alarming and prompting, and the communication module 30 is used for allowing other equipment to read and control the parameters of the phase change cooler through a wireless network.
The phase change cooler is applied to the actual application, and the specific cooling process comprises the following steps:
s1, controlling a chip to calculate to obtain heat flux density according to the rated power of a microelectronic chip and the contact area of the microelectronic chip and a phase change cooler;
s2, according to the target temperature set by a user and the calculated heat flux density, the control chip calls data in the memory to obtain the initial reference flow of the phase change cooler, so that the initial opening of the electromagnetic valve is controlled;
s3, the temperature sensor transmits the acquired temperature data of each cooling unit to a control chip in real time, the control chip compares the temperature data of each cooling unit with a target temperature to control the opening of each electromagnetic valve respectively, so that the aim of performing differential heat dissipation adjustment on the temperatures of different positions of the microelectronic chip is fulfilled, specifically, the control chip compares the temperature data of each cooling unit with the target temperature respectively, and if the temperature data of the cooling unit is greater than the target temperature and the absolute value of the difference between the two is greater than or equal to a preset value, the control chip controls to increase the opening of the electromagnetic valve on a communicating pipe connected with the cooling unit;
if the temperature data of the cooling unit is less than the target temperature and the absolute value of the difference between the target temperature and the target temperature is greater than or equal to a preset value, the control chip controls to reduce the opening degree of an electromagnetic valve on a communicating pipe connected with the cooling unit;
if the absolute value of the difference between the temperature data of the cooling unit and the target temperature is smaller than the preset value, the control chip controls and maintains the opening degree of the electromagnetic valve on the communicating pipe connected with the cooling unit currently.
As shown in fig. 7, after the phase change cooler is started, the rated power of the chip and the contact area between the chip and the heat dissipation bottom plate are input into the interface of the touch display screen, the phase change cooler automatically calculates the heat flux density of the heat dissipation surface, and in addition, a target temperature, i.e., a control temperature for the heat dissipation bottom plate of the phase change cooler needs to be input, and the chip can normally operate at a high performance at the temperature;
then, the control chip automatically calls preset data in a memory according to the calculated heat flow density and the input target temperature, and gives the flow of the cooling working medium at the branch inlet, wherein the flow is the reference flow of the phase change cooler during intelligent temperature control;
finally, temperature sensors in different cooling units of the cooling chamber can read temperature measurement values in real time, the temperature measurement values of the different cooling units are different due to the fact that the heat generation of the microelectronic chip is unevenly distributed, and an intelligent temperature control algorithm used by the phase change cooler is as follows: when the temperature measurement value of the cooling unit is higher than the target temperature, the cooling system can automatically increase the opening of the electromagnetic valve in the communicating pipe, so that the flow of the cooling working medium at the branch inlet is increased, and the cooling effect is enhanced; when the temperature measured value of the cooling unit is lower than the target temperature value, the cooling system can automatically reduce the opening of the electromagnetic valve in the communicating pipe, the pump power consumption of the cooling system is reduced by reducing the flow supply, and the energy-saving effect is achieved under the condition of ensuring the normal temperature of the chip; when the temperature measurement value of the cooling unit is close to the target temperature value, the cooling system operates normally without adjusting the flow of the cooling working medium at the branch inlet. This phase change cooler carries out intelligent control through the cooling working medium flow to in each cooling unit, and then realizes the differentiation adjustment to the different position temperatures in chip surface, solves the heat dissipation problem of chip under the inhomogeneous condition that generates heat.
In summary, the present invention can effectively solve the heat dissipation problem under the condition of uneven heating of the microelectronic chip based on the application of the partitioned differential heat dissipation, has a very strong cooling effect by combining the micro-scale structure of the cooling unit, and also has the characteristic of energy saving, that is, the power consumption of the pump is actively reduced by intelligent temperature control on the premise of ensuring the cooling effect of the chip.
Claims (8)
1. The intelligently-controlled phase-change cooler is characterized by comprising a liquid storage chamber (2), a backflow chamber (3) and a cooling chamber (10) which are sequentially arranged from top to bottom, wherein a main inlet (1) for flowing cooling working media is formed in the liquid storage chamber (2), a main outlet (15) for flowing vapor-liquid mixed working media is formed in the backflow chamber (3), the liquid storage chamber (2) is correspondingly connected with a plurality of cooling units in the cooling chamber (10) through a plurality of communicating pipes (5) with controllable flow, the cooling units are arranged in the cooling chamber (10) in a matrix arrangement structure, the cooling units correspond to different positions of a microelectronic chip, a cover plate (7) is arranged between the cooling chamber (10) and the backflow chamber (3), a plurality of branch outlets (14) for flowing the vapor-liquid mixed working media are formed in the cover plate (7), branch inlets (8) connected with the communicating pipes (5) are further formed in the cover plate (7), the main inlet (1) is connected with a liquid feeding pump (18), the main outlet (15) is connected with a condenser (19), and the condenser (19) is connected with a liquid feeding pool (17);
the cooling system is characterized in that an electromagnetic valve (6) is arranged on the communicating pipe (5), the cooling unit is provided with a temperature sensor (26), the electromagnetic valve (6) and the temperature sensor (26) are both connected to a heat dissipation control system, the temperature sensor (26) is used for collecting temperature data of the cooling unit and transmitting the temperature data to the heat dissipation control system, and the heat dissipation control system is used for controlling the opening of the electromagnetic valve (6) so as to adjust the flow of a cooling working medium in the communicating pipe (5);
the heat dissipation control system comprises a control chip (23), the control chip (23) is respectively connected with an electromagnetic valve (6), a liquid feeding pump (18) and a temperature sensor (26), the control chip (23) is further connected with a touch display screen (24), a memory (25), a pressure sensor (27), a flow meter (28), a buzzer (29) and a communication module (30), and the touch display screen (24) is used for displaying the operation parameters of the phase change cooler and receiving operation control information input by a user;
the memory (25) stores corresponding reference flow of the phase change cooler under the conditions of different control target temperatures and heat flux densities;
the pressure sensors (27) are arranged at the positions of the main inlet (1) and the main outlet (15) and are used for collecting pressure data of the phase change cooler;
the flowmeter (28) is arranged at the position of the main inlet (1) and is used for collecting the total cooling working medium flow entering the phase change cooler;
the communication module (30) is used for realizing data information transmission between the control chip (23) and external equipment;
the control chip (23) is used for controlling the opening and closing of the liquid feeding pump (18), controlling the opening degree of the electromagnetic valve (6) and outputting alarm control information to the buzzer (29).
2. The intelligent regulated phase change cooler according to claim 1, wherein the cooling chamber (10) comprises a heat dissipation bottom plate (12) and a cooling chamber baffle (9) surrounding the heat dissipation bottom plate (12), the heat dissipation bottom plate (12) is divided into a plurality of cooling units, return channels (11) are formed between the cooling units and the cooling chamber baffle (9), and the return channels (11) are correspondingly communicated with the branch outlets (14).
3. The intelligent controlled phase change cooler according to any one of claims 1-2, wherein the surface of the cooling unit is provided with a micro-scale structure, and the micro-scale structure comprises a branched rib column structure (13) and a parallel micro-channel structure (22).
4. An intelligently regulated phase change cooler according to claim 1, characterised in that said branch inlet (8) corresponds to a central position of the cooling unit.
5. A smart conditioned phase change cooler according to claim 1, characterised in that the return chamber (3) comprises a return chamber baffle (4) surrounding the cover plate (7), the main outlet (15) opening into a side wall of the return chamber baffle (4).
6. An intelligently regulated phase change cooler according to claim 1, characterised in that the main inlet (1) opens at the top of the reservoir chamber (2).
7. A cooling method using the phase change cooler of claim 1, comprising the steps of:
s1, controlling a chip to calculate to obtain heat flux density according to the rated power of a microelectronic chip and the contact area of the microelectronic chip and a phase change cooler;
s2, according to the target temperature set by a user and the calculated heat flux density, the control chip calls data in the memory to obtain the initial reference flow of the phase change cooler, so that the initial opening of the electromagnetic valve is controlled;
and S3, the temperature sensor transmits the acquired temperature data of each cooling unit to the control chip in real time, and the control chip compares the temperature data of each cooling unit with the target temperature to control the opening of each electromagnetic valve respectively, so that the aim of performing differential heat dissipation adjustment on the temperatures of different positions of the microelectronic chip is fulfilled.
8. The cooling method according to claim 7, wherein the specific process of the control chip controlling the opening of each solenoid valve in step S3 is as follows:
the control chip compares the temperature data of each cooling unit with a target temperature respectively, and controls to increase the opening degree of an electromagnetic valve on a communicating pipe connected with the cooling unit if the temperature data of the cooling unit is greater than the target temperature and the absolute value of the difference between the temperature data of the cooling unit and the target temperature is greater than or equal to a preset value;
if the temperature data of the cooling unit is less than the target temperature and the absolute value of the difference between the target temperature and the target temperature is greater than or equal to a preset value, the control chip controls to reduce the opening degree of an electromagnetic valve on a communicating pipe connected with the cooling unit;
and if the absolute value of the difference between the temperature data of the cooling unit and the target temperature is smaller than the preset value, the control chip controls and maintains the opening degree of the electromagnetic valve on the communicating pipe connected with the cooling unit at present.
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| CN116581097B (en) * | 2023-07-11 | 2023-09-29 | 北京汤谷软件技术有限公司 | Device for stabilizing communication data transmission among multiple chips |
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